CN204216093U - For providing the ray structure of illumination and the circuit substrate for carrying luminescence component - Google Patents
For providing the ray structure of illumination and the circuit substrate for carrying luminescence component Download PDFInfo
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- CN204216093U CN204216093U CN201420623440.8U CN201420623440U CN204216093U CN 204216093 U CN204216093 U CN 204216093U CN 201420623440 U CN201420623440 U CN 201420623440U CN 204216093 U CN204216093 U CN 204216093U
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Abstract
The utility model provides a kind of for providing the ray structure of illumination and the circuit substrate for carrying luminescence component.Circuit substrate comprises: dielectric base layer, conductive radiating layer, insulating cover, conductive line structure and run through conductive structure.Conductive radiating layer is arranged on dielectric base layer.Insulating cover is arranged on conductive radiating layer.Conductive line structure comprises the first electrode conducting layer and the second electrode conducting layer.First and second electrode conducting layer to be arranged on insulating cover and a preset distance separated from one another.Run through conductive structure and comprise the electric conductor that at least one through hole and running through insulating cover fills up through hole.Through hole and electric conductor are all connected between first and second electrode conducting layer one of them and conductive radiating layer.Utilize first and second both electrode conducting layer one of them by electric conductor, to be electrically connected at conductive radiating layer, make the first electrode conducting layer and the second electrode conducting layer one of them to luminescence component as electrically to guide or ground connection uses.
Description
Technical field
The utility model relates to a kind of ray structure and circuit substrate, espespecially a kind of for providing the ray structure of illumination and the circuit substrate for carrying luminescence component.
Background technology
About comparing of light-emitting diode (LED) and conventional light source, light-emitting diode has that volume is little, power saving, luminous efficiency is high, the life-span is long, operant response speed fast and the advantages such as non-thermal radiation and the pollution without noxious substances such as mercurys.Therefore in recent years, the application surface of light-emitting diode is to the utmost is extensive.Past also cannot replace traditional lighting source due to the brightness of light-emitting diode, but along with the continuous lifting of technical field, developed the High Power LED of high brightness of illumination at present, it is enough to replace traditional lighting source.
Summary of the invention
The utility model embodiment is to provide a kind of for providing the ray structure of illumination and the circuit substrate for carrying luminescence component.
The utility model is a kind of circuit substrate for carrying luminescence component of providing of an embodiment wherein, and it comprises: a dielectric base layer, a conductive radiating layer, an insulating cover, a conductive line structure and run through conductive structure.Described conductive radiating layer is arranged on described dielectric base layer.Described insulating cover is arranged on described conductive radiating layer.Described conductive line structure comprises at least one first electrode conducting layer and at least one second electrode conducting layer, and wherein at least one described first electrode conducting layer and at least one described second electrode conducting layer to be all arranged on described insulating cover and a preset distance separated from one another.The described conductive structure that runs through comprises the electric conductor that at least one through hole and running through described insulating cover fills up at least one described through hole, and wherein at least one described through hole and described electric conductor are all connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them and described conductive radiating layer.Wherein, described luminescence component to be arranged on described conductive line structure and to be electrically connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer; At least one described first electrode conducting layer and at least one described second electrode conducting layer one of them by described electric conductor, to be electrically connected at described conductive radiating layer.
Described circuit substrate also comprises a reflecting coating further, described reflecting coating is arranged on described conductive line structure, at least one described first electrode conducting layer has and first conductive welding pad that go out exposed from described reflecting coating, at least one described second electrode conducting layer has and second conductive welding pad that go out exposed from described reflecting coating, and described luminescence component is electrically connected between described first conductive welding pad and described second conductive welding pad.
Wherein said conductive radiating layer and described conductive line structure are different material layers, wherein said dielectric base layer is layer of silica gel, described conductive radiating layer is aluminium lamination, described insulating cover is film, and at least one described first electrode conducting layer and at least one described second electrode conducting layer are both layers of copper.
