CN107525025A - A kind of LED encapsulation method and structure - Google Patents
A kind of LED encapsulation method and structure Download PDFInfo
- Publication number
- CN107525025A CN107525025A CN201710866091.0A CN201710866091A CN107525025A CN 107525025 A CN107525025 A CN 107525025A CN 201710866091 A CN201710866091 A CN 201710866091A CN 107525025 A CN107525025 A CN 107525025A
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- Prior art keywords
- groove
- led encapsulation
- bowl
- support
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 28
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052709 silver Inorganic materials 0.000 claims abstract description 49
- 239000004332 silver Substances 0.000 claims abstract description 49
- 239000002002 slurry Substances 0.000 claims abstract description 24
- 241000218202 Coptis Species 0.000 claims abstract description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims 1
- 238000012856 packing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 31
- 238000005516 engineering process Methods 0.000 description 8
- 235000013399 edible fruits Nutrition 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
- F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED encapsulation method and structure, wherein method for packing includes step 1, and groove is set in the bottom of bowl of support；Step 2, silver slurry layer is set in the bottom of bowl, and causes silver paste layer to enter the groove；Step 3, chip is arranged on to the upper surface of silver paste layer；Step 4, gold thread connection is carried out to the chip, and be packaged with the support.Groove is set by support bottom of bowl, for increasing the contact area of silver slurry layer and support, its associativity and connection reliability is improved, improves LED use reliability and service life.
Description
Technical field
The present invention relates to technical field of LED illumination, more particularly to a kind of LED encapsulation method and structure.
Background technology
LED is referred to as forth generation lighting source or green light source, has the characteristics that energy-saving and environmental protection, long lifespan, small volume,
It is widely used in the fields such as various instructions, display, decoration, backlight, general lighting and urban landscape.According to use function not
Together, presentation of information, signal lamp, Vehicular lamp, liquid crystal screen backlight, the major class of general illumination five can be divided into.
LED product is mainly used in backlight, color screen, three big field of room lighting.It is following to be led in technology constantly maturation
Under the influence of the factor such as incandescent lamp climax rise that the product price of cause declines and the new round whole world prohibits selling, room lighting will substitute
Backlight turns into the fastest-rising subdivision fields of following LED.In addition, driven in recent years in the product up-gradation such as small clearance display screen factor
Under dynamic, LED product speedup is also constantly lifted, and the trend of solid growth is presented.
The supports that use of encapsulation LED are the flat support of common bowl at present, and the contact surface of silver paste and support is limited, product
Being worked in the environment of moist, high temperature can be such that aqueous vapor penetrates into lamp body, and larger stress release is produced by superheated vapor expansion,
So as to cause silver paste and support to occur being bonded bad phenomenon, its reliability and service life for using is reduced.
The content of the invention
The present invention proposes a kind of LED encapsulation method and structure, improves LED encapsulation associativity and use reliability, carries
The high service life of product.
In order to solve the above technical problems, the embodiments of the invention provide a kind of LED encapsulation method, including
Step 1, groove is set in the bottom of bowl of support；
Step 2, silver slurry layer is set in the bottom of bowl, and causes silver paste layer to enter the groove；
Step 3, chip is arranged on to the upper surface of silver paste layer；
Step 4, gold thread connection is carried out to the chip, and be packaged with the support.
Wherein, the quantity of the groove is multiple.
Wherein, at least one groove is located at the underface of the chip.
Wherein, multiple groove squarely lattice arrangements.
Wherein, the shape of multiple grooves is identical.
Wherein, the cross section of the groove is square or circular.
Wherein, the longitudinal section of the groove is circular arc, isosceles trapezoid or rectangle.
In addition, the embodiment of the present invention additionally provides a kind of LED encapsulation structure, including support bottom of bowl, be arranged on it is described
The silver slurry layer of bottom of bowl upper surface and the chip for being arranged on silver paste layer upper surface, the support bottom of bowl setting is fluted, described
Silver slurry layer enters the groove.
Wherein, at least one groove is arranged on the underface of the chip.
Wherein, the summation of the top cross-section of the groove is the 30%~60% of the floor space of the chip.
