CN107591395A - Simple led - Google Patents
Simple led Download PDFInfo
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- CN107591395A CN107591395A CN201710926465.3A CN201710926465A CN107591395A CN 107591395 A CN107591395 A CN 107591395A CN 201710926465 A CN201710926465 A CN 201710926465A CN 107591395 A CN107591395 A CN 107591395A
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- substrate
- chip
- outer layer
- sealing
- simple led
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Abstract
The invention discloses a kind of simple LED, including sealing, outer layer, chip, substrate, middle side part fixes multiple chips side by side on the substrate, and each chip outside sets sealing by filling mode, parcel outer layer, outer layer are screwed in base upper side edge edge on the outside of sealing.Its structure design is simple, LED chip fast changeable, improves the service life of product, meets market use demand, be advantageous to product promotion.
Description
Technical field
The invention belongs to lighting technical field, and in particular to a kind of simple LED.
Background technology
Traditional simple LED fluorescent powder encapsulation is after LED sapphire chips are fixed on support or substrate, with certain
It is enclosed in after the LED fluorescent powder and casting glue of ratio are well mixed on sapphire chip, dispensing or spraying method is specifically included, with reality
Exciting by fluorescent material after existing sapphire chip is powered, sends different colours.Its problem of existing of the simple LED of this structure
It is that chip is fragile, and can not changes in time, has had a strong impact on the service life of product.
The content of the invention
The purpose of the present invention is to propose to a kind of simple LED, the above-mentioned deficiency of prior art, the letter of its structure design are overcome
It is single, LED chip fast changeable, the service life of product is improved, meets market use demand, is advantageous to product promotion.
In order to reach above-mentioned purpose of design, the technical solution adopted by the present invention is as follows：
A kind of simple LED, including sealing, outer layer, chip, substrate, middle side part fixes multiple chips side by side on the substrate,
Sealing is set by filling mode on the outside of each chip, outer layer is wrapped up on the outside of sealing, outer layer is screwed on the upside of base
Edge.
Preferably, the substrate is arranged side by side by multiple independent substrate segments and formed, and one is fixed respectively in each substrate segment
Individual chip.
Preferably, the electrode wires that the chip both sides on the upside of each substrate segment are set pass through substrate segment, extend to substrate
Section downside, the electrode wires that the chip of adjacent substrate segments is relative are welded on the downside of substrate segment.
Groove is provided with the downside of the substrate segment, electrode wires are extended in groove, and are welded.
Simple LED of the present invention beneficial effect is：Its structure design is simple, LED chip fast changeable, improves
The service life of product, meets market use demand, is advantageous to product promotion.
Brief description of the drawings
Fig. 1 is simple LED of the present invention sectional view；
Fig. 2 is the sectional view of a simple LED of the present invention segment structure；
Fig. 3 is the rearview of simple LED of the present invention substrate.
Embodiment
Preferred embodiment of the invention is described in further detail below.
As Figure 1-3, in embodiment of the present invention, the simple LED, including sealing 1, outer layer 2, chip 3, substrate 4,
Electrode wires 5, groove 6, substrate segment 7, middle side part fixes multiple chips 3 side by side on the substrate 4, and each outside of chip 3 passes through filling
The mode of dress sets sealing 1, the outside of sealing 1 parcel outer layer 2, and outer layer 2 is screwed in the upper side edge edge of substrate 4, in use,
Quick release substrate 4 so that substrate 4 departs from outer layer 2, and then repairs or change single chip 3, improves making for product
Use the life-span.
In further implementing, more preferably technical scheme is, the substrate 4 is arranged side by side by multiple independent substrate segments 7
Formed, fix a chip 3 respectively in each substrate segment 7, be convenient for changing.
In further implementing, more preferably technical scheme is, the both sides of chip 3 setting of each upside of substrate segment 7
Electrode wires 5 pass through substrate segment 7, extend to the downside of substrate segment 7, and the relative electrode wires 5 of the chips 3 of adjacent substrate segments 7 are in substrate segment 7
Weld downside.
The downside of substrate segment 7 is provided with groove 6, and electrode wires 5 are extended in groove 6, and are welded.
Above content is to combine the further description that specific preferred embodiment is done to the present invention, is easy to the skill
The technical staff in art field is understood that and using the present invention, it is impossible to assert that the specific implementation of the present invention is confined to these explanations.
For general technical staff of the technical field of the invention, it can also make without departing from the inventive concept of the premise
Some simple deduction or replace, without by performing creative labour.Therefore, those skilled in the art's taking off according to the present invention
Show, the simple modifications made to the present invention all should be within protection scope of the present invention.
Claims (4)
- A kind of 1. simple LED, it is characterised in that：Including sealing, outer layer, chip, substrate, middle side part is fixed side by side on the substrate Multiple chips, each chip outside set sealing by filling mode, wrap up outer layer on the outside of sealing, outer layer is screwed On base upper side edge edge.
- 2. simple LED according to claim 1, it is characterised in that：The substrate is set side by side by multiple independent substrate segments Put to be formed, fix a chip in each substrate segment respectively.
- 3. simple LED according to claim 2, it is characterised in that：Chip both sides on the upside of each substrate segment are set Electrode wires pass through substrate segment, extend on the downside of substrate segment, the relative electrode wires of the chips of adjacent substrate segments are on the downside of substrate segment Welding.
- 4. simple LED according to claim 3, it is characterised in that：Groove, electrode wires extension are provided with the downside of the substrate segment Into groove, and weld.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710926465.3A CN107591395A (en) | 2017-10-07 | 2017-10-07 | Simple led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710926465.3A CN107591395A (en) | 2017-10-07 | 2017-10-07 | Simple led |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107591395A true CN107591395A (en) | 2018-01-16 |
Family
ID=61053094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710926465.3A Pending CN107591395A (en) | 2017-10-07 | 2017-10-07 | Simple led |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107591395A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1836339A (en) * | 2002-08-30 | 2006-09-20 | 吉尔科有限公司 | Light emitting diode with improved effience |
| CN102468403A (en) * | 2010-11-18 | 2012-05-23 | 展晶科技(深圳)有限公司 | Light-emitting diode encapsulating structure |
| CN104953010A (en) * | 2012-10-30 | 2015-09-30 | 四川新力光源股份有限公司 | LED light emitting module |
| CN106098911A (en) * | 2016-06-22 | 2016-11-09 | 深圳市领德奥普电子有限公司 | Can the heat dissipation type lamp plate and preparation method thereof of once light-distribution molding |
| CN206329944U (en) * | 2016-12-05 | 2017-07-14 | 东莞市伊伯光电科技有限公司 | A kind of glare prevention LED lamp |
-
2017
- 2017-10-07 CN CN201710926465.3A patent/CN107591395A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1836339A (en) * | 2002-08-30 | 2006-09-20 | 吉尔科有限公司 | Light emitting diode with improved effience |
| CN102468403A (en) * | 2010-11-18 | 2012-05-23 | 展晶科技(深圳)有限公司 | Light-emitting diode encapsulating structure |
| CN104953010A (en) * | 2012-10-30 | 2015-09-30 | 四川新力光源股份有限公司 | LED light emitting module |
| CN106098911A (en) * | 2016-06-22 | 2016-11-09 | 深圳市领德奥普电子有限公司 | Can the heat dissipation type lamp plate and preparation method thereof of once light-distribution molding |
| CN206329944U (en) * | 2016-12-05 | 2017-07-14 | 东莞市伊伯光电科技有限公司 | A kind of glare prevention LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180116 |
|
| RJ01 | Rejection of invention patent application after publication |