CN214482091U

CN214482091U - Gear shaping radiator and electronic equipment case

Info

Publication number: CN214482091U
Application number: CN202120876765.7U
Authority: CN
Inventors: 邢昱阳; 李姣枫; 邓超平; 王世华
Original assignee: Datang Mobile Communications Equipment Co Ltd
Current assignee: Datang Mobile Communications Equipment Co Ltd
Priority date: 2021-04-26
Filing date: 2021-04-26
Publication date: 2021-10-22
Anticipated expiration: 2031-04-26

Abstract

The embodiment of the application provides a gear shaping radiator and an electronic equipment case. Wherein, the gear shaping radiator includes: the heat pipe comprises a base plate, a plurality of heat dissipation toothed sheets and at least one heat pipe, wherein the heat dissipation toothed sheets are detachably arranged on the first side of the base plate; at least a portion of the heat pipe is disposed on the first side of the substrate in an embedded manner. According to the scheme of the embodiment of the application, the heat pipe is arranged on the first side of the base plate provided with the radiating tooth piece, the heat pipe can be embedded into the radiator from the outer side, therefore, the complex internal structure of the electronic equipment case does not need to be considered, the radiator is simple and flexible in design, the heat pipe can be applicable to electronic equipment with different structures in a mode of being embedded into the radiator from the outer side, and the universality is high. The problem that the existing radiator is large in design difficulty and low in universality can be effectively solved through the scheme.

Description

Gear shaping radiator and electronic equipment case

Technical Field

The application relates to the technical field of radiators, in particular to a gear shaping radiator and an electronic equipment case.

Background

When the electronic equipment works for a long time, the temperature is too high due to the accumulation of a large amount of heat. If the heat cannot be dissipated in time, the working performance of the electronic equipment can be reduced due to high temperature, and even the electronic equipment is burnt in severe cases.

In the prior art, gear shaping heat sinks have been used in a large number of applications. The gear shaping heat sink generally includes a base plate and a plurality of heat dissipating fins disposed in parallel spaced relation on the base plate.

In order to improve the heat dissipation performance of the gear shaping radiator, a heat pipe is usually embedded in one side of a gear shaping radiator substrate close to a heating component of the electronic equipment. However, because the internal structure of the electronic equipment chassis is quite complex, when designing the heat pipe, in addition to heat dissipation, avoidance of structures such as components or bosses in the electronic equipment needs to be considered so as to carry out special design; and the heat sink is designed to be suitable for electronic equipment with a specific structure. Therefore, the existing radiator has the problems of large design difficulty and low universality.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a gear shaping radiator and an electronic equipment case, so as to solve the problems that the existing radiator is large in design difficulty and low in universality. The specific technical scheme is as follows:

in a first aspect, an embodiment of the present application provides a gear shaping heat sink, including:

a substrate;

a plurality of heat dissipating fins detachably disposed on a first side of the substrate;

at least one heat pipe, at least one part of the heat pipe is arranged on the first side of the substrate in a embedding mode.

According to the scheme of the embodiment of the application, the heat pipe is arranged on the first side of the base plate provided with the radiating tooth piece, the heat pipe can be embedded into the radiator from the outer side, therefore, the complex internal structure of the electronic equipment case does not need to be considered, the radiator is simple and flexible in design, the heat pipe can be applicable to electronic equipment with different structures in a mode of being embedded into the radiator from the outer side, and the universality is high. The problem that the existing radiator is large in design difficulty and low in universality can be effectively solved through the scheme.

In some embodiments of the present application, further comprising:

the heat dissipation tooth piece is detachably arranged on the base.

In some embodiments of the present application, a receiving groove is formed between two adjacent bases;

at least one part of the heat pipe is arranged in the accommodating groove in an embedded mode.

In some embodiments of the present application, a portion of the heat pipe is embedded in the receiving groove, and another portion of the heat pipe is bent at an edge of the substrate and extends to the second side of the substrate.