A kind of circuit substrate for carrying luminescence component that the other embodiment of the utility model provides, it comprises: a dielectric base layer, a conductive radiating layer, an embedded insulating barrier, an embedded conductive layer, an insulating cover, a conductive line structure and run through conductive structure.Described conductive radiating layer is arranged on described dielectric base layer.Described embedded insulating barrier is arranged on described conductive radiating layer.Described embedded conductive layer is arranged on described embedded insulating barrier.Described insulating cover is arranged on described embedded conductive layer.Described conductive line structure comprises at least one first electrode conducting layer and at least one second electrode conducting layer, and wherein at least one described first electrode conducting layer and at least one described second electrode conducting layer to be all arranged on described insulating cover and a preset distance separated from one another.The described conductive structure that runs through comprises the electric conductor that at least one through hole and running through described insulating cover fills up at least one described through hole, and wherein at least one described through hole and described electric conductor are all connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them and described embedded conductive layer.Wherein, described luminescence component to be arranged on described conductive line structure and to be electrically connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer; At least one described first electrode conducting layer and at least one described second electrode conducting layer one of them by described electric conductor, to be electrically connected at described embedded conductive layer.
Described circuit substrate also comprises a reflecting coating further, described reflecting coating is arranged on described conductive line structure, at least one described first electrode conducting layer has and first conductive welding pad that go out exposed from described reflecting coating, at least one described second electrode conducting layer has and second conductive welding pad that go out exposed from described reflecting coating, and described luminescence component is electrically connected between described first conductive welding pad and described second conductive welding pad.
Wherein said conductive radiating layer is different material layers from described embedded conductive layer, described conductive radiating layer and described conductive line structure are different material layers, and described embedded conductive layer and described conductive line structure are identical material layer, wherein said dielectric base layer is layer of silica gel, described conductive radiating layer is aluminium lamination, described insulating cover is film, and described embedded conductive layer, at least one described first electrode conducting layer and at least one described second electrode conducting layer three are layers of copper.
It is a kind of for providing the ray structure of illumination that the other embodiment again of the utility model provides, it comprises: a circuit substrate and a luminescence unit, and wherein said circuit substrate comprises: a dielectric base layer, a conductive radiating layer, an insulating cover, a conductive line structure and run through conductive structure.Described conductive radiating layer is arranged on described dielectric base layer.Described insulating cover is arranged on described conductive radiating layer.Described conductive line structure comprises at least one first electrode conducting layer and at least one second electrode conducting layer, and wherein at least one described first electrode conducting layer and at least one described second electrode conducting layer to be all arranged on described insulating cover and a preset distance separated from one another.The described conductive structure that runs through comprises the electric conductor that at least one through hole and running through described insulating cover fills up at least one described through hole, and wherein at least one described through hole and described electric conductor are all connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them and described conductive radiating layer.Described luminescence unit comprises at least one luminescence component, and wherein at least one described luminescence component to be arranged on described conductive line structure and to be electrically connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer.Wherein, at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them by described electric conductor, to be electrically connected at described conductive radiating layer.
Described circuit substrate also comprises a reflecting coating further, described reflecting coating is arranged on described conductive line structure, at least one described first electrode conducting layer has and first conductive welding pad that go out exposed from described reflecting coating, at least one described second electrode conducting layer has and second conductive welding pad that go out exposed from described reflecting coating, and described luminescence component is electrically connected between described first conductive welding pad and described second conductive welding pad.
Wherein said conductive radiating layer and described conductive line structure are different material layers, wherein said dielectric base layer is layer of silica gel, described conductive radiating layer is aluminium lamination, described insulating cover is film, and at least one described first electrode conducting layer and at least one described second electrode conducting layer are both layers of copper.
The beneficial effects of the utility model can be, due to " the first electrode conducting layer and the second electrode conducting layer one of them can pass through electric conductor; to be electrically connected at conductive radiating layer or embedded conductive layer " design, so when luminescence component is electrically connected between the first electrode conducting layer and the second electrode conducting layer, the first electrode conducting layer and the second electrode conducting layer one of them can be supplied to luminescence component as electrically to guide or ground connection uses.
For further understanding feature of the present invention and technology contents, refer to following detailed description for the present invention and accompanying drawing, but accompanying drawing only provides reference and explanation use, is not used for being limited the present invention.
Accompanying drawing explanation
Fig. 1 for the utility model first embodiment disclose for providing the ray structure of illumination and the partial cutaway schematic view for the circuit substrate that carries luminescence component.
