CN112822380A

CN112822380A - Photosensitive chip, packaging structure, manufacturing method of photosensitive chip, camera module and electronic equipment

Info

Publication number: CN112822380A
Application number: CN202110163110.XA
Authority: CN
Inventors: 穆江涛; 刘秀; 申成哲
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Nanchang OFilm Tech Co Ltd; Nanchang OFilm Optoelectronics Technology Co Ltd
Priority date: 2021-01-22
Filing date: 2021-02-05
Publication date: 2021-05-18
Also published as: CN215451414U; CN214381086U; CN214848643U; CN113161430A; CN214851432U; CN112995480A; WO2022156032A1

Abstract

The application relates to a photosensitive chip, a packaging structure, a manufacturing method of the photosensitive chip, a camera module and electronic equipment. The photosensitive chip and the packaging structure comprise a circuit board, a photosensitive chip, an adhesive, a light-transmitting sheet, a conductive connecting line and a filling body. The photosensitive chip is arranged on one side of the circuit board along the optical axis direction, the photosensitive chip is provided with a photosensitive surface far away from the circuit board and a first side surface connected with the photosensitive surface, and the photosensitive surface is provided with a main area and an edge area positioned on the periphery of the main area; the adhesive is at least partially arranged on the edge area; the light-transmitting sheet is arranged on one side of the adhesive, which is far away from the edge area, is supported by the adhesive and is fixed on one side of the photosensitive chip, which is far away from the circuit board, and is provided with a first surface, which is close to the photosensitive chip, and a second surface, which is positioned on the opposite side of the first surface; one end of the conductive connecting wire is coated by the adhesive and is electrically connected with the edge area, and the other end of the conductive connecting wire is electrically connected with the circuit board; the filler is at least encapsulated on the first side surface.

Description

Photosensitive chip, packaging structure, manufacturing method of photosensitive chip, camera module and electronic equipment

Technical Field

The application relates to the technical field of optical imaging, in particular to a photosensitive chip, a packaging structure, a manufacturing method of the photosensitive chip, a camera module and electronic equipment.

Background

The module of making a video recording is as important formation of image instrument, and its range of application constantly expands, has been used widely in civilian, for military use fields such as mobile terminal, car, unmanned aerial vehicle, robot, intelligent house, video security protection, AR at present. The camera module generally includes a lens, a photo sensor chip and a package structure, wherein the photo sensor chip is packaged and fixed by the package structure and is disposed corresponding to the lens, so as to receive light from an object side from the lens to generate an image signal. However, how to achieve effective packaging of the photosensitive chip is an important issue in the industry.

Disclosure of Invention

In view of the above, it is desirable to provide a photosensitive chip and a package structure, a method for manufacturing the same, a camera module, and an electronic device.

In a first aspect, an embodiment of the present application provides a photosensitive chip and a package structure, which includes

A circuit board;

the photosensitive chip is arranged on one side of the circuit board along the direction of an optical axis, the photosensitive chip is provided with a photosensitive surface far away from the circuit board and a first side surface connected with the photosensitive surface, and the photosensitive surface is provided with a main area and an edge area positioned on the periphery of the main area;

an adhesive at least partially disposed in the edge region;

the light-transmitting sheet is arranged on one side, away from the edge area, of the adhesive, is supported by the adhesive and is fixed on one side, away from the circuit board, of the photosensitive chip, and is provided with a first surface adjacent to the photosensitive chip and a second surface located on the opposite side of the first surface;

one end of the conductive connecting wire is coated by the adhesive and is electrically connected with the edge area, and the other end of the conductive connecting wire is electrically connected with the circuit board;

the filler is at least encapsulated on the first side surface.

In the photosensitive chip and the packaging structure provided by the embodiment of the application, the adhesive can protect the conductive connecting wire and the main area from being corroded by water vapor and/or air oxidation on the one hand, and on the other hand can support the light-transmitting sheet, and can avoid the direct contact between the conductive connecting wire and the light-transmitting sheet, avoid the light-transmitting sheet from generating scratches and further generating stray light and influencing the light sensing of the photosensitive chip, ensure the optical imaging quality of the camera module, and simultaneously can prevent the light-transmitting sheet from being inclined due to the direct contact between the light-transmitting sheet and the conductive wire. Therefore, the photosensitive chip and the photosensitive chip in the packaging structure can be effectively packaged through the adhesive and the filler, and meanwhile, the adhesive and the filler are also beneficial to enhancing the strength of the whole structure. In addition, the adhesive can cover one end of the conductive connecting line, namely, the adhesive and one end of the conductive connecting line are overlapped when viewed along the optical axis, so that the width of an edge area occupied by the adhesive and one end of the conductive connecting line can be smaller, namely, the size of the edge area can be reduced, the occupation ratio of a main area can be higher, and the occupation ratio of the main area (such as a photosensitive area) of the photosensitive chip and the reduction of the size of the photosensitive chip can be improved.

In one embodiment, the edge region is an annular region, and the adhesive is disposed along the edge region and is annular; the first side face is an annular side face, and the filling body is arranged along the first side face and is annular. It will be appreciated that the annular edge region and the adhesive may provide a better seal against corrosion and oxidation of the conductive traces and main region by moisture and/or air. The annular first side surface and the filling body further realize better sealing performance, and effectively prevent water vapor and/or air from corroding and oxidizing the conductive connecting line and the main area.

In one embodiment, the thickness of the adhesive in the direction of the optical axis is in the range of 25um to 300 um. It will be appreciated that the above thicknesses of adhesive are beneficial for achieving better holding and support strength

In one embodiment, when viewed in the optical axis direction, an outer side surface of the adhesive on a side away from the main area is flush with the first side surface, an outer side surface of the adhesive on a side away from the main area is at least partially located inside the first side surface, or an outer side surface of the adhesive on a side away from the main area is located outside the first side surface. It can be understood that, when viewed along the optical axis direction, the outer side surface of the side of the adhesive away from the main area is flush with the first side surface, so that the filling body can be easily packaged on the first side surface. Seen along the optical axis direction, the lateral surface that main area one side was kept away from to the adhesive is located the inboard of first side, and the adhesive is for first side indent promptly, and the obturator can encapsulate lateral surface, marginal area and the first surface of printing opacity piece of adhesive, has increased the obturator and has just played the block effect with the area of contact of adhesive, marginal area and printing opacity piece, has improved the structural strength who increases sensitization chip and packaging structure. Seen along the optical axis direction, the outer side face, away from one side of the main area, of the adhesive is located on the outer side of the first side face, namely, the adhesive protrudes out of the first side face, the filler can encapsulate the outer side face of the adhesive and two surfaces connected with the outer side face, the contact area of the filler and the adhesive is increased, the clamping effect is achieved, and the structural strength of the photosensitive chip and the packaging structure is improved.

