CN107529662A - A kind of pos machines - Google Patents
A kind of pos machines Download PDFInfo
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- CN107529662A CN107529662A CN201710817884.3A CN201710817884A CN107529662A CN 107529662 A CN107529662 A CN 107529662A CN 201710817884 A CN201710817884 A CN 201710817884A CN 107529662 A CN107529662 A CN 107529662A
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Abstract
The invention provides a kind of pos machines, are related to pos machine technical field of heat dissipation.The pos machines include:Backboard and rear shell, the backboard is included towards the rear surface of the rear shell, fixed mainboard on surface in the rear includes the chip being arranged on the mainboard and the first radiator being bonded with the chip, first radiator includes the first thermal conductive surface in the fixed position of the mainboard, it is characterised in that：It is additionally included in the second radiator set between the rear shell and the rear surface outside the fixed position of the mainboard, second radiator includes the second thermal conductive surface and extends the extension of second thermal conductive surface, the extension is fixed on first thermal conductive surface, and the thermal conductivity factor of first thermal conductive surface is less than the thermal conductivity factor of the extension.The present invention can be overcome due to not changing the first radiator when the caloric value of chip is more than the heat conduction amount of the first thermal conductive surface, the problem of causing the first thermal conductive surface can not increase the heat conduction amount to chip.
Description
Technical field
The present invention relates to pos machine technical field of heat dissipation.
Background technology
In the related art, the pos machines of no radiator fan and air outlet corresponding with radiator fan are integral type pos machines,
As depicted in figs. 1 and 2, integral type pos100 includes backboard 110 and rear shell 120, and the backboard 110 is included towards the rear shell
120 surface 111（Call rear surface in the following text）, the rear shell 120 includes the surface towards surface 111 after described（It is lower into inner surface）,
Mainboard 130 and the hard disk 140 positioned at the fixed position upper strata of mainboard 130 are installed on rear surface 111, set on mainboard 130
There are chip 131, the component being connected with chip 131 and the first radiator 150 for fitting in chip 131, be arranged on mainboard 130
The first radiator 150 in FX includes the first thermal conductive surface 151 and the first radiating surface 152 being bonded with inner surface, wherein,
First thermal conductive surface 151 conducts the heat that chip 131 is sent to the first radiating surface 152.
Wherein, backboard 110 also includes the preceding surface opposite with rear surface 111, and rear shell 120 also includes opposite with inner surface
Outer surface.
In some cases, when the caloric value increase of chip 131, until the caloric value of chip 131 is more than the first thermal conductive surface
, it is necessary to increase the heat conduction amount of the first thermal conductive surface 151 during 151 heat conduction amount, to increase the heat dissipation capacity to chip, in order to not increase
The thickness of pos machines, in the case where heat sink thickness is constant, the thermal conductivity factor and/or thermal conductive surface of the first thermal conductive surface can be increased
Product.
However, due to increasing the thermal conductivity factor of the first thermal conductive surface, it is necessary to which radiator uses the higher novel-section of thermal conductivity factor
Material, can greatly increase radiator cost, and because each device typesetting area being connected on mainboard with chip is fixed, cause
The heat-conducting area of the first thermal conductive surface can not be increased on mainboard, so as to cause that the heat conduction amount of the first thermal conductive surface can not be increased.
The content of the invention
The present invention provides a kind of pos machines, can be more than leading for the first radiator in the caloric value increase of chip and caloric value
During heat, the problem of overcoming the heat conduction amount that can not increase by the first radiator due to not changing the first radiator, and then can not increase
Radiating to chip.