Fig. 2 for the utility model first embodiment disclose for providing the ray structure of illumination and the schematic top plan view for the circuit substrate that carries luminescence component.
Fig. 3 for the utility model second embodiment disclose for providing the ray structure of illumination and the partial cutaway schematic view for the circuit substrate that carries luminescence component.
The schematic side view for providing the ray structure of illumination to be applied to ceiling light that Fig. 4 discloses for first and second embodiment of the utility model.
The schematic side view for providing the ray structure of illumination to be applied to fan lamp that Fig. 5 discloses for first and second embodiment of the utility model.
Wherein, description of reference numerals is as follows:
Ray structure Z
Circuit substrate 1
Dielectric base layer 10
Conductive radiating layer 11
Insulating cover 12
Conductive line structure 13
First electrode conducting layer 131
First conductive welding pad 1310
Second electrode conducting layer 132
Second conductive welding pad 1320
Run through conductive structure 14
Through hole 140
Electric conductor 141
Reflecting coating 15
Embedded insulating barrier 16
Embedded conductive layer 17
Luminescence unit 2
Luminescence component 20
Ceiling light P1
Fan lamp P2
Live wire L
First live wire L1
Second live wire L2
Neutral line N
Earth connection G
Embodiment
Be below by particular specific embodiment to illustrate the utility model disclose execution mode about " for providing the ray structure of illumination and the circuit substrate for carrying luminescence component ", those of ordinary skill in the art can understand advantage of the present utility model and effect by content disclosed in the present specification.The utility model can be implemented by other different specific embodiments or be applied, and the every details in this specification also based on different viewpoints and application, can carry out various modification and change under not departing from spirit of the present utility model.In addition, accompanying drawing of the present utility model is only simply to be illustrated to illustrate, not according to the description of actual size, first gives explanation.Following execution mode will describe correlation technique content of the present utility model further in detail, but the content disclosed be not used to limit technology category of the present utility model.
(the first embodiment)
Refer to shown in Fig. 1 and Fig. 2, Fig. 1 for the utility model first embodiment disclose for providing the ray structure of illumination and the partial cutaway schematic view for the circuit substrate that carries luminescence component, and Fig. 2 for the utility model first embodiment disclose for providing the ray structure of illumination and the schematic top plan view for the circuit substrate that carries luminescence component.From in above-mentioned figure, the utility model first embodiment provides a kind of for carrying the circuit substrate 1 of luminescence component 20 (light-emitting diode of such as SMD type or other type), and it comprises: dielectric base layer 10, conductive radiating layer 11, insulating cover 12, conductive line structure 13 and runs through conductive structure 14.
First, as shown in Figure 1, conductive radiating layer 11 is arranged on dielectric base layer 10.Insulating cover 12 is arranged on conductive radiating layer 11.Conductive line structure 13 comprises at least one first electrode conducting layer 131 and at least one second electrode conducting layer 132, wherein the first electrode conducting layer 131 and the second electrode conducting layer 132 to be all arranged on insulating cover 12 and a preset distance separated from one another, with make the first electrode conducting layer 131 and the second electrode conducting layer 132 insulated from each other.Run through conductive structure 14 to comprise at least one through hole 140 and running through insulating cover 12 and to fill up completely or part fills up the electric conductor 141 of through hole 140, wherein through hole 140 and electric conductor 141 are all connected to both the first electrode conducting layer 131 and the second electrode conducting layer 132 between one of them and conductive radiating layer 11.In addition, one of them is understood by electric conductor 141, to be electrically connected at conductive radiating layer 11 for both the first electrode conducting layer 131 and the second electrode conducting layer 132.
For example, as shown in Figure 1, through hole 140 and electric conductor 141 are all connected between the second electrode conducting layer 132 and conductive radiating layer 11, and the second electrode conducting layer 132 is by electric conductor 141, to be electrically connected at conductive radiating layer 11.In addition, conductive radiating layer 11 is different material layers from conductive line structure 13, and such as conductive radiating layer 11 can be aluminium lamination, and the first electrode conducting layer 131 and the second electrode conducting layer 132 both can be layers of copper.Dielectric base layer 10 can be layer of silica gel, and insulating cover 12 can be PP (Prepreg, film or prepreg cloth).But the utility model is not limited with above-mentioned lifted example.