In one embodiment, a second side surface of the light-transmitting sheet adjacent to the position of the conductive connection line is flush with the adjacent first side surface or is farther away from the optical axis relative to the adjacent first side surface, where the second side surface is a surface of the light-transmitting sheet connected between the first surface and the second surface. It can be understood that the above design is beneficial to increase the contact area between the adhesive and the light-transmitting sheet and between the adhesive and the photosensitive chip, so as to increase the adhesive force between the first surface of the light-transmitting sheet and the first side surface of the photosensitive chip, and make the adhesive fixation between the light-transmitting sheet and the photosensitive chip more firm.

In one embodiment, a second side surface of the light-transmitting sheet adjacent to the position of the conductive connecting line is farther away from the optical axis than the adjacent first side surface, and at least a portion of one side of the adhesive, which is far away from the main region, is adhered to a portion, protruding out of the first side surface, of a first surface of the light-transmitting sheet and is outside the first side surface, protruding out of the first side surface, of the light-transmitting sheet, and the first side surface is adjacent to the portion, protruding out of the first side surface, of the first surface, wherein the second side surface is a surface, connected between the first surface and the second surface, of the light-transmitting sheet. It can be understood that above-mentioned design is favorable to increasing the area of contact of adhesive and printing opacity piece and sensitization chip and plays the effect that the block bonded, makes the fixed more firm of adhesion between printing opacity piece and the sensitization chip, has also improved the structural strength who increases sensitization chip and packaging structure.

In one embodiment, the second side surface of the light-transmitting sheet is farther from the optical axis than the adjacent first side surface, and at least a portion of one side of the adhesive, which is far from the main area, is adhered to the outer side of the first side surface and a portion of the first surface of the light-transmitting sheet, which protrudes from the first side surface, as viewed in the direction of the optical axis. It can be understood that above-mentioned design also makes the area of contact of adhesive and printing opacity piece and sensitization chip great, can play the effect that the block bonded, makes the adhesion between printing opacity piece and the sensitization chip fixed more firm, has also improved the structural strength who increases sensitization chip and packaging structure.

In one embodiment, an outer side surface of the adhesive on a side away from the main region is located outside the first side surface as viewed in the optical axis direction, the adhesive includes a first portion located between the edge region and the light-transmitting sheet and a second portion protruding outside the first side surface and connected to the first portion,

the second portion is flush with the first portion as viewed in a direction perpendicular to the optical axis; or

At least part of the second portion covers the first side surface, a second side surface of the light-transmitting sheet connected between the first surface and the second surface, or the first side surface and a second side surface of the light-transmitting sheet connected between the first surface and the second surface.

It can be understood that the filling body can encapsulate the outer side surface of the adhesive and two surfaces of the second part connected with the outer side surface, so that the contact area of the filling body and the adhesive is increased, the clamping effect is realized, and the structural strength of the photosensitive chip and the packaging structure is improved.

In one embodiment, the filling body is further encapsulated on the outer side surface of the side of the adhesive away from the main area and/or the second side surface of the light-transmitting sheet connected between the first surface and the second surface. It can be understood that the filling body can realize better sealing performance and effectively prevent the corrosion and oxidation of water vapor and/or air to the conductive connecting wire and the photosensitive chip.

In one embodiment, both ends of the conductive connecting wire are provided with a wire body and welding materials wrapping the wire body. The welding point formed by the welding material can ensure effective electric connection between the conductive connecting line and the edge area and between the conductive connecting line and the circuit board, the welding process is mature and simple, the reliability of the product can be improved, and the cost is not increased basically.

In one embodiment, the conductive connecting line includes a first conducting wire segment at least partially located in the adhesive, a second conducting wire segment connecting the first conducting wire segment and the circuit board, and the filling body is encapsulated on an outer side surface of the adhesive on a side away from the main area, wherein,

the first lead wire segment and the second lead wire segment are wrapped by the filling body; or

The filler body wraps at least parts of the first conducting wire segment and the second conducting wire segment, so that at least parts of the first conducting wire segment and the second conducting wire segment extend out of the filler body.

It can be understood that the above design is favorable for flexibly designing the filling body, and the adaptability of the photosensitive chip, the packaging structure and the camera module is improved according to different application requirements.

In one embodiment, an included angle between a portion of the first wire segment connected to the edge region and a direction along the optical axis and pointing to the light-transmitting sheet of the photosensitive chip is an acute angle, and an included angle between the second wire segment and the first wire segment is an acute angle or a right angle. It can be understood that the angle design is favorable for enabling the ratio of the whole length of the conductive connecting line to the linear distance between the positions of the two ends of the conductive connecting line to be larger, namely enabling the conductive connecting line to have larger movement allowance, thereby being favorable for reducing the stress of the conductive connecting line, avoiding the conditions of conductive connecting line fracture and the like caused by larger stress and prolonging the service life of the conductive connecting line.

In one embodiment, a partition is arranged between the photosensitive chip and the circuit board for reinforcing and/or dissipating heat. It will be appreciated that the overall structural strength and/or heat dissipation may be enhanced by the baffles.

In a second aspect, an embodiment of the present application further provides a camera module, where the lens includes the sensor chip and the package structure of any of the above embodiments, and a lens disposed on an object side of the sensor chip and the package structure.

In a third aspect, an embodiment of the present application further provides an electronic device, where the electronic device includes the camera module according to the foregoing embodiment.

The electronic equipment that this application embodiment provided and module of making a video recording have any one of the above-mentioned embodiment sensitization chip and packaging structure, wherein, the adhesive can protect electrically conductive line and main region not receive steam and/or air oxidation on the one hand and corrode, and on the other hand can support the printing opacity piece, and can avoid electrically conductive line direct and printing opacity piece contact, avoids making the printing opacity piece produce the mar and then produce stray light and influence the light sensing of sensitization chip, guarantees the optical imaging quality of module of making a video recording. Therefore, the photosensitive chip and the photosensitive chip in the packaging structure can be effectively packaged through the adhesive and the filler, and meanwhile, the adhesive and the filler are also beneficial to enhancing the strength of the whole structure. In addition, the adhesive can cover one end of the conductive connecting line, namely, the adhesive and one end of the conductive connecting line are overlapped when viewed along the optical axis, so that the width of an edge area occupied by the adhesive and one end of the conductive connecting line can be smaller, namely, the size of the edge area can be reduced, the occupation ratio of a main area can be higher, and the occupation ratio of the main area (such as a photosensitive area) of the photosensitive chip and the reduction of the size of the photosensitive chip can be improved. In addition, the electronic device and the camera module also have other beneficial effects of the photosensitive chip and the package structure of any of the above embodiments, and the beneficial effects of the photosensitive chip and the package structure are explained in detail, so that no further description is given here.