To reach above-mentioned purpose, technical scheme is used by the embodiment of the present invention：
Pos machines include backboard and rear shell, and the mainboard that backboard includes towards the rear surface of rear shell, being fixed on rear surface includes installation
Chip on mainboard and the first radiator being bonded with chip, the first radiator include the in the fixed position of mainboard
One thermal conductive surface, and the second radiator being located at outside the fixed position of mainboard is set between rear shell and rear surface, second dissipates
Hot device includes the second thermal conductive surface and extends the extension of the second thermal conductive surface, and extension is fixed on the first thermal conductive surface and first leads
The thermal conductivity factor in hot face is less than the thermal conductivity factor of the extension.
Compared with prior art, the beneficial effect that the present invention obtains comprises at least：
The present invention can be more than the fixation of the heat conduction amount and the first radiator of the first radiator on mainboard in the caloric value of chip
In position it is restricted in the case of, and when not changing to the first radiator, by setting outside the fixed position of mainboard
Second radiator, increase the heat-conducting area of the first thermal conductive surface with the second thermal conductive surface on the second radiator, to increase by the first thermal conductive surface
Heat conduction amount, while the extension that would extend out on the second thermal conductive surface is fixed on the first thermal conductive surface and the second thermal conductive surface, is played
The effect of the first radiator and the second radiator is connected, and thermal conductivity factor the prolonging not less than the first thermal conductive surface of extension is set
Extending portion, ensure to be conducted to the heat on the first thermal conductive surface by chip and can quickly be conducted by extension to the second thermal conductive surface, entered
And the heat dissipation capacity by the increase of the second radiator to chip.
Brief description of the drawings
Illustrate technical scheme of the invention or of the prior art in order to clearer, below will be to embodiment or existing
The required accompanying drawing used is briefly described in technology description, it is therefore apparent that drawings in the following description are only the present invention
Some possible embodiments, for those of ordinary skill in the art, on the premise of creative work achievement is not paid, also
Other accompanying drawings can be obtained according to the following drawings.
Fig. 1 is the exploded perspective view of integral type pos in the prior art；
Fig. 2 is the radiator schematic diagram of integral type pos machines in Fig. 1；
Fig. 3 is a kind of backboard schematic diagram for pos machines that the embodiment of the present invention one provides；
Fig. 4 is a kind of heat spreader structures schematic diagram that the embodiment of the present application one provides；
Fig. 5 is that surface overlaps schematic diagram when a kind of chip that the embodiment of the present application one provides and the first radiator are fixed；
Fig. 6 is the heat conduction power schematic diagram that the present invention implements first thermal conductive surface provided；
Fig. 7 is Fig. 3 dorsulum schematic top plan views；
Fig. 8 is the polycrystalline substance schematic diagram that the present invention implements a radiator of another kind first provided；
Fig. 9 is another pos machines schematic cross-section that the embodiment of the present invention two provides；
Figure 10 is another kind the second radiator schematic diagram that the embodiment of the present invention two provides；
100- pos machines of the prior art, the pos machines of the 200/201- present invention, 110- backboards, surface after 111-, 120/
320- rear shells, 130- mainboards, 131- chips, 140- hard disks, the radiators of 150- first, the thermal conductive surfaces of 151- first, 152- first dissipate
Hot face, the holding tanks of 153- first, 1531- tubulose holding tanks, 1532- square holding tanks；
The radiators of 220- second, the thermal conductive surfaces of 221- second, 222- extensions, 2221- heat conducting pipes, 2222- hot junctions, 2223- heat conduction
Block, the radiating surfaces of 223- second, 224- the first side walls, 225- second sidewalls, 226- connecting portions, the thermally conductive sheet that 227- is rectangle,
The regions of D1- the 4th, D2- second areas.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.It is based on
The embodiment that the present invention includes, those of ordinary skill in the art are obtained on the premise of creative work achievement is not made
Every other embodiment, belong to the scope of protection of the invention.
Embodiment one
In order to it is more succinct, easily describe, with structure in the pos machines of prior art or/and function similar in part, the present invention
Embodiment one adopts same tag and title.
