CN107540844A - 感温性树脂、感温性粘合剂和感温性粘合剂组合物 - Google Patents

感温性树脂、感温性粘合剂和感温性粘合剂组合物 Download PDF

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Publication number
CN107540844A
CN107540844A CN201710486007.2A CN201710486007A CN107540844A CN 107540844 A CN107540844 A CN 107540844A CN 201710486007 A CN201710486007 A CN 201710486007A CN 107540844 A CN107540844 A CN 107540844A
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CN
China
Prior art keywords
response
temperature
formula
integer
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710486007.2A
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English (en)
Chinese (zh)
Inventor
山口聪士
河原伸郎
河原伸一郎
村上裕人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juristic Person Of Nagasaki Public University
Nitta Corp
Original Assignee
Juristic Person Of Nagasaki Public University
Nitta Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juristic Person Of Nagasaki Public University, Nitta Corp filed Critical Juristic Person Of Nagasaki Public University
Publication of CN107540844A publication Critical patent/CN107540844A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201710486007.2A 2016-06-23 2017-06-23 感温性树脂、感温性粘合剂和感温性粘合剂组合物 Pending CN107540844A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016124779 2016-06-23
JP2016-124779 2016-06-23

Publications (1)

Publication Number Publication Date
CN107540844A true CN107540844A (zh) 2018-01-05

Family

ID=60945886

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710486007.2A Pending CN107540844A (zh) 2016-06-23 2017-06-23 感温性树脂、感温性粘合剂和感温性粘合剂组合物

Country Status (4)

Country Link
JP (1) JP7007550B2 (ja)
KR (1) KR102328925B1 (ja)
CN (1) CN107540844A (ja)
TW (1) TWI780053B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3766911B1 (en) * 2018-03-15 2024-08-14 Resonac Corporation Epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, c-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6203954B1 (en) * 1998-06-30 2001-03-20 Canon Kabushiki Kaisha Electrophotographic photosensitive member process cartridge and electrophotographic apparatus
JP4869468B2 (ja) 2000-04-06 2012-02-08 ニッタ株式会社 液晶表示装置用のフィルム基板アセンブリ
US6458461B1 (en) * 2000-12-06 2002-10-01 Lexmark International, Inc Release agent composition
WO2004083334A2 (en) * 2003-03-17 2004-09-30 Dow Corning Corporation Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength
KR100839780B1 (ko) 2006-01-18 2008-06-19 주식회사 엘지화학 유연성 기판 반송용 점착제
JP5118350B2 (ja) 2007-01-26 2013-01-16 ニッタ株式会社 粘着剤
JP5551959B2 (ja) 2010-04-09 2014-07-16 ニッタ株式会社 易剥離性粘着シートおよび易剥離性粘着テープ
JP5714349B2 (ja) 2011-01-31 2015-05-07 ニッタ株式会社 易剥離性粘着シートおよび易剥離性粘着テープ
JP5908795B2 (ja) 2012-05-31 2016-04-26 日立オムロンターミナルソリューションズ株式会社 易剥離性粘着剤およびそれを用いた粘着材料ならびに処理装置
JP6289960B2 (ja) * 2014-03-27 2018-03-07 ニッタ株式会社 感温性粘着剤
WO2015152006A1 (ja) * 2014-04-04 2015-10-08 ニッタ株式会社 側鎖結晶性ポリマー、感温性粘着剤、感温性粘着シートおよび感温性粘着テープ
JP6504600B2 (ja) 2015-03-27 2019-04-24 ニッタ株式会社 感温性粘着剤および感温性粘着剤組成物
CN105131300B (zh) 2015-08-20 2018-03-30 京东方科技集团股份有限公司 一种硅氧烷侧链液晶弹性体及由其制得的智能手表

Also Published As

Publication number Publication date
KR102328925B1 (ko) 2021-11-19
KR20180000693A (ko) 2018-01-03
JP2018003008A (ja) 2018-01-11
JP7007550B2 (ja) 2022-01-24
TW201819538A (zh) 2018-06-01
TWI780053B (zh) 2022-10-11

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180105