In a fourth aspect, an embodiment of the present application further provides a method for manufacturing a photosensitive chip and a package structure, including the following steps:

providing a circuit board;

arranging a photosensitive chip on one side of the circuit board, wherein the photosensitive chip is provided with a photosensitive surface far away from the circuit board and a first side surface connected with the photosensitive surface, and the photosensitive surface is provided with a main area and an edge area positioned at the periphery of the main area;

electrically connecting a conductive wire between the edge region and the circuit board;

arranging an adhesive in the edge area and coating one end of the conductive connecting line, and arranging the light-transmitting sheet on one side of the adhesive, which is far away from the photosensitive chip;

and encapsulating the filling body at least at the first side face.

In the manufacturing method of the photosensitive chip and the packaging structure provided by the embodiment of the application, the adhesive can protect the conductive connecting wire and the main area from being oxidized and corroded by water vapor and/or air on the one hand, and can support the light-transmitting sheet on the other hand, and can avoid the direct contact between the conductive connecting wire and the light-transmitting sheet, so that the light-transmitting sheet is prevented from generating scratches, stray light is prevented from being generated, light sensing of the photosensitive chip is prevented from being influenced, and the optical imaging quality of the camera module is ensured. Therefore, the photosensitive chip and the photosensitive chip in the packaging structure can be effectively packaged through the adhesive and the filler, and meanwhile, the adhesive and the filler are also beneficial to enhancing the strength of the whole structure. In addition, the adhesive can cover one end of the conductive connecting line, namely, the adhesive and one end of the conductive connecting line are overlapped when viewed along the optical axis, so that the width of an edge area occupied by the adhesive and one end of the conductive connecting line can be smaller, namely, the size of the edge area can be reduced, the occupation ratio of a main area can be higher, and the occupation ratio of the main area (such as a photosensitive area) of the photosensitive chip and the reduction of the size of the photosensitive chip can be improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a cross-sectional view of a related art camera module;

fig. 2 is a perspective view of a camera module according to a first embodiment of the present application;

fig. 3 is an exploded perspective view of a camera module according to an embodiment of the present disclosure;

fig. 4 is a cross-sectional view of a camera module according to an embodiment of the present application;

fig. 5 is a flowchart of a method for manufacturing a photo sensor chip and a package structure of a camera module according to an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram illustrating steps of a method for manufacturing the sensor chip and the package shown in FIG. 5;

fig. 7 is a cross-sectional view of a camera module according to a second embodiment of the present application;

fig. 8 is a cross-sectional view of a camera module according to a third embodiment of the present application;

fig. 9 is a cross-sectional view of a camera module according to the fourth embodiment of the present application;

fig. 10 is a cross-sectional view of a camera module according to a fifth embodiment of the present application;

fig. 11 is a cross-sectional view of a camera module according to a sixth embodiment of the present application;

fig. 12 is a cross-sectional view of a camera module according to a seventh embodiment of the present application;

fig. 13 is a cross-sectional view of an image pickup module according to an eighth embodiment of the present application;

fig. 14 is a cross-sectional view of a camera module according to a ninth embodiment of the present application;

fig. 15 is a block diagram of an electronic device provided in an embodiment of the present application.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In a related art camera module 100 ', as shown in fig. 1, a photosensitive chip 220 ' is disposed on a circuit board 210 ', a non-photosensitive region 224 ' at an edge of the photosensitive chip 220 ' has a supporting material 240, a transparent sheet 230 ' is fixed on the supporting material 240 ', the non-photosensitive region 224 ' at the periphery of the supporting material 240 ' is further provided with an electrical connection end 226 ', and the electrical connection end 226 ' can be connected to the circuit board 210 ' through a conductive connection line 250 '.

However, as the photosensitive chip 220 'is miniaturized, the area of the non-photosensitive region 224' is reduced, and when the area of the non-photosensitive region 224 'is limited, in order to prevent moisture and dust from entering the photosensitive region 222', on one hand, the non-photosensitive region is fixed to the transparent sheet 230 'by manufacturing the supporting material 240' with a thickness greater than 250um, on the other hand, the supporting material 240 'is too close to the end of the conductive connection wire 250' of the non-photosensitive region 224 ', which is connected to the electrical connection end 226', which is likely to cause damage to the conductive connection wire 250 'and the electrical connection end 226', and on the other hand, the process of the supporting material 240 'conflicts with the bonding process of the conductive connection wire 250', which is difficult to implement in the conventional process.

The photosensitive chip, the package structure, the camera module and the electronic device provided by the embodiment of the present application are further described in detail with reference to the accompanying drawings.

Example one

As shown in fig. 2 to 4, fig. 2 is a perspective view of a camera module 100 according to a first embodiment of the present disclosure, fig. 3 is an exploded perspective view of the camera module 100 according to the first embodiment of the present disclosure, and fig. 4 is a cross-sectional view of the camera module 100 according to the first embodiment of the present disclosure, which is also a cross-sectional view of the camera module 100 along a line IV-IV shown in fig. 1. The camera module 100 according to the first embodiment of the present disclosure includes a photo sensor chip and package structure 200, a lens 300, and a housing 400. The lens 300 is mounted on the housing 400, and at least a portion of the light sensing chip and the package structure 200 is received in the housing 400.

Specifically, one side of the housing 400 may have a first mounting opening 412. The lens 300 is mounted on the housing 400 corresponding to the first mounting opening 412. The other side of the housing 400 may have a second mounting opening 422. The photo sensor chip and package structure 200 is mounted corresponding to the second mounting opening 422 and disposed corresponding to the lens 300 for receiving the object-side light provided by the lens 300. It is understood that the lens 300 may be fixed to the first mounting opening 412, at least a portion of the lens 300 may be located in the first mounting opening 412 and/or the housing 400, and at least a portion of the photo sensor chip and the package structure 200 may be located in the housing 400.

Further, the housing 400 may include a mounting plate 410 and a sidewall structure 420, the mounting plate 410 has a first mounting opening 412 therethrough, the lens 300 includes a first portion 310, a connecting portion 330 and a second portion 320 connected in sequence along the optical axis L of the camera module 100, the second portion 320 is located in the first mounting opening 412, the connecting portion 330 and the first portion 310 extend out of the housing 400, and an outer diameter of the connecting portion 330 may be larger than a diameter of the first mounting opening 412, so that the connecting portion 330 may be clamped to an outer side of the mounting plate 410, and specifically, a first annular seal 510 may be provided between the connecting portion 330 and the mounting plate 410, so that the lens 300 may be sealingly connected with the housing 400. A second annular sealing member 520 may be disposed between an end of the sidewall structure 420 away from the mounting board 410 and the photo sensor chip and package structure 200, so that the housing 400 and the photo sensor chip and package structure 200 can be hermetically connected. The material of the first annular seal 510 and the second annular seal 520 may be the same, such as a sealant, but is not limited to the above.