The LED encapsulation method and structure that the embodiment of the present invention is provided, compared with prior art, there is advantages below：
LED encapsulation method provided in an embodiment of the present invention, including
Step 1, groove is set in the bottom of bowl of support；
Step 2, silver slurry layer is set in the bottom of bowl, and causes silver paste layer to enter the groove；
Step 3, chip is arranged on to the upper surface of silver paste layer；
Step 4, gold thread connection is carried out to the chip, and be packaged with the support.
LED encapsulation structure provided in an embodiment of the present invention, including support bottom of bowl, the silver paste for being arranged on the bottom of bowl upper surface
Layer and the chip for being arranged on silver paste layer upper surface, the support bottom of bowl setting is fluted, and silver paste layer enters described recessed
Groove.
The LED encapsulation structure and method, groove is set by support bottom of bowl, for increasing the contact surface of silver slurry layer and support
Product, improves its associativity and connection reliability, that improves LED makes service life.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is a kind of step schematic flow sheet of embodiment of LED encapsulation method provided in an embodiment of the present invention；
Fig. 2 is a kind of structural representation of embodiment of LED encapsulation structure provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1~Fig. 2 is refer to, Fig. 1 is a kind of embodiment of LED encapsulation method provided in an embodiment of the present invention
Steps flow chart schematic diagram；Fig. 2 is a kind of structural representation of embodiment of LED encapsulation structure provided in an embodiment of the present invention
Figure.
In a kind of embodiment, the LED encapsulation method, including
Step 1, groove is set in the bottom of bowl of support；
Step 2, silver slurry layer is set in the bottom of bowl, and causes silver paste layer to enter the groove；
Step 3, chip is arranged on to the upper surface of silver paste layer；
Step 4, gold thread connection is carried out to the chip, and be packaged with the support.
By support bottom of bowl set groove, for increasing the contact area of silver slurry layer and support, improve its associativity and
Connection reliability, that improves LED makes service life.
LED encapsulation method provided in an embodiment of the present invention, it is generally identical with existing method for packing, including formulate LED
Drawing, selection support carry out die bond, encapsulation, produce the LED of needs.Difference is that support bottom of bowl of the prior art is plane,
Set in support bottom of bowl in the present invention it is fluted, by increasing groove so that when silver slurry layer is arranged on support bottom of bowl, add
With the contact area of support bottom of bowl, the intensity in silver paste surface trimming face can be utilized to improve silver paste and the connection adhesion of support.
It is pointed out that the present invention is not specifically limited for the manufacture craft of groove, typically Sheet Metal Forming Technology system is used
Into can also be such as etched into using other manufacture crafts.
Because silver slurry layer enters groove, it is possible to increase the contact area with support, due to being provided with groove in support bottom of bowl,
So that the structure of support becomes the structure for having cup in cup, therefore may also be referred to as cup structure in cup.
And LED made of the LED encapsulation method of the present invention is used, in one embodiment, in a failtests
The data of acquisition are as follows：
1st, experimental method：Support bowl outer 5S is contacted after the upper tin of 280 DEG C of electric iron, uses DAGE4000 instrument tests.
Under identical environment (high temperature), silver paste is with cup support adhesion mean values in cup in 135g, silver paste and common branch
Frame adhesion mean values cup support in 96g, cup is higher by about 30% with silver paste adhesion than ordinary stent.
2nd, make moist condition：Hot and humid 85 DEG C ＆85%---48H.
Wave-soldering condition：260 DEG C/5s--- dual waves.
Wave-soldering number is crossed under identical environment, after cup support finished product makes moist in cup up to more than 5 times, and ordinary stent is only
It can cross about 2 times, the more obvious (criterion of performance boost：Product whether occurs that IP is bad or the increase of VF values).
And in order to further increase the contact area of silver slurry layer and support, the quantity of the groove is multiple.
Due to the setting of silver slurry layer be in order to carry out die bond, i.e., for fixed wafer, therefore in order to improve die bond effect, one
As at least one groove be located at the underface of the chip, this be in order to avoid in the gold thread connection procedure of chip, or
In the follow-up other steps of person, when chip is by horizontal active force, the adhesion of a certain fringe region is weaker to be departed from, and
If groove is arranged on the underface of chip by fruit, basic is also in the center of silver slurry layer, can be all directions increase knot
With joint efforts.