Further, as shown in Figure 1, the utility model also comprises further for the circuit substrate 1 carrying luminescence component 20: a reflecting coating 15 (such as can be solder mask or the welding resisting layer of white).Reflecting coating 15 is arranged on conductive line structure 13, wherein the first electrode conducting layer 131 has and first conductive welding pad 1310 that go out exposed from reflecting coating 15, second electrode conducting layer 132 has and second conductive welding pad 1320 that go out exposed from reflecting coating 15, and luminescence component 20 to be arranged on conductive line structure 13 and to be electrically connected between the first conductive welding pad 1310 of the first electrode conducting layer 131 and the second conductive welding pad 1320 of the second electrode conducting layer 132.In other words, the two opposition side ends due to luminescence component 20 can extend two conductive connecting pin (not shown) corresponded to each other respectively, so luminescence component 20 just can by two conductive connecting pin (not shown) to be electrically connected at the first conductive welding pad 1310 and the second conductive welding pad 1320 respectively.Certainly, luminescence component 20 also can be placed on reflecting coating 15.
Moreover, shown in same cooperation Fig. 1 and Fig. 2, the utility model first embodiment also provides a kind of for providing the ray structure Z of illumination in addition, it comprises: circuit substrate 1 and a luminescence unit 2, wherein circuit substrate 1 comprises: dielectric base layer 10, conductive radiating layer 11, insulating cover 12, conductive line structure 13 and runs through conductive structure 14, and luminescence unit 2 comprises at least one luminescence component 20 (luminescence component of such as SMD type).
First, as shown in Figure 1, conductive radiating layer 11 is arranged on dielectric base layer 10.Insulating cover 12 is arranged on conductive radiating layer 11.Conductive line structure 13 comprises at least one first electrode conducting layer 131 and at least one second electrode conducting layer 132, wherein the first electrode conducting layer 131 and the second electrode conducting layer 132 to be all arranged on insulating cover 12 and a preset distance separated from one another, with make the first electrode conducting layer 131 and the second electrode conducting layer 132 insulated from each other.Run through conductive structure 14 to comprise at least one through hole 140 and running through insulating cover 12 and to fill up completely or part fills up the electric conductor 141 of through hole 140, wherein through hole 140 and electric conductor 141 are all connected to both the first electrode conducting layer 131 and the second electrode conducting layer 132 between one of them and conductive radiating layer 11.
In addition, as shown in Figure 1, due to the design of " one of them (such as second electrode conducting layer 132) of both the first electrode conducting layer 131 and the second electrode conducting layer 132 can by electric conductor 141; to be electrically connected at conductive radiating layer 11 ", so when luminescence component 20 is electrically connected between the first electrode conducting layer 131 and the second electrode conducting layer 132, both the first electrode conducting layer 131 and the second electrode conducting layer 132 one of them (such as second electrode conducting layer 132) can be supplied to luminescence component 20 as electrically to guide or ground connection uses.
(the second embodiment)
Refer to shown in Fig. 3, Fig. 3 for the utility model second embodiment disclose for providing the ray structure of illumination and the partial cutaway schematic view for the circuit substrate that carries luminescence component.From in above-mentioned figure, the utility model second embodiment provides a kind of for carrying the circuit substrate 1 of luminescence component 20 (luminescence component of such as SMD type), and it comprises: embedded conductive layer 17, insulating cover 12, conductive line structure 13 and of dielectric base layer 10, conductive radiating layer 11, an one embedded insulating barrier 16, runs through conductive structure 14.
As shown in Figure 3, conductive radiating layer 11 is arranged on dielectric base layer 10.Embedded insulating barrier 16 is arranged on conductive radiating layer 11.Embedded conductive layer 17 is arranged on embedded insulating barrier 16.Insulating cover 12 is arranged on embedded conductive layer 17.Conductive line structure 13 comprises at least one first electrode conducting layer 131 and at least one second electrode conducting layer 132, wherein the first electrode conducting layer 131 and the second electrode conducting layer 132 to be all arranged on insulating cover 12 and a preset distance separated from one another, with make the first electrode conducting layer 131 and the second electrode conducting layer 132 insulated from each other.Run through conductive structure 14 to comprise at least one through hole 140 and running through insulating cover 12 and to fill up completely or part fills up the electric conductor 141 of through hole 140, wherein through hole 140 and electric conductor 141 are all connected to both the first electrode conducting layer 131 and the second electrode conducting layer 132 between one of them and embedded conductive layer 17.In addition, one of them is understood by electric conductor 141, to be electrically connected at embedded conductive layer 17 for both the first electrode conducting layer 131 and the second electrode conducting layer 132.