The lens 300 may include lenses and a lens barrel for accommodating and mounting the lenses, and it is understood that the number of the lenses may be one, two or more, which is not limited in this application. In other embodiments, the lens 300 may include a lens, and the lens barrel may be omitted when the lens is mounted in the first mounting opening 412.

Specifically, the photo sensor chip and package structure 200 includes a circuit board 210, a photo sensor chip 220, a light-transmitting sheet 230, an adhesive 240, a conductive wire 250, and a filling body 260.

The photosensitive chip 220 is disposed on the circuit board 210 and located on one side of the circuit board 210. The light sensing chip 220 has a light sensing surface 220a away from the circuit board 210 and a first side 220b connected to the light sensing surface 220a, and the light sensing surface 220a has a main region 222 and an edge region 224 located at the periphery of the main region 222. The adhesive 240 is at least partially disposed on the edge region 224. The light-transmitting sheet 230 is disposed on a side of the adhesive 240 away from the light-sensing chip 220, and the light-transmitting sheet 230 is supported and fixed by the adhesive 240 on a side of the light-sensing chip 220 away from the circuit board 210, the light-transmitting sheet 230 having a first surface 232 adjacent to the light-sensing chip 220 and a second surface 234 opposite to the first surface 232. One end of the conductive wire 250 is covered by the adhesive 240 and electrically connected to the edge region 224, and a space may be provided between the light-transmitting sheet 230 and the portion of the conductive wire 250 on the first surface so as to prevent the conductive wire 250 from contacting the light-transmitting sheet 230, and the other end of the conductive wire 250 is electrically connected to the circuit board 210. The filling body 260 is at least encapsulated at the first side 220b of the photosensitive chip 220.

It can be understood that, compared to the related art, in the photo sensor chip and package structure 200, the adhesive 240 can protect the conductive connecting line 250 and the main region 222 from being oxidized and corroded by water vapor and/or air, and can support the light-transmitting sheet 230, and prevent the conductive connecting line 250 from directly contacting the light-transmitting sheet 230, so as to prevent the light-transmitting sheet 230 from generating scratches, thereby generating stray light and affecting the light sensing of the photo sensor chip 220, and thus ensuring the optical imaging quality of the camera module 100. It can be seen that the photosensitive chip can be effectively packaged by the adhesive 240 and the filling body 260, and at the same time, the adhesive 240 and the filling body 260 also contribute to enhancing the overall structural strength. In addition, since the adhesive 240 can cover one end of the conductive connection line 250, that is, the adhesive 240 and one end of the conductive connection line 250 overlap each other when viewed along the optical axis L, and thus the width of the edge region 224 occupied by the adhesive 240 and one end of the conductive connection line 250 can be smaller, that is, the size of the edge region 224 can be reduced, the occupation ratio of the main region 222 can be higher, which is beneficial to increasing the occupation ratio of the main region 222 (e.g., photosensitive region) of the photosensitive chip 220 and the reduction in size of the photosensitive chip 220.

Further, the rim area 224 may be a closed loop shape, and the adhesive 240 is disposed along the rim area 224 and is also a closed loop shape. The first side 220b is a closed ring-shaped side, and the filling body 260 is disposed along the first side 220b and also has a closed ring shape. It will be appreciated that the annular edge region 224 and the adhesive 240 can achieve better sealing, effectively prevent corrosion and oxidation of the conductive traces 250 and the main region 222 by moisture and/or air, and prevent dust from entering and contaminating the main region 222. The annular first side surface 220b and the filling body 260 further achieve better sealing performance, effectively prevent water vapor and/or air from corroding and oxidizing the conductive connecting line 250 and the main region 222, and prevent dust from entering and polluting the main region 222.

Further, the thickness of the adhesive 240 along the direction of the optical axis L may be in a range of 25um to 300um, and the adhesive 240 with the above thickness is favorable for achieving better fixing and supporting strength. The width of the adhesive 240 in a direction perpendicular to the optical axis L may be in a range of 150um to 600 um. Specifically, the edge of the adhesive 240 on the side close to the main region 22 and the outer edge of the main region 222 may have a predetermined interval in a direction perpendicular to the optical axis L, wherein the width of the predetermined interval may be greater than or equal to 100 um. The adhesive 240 may be DAM glue (i.e., rail glue) or other glue that is easily formed and releases controllably. In this embodiment, when viewed along the direction of the optical axis L, the outer side surface 242 of the adhesive 240 away from the main region 222 may be flush with the first side surface 220 b. However, in a modified embodiment, the outer side of the adhesive 240 away from the main region 222 may be at least partially located inside the first side 220 b. When viewed along the direction of the optical axis L, the outer side surface 242 of the adhesive 240 on the side away from the main region 222 is located inside the first side surface 220b, that is, the adhesive 240 is recessed relative to the first side surface 220b, and the filling body 260 can encapsulate the outer side surface 242 of the adhesive 240, the edge region 224 and the first surface of the light-transmitting sheet 230, so that the contact area between the filling body 260 and the adhesive 240, the edge region 224 and the light-transmitting sheet 230 is increased, and the clamping effect is achieved, thereby improving the structural strength of the photosensitive chip and the package structure 10. In addition, in some embodiments, the same material may be used for the adhesive 240 and the filling body 260.

The photosensitive chip 220 may be rectangular, the main region 222 may be a photosensitive region and may also be rectangular, and the edge region 224 may be a non-photosensitive region and may be a rectangular ring. The light-transmitting sheet 230 is disposed corresponding to the photo sensor chip 220 and also has a rectangular shape. It can be understood that the photosensitive chip 220, the main area 222 and the light-transmitting sheet 230 are all rectangular, and not only can be adapted to the requirements of the existing electronic equipment to shoot rectangular images suitable for being played by a rectangular screen of the electronic equipment, but also have the advantage of higher utilization rate compared with photosensitive chips in other shapes.

The photosensitive chip 220 may be adhered to the circuit board 210 by an adhesive. The light sensing chip 220 may be an image sensor for converting the object-side light received through the light transmissive sheet 230 into an image signal. Further, in the photosensitive chip 220, the edge region 224 may be provided with a first connection terminal 226. The first connection end 226 is used for electrically connecting the photosensitive chip 220 with the circuit board 210 through a conductive wire 250. The number of the first connection ends 226 may be plural, and a plurality of the first connection ends 226 may be arranged around four sides of the edge region 224 or along two opposite sides of the edge region 224. In an alternative embodiment, the plurality of first connection ends 226 may also be disposed on one or three sides of the edge region 224, and the design may be specific according to actual requirements.