In some embodiments of this application, the heat pipe is end to end's annular heat pipe, annular heat pipe includes two gomphosis portions and connects two connecting portion of gomphosis portion, two gomphosis portion installs respectively in the difference the holding tank.

In some embodiments of the present application, a plurality of the bases are arranged in parallel at intervals, and at least two grooves for accommodating the heat pipes are formed on the bases;

at least one part of the heat pipe is arranged in the groove in an embedding mode.

In some embodiments of the present application, a portion of the heat pipe is embedded in the groove, and another portion of the heat pipe is bent at the edge of the substrate and extends to the second side of the substrate.

In some embodiments of the present application, the base is provided with a groove for accommodating the heat pipe;

the heat pipe is an annular heat pipe connected end to end, the annular heat pipe comprises two embedded parts and two connecting parts for connecting the two embedded parts, and the embedded parts are installed in a co-located mode through different grooves in the base.

In a second aspect, an embodiment of the present application further provides an electronic device chassis, including a chassis body and the gear shaping heat sink of the first aspect;

the gear shaping radiator is arranged in the case body.

In some embodiments of the present application, the heat sink fins of the gear shaping heat sink employ an expansion plate;

the base plate of the gear shaping radiator is vertically arranged in the case body.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a first gear shaping heat sink provided in an embodiment of the present application;

FIG. 2 is an enlarged schematic view of detail I of the gear tooth heat sink of FIG. 1;

FIG. 3 is a schematic structural diagram of a second gear shaping heat sink provided in an embodiment of the present application;

FIG. 4 is a schematic view of another perspective of the gear-shaping heat sink of FIG. 3;

FIG. 5 is a schematic structural diagram of a third gear shaping heat sink provided in an embodiment of the present application;

FIG. 6 is a top view of the tooth insertion heat sink of FIG. 5;

FIG. 7 is a schematic structural diagram of a fourth gear shaping heat sink provided in an embodiment of the present application;

FIG. 8 is a schematic view of another perspective of the tooth form heat sink of FIG. 7;

FIG. 9 is a schematic structural diagram of a fifth gear shaping heat sink provided in an embodiment of the present application;

FIG. 10 is a top view of the tooth insertion heat sink of FIG. 9;

fig. 11 is a schematic view of a gear shaping heat sink (omitting a heat pipe) provided in an embodiment of the present application when the gear shaping heat sink is vertical. The reference numerals in the drawings are explained as follows:

1-a substrate;

2-heat dissipation tooth sheet;

3-heat pipe, 31-embedded part, 32-connecting part;

4-base, 41-holding tank, 42-recess.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

In order to solve the problems of large design difficulty and low universality of the existing radiator, the embodiment of the application provides a gear shaping radiator and an electronic equipment case.

First, a gear shaping heat sink provided in an embodiment of the present application will be described in detail with reference to the accompanying drawings.

As shown in fig. 1, an embodiment of the present application provides a gear shaping heat sink, including:

a substrate 1;

a plurality of heat radiating fins 2, the heat radiating fins 2 being detachably provided on a first side of the substrate 1;

at least one heat pipe 3, at least a part of the heat pipe 3 is arranged on the first side of the substrate 1 in an embedded mode.

In the embodiment of the present application, the heat dissipation fins 2 may be aluminum sheets or an inflation plate. Wherein, set up heat pipe 3 at the first side that base plate 1 set up heat dissipation pick 2, heat pipe 3 combines heat dissipation pick 2 such as aluminum sheet or inflation board, can effectively improve heat transfer capacity and the temperature uniformity nature of the tooth root of heat dissipation pick 2 and base plate connection region, promotes the heat exchange of heat dissipation pick 2, especially adopts the double-phase transform heat transfer in the heat dissipation pick 2 of inflation board, effectively improves the heat dispersion of radiator.

According to the scheme of the embodiment of the application, the heat pipe 3 is arranged on the first side of the base plate 1, the heat pipe 3 is embedded into the radiator from the outer side, therefore, the complex internal structure of the electronic equipment case does not need to be considered, the radiator is simple and flexible in design, the heat pipe 3 can be applicable to electronic equipment with different structures in the mode of being embedded into the radiator from the outer side, and the universality is high. The problem that the existing radiator is large in design difficulty and low in universality can be effectively solved through the scheme.