As shown in Figure 3 and Figure 4, the present invention provides a kind of pos machines 200, and pos machines 200 include backboard 110 and rear shell 120, carries on the back
Plate 110 is included towards the rear surface 111 of rear shell 120, and being fixed on the mainboard 130 on rear surface 111 includes being arranged on mainboard 130
Chip 131 and the first radiator 150 for being bonded with chip 131, the first radiator 150 include the fixed bit positioned at mainboard 130
The first thermal conductive surface 151 in 210 is put, and is set between rear shell 120 and rear surface 111 positioned at the fixed position of mainboard 130
The second radiator 220 outside 210, the second radiator 220 include the second thermal conductive surface 221 and extend the second thermal conductive surface 221
Extension 222, extension 222 is fixed on the first thermal conductive surface 151 and the thermal conductivity factor of the first thermal conductive surface 151 is less than extension
222 thermal conductivity factor, wherein, the thermal conductive surface 221 of extension 222 and second can be integral structure or independently of each other
Separation member.
When the thermal conductive surface 221 of extension 222 and second is separate separation member, extension 222 is heat-conductive assembly
222, as shown in figure 4, heat-conductive assembly 222 includes heat conducting pipe 2221 and the heat-conducting block being located on the one end 2222 of heat conducting pipe 221
2223, heat-conducting block 2223 is fixed on the first thermal conductive surface 151, and is fixed on heat conducting pipe 2221 away from the one end of heat-conducting block 2223
On second thermal conductive surface 221, heat-conducting block is worn because the heat transfer distances of remote one end of heat-conducting block 2223 on heat conducting pipe 2221 are more than
The heat transfer distances of 2223 one end 2223, therefore the temperature of rear one end is less than the temperature of preceding one end in foregoing both ends, i.e.,：Preceding one end is
The hot junction of heat conducting pipe 2221 and rear one end are the cold end of heat conducting pipe 2221, wherein, heat-conductive assembly 222 is act as：In connection the
On the basis of one thermal conductive surface 151 and the second radiator 220, the heat on the first thermal conductive surface 151 is conducted to the second thermal conductive surface
221, in a manner of increasing the heat-conducting area of the first thermal conductive surface 111, increase the heat conduction power of the first thermal conductive surface 151, and then increase pair
The heat dissipation capacity of chip.
Alternatively, extension 222 is made by grapheme material, extension 222 includes the company being fixed on the second thermal conductive surface
Socket part and the thermally conductive sheet being connected with connecting portion, square thermally conductive sheet are fixed on the first thermal conductive surface.
Preferably, in the case of keeping other conditions change less, heat conducting pipe 2221 and heat-conducting block 2223 are by copper product
Make, and the thermal conductivity factor of copper is higher than the thermal conductivity factor of the first thermal conductive surface 151, and the surface of heat-conducting block 2223 and chip 131
Fitting, the heat of such chip 131 conduct the cold end to the first thermal conductive surface 111 and heat conducting pipe 2221 by heat-conducting block 2223, can
Faster to conduct the heat sent by chip 131.
Preferably, when the surface of heat-conducting block 2223 is bonded with the surface 1311 of chip 131, as shown in figure 5, chip 131,
The thermal conductive surface 151 of heat-conducting block 2223 and first overlaps successively from top to bottom, the area of the area of heat-conducting block 2223 between surface 1311
And first thermal conductive surface 151 area between, and the area of the first thermal conductive surface 151 be less than the second thermal conductive surface 221 area（In figure not
Show）, wherein, chip 131 and the surface of heat-conducting block 2223 are located at the middle position of the first thermal conductive surface 151, so that foregoing three tables
Face is with X（Along the length direction of the first thermal conductive surface）, Y-axis（Along the width of the first thermal conductive surface）, and the first thermal conductive surface
151 central points are that coordinate system is substantially symmetric, so ensure that the heat that chip 131 is sent can be with uniform conductive to the table of heat-conducting block 2223
Face and each edge of the first thermal conductive surface 151.