The light-transmissive plate 230 can be a light filter, and in particular, in some embodiments, the light-transmissive plate 230 can be a light-transmissive plate (such as blue glass) with an infrared filtering function, and in other embodiments, it can also include a light-transmissive substrate, or a light-transmissive substrate and an infrared filter film attached to the light-transmissive substrate. In addition, the light-transmitting sheet 230 may also be a common light-transmitting layer, a light-transmitting film, a light-transmitting plate, or the like, and the material may include resin, acryl, or the like.

Further, in some embodiments, the light transmissive sheet 230 may also be a film with a single light transmissive property, such as a single light transmissive region. In other embodiments, the light-transmissive sheet 230 may also be a film having a plurality of light-transmissive regions with different light-transmissive properties, for example, the plurality of different light-transmissive regions may have different materials and/or thicknesses, etc., so that the plurality of different light-transmissive regions have different light-transmissive functions (e.g., different filtering properties).

In some embodiments, the second side surface 236 of the light-transmitting sheet 230 adjacent to the position of the conductive connection line 250 is flush with the adjacent first side surface 220b, or the second side surface 236 of the light-transmitting sheet 230 adjacent to the position of the conductive connection line 250 may be farther from the optical axis L than the adjacent first side surface 220b, for example, when viewed along the optical axis L, the area of the projection of the light-transmitting sheet 230 on the circuit board 210 may be equal to or larger than the area of the projection of the photosensitive chip 220 in the direction of the circuit board 210. In particular, when the second side surface 236 of the light-transmitting sheet 230 is farther from the optical axis L than the adjacent first side surface 220b, and when the area of the projection of the light-transmitting sheet 230 on the circuit board 210 may be equal to or larger than the area of the projection of the photosensitive chip 220 on the circuit board 210 as viewed along the direction of the optical axis L, at least a portion of the adhesive 240 on the side away from the main region 222 may be adhered to the outer side of the first side surface 220b and a portion of the first surface 232 of the light-transmitting sheet 230 protruding from the first side surface 220b as viewed along the direction of the optical axis L. The above design makes the contact area between the light-transmitting sheet 230 and the adhesive 240 when the adhesive 240 overflows, and also can play a role of clamping and bonding, so that the light-transmitting sheet 230 and the photosensitive chip 220 are more firmly adhered and fixed, and the structural strength of the photosensitive chip and the packaging structure 100 is improved. .

In still other embodiments, when the second side surface 236 of the light-transmitting sheet 230 adjacent to the position of the conductive connection line 250 is farther away from the optical axis L than the adjacent first side surface 220b, at least a portion of the adhesive 240 away from the main region 222 may be adhered to a portion of the first surface 232 of the light-transmitting sheet 230 protruding from the first side surface 220b and an outer side of the first side surface 220b adjacent to the portion of the first surface 232 protruding from the first side surface 220b, as viewed along the optical axis L. It can be understood that the above design makes the contact area between the adhesive 240 and the light-transmitting sheet 230 and the photo sensor chip 220 larger, so that the adhesion and fixation between the light-transmitting sheet 230 and the photo sensor chip 220 are firmer, and the structural strength of the photo sensor chip and the package structure 100 is also improved.

The conductive wire 250 may be a conductive metal wire (e.g., a copper wire). The conductive wires 250 correspond to the first connection terminals 226, i.e., each of the first connection terminals 226 may connect to a corresponding at least one of the conductive wires 250. In this embodiment, the number of the conductive connection lines 250 is the same as that of the first connection terminals 226, and each first connection terminal 226 is connected to a corresponding one of the conductive connection lines 250. Wherein. The adhesive 240 may completely cover the first connection end 226.

The circuit board 210 may be a printed circuit board, but is not limited to a printed circuit board, a rigid-flex circuit board, or a flexible printed circuit board. It can be understood that, when the circuit board 210 is a flexible circuit board, the camera module 100 may further include a support structure such as a stiffener disposed on a side of the circuit board 210 away from the photo sensor chip 220, so as to ensure the overall strength of the camera module 100.

The surface 210a of the circuit board 210 adjacent to the photosensitive chip 220 has a carrying region 212 and a peripheral region 214 located at the periphery of the carrying region 212, and the peripheral region 214 is provided with a second connection terminal 216. The second connecting terminal 216 is used to connect one end of the conductive wire 250 away from the photo sensor chip 220 to electrically connect the circuit board 210 with the photo sensor chip 220. The number of the second connection terminals 216 may be a plurality and equal to the number of the first connection terminals 226, and each of the second connection terminals 216 may be connected to the first connection terminal 226 by at least one conductive connection line 250. The plurality of second connection ends 216 may be annularly disposed along the peripheral region 214, however, in an alternative embodiment, the plurality of second connection ends 216 may also be disposed on two opposite sides of the peripheral region 214, or disposed on one side of the peripheral region 214, and may be specifically designed according to actual requirements.

The conductive wire 250 may be divided into a first wire segment 252 at least partially disposed in the adhesive 240 and a second wire segment 254 connected between the first wire segment 252 and the circuit board 210. The first wire segment 252 is substantially a straight line segment and extends toward the outside far away from the photo sensor chip 220, and the second wire segment 254 is substantially a straight line segment and extends from one end of the first wire segment 252 toward the side where the circuit board 210 is located. Specifically, the second wire segment 254 may be connected with the first wire segment 252 in a bent manner. The portion of the first wire segment 252 connecting the edge region 224 and the direction along the optical axis L and directed from the light sensing chip 220 to the light transmissive sheet 230 may be at an acute angle, and the angle may range from 30 degrees to 85 degrees. In other words, the portion of the first wire segment 252 connecting the edge region 224 may be at an acute angle with respect to the surface of the edge region 224 near the outer side, and the angle may range from 5 degrees to 60 degrees. The angle between the second wire segment 254 and the first wire segment 252 may be substantially a right angle. The second wire segment 254 may extend at a substantially right angle to the surface 210a of the circuit board 210. Further, in other embodiments, the first wire segment 252 may also be substantially in the shape of a polygonal line protruding toward the side away from the photosensitive chip 220, and the included angle of the polygonal line may be an obtuse angle.

In one embodiment, an angle between the portion of the first wire segment 252 connected to the edge region 224 and the direction along the optical axis L and pointing the light-sensing chip 220 to the light-transmitting sheet 230 is an acute angle, and an angle between the second wire segment 254 and the first wire segment 252 is an acute angle or a right angle. It can be understood that the above-mentioned angle design is favorable for making the ratio of the overall length of the conductive connection line 250 to the linear distance between the two ends of the conductive connection line 250 larger, that is, making the conductive connection line 250 have a larger movement margin, thereby being favorable for reducing the stress of the conductive connection line 250, avoiding the situations of the conductive connection line 250 fracture and the like caused by the larger stress, and prolonging the service life of the conductive connection line 250.