In some embodiments of the present application, as shown in fig. 1 and 2, the gear shaping heat sink may further comprise:

a plurality of susceptors 4, the susceptors 4 being disposed on a first side of the substrate 1, and the heat radiating fins 2 being detachably disposed on the susceptors 4.

In the embodiment of the present application, the base 4 is provided to facilitate the installation of the heat dissipation blade 2 and the substrate 1.

The gear shaping radiator provided by the embodiment of the application can utilize the gap between the bases 4, and the processing technology is simple and feasible. When the gear shaping radiator is machined, the heat pipe 3 is embedded into a gap between the bases 4, then the radiating fins 2 are inserted into the bases to realize gear shaping, and machining of the gear shaping radiator can be completed quickly and efficiently.

In some embodiments of the present application, as shown in fig. 1 and 2, a receiving groove 41 is formed between two adjacent bases 4;

at least a part of the heat pipe 3 is fitted in the housing groove 41.

In the embodiment of the present application, the bases 4 are provided on the substrate 1, and the heat pipes 3 may be provided by using the gaps between the bases 4. As shown in fig. 1 and 2, the base 4 has a long bar shape, and the housing groove 41 formed between the base 4 and the base 4 has a long bar shape, so that the heat pipe 3 fitted in the housing groove 41 has a long bar shape. It will be understood that the base 4 may be provided in other shapes, such as a curved shape, and the shape of the accommodating groove 41 and the heat pipe 3 formed between the base 4 and the base 4 is also corresponding to the curved shape, such as the accommodating groove 41 and the heat pipe 3 are also corresponding to the curved shape. The shape of the base 4 is not particularly limited in the embodiment of the present application.

In some embodiments of the present application, as shown in fig. 3 and 4, a portion of the heat pipe 3 is embedded in the accommodating groove 41, and another portion of the heat pipe 3 is bent at the edge of the substrate 1 and extends to the second side of the substrate 1.

In the embodiment of the present application, a part of the heat pipe 3 is embedded in the accommodating groove 41, that is, externally embedded in the heat sink; another part of the heat pipe 3 is bent at the edge of the substrate 1 and extends to the second side of the substrate 1, in other words, another part of the heat pipe 3 is disposed near the second side of the component in the electronic device, that is, embedded in the heat sink. The heat pipe with the U-shaped structure formed by one part of the heat pipe 3 and the other part of the heat pipe 3 can realize the internal and external linkage heat dissipation. The gear shaping radiator with the internal and external linkage heat dissipation heat pipe has the advantages of high heat dissipation efficiency and simple design. And the U-shaped structure heat pipe also has the advantage of simple processing technology, and the processing of the gear shaping radiator can be very conveniently realized through plug-in mounting during installation.

In the above-mentioned gear shaping radiator adopting the heat pipes with the U-shaped structures, the number of the heat pipes with the U-shaped structures may be multiple, and at least one accommodating groove 41 may be left between two adjacent heat pipes. As shown in fig. 3 and 4, the number of the heat pipes having the U-shaped structure may be 3, and a receiving groove 41 may be left between two adjacent heat pipes.

In some embodiments of the present application, as shown in fig. 5 and 6, the heat pipe 3 is an endless loop heat pipe, the endless loop heat pipe includes two engaging portions 31 and two connecting portions 32 connecting the two engaging portions 31, and the two engaging portions 31 are respectively mounted in different receiving grooves 41.

In this application embodiment, the heat pipe that adopts annular structure can inlay fast accurately and adorn in the holding tank. As shown in fig. 5 and 6, an accommodating groove 41 may be left between the two fitting portions 31. It can be understood that the accommodating groove 41 may not be left between the two fitting parts 31, and a plurality of accommodating grooves 41 may be left, wherein the number of the left accommodating grooves 41 is specifically set according to actual heat dissipation needs. In addition, the heat pipe 3 having such a ring structure may be provided in the embodiment of the present application.