In some cases, the heating power of chip becomes heat conduction power of the big and heating power more than the first thermal conductive surface, this
When chip caloric value be more than the first thermal conductive surface heat conduction amount, if not changing the first radiator, can not increase by the first radiator
Heat-sinking capability, so as to cause the temperature of chip too high, such as：In order to extend the life cycle of pos machines, reduce mainboard upgrading
Cost and simplified backboard mounting structure etc., often select high integration mainboard（Such as：Skalake platforms）, high integration master
The power increase of plate causes the heating power of chip to increase, and now the first thermal conductive surface can only meet dissipating before heating power increase
Heat demand is, it is necessary to increase the heat conduction power of the first thermal conductive surface, and the problem of to avoid mainboard local temperature too high, be particularly suitable for use in work(
Rate is not less than 15W mainboard.
When in mainboard power be 15W and the thermal conductivity factor of the first thermal conductive surface is constant, 0.06 ㎡ heat-conducting area is at least needed,
And area of the device typesetting being connected with chip on mainboard is removed, the maximum idle ㎡ of area 0.007, the thermal conductive surface after increase
Product is up to 0.016 ㎡, and the heat-conducting area that can not increase by the first thermal conductive surface reaches 0.06 ㎡, so as to cause the caloric value of chip big
In the heat conduction amount of the first thermal conductive surface.
The heat conduction amount formula of first radiator 150 is：（1）, wherein, k is thermal conductivity factor, A first
The heat-conducting area of thermal conductive surface 151,For the temperature difference between the first thermal conductive surface 151 and chip 131, L is the thickness of the first radiator
Degree, k, A and L it is constant or change less in the case of, as shown in fig. 6, the thermal conductivity factor in the first radiator is not higher than
When the thermal conductivity factor of extension and the thermal conductivity factor not less than the second radiator, because thermal conductivity factor refers to object in unit length
Required thermal power during the temperature difference of upper 1 DEG C of generation, therefore derivation formula：（2）, and to the formula（2）
Integration is the heat conduction power of the first thermal conductive surface 151, in the case of the heating power of increase chip, the heating power of chip
More than heat conduction power, cause the caloric value of chip to be more than the heat conduction amount of the first thermal conductive surface, leading for heat-conducting block 2223 be now set
Hot coefficient is more than the thermal conductivity factor of the first thermal conductive surface 151, and it is the further heat conduction work(increased on the first thermal conductive surface 151 that it, which is acted on,
Rate, and then increase the heat conduction amount to chip.
It is alternatively possible to select thermal conductivity factor that the second radiating is made not less than the Heat Conduction Material of the thermal conductivity factor of extension
Device, to ensure that the second thermal conductive surface is not less than the thermal conductivity factor of heat-conducting block, to further speed up the conduction to heat on heat-conducting block.
When mainboard 130 is fixed on the rear surface 111 of backboard 110, the rear central region of surface 111 is the fixation of mainboard 130
Position, with reference to Fig. 3 and Fig. 7, the fixed position is the area on surface 111 after fixed mainboard 130 takes, along the width of mainboard 130
Direction, the first radiator 150 are located within the fixed position, and the second radiator 220 is fixed on outside the fixed position, with
And be located at along the length direction of mainboard 130, the first radiator 150 within the fixed position, is fixed outside the fixed position
Second radiator 220, so ensure that on the premise of pos machine thickness is not increased, the external expansion in portion region first is led in the back surface
Hot face, overcome by mainboard the miscellaneous part of typesetting limited.
Wherein, along the width of mainboard 130, the first of fixed power source is remained in advance respectively in foregoing fixed position both sides
Region and the second area away from first area, fix the second radiator 220, the width of the second thermal conductive surface 221 in second area
Degree is less than the width of second area, and the first thermal conductive surface 151 is grown close to second area along mainboard 130 in foregoing fixed position
Direction is spent, the length of the first thermal conductive surface 151 is less than the second thermal conductive surface 221, and the heat-conducting area of the second thermal conductive surface is led not less than first
The area in hot face.