For example, as shown in Figure 3, through hole 140 and electric conductor 141 are all connected between the second electrode conducting layer 132 and embedded conductive layer 17, and the second electrode conducting layer 132 is by electric conductor 141, to be electrically connected at embedded conductive layer 17.In addition, conductive radiating layer 11 is different material layers from embedded conductive layer 17, and such as conductive radiating layer 11 can be aluminium lamination, and embedded conductive layer 17 then can be layers of copper.Conductive radiating layer 11 is different material layers from conductive line structure 13, and such as conductive radiating layer 11 can be aluminium lamination, and conductive line structure 13 then can be layers of copper.Embedded conductive layer 17 is identical material layer with conductive line structure 13, and such as embedded conductive layer 17, first electrode conducting layer 131 and the second electrode conducting layer 132 three can be layers of copper.In addition, dielectric base layer 10 can be layer of silica gel, and insulating cover 12 can be PP (Prepreg, film or prepreg cloth).But the utility model is not limited with above-mentioned lifted example.
Further, as shown in Figure 3, the utility model also comprises further for the circuit substrate 1 carrying luminescence component: a reflecting coating 15 (such as can be solder mask or the welding resisting layer of white).Reflecting coating 15 is arranged on conductive line structure 13, wherein the first electrode conducting layer 131 has and first conductive welding pad 1310 that go out exposed from reflecting coating 15, second electrode conducting layer 132 has and second conductive welding pad 1320 that go out exposed from reflecting coating 15, and luminescence component 20 to be arranged on conductive line structure 13 and to be electrically connected between the first conductive welding pad 1310 of the first electrode conducting layer 131 and the second conductive welding pad 1320 of the second electrode conducting layer 132.In other words, the two opposition side ends due to luminescence component 20 can extend two conductive connecting pin (not shown) corresponded to each other respectively, so luminescence component 20 just can by two conductive connecting pin (not shown) to be electrically connected at the first conductive welding pad 1310 and the second conductive welding pad 1320 respectively.Certainly, luminescence component 20 also can be placed on reflecting coating 15.
Moreover, coordinate shown in Fig. 2 and Fig. 3, the utility model second embodiment also provides a kind of for providing the ray structure Z of illumination in addition, it comprises: circuit substrate 1 and a luminescence unit 2, wherein circuit substrate 1 comprises: embedded conductive layer 17, insulating cover 12, conductive line structure 13 and of dielectric base layer 10, conductive radiating layer 11, an one embedded insulating barrier 16, runs through conductive structure 14, and luminescence unit 2 comprises at least one luminescence component 20 (luminescence component of such as SMD type).
First, as shown in Figure 3, conductive radiating layer 11 is arranged on dielectric base layer 10.Embedded insulating barrier 16 is arranged on conductive radiating layer 11.Embedded conductive layer 17 is arranged on embedded insulating barrier 16.Insulating cover 12 is arranged on embedded conductive layer 17.Conductive line structure 13 comprises at least one first electrode conducting layer 131 and at least one second electrode conducting layer 132, wherein the first electrode conducting layer 131 and the second electrode conducting layer 132 to be all arranged on insulating cover 12 and a preset distance separated from one another, with make the first electrode conducting layer 131 and the second electrode conducting layer 132 insulated from each other.Run through conductive structure 14 to comprise at least one through hole 140 and running through insulating cover 12 and to fill up completely or part fills up the electric conductor 141 of through hole 140, wherein through hole 140 and electric conductor 141 are all connected to both the first electrode conducting layer 131 and the second electrode conducting layer 132 between one of them and embedded conductive layer 17.