In some embodiments of the present application, the plurality of bases 4 are arranged in parallel at intervals, and the bases 4 are provided with grooves 42 for accommodating the heat pipes 3;

at least a part of the heat pipe 3 is fitted in the groove 42.

In addition to the heat pipe 3 embedded in the receiving groove 41 between two adjacent bases 4 in the above embodiments, the present embodiment also proposes a method of forming the groove 42 in the base 4 to embed the heat pipe 3. As shown in fig. 7 to 10, a groove 42 for accommodating the heat pipe 3 may be formed in the base 4. The base 4 is provided with the groove 42, and the heat pipe 3 is embedded in the groove 42, so that the heat dissipation effect of the gear shaping heat radiator in the directions other than the direction of the heat dissipation toothed sheet 2 can be improved. As shown in fig. 7 to 10, when the straight line of the groove 42 on the base 4 is perpendicular to the heat-dissipating blade 2, the heat-dissipating effect of the gear shaper heat sink in the lateral direction perpendicular to the heat-dissipating blade 2 can be improved.

In some embodiments of the present application, as shown in fig. 7 and 8, a portion of the heat pipe 3 is embedded in the groove 42, and another portion of the heat pipe 3 is bent at the edge of the substrate 1 and extends to the second side of the substrate 1.

In the embodiment of the present application, a part of the heat pipe 3 is embedded in the groove 42, that is, externally embedded in the heat sink; another part of the heat pipe 3 is bent at the edge of the substrate 1 and extends to the second side of the substrate 1, in other words, another part of the heat pipe 3 is disposed near the second side of the component in the electronic device, that is, embedded in the heat sink. One part of the heat pipe 3 and the other part of the heat pipe 3 can form a U-shaped heat pipe, and internal and external linkage heat dissipation can be realized. The gear shaping radiator with the internal and external linkage heat dissipation heat pipe has the advantages of high heat dissipation efficiency and simple design. And the radiating pipe with the U-shaped structure also has the advantage of simple processing technology, and the processing of the gear shaping radiator can be very conveniently realized through inserting during installation.

In some embodiments of the present application, as shown in fig. 9 and 10, the base 4 is provided with at least two grooves 42 for accommodating the heat pipes 3;

the heat pipe 3 is an end-to-end annular heat pipe, the annular heat pipe includes two embedded portions 31 and two connecting portions 32 connecting the two embedded portions 31, and the embedded portions 31 are installed by being co-located through the grooves 42 on different bases 4.

In the embodiment of the present application, the two fitting portions 31 and the two connecting portions 32 fitted in the grooves 42 are connected end to form an annular heat pipe. The annular heat pipe can be quickly and accurately embedded in the accommodating groove.

As shown in fig. 9 and 10, the loop heat pipe may surround all of the bases in the middle section thereof, which is sectioned by two grooves 42. This structure can improve the heat radiation effect of the gear shaping heat radiator in the transverse direction perpendicular to the heat radiation fins 2. Of course, the loop heat pipe may surround only a central portion of one or more pedestals that is intercepted by the groove 42. At this time, a plurality of loop heat pipes may be provided. It will be understood that the number of the loop heat pipes and the size of the middle portion surrounded by the loop heat pipes can be specifically set according to the actual heat dissipation needs.

The embodiment of the application also provides an electronic equipment case, which comprises a case body and any one of the gear shaping radiators;

the gear shaping radiator is arranged in the case body.

The electronic equipment chassis provided by the embodiment of the application has all the advantages of the gear shaping radiator, and specific contents can be referred to above and are not described herein again.

In some embodiments of the present application, as shown in fig. 11, the heat sink fins 2 of the gear shaper heat sink employ an inflation plate;

the base plate 1 of the gear shaping radiator is vertically arranged in the machine box body.