Alternatively, along the length direction of mainboard 130, the length of the second thermal conductive surface 221 is more than the length of mainboard 130, so
Second area can be utilized to greatest extent.
Preferably, with reference to shown in Fig. 4 and Fig. 8, the first holding tank 153, phase are opened up in the middle position of the first thermal conductive surface 151
Ying Di, the second holding tank is opened up along its length on the second thermal conductive surface 221（Not shown in figure）, the first holding tank 153 wraps
Include the tubulose holding tank 1531 along the width of the first thermal conductive surface 151 and the square perpendicular to tubulose holding tank 1531 accommodates
Groove 1532, the hot junction of heat conducting pipe 2221 is set in tubulose holding tank 1531 and heat-conducting block is set in square holding tank 1532
2223, the thickness of heat-conducting block 2223 is not more than the depth of square holding tank 1532, so that the first thermal conductive surface 151 and chip 131
Surface 1311 be brought into close contact, can so reduce the spacing between chip and the first thermal conductive surface so that heat-conducting block does not increase core
Piece is to the thickness between rear shell, so as to not increase the assembly difficulty of rear shell and backboard.
Wherein, the second holding tank is opened up in the middle position of the second thermal conductive surface, the second holding tank is included along the second heat conduction
3rd groove of face length direction, the cold end of heat conducting pipe 2221 is fixed in the 3rd groove.
Further, the second radiator 220 is fixed for convenience so that heat conducting pipe 2221 is located in the second thermal conductive surface 221
Portion, sets the diameter of heat conducting pipe 2221 to be not more than the depth of the second holding tank, and heat conducting pipe 2221 includes connection hot junction 2222 and cold
The connecting portion at end, connecting portion are in bending, and heat conducting pipe 2221 after bending is in substantially " L " shape, in the first radiator 150 and second
When radiator 220 connects, it is easy to fix the first radiator 150 on chip.
Preferably, the first radiating surface 152 on the first thermal conductive surface 151 is included on the first radiator 150, second dissipates
Hot device 220 includes the second radiating surface 223 on the second thermal conductive surface 221, the first radiating surface 152 and the second radiating surface 223
It is in grating structure, grating structure is multiple grizzly bars of interphase distribution, and the structure of certain interval is provided between grizzly bar, works as heat
When amount conduction is to the second radiating surface 223, the groove on the second radiating surface 223 between grizzly bar can accelerate air circulation, with increase pair
The heat dissipation capacity of chip.
Wherein, width arrangement of the grating structure on the first radiating surface 152 along the first thermal conductive surface 151, and second
Length direction arrangement of the grating structure along the second thermal conductive surface 221 on radiating surface 223, and the width of the first thermal conductive surface 151
The length direction of direction and the second thermal conductive surface 221 is mutually perpendicular to.
Alternatively, width arrangement of the grating structure on the second radiating surface 223 along the second thermal conductive surface 221, so
The logical distance of the second radiating surface radiating Airflow can be reduced.
Set determining deviation d, d a value smaller between the bottom of the grating structure of first radiating surface 152 and the first thermal conductive surface 151,
The heat that first thermal conductive surface 151 is conducted to grating structure is more, grating structure can be accelerated to radiate, correspondingly, the second radiating surface 223
It is identical with the first radiating surface 152.
Be connected to " T " shape boss on first radiating surface 152 and the second radiating surface 223, boss include with it is foregoing
The parallel fixed arm of two radiating surfaces and the support arm perpendicular to the fixed arm, the sticking flexible thermally conductive sheet on fixed arm, are being carried on the back
During plate and rear shell are assembled, flexible thermally conductive sheet, which is under pressure, compresses its air between rear shell, makes it close with rear shell
Fitting, when rear shell is made up of metal material, conducts the heat on the second radiating surface to rear shell by flexible thermally conductive sheet, so that
Obtain the thermally conductive sheet to be brought into close contact with rear shell, can further increase radiating efficiency when rear shell is made up of metal material.