In addition, as shown in Figure 3, due to the design of " one of them (such as second electrode conducting layer 132) of both the first electrode conducting layer 131 and the second electrode conducting layer 132 can by electric conductor 141; to be electrically connected at embedded conductive layer 17 ", so when luminescence component 20 is electrically connected between the first electrode conducting layer 131 and the second electrode conducting layer 132, both the first electrode conducting layer 131 and the second electrode conducting layer 132 one of them (such as second electrode conducting layer 132) can be supplied to luminescence component 20 as electrically to guide or ground connection uses.
It should be noted that dielectric base layer 10 also can omit by the utility model second embodiment, and form another enforceable form.
It is worth mentioning that, provided by the utility model for providing the ray structure Z of illumination to can be applicable to ceiling light P1 (as shown in Figure 4) or fan lamp P2 (as shown in Figure 5), wherein ceiling light P1 can provide a live wire L, a neutral line N and an earth connection G, and fan lamp P2 can provide one for for providing the first live wire L1 of the ray structure Z of illumination, to be shared on neutral line N for the ray structure Z and fan providing illumination for the second live wire L2 and of fan (non-label).But the utility model is not limited with above-mentioned lifted example application.
(possible effect of embodiment)
In sum, the beneficial effects of the utility model can be, due to the design of " one of them is understood by electric conductor 141 for both the first electrode conducting layer 131 and the second electrode conducting layer 132; to be electrically connected at conductive radiating layer 11 or embedded conductive layer 17 ", so when luminescence component 20 is electrically connected between the first electrode conducting layer 131 and the second electrode conducting layer 132, both the first electrode conducting layer 131 and the second electrode conducting layer 132 one of them can be supplied to luminescence component 20 as electrically to guide or ground connection uses.
The foregoing is only better possible embodiments of the present utility model, non-ly therefore limit to the scope of the claims of the present utility model, therefore the equivalence techniques change of such as using the utility model specification and accompanying drawing content to do, be all contained in protection range of the present utility model.
Claims (9)
1. for carrying a circuit substrate for luminescence component, it is characterized in that, described circuit substrate comprises:
One dielectric base layer;
One conductive radiating layer, described conductive radiating layer is arranged on described dielectric base layer;
One insulating cover, described insulating cover is arranged on described conductive radiating layer;
One conductive line structure, described conductive line structure comprises at least one first electrode conducting layer and at least one second electrode conducting layer, and wherein at least one described first electrode conducting layer and at least one described second electrode conducting layer to be all arranged on described insulating cover and a preset distance separated from one another; And
One runs through conductive structure, the described conductive structure that runs through comprises the electric conductor that at least one through hole and running through described insulating cover fills up at least one described through hole, and wherein at least one described through hole and described electric conductor are all connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them and described conductive radiating layer;
Wherein, described luminescence component to be arranged on described conductive line structure and to be electrically connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer;
Wherein, at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them by described electric conductor, to be electrically connected at described conductive radiating layer.
2. as claimed in claim 1 for carrying the circuit substrate of luminescence component, it is characterized in that, also comprise further: a reflecting coating, described reflecting coating is arranged on described conductive line structure, at least one described first electrode conducting layer has and first conductive welding pad that go out exposed from described reflecting coating, at least one described second electrode conducting layer has and second conductive welding pad that go out exposed from described reflecting coating, and described luminescence component is electrically connected between described first conductive welding pad and described second conductive welding pad.
3. as claimed in claim 1 for carrying the circuit substrate of luminescence component, it is characterized in that, described conductive radiating layer and described conductive line structure are different material layers, wherein said dielectric base layer is layer of silica gel, described conductive radiating layer is aluminium lamination, described insulating cover is film, and at least one described first electrode conducting layer and at least one described second electrode conducting layer are both layers of copper.
4. for carrying a circuit substrate for luminescence component, it is characterized in that, described circuit substrate comprises:
One dielectric base layer;
One conductive radiating layer, described conductive radiating layer is arranged on described dielectric base layer;
One embedded insulating barrier, described embedded insulating barrier is arranged on described conductive radiating layer;
One embedded conductive layer, described embedded conductive layer is arranged on described embedded insulating barrier;
One insulating cover, described insulating cover is arranged on described embedded conductive layer;
One conductive line structure, described conductive line structure comprises at least one first electrode conducting layer and at least one second electrode conducting layer, and wherein at least one described first electrode conducting layer and at least one described second electrode conducting layer to be all arranged on described insulating cover and a preset distance separated from one another; And
One runs through conductive structure, the described conductive structure that runs through comprises the electric conductor that at least one through hole and running through described insulating cover fills up at least one described through hole, and wherein at least one described through hole and described electric conductor are all connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them and described embedded conductive layer;
Wherein, described luminescence component to be arranged on described conductive line structure and to be electrically connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer;
Wherein, at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them by described electric conductor, to be electrically connected at described embedded conductive layer.