The conductive wire 250 has a wire body 250a and a soldering material 250b covering the wire body 250a at both ends. It is understood that the welding material 250b may form a substantially point-shaped welding point, and specifically, may be substantially spherical, ellipsoidal, or square. Forming the solder joint through the solder material 250b not only ensures effective electrical connection between the conductive trace 250 and the edge region 224 and the circuit board 210, but also provides a mature and simple soldering process, improves product reliability, and does not substantially increase cost. Specifically, the solder material 250b may be a conductive gold ball commonly used for soldering, but is not limited to the above.

The filling body 260 may encapsulate the first side surface 220b and the outer side surface 242 of the adhesive 240 on the side away from the main region 222 and completely cover the first side surface 220b and the outer side surface 242 of the adhesive 240 on the side away from the main region 222. Also, the filling member 260 may cover the first and

second wire segments

252 and 254 and completely cover the second connection end 216 on the circuit board 210. It can be appreciated that, by the filling body 260, better sealing performance can be achieved, corrosion and oxidation of the conductive connection line 250 and the photosensitive chip 220 by water vapor and/or air can be effectively prevented, and pollution of the main region 222 caused by dust can be prevented. The filling body 260 may be made of common sealant, such as silicone rubber, epoxy resin or polyurethane. Specifically, the filling member 260 may be selected from different materials to enhance the structural strength, shock resistance, durability, and/or electrical insulation.

In addition, in the camera module 100 and the photo sensor chip and the package structure 200 thereof provided in the embodiment of the present application, the photo sensor chip 220 may be a bare chip without being packaged by a protection glass, and the light-transmitting sheet 230 is fixed on a side of the photo sensor surface 220a of the photo sensor chip 220 by the adhesive 240, so that the light-transmitting sheet 230 can seal and protect the photo sensor chip 220, and in addition, the light-transmitting sheet 230 may be a light filter, so that the light-transmitting sheet 230 can seal and protect the photo sensor chip 220 and can also play a role in filtering light, compared with some camera modules of related technologies having both protection glass and light filter, the number of components of the camera module 100 and the photo sensor chip and the package structure 200 thereof can be small, which is not only beneficial to miniaturization and light weight of the camera module 100 and the photo sensor chip and the package structure 200, but also can simplify the assembly process, The component cost is reduced.

Further, as shown in fig. 5 and fig. 6, a method for manufacturing a photo sensor chip and package structure 200 is also provided in the first embodiment of the present application.

Step S201, a circuit board is provided.

As shown in fig. 6(a), in step S201, a circuit board 210 is provided, and it is understood that the specific structure of the circuit board 210 has been described in detail in the description of the camera module 100, and is not described herein again.

Step S202, a photosensitive chip is arranged on one side of the circuit board, the photosensitive chip is provided with a photosensitive surface far away from the circuit board and a first side surface connected with the photosensitive surface, and the photosensitive surface is provided with a main area and an edge area located on the periphery of the main area.

As shown in fig. 6(b), in step S202, the photosensitive chip 220 is disposed on one side of the circuit board 210, wherein the photosensitive chip 220 has a photosensitive surface 220a away from the circuit board 210 and a first side 220b connected to the photosensitive surface 220a, and the photosensitive surface 220a has a main region 222 and an edge region 224 located at the periphery of the main region 222. Specifically, the photosensitive chip 220 may be adhered to the surface 210a of the circuit board 210 by an adhesive. It is understood that the detailed structure of the photo sensor chip 220 has been described in detail in the description of the image capturing module 100, and will not be described herein again.

Step S203, electrically connecting a conductive wire between the edge region and the circuit board.

As shown in fig. 6(c), in step S203, one end of the conductive wire 250 may be electrically connected to the edge region 224 of the photosensitive chip 220, and the other end of the conductive wire 250 may be electrically connected to the circuit board 210. The detailed structure of the conductive connection line 250 has already been described in detail in the description of the camera module 100, and is not described herein again.

Step S204, an adhesive is arranged in the edge area and covers one end of the conductive connecting line, and the light-transmitting sheet is arranged on one side of the adhesive, which is far away from the photosensitive chip.

As shown in fig. 6(d), in step S204, the adhesive 240 is disposed on the edge region 224 and covers one end of the conductive wire 250, and the light-transmitting sheet 230 is disposed on a side of the adhesive 240 away from the photosensitive chip 220. Specifically, the adhesive 240 may completely cover the edge region 224 and completely cover one end of the conductive wire 250, such that the light-transmissive sheet 230 is supported by the adhesive 240. It is understood that the specific structure of the adhesive 240 has been described in detail in the description of the camera module 100, and will not be described herein.

Step S205, encapsulating the filling body at least on the first side surface.

As shown in fig. 6(e), in step S205, the filling body 260 is at least encapsulated on the first side surface 220 b. Specifically, the filling body 260 may encapsulate the first side surface 220b and the outer side surface 242 of the adhesive 240 on the side away from the main region 222, and completely cover the first side surface 220b and the outer side surface 242 of the adhesive 240 on the side away from the main region 222. Also, the filling member 260 may cover the first and

second wire segments

252 and 254 and completely cover the second connection end 216 on the circuit board 210. The specific structure of the filling body 260 has already been described in detail in the description of the camera module 100, and is not described herein again.

Example two

Referring to fig. 7, fig. 7 is a cross-sectional view of a camera module 100 according to a second embodiment of the present application. The camera module 100 of the second embodiment is substantially the same as the camera module 100 of the first embodiment, that is, the description of the camera module 100 of the first embodiment can also be basically applied to the camera module 100 of the second embodiment, and the following mainly describes the difference between the camera module 100 of the second embodiment and the camera module 100 of the first embodiment.

In the photo sensor chip and package structure 200 of the camera module 100 according to the second embodiment, the filling body 260 is packaged at the first side surface 220b of the photo sensor chip 220, the outer side surface 242 of the adhesive 240 far from the main region 222, and the second side surface 236 of the light transmissive sheet 230, and the filling body 260 completely covers the outer side surface 242 and the conductive connecting line 250 of the first side surface 220b and the adhesive 240 far from the main region 222. It can be understood that, by the filling body 260, better sealing performance can be achieved, and corrosion and oxidation of the conductive connection line 250 and the photosensitive chip 220 by moisture and/or air can be effectively prevented. The filling body 260 may be made of common sealant, such as silicone rubber, epoxy resin or polyurethane. Specifically, the filling member 260 may be selected from different materials to enhance the structural strength, shock resistance, durability, and/or electrical insulation.