Preferably, boss is located at the middle position of both of the aforesaid radiating surface, and support arm extends to the bottom of grating structure, with
And certain spacing between grizzly bar and fixed arm in the region of fixed arm be present.
Alternatively, the first radiator 150 and the second radiator 220 are made by aluminum, on the first radiator 150
Corner opens up screw hole respectively, heat-conducting block 2223 is fixed in the rectangular region of four screw compositions, in the second radiator
Three screw holes in angular distribution are opened up on 220, the cold end of heat conducting pipe 2221 is fixed in Delta Region.
It should be noted that pos machines 200 are not provided with radiator fan and for radiator fan air-out in the present embodiment one
Air outlet, and the design of integrated pos machines, and and pos it is identical with the length direction of both of the aforesaid radiator, and width side
To also identical.
Embodiment two
In order to it is more succinct, easily describe, with structure in embodiment one or/and function similar in part, in embodiment two
Same tag and title are equally adopted, while is illustrated with omitting corresponding component.
First radiator and the second radiator link position aa " in figure 3, are obtained along the width section of backboard 110
To the sectional view 9 of pos machines 201, as shown in figure 9, after backboard 110 and rear shell 120 assemble, include and mainboard 130 in rear shell 120
Relative the 3rd region 121 in fixed position, the inner surface of rear shell 320 pastes with the second radiator 220 in the 3rd region 121
Close, cold end welding and cold end of second thermal conductive surface 221 with extension 222 protrude from the second thermal conductive surface 221, the heat of extension 222
End 2221 is welded on the first thermal conductive surface 151, the first radiating surface 152 and the 3rd region 121 on the first thermal conductive surface 151
Fitting, wherein, backboard 110 and rear shell 120 are made by metal material, and the first radiating surface 152 and the second radiating surface 223 respectively will
The heat of first thermal conductive surface 151 and the second thermal conductive surface 221 is conducted to rear shell 120, while extension 222 is fixed on backboard 110,
So that the heat on the second thermal conductive surface 221 is conducted to backboard 110, so as to further increase the heat-conducting area of the second thermal conductive surface.
Wherein, along the width of mainboard 130, include fixing first on mainboard 130 in the fixed position of mainboard 130
4th region D1 of radiator 150, hot junction 2221 is between chip and the first thermal conductive surface in the 4th region D1, rear shell 120
Also include being connected with the 3rd region 121 and close to the side wall 122 of the first radiator 150, between the region D1 of side wall 122 and the 4th
Second area D2 is reserved with, second is fixed in second area D2 and the fixed space formed along second area D2 vertical direction
The thickness direction of radiator, second area D2 vertical direction namely pos machines, second area D2 is along the width of backboard 110
Width is more than the width of the second radiator 220, in order to which the second radiator 220 is fixed on backboard 110, is particularly suitable for use in not
Pos machines less than 15 cun.
Alternatively, the second radiator 220 is fixed in rear shell 120, and the fixed position in rear shell 120 is second area D2
The region relative with rear shell 120, now the second radiator 220 can be not provided with the second radiating surface, be directly bonded in second area
In region relative with rear shell 120 D2.
In extension and the formation of the second radiator integrated, as shown in Figure 10, the second radiator 220 includes the second heat conduction
Face 221, the first side wall connected vertically with the second thermal conductive surface 224 and the second sidewall 225 relative with the first side wall 224, with
The connecting portion 226 of two side walls 225 connection is in strip, and the one end of connecting portion 226 away from second sidewall 225, which is connected with, to be rectangle
Thermally conductive sheet 227, wherein, above-mentioned various pieces are integrally-formed by identical Heat Conduction Material.