5. as claimed in claim 4 for carrying the circuit substrate of luminescence component, it is characterized in that, also comprise further: a reflecting coating, described reflecting coating is arranged on described conductive line structure, at least one described first electrode conducting layer has and first conductive welding pad that go out exposed from described reflecting coating, at least one described second electrode conducting layer has and second conductive welding pad that go out exposed from described reflecting coating, and described luminescence component is electrically connected between described first conductive welding pad and described second conductive welding pad.
6. as claimed in claim 4 for carrying the circuit substrate of luminescence component, it is characterized in that, described conductive radiating layer is different material layers from described embedded conductive layer, described conductive radiating layer and described conductive line structure are different material layers, and described embedded conductive layer and described conductive line structure are identical material layer, wherein said dielectric base layer is layer of silica gel, described conductive radiating layer is aluminium lamination, described insulating cover is film, and described embedded conductive layer, at least one described first electrode conducting layer and at least one described second electrode conducting layer three are layers of copper.
7. for providing a ray structure for illumination, it is characterized in that, described ray structure comprises:
One circuit substrate, described circuit substrate comprises:
One dielectric base layer;
One conductive radiating layer, described conductive radiating layer is arranged on described dielectric base layer;
One insulating cover, described insulating cover is arranged on described conductive radiating layer;
One conductive line structure, described conductive line structure comprises at least one first electrode conducting layer and at least one second electrode conducting layer, and wherein at least one described first electrode conducting layer and at least one described second electrode conducting layer to be all arranged on described insulating cover and a preset distance separated from one another; And
One runs through conductive structure, the described conductive structure that runs through comprises the electric conductor that at least one through hole and running through described insulating cover fills up at least one described through hole, and wherein at least one described through hole and described electric conductor are all connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them and described conductive radiating layer; And
One luminescence unit, described luminescence unit comprises at least one luminescence component, and wherein at least one described luminescence component to be arranged on described conductive line structure and to be electrically connected between at least one described first electrode conducting layer and at least one described second electrode conducting layer;
Wherein, at least one described first electrode conducting layer and at least one described second electrode conducting layer one of them by described electric conductor, to be electrically connected at described conductive radiating layer.
8. as claimed in claim 7 for providing the ray structure of illumination, it is characterized in that, described circuit substrate also comprises a reflecting coating further, described reflecting coating is arranged on described conductive line structure, at least one described first electrode conducting layer has and first conductive welding pad that go out exposed from described reflecting coating, at least one described second electrode conducting layer has and second conductive welding pad that go out exposed from described reflecting coating, and described luminescence component is electrically connected between described first conductive welding pad and described second conductive welding pad.
9. as claimed in claim 7 for providing the ray structure of illumination, it is characterized in that, described conductive radiating layer and described conductive line structure are different material layers, wherein said dielectric base layer is layer of silica gel, described conductive radiating layer is aluminium lamination, described insulating cover is film, and at least one described first electrode conducting layer and at least one described second electrode conducting layer are both layers of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420623440.8U CN204216093U (en) | 2014-10-24 | 2014-10-24 | For providing the ray structure of illumination and the circuit substrate for carrying luminescence component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420623440.8U CN204216093U (en) | 2014-10-24 | 2014-10-24 | For providing the ray structure of illumination and the circuit substrate for carrying luminescence component |
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| Publication Number | Publication Date |
|---|---|
| CN204216093U true CN204216093U (en) | 2015-03-18 |
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| CN201420623440.8U Active CN204216093U (en) | 2014-10-24 | 2014-10-24 | For providing the ray structure of illumination and the circuit substrate for carrying luminescence component |
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| CN (1) | CN204216093U (en) |
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2014
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