EXAMPLE III

Referring to fig. 8, fig. 8 is a cross-sectional view of a camera module 100 according to a third embodiment of the present application. The camera module 100 in the third embodiment is substantially the same as the camera module 100 in the first embodiment, that is, the description of the camera module 100 in the first embodiment can also be basically applied to the camera module 100 in the third embodiment, and the differences between the camera module 100 in the third embodiment and the camera module 100 in the first embodiment will be mainly described below.

In the photo-sensing chip and package structure 200 of the camera module 100 according to the third embodiment, when viewed along the direction of the optical axis L, the outer surface 242 of the adhesive 240 away from the main region 222 protrudes from the first side surface 220b so as to be located outside the first side surface 220 b. Specifically, the adhesive 240 includes a first portion 240a located between the edge region 224 and the light transmissive sheet 230 and a second portion 240b protruding outside the first side surface 220b and connected to the first portion 240a, wherein the second portion 240b is flush with the first portion 240a as viewed in a direction perpendicular to the optical axis L.

It can be understood that, when the adhesive 240 protrudes from the first side surface 220b along the direction of the optical axis L, the filling body 260 can encapsulate the outer side surface 242 of the adhesive 240 and two surfaces connected to the outer side surface 242, so that the contact area between the filling body 260 and the adhesive 240 is increased, the clamping effect is achieved, and the structural strength of the photo sensor chip and the package structure 200 is improved.

Example four

Referring to fig. 9, fig. 9 is a cross-sectional view of a camera module 100 according to a fourth embodiment of the present application. The camera module 100 in the fourth embodiment is substantially the same as the camera module 100 in the first embodiment, that is, the description of the camera module 100 in the first embodiment can also be basically applied to the camera module 100 in the fourth embodiment, and the differences between the camera module 100 in the fourth embodiment and the camera module 100 in the first embodiment will be mainly described below.

In the photosensitive chip and package structure 200 of the image pickup module 100 according to the fourth embodiment, when viewed along the direction of the optical axis L, the outer surface 242 of the adhesive 240, which is at least partially away from the main region 222, protrudes from the first side surface 220b so as to be located outside the first side surface 220 b. Specifically, the adhesive 240 includes a first portion 240a between the edge region 224 and the light-transmissive sheet 230 and a second portion 240b protruding outside the first side 220b and connected to the first portion 240 a. At least a portion of the second portion 240b covers the first side 220b, the second side 236 of the light-transmitting sheet 230 connected between the first surface 232 and the second surface 234, or the second side 236 of the first side 220b and the light-transmitting sheet 230 connected between the first surface 232 and the second surface 234.

It can be understood that, with the above structure, the filling body 260 can encapsulate the outer side surface 242 of the adhesive 240 and two surfaces of the second portion 240b connected to the outer side surface 242, so that the contact area between the filling body 260 and the adhesive 240 is increased, the clamping effect is achieved, and the structural strength of the photo sensor chip and the package structure 200 is increased.

EXAMPLE five

Referring to fig. 10, fig. 10 is a cross-sectional view of a camera module 100 according to a fifth embodiment of the present application. The camera module 100 in the fifth embodiment is substantially the same as the camera module 100 in the first embodiment, that is, the description of the camera module 100 in the first embodiment can also be basically applied to the camera module 100 in the fifth embodiment, and the differences between the camera module 100 in the fifth embodiment and the camera module 100 in the first embodiment will be mainly described below.

In the photo-sensing chip and package structure 200 of the image pickup module 100 according to the fifth embodiment, when viewed along the direction of the optical axis L, the outer surface 242 of the adhesive 240 at least on the side away from the main region 222 protrudes from the first side surface 220b so as to be located outside the first side surface 220 b. Specifically, the adhesive 240 includes a first portion 240a between the edge region 224 and the light-transmissive sheet 230 and a second portion 240b protruding outside the first side 220b and connected to the first portion 240a, and at least a portion of the second portion 240b covers the first side 220b, a second side 236 of the light-transmissive sheet 230 connected between the first surface 232 and the second surface 234, or the first side 220b and the second side 236 of the light-transmissive sheet 230 connected between the first surface 232 and the second surface 234.

In addition, in the embodiment, the second portion 240b completely covers the first side surface 220b of the photo sensor chip 220 and is located between the filling body 260 and the first side surface 220 b. Therefore, the first side surface 220b of the photosensitive chip 220 can be sequentially sealed by the second portion 240b and the filling body 260, so that a better sealing and protecting effect can be achieved. The second portion 240b may be further extended and adhered to the circuit board, so as to further improve the sealing and protection effects.

EXAMPLE six

Referring to fig. 11, fig. 11 is a cross-sectional view of a camera module 100 according to a sixth embodiment of the present application. The camera module 100 in the sixth embodiment is substantially the same as the camera module 100 in the fourth embodiment, that is, the description of the camera module 100 in the fourth embodiment can be basically applied to the camera module 100 in the sixth embodiment, and the differences between the camera module 100 in the sixth embodiment and the camera module 100 in the fourth embodiment will be mainly described below.

In the photo sensor chip and package structure 200 of the camera module 100 according to the sixth embodiment, the length of the first wire segment 252 may be longer than the length of the first wire segment 252 according to the first embodiment, so that an included angle between the second wire segment 254 and the first wire segment 252 is an acute angle.

It can be understood that, by the above design, the first wire segment 252 is longer, and the second wire segment 254 may be approximately perpendicular or tilted outwards, so that the overall length of the conductive connection line 250 is longer, the length of the wire arc is extended, the stress of the conductive connection line 250 is reduced, the situations that the conductive connection line 250 is broken due to a larger stress are avoided, and the service life of the conductive connection line 250 is extended.

EXAMPLE seven

Referring to fig. 12, fig. 12 is a cross-sectional view of a camera module 100 according to a seventh embodiment of the present application. The image pickup module 100 in the seventh embodiment is substantially the same as the image pickup module 100 in the fourth embodiment, that is, the description of the image pickup module 100 in the fourth embodiment can be basically applied to the image pickup module 100 in the seventh embodiment, and the differences between the image pickup module 100 in the seventh embodiment and the image pickup module 100 in the fourth embodiment will be mainly described below.

In the photosensitive chip and package structure 200 of the camera module 100 according to the seventh embodiment, the filling body 260 covers at least parts of the first wire segment 252 and the second wire segment 254, so that at least parts (e.g., bent and connected parts) of the first wire segment 252 and the second wire segment 254 extend out of the filling body 260. It is to be understood that the above-described "at least portions of the first and

second wire segments

252, 254" are at least portions of the entirety when the first and

second wire segments

252, 254 are considered to be integral. Specifically, in some embodiments, the filler body 260 may encapsulate at least a portion of the first wire segment 252 such that another portion of the first wire segment 252 and the second wire segment 254 extend outside of the filler body 260. In another embodiment, the filler body 260 may also cover all of the first conductor segment 252 and at least a portion of the second conductor segment 254 such that another portion of the second conductor segment 254 extends outside the filler body 260.