Above-described embodiment, the purpose of the present invention, technical scheme, beneficial effect are carried out further in detail
Describe in detail it is bright, should be understood that the foregoing is only the present invention embodiment, be not intended to limit the present invention
Protection domain, instead within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc., it should be included in
In protection scope of the present invention.
Claims (10)
1. a kind of pos machines, the pos machines include:Backboard and rear shell, the backboard are included towards the rear surface of the rear shell, Gu
Fixed mainboard on surface in the rear includes the chip being arranged on the mainboard and the first radiator being bonded with the chip,
First radiator includes the first thermal conductive surface in the fixed position of the mainboard, it is characterised in that：It is additionally included in institute
State the second radiator set between rear shell and the rear surface outside the fixed position of the mainboard, second radiating
Device includes the second thermal conductive surface and extends the extension of second thermal conductive surface, and the extension is fixed on first heat conduction
Face, the thermal conductivity factor of first thermal conductive surface are less than the thermal conductivity factor of the extension.
2. pos machines as claimed in claim 1, it is characterised in that：
The extension includes the hot junction being fixed on first thermal conductive surface, the heat-conducting block being located on the hot junction and fixation
Cold end on second thermal conductive surface, the heat-conducting block are fixed on the middle position of first thermal conductive surface, and described
Cold end is fixed on the middle position of second thermal conductive surface.
3. pos machines as claimed in claim 2, it is characterised in that：
The first holding tank is offered in the middle position of first thermal conductive surface, first holding tank includes the fixed heat conduction
First groove of block and the second groove along the first thermal conductive surface width, it is fixed on described in second groove
Hot junction is brought into close contact with the chip.
4. the pos machines as described in claim any one of 1-3, it is characterised in that：
The rear shell includes the side wall close to the first radiator, the fixed space reserved between the side wall and the mainboard
Interior fixation second radiator, second radiator is identical with the length direction of first radiator, and described
Second radiator is identical with the width of first radiator.
5. pos machines as claimed in claim 4, it is characterised in that：
The rear shell includes the inner surface towards surface after described, first radiator include being connected with the inner surface the
One radiating surface, and fix the second radiating that second radiator on surface in the rear includes being connected with the inner surface
Face, second radiating surface and first radiating surface are in grating structure.
6. the pos machines as described in claim any one of 1-3, it is characterised in that：
The area of second thermal conductive surface is more than the area of first thermal conductive surface.
7. pos machines as claimed in claim 6, it is characterised in that：
The thermal conductivity factor of second thermal conductive surface is not less than the thermal conductivity factor of the extension.
8. pos machines as claimed in claim 2 or claim 3, it is characterised in that：
The second holding tank is opened up in the middle position of second thermal conductive surface, second holding tank includes leading along described second
3rd groove of hot face length direction, the cold end is fixed in the 3rd groove.
9. pos machines as claimed in claim 8, it is characterised in that：
The extension includes the connecting portion being connected between the hot junction and the cold end for fitting in the backboard, in curved
The crooked place for rolling over the connecting portion of shape is arranged in second holding tank.
10. the pos machines as described in claim 1 or 5, it is characterised in that：
The middle position of first radiating surface and second radiating surface is respectively arranged with boss, and the boss includes being fixed on
The support arm of the grating structure bottom and the fixed arm on the support arm is extended in, sticking flexible is led on the fixed arm
Backing and the thermally conductive sheet and the rear shell are closely pasted towards the inner surface on surface after described.
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| CN201710817884.3A CN107529662A (en) | 2017-09-12 | 2017-09-12 | A kind of pos machines |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710817884.3A CN107529662A (en) | 2017-09-12 | 2017-09-12 | A kind of pos machines |
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| CN107529662A true CN107529662A (en) | 2018-01-02 |
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| CN2445434Y (en) * | 2000-08-15 | 2001-08-29 | 徐惠群 | Geometric fish-type body airflow guidance heat sink |
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Application publication date: 20180102 |