The heat dissipation tooth sheet 2 adopting the blowing plate is provided with the blowing pipeline, and the refrigerant in the blowing plate can be converted into two phases, so that the heat transfer capacity of the aluminum alloy blowing plate is obviously superior to that of pure aluminum.

Note that, the heat dissipation performance of the heat dissipation blade 2 using the inflation plate is greatly affected by the gravity direction and the substrate temperature distribution. As shown in fig. 11, when the substrate 1 of the heat sink is placed vertically in the direction of gravity as indicated by the arrow in the figure, the temperature of the substrate 1 tends to be distributed with the upper part higher and the lower part lower due to the rising and accumulation of heat emitted from components in the electronic device. Correspondingly, the lower temperature and the upper temperature of the blowing plate are low and high, so that two-phase transformation in the blowing plate is inhibited, namely, the liquid phase of a lower refrigerant and the gas phase of an upper refrigerant in the blowing plate cannot be circulated well, and the heat dissipation advantage of the blowing plate is difficult to be fully exerted.

In view of the above problems, in the embodiment of the present application, the heat pipe 3 is disposed on the first side of the substrate 1 where the heat dissipation fins 2 are disposed, so that the heat transfer capability and the temperature uniformity of the connection region between the tooth root of the heat dissipation fins 2 and the substrate can be effectively improved, thereby improving the working state of "up-heating and down-cooling" when the heat sink is vertically placed, promoting the two-phase transformation of the refrigerant in the heat dissipation fins 2 using the blowing plate, and further improving the overall heat dissipation performance of the heat sink.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments.

The above description is only for the preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A gear shaping heat sink, comprising:

a substrate (1);

a plurality of heat dissipating fins (2), the heat dissipating fins (2) being detachably disposed on a first side of the substrate (1);

at least one heat pipe (3), wherein at least one part of the heat pipe (3) is arranged on the first side of the substrate (1) in an embedded mode.

2. The gear shaping heat sink of claim 1 further comprising:

a plurality of bases (4), the bases (4) are arranged on the first side of the base plate (1), and the heat dissipation tooth sheets (2) are detachably arranged on the bases (4).

3. A toothed heat sink according to claim 2, wherein a receiving groove (41) is formed between two adjacent bases (4);

at least a part of the heat pipe (3) is fitted in the housing groove (41).

4. A toothed heat sink according to claim 3, wherein a part of the heat pipe (3) is embedded in the receiving groove (41), and another part of the heat pipe (3) is bent at the edge of the base plate (1) and extends to the second side of the base plate (1).

5. A gear shaping heat sink according to claim 3, wherein the heat pipe (3) is an endless loop heat pipe comprising two engaging portions (31) and two connecting portions (32) connecting the two engaging portions (31), the two engaging portions (31) being respectively mounted in different receiving grooves (41).

6. The gear shaping heat sink according to claim 2, wherein a plurality of the bases (4) are arranged in parallel at intervals, and grooves (42) for accommodating the heat pipes (3) are formed in the bases (4);

at least a part of the heat pipe (3) is arranged in the groove (42) in an embedded manner.

7. A toothed heat sink according to claim 6, wherein a part of the heat pipe (3) fits into the recess (42), and another part of the heat pipe (3) is bent at the edge of the base plate (1) and extends to the second side of the base plate (1).

8. A toothed heat sink according to claim 6, wherein the base (4) is provided with at least two recesses (42) for accommodating the heat pipes (3);

heat pipe (3) are end to end's annular heat pipe, annular heat pipe includes two gomphosis portions (31) and connects two connecting portion (32) of gomphosis portion (31), gomphosis portion (31) are through different on base (4) recess (42) are the installation of fixing a position jointly.

9. An electronic equipment chassis comprising a chassis body and the gear-shaping heat sink of any of claims 1-8;

the gear shaping radiator is arranged in the case body.

10. The electronic equipment cabinet according to claim 9, characterized in that the heat-dissipating fins (2) of the gear-shaping heat sink are formed by an expansion plate;

the base plate (1) of the gear shaping radiator is vertically arranged in the case body.