It can be understood that the above design is beneficial to flexibly designing the filling body 260, adapting to different application requirements, and improving the adaptability of the photosensitive chip and package structure 200 and the camera module 100.

Example eight

Referring to fig. 13, fig. 13 is a cross-sectional view of a camera module 100 according to an eighth embodiment of the present application. The image pickup module 100 in the eighth embodiment is substantially the same as the image pickup module 100 in the seventh embodiment, that is, the description of the image pickup module 100 in the seventh embodiment can be basically applied to the image pickup module 100 in the eighth embodiment, and the difference between the image pickup module 100 in the eighth embodiment and the image pickup module 100 in the seventh embodiment will be mainly described below.

In the photo sensor chip and package structure 200 of the image capturing module 100 according to the eighth embodiment, the filling body 260 covers at least a portion of the first wire segment 252 and the second wire segment 254, so that at least a portion of the first wire segment 252 and the second wire segment 254 (e.g., a portion of the first wire segment 252 bent and connected with the second wire segment 254, and all of the second wire segment 254) extends out of the filling body 260. It is understood that the second connection terminals 216 on the circuit board 210 are also exposed out of the filling body 260 at this time.

Example nine

Referring to fig. 14, fig. 14 is a cross-sectional view of a camera module 100 according to a ninth embodiment of the present application. The camera module 100 in the ninth embodiment is substantially the same as the camera module 100 in the first embodiment, that is, the description of the camera module 100 in the first embodiment can also be basically applied to the camera module 100 in the ninth embodiment, and the following mainly describes the difference between the camera module 100 in the ninth embodiment and the camera module 100 in the first embodiment.

In the photo sensor chip and package structure 200 of the camera module 100 according to the ninth embodiment, a spacer 270 is disposed between the photo sensor chip 220 and the circuit board 210 for reinforcing and/or dissipating heat. It is understood that the partition 270 of the present embodiment can also be applied to the photo sensor chip and the package structure 200 of the second to eighth embodiments, and is located between the photo sensor chip 220 and the circuit board 210.

An electronic device is also provided in the embodiments of the present application, please refer to fig. 15, which is a block diagram of an electronic device 600 in an embodiment of the present application. The electronic device 600 includes, but is not limited to, a smart device having a network function, such as a mobile phone, a tablet Computer, an e-reader, a Personal Computer (PC), a notebook Computer, a vehicle-mounted device, a network television, and a wearable device. The electronic device 600 may include the device body 500 and the camera module 100 according to any of the above embodiments.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a sensitization chip and packaging structure which characterized in that, sensitization chip and packaging structure include:

a circuit board;

an adhesive at least partially disposed in the edge region;

the filler is at least encapsulated on the first side surface.

2. The sensor chip and package structure of claim 1, wherein the edge region is an annular region, and the adhesive is disposed along the edge region and is annular; the first side face is an annular side face, and the filling body is arranged along the first side face and is annular.

3. The sensor chip and package structure of claim 1, wherein the thickness of the adhesive along the optical axis is between 25um and 300 um.

4. The sensor chip and package structure of claim 1, wherein, when viewed along the optical axis, an outer side surface of the adhesive on a side away from the main area is at least partially flush with the first side surface, an outer side surface of the adhesive on a side away from the main area is at least partially located inside the first side surface, or an outer side surface of the adhesive on a side away from the main area is at least partially located outside the first side surface.

5. The sensor chip and package structure according to claim 4, wherein at least a portion of an outer surface of the adhesive on a side away from the main region is located outside the first side surface, as viewed in the optical axis direction, the adhesive includes a first portion located between the edge region and the light-transmissive sheet and a second portion protruding outside the first side surface and connected to the first portion,

6. The sensor chip and package structure of claim 4, wherein a second side surface of the light-transmitting sheet adjacent to the conductive connection line is flush with the adjacent first side surface or is farther from the optical axis than the adjacent first side surface, wherein the second side surface is a surface of the light-transmitting sheet connected between the first surface and the second surface.

7. The sensor chip and package structure of claim 4, wherein a second side surface of the light-transmitting sheet adjacent to the position of the conductive connection line is farther from the optical axis than an adjacent first side surface, and when viewed along the optical axis, at least a portion of a side of the adhesive away from the main area is adhered to a portion of the first surface of the light-transmitting sheet protruding from the first side surface and an outer side of the first side surface adjacent to the portion of the first surface protruding from the first side surface.

8. The sensor chip and package structure of claim 6, wherein a second side surface of the light-transmissive sheet is farther from the optical axis than the adjacent first side surface, and at least a portion of a side of the adhesive away from the main area is adhered to an outer side of the first side surface and a portion of the first surface of the light-transmissive sheet protruding from the first side surface, as viewed along the optical axis, wherein the second side surface is a surface of the light-transmissive sheet connected between the first surface and the second surface.

9. The sensor chip and package structure of claim 1, wherein the filling body is further packaged on an outer side surface of the adhesive on a side away from the main area and/or a second side surface of the light-transmitting sheet connected between the first surface and the second surface.

10. The sensor chip and package structure of claim 1, wherein the conductive trace has a trace body and a solder material covering the trace body at both ends.

11. The photosensitive chip and package structure of claim 1, wherein the conductive connection line comprises a first conductive line segment at least partially disposed in the adhesive, a second conductive line segment connecting the first conductive line segment and the circuit board, and the filling body is packaged on an outer side of the adhesive on a side away from the main area, wherein,

12. The sensor chip and package structure of claim 11, wherein an angle between a portion of the first wire segment connecting the edge region and a direction along the optical axis and pointing to the light-transmissive sheet of the sensor chip is an acute angle, and an angle between the second wire segment and the first wire segment is an acute angle or a right angle.

13. The sensor chip and package structure of claim 1, wherein a spacer is disposed between the sensor chip and the circuit board for reinforcing and/or dissipating heat.

14. A camera module, comprising the sensor chip and the package of any one of claims 1 to 13, and a lens disposed on an object side of the sensor chip and the package.

15. An electronic apparatus characterized by comprising the camera module according to claim 14 and an apparatus body.

16. A manufacturing method of a photosensitive chip and a packaging structure is characterized by comprising the following steps:

providing a circuit board;

arranging an adhesive in the edge area and coating one end of the conductive connecting line, and arranging the light-transmitting sheet on one side of the adhesive, which is far away from the photosensitive chip; and encapsulating the filling body at least at the first side face.