And do not limited for the set-up mode of multiple grooves, the present invention, it is multiple described typically in order to reduce technology difficulty
Groove squarely lattice arrangement.
Further, the shape of multiple grooves is identical.
And the cross section of the groove is square or circular, i.e., from the angle of vertical view, groove is shaped as pros
Shape or circle, same progress groove setting, reduce technology difficulty.
Wherein, the longitudinal section of the groove is circular arc, isosceles trapezoid or rectangle.
It is pointed out that the present invention is for the specific position of groove, size, adjacent spacing, depth and quantity
Etc. being not specifically limited, and also it is not specifically limited for the thickness of silver slurry layer.
In addition, the embodiment of the present invention additionally provides a kind of LED encapsulation structure, including support bottom of bowl 10, is arranged on institute
State the silver slurry layer 20 of bottom of bowl upper surface and be arranged on the chip 30 of the upper surface of silver paste layer 20, the support bottom of bowl 10 is provided with
Groove 11, silver paste layer 20 enter the groove 11.
By setting groove 11 in support bottom of bowl 10 so that silver slurry layer 20 enters groove 11, improves silver slurry layer 20 and branch
The contact area of frame bottom of bowl 10, adhesion therebetween is improved, improve the service life of the LED after encapsulation and using ring
Border limits.
Because the setting of silver slurry layer 20 is in order to carry out die bond, i.e., for fixed wafer 30, therefore in order to improve die bond effect
Fruit, general at least one groove 11 are located at the underface of the chip 30, and this is in order to avoid connecting in the gold thread of chip 30
In termination process, or in follow-up other steps, chip 30 by transverse direction active force when, the adhesion of a certain fringe region compared with
It is weak to depart from, and if groove 11 is arranged on the underface of chip 30 by fruit, it is basic and in the center of silver slurry layer 20, energy
Enough increase adhesion for all directions.
And do not limited for the set-up mode of multiple grooves 11, the present invention, typically in order to reduce technology difficulty, Duo Gesuo
State the squarely lattice arrangement of groove 11.
Further, the shape of multiple grooves 11 is identical.
And the cross section of the groove 11 is square or circular, i.e., from the angle of vertical view, groove 11 is shaped as
Square is circular, and same progress groove 11 is set, and reduces technology difficulty.
Wherein, the longitudinal section of the groove 11 is circular arc, isosceles trapezoid or rectangle.
It is pointed out that the present invention is for the specific position of groove 11, size, adjacent spacing, depth and number
Amount etc. is not specifically limited, and is also not specifically limited for the thickness of silver slurry layer 20.
The setting quantity and size of groove 11 in the present invention can also carry out specification by various modes, general described
The summation of the top cross-section of groove 11 is the 30%~60% of the floor space of the chip 30.I.e. in one embodiment of the present of invention
In, by ratio between cross-sectional area in fluted 11 and the floor space of chip 30 be configured, with more rule
Plasticity, optimal ratio can be obtained by quantitative setting.
In summary, LED encapsulation structure and method provided in an embodiment of the present invention, groove is set by support bottom of bowl, used
In the contact area of increase silver slurry layer and support, its associativity and connection reliability are improved, that improves LED makes service life.
LED encapsulation structure provided by the present invention and method are described in detail above.It is used herein specifically
Individual example is set forth to the principle and embodiment of the present invention, and the explanation of above example is only intended to help and understands the present invention
Method and its core concept.It should be pointed out that for those skilled in the art, original of the invention is not being departed from
On the premise of reason, some improvement and modification can also be carried out to the present invention, these are improved and modification also falls into right of the present invention and wanted
In the protection domain asked.
Claims (10)
- A kind of 1. LED encapsulation method, it is characterised in that includingStep 1, groove is set in the bottom of bowl of support；Step 2, silver slurry layer is set in the bottom of bowl, and causes silver paste layer to enter the groove；Step 3, chip is arranged on to the upper surface of silver paste layer；Step 4, gold thread connection is carried out to the chip, and be packaged with the support.
- 2. LED encapsulation method as claimed in claim 1, it is characterised in that the quantity of the groove is multiple.
- 3. LED encapsulation method as claimed in claim 2, it is characterised in that at least one groove is being located at the chip just Lower section.
- 4. LED encapsulation method as claimed in claim 3, it is characterised in that multiple groove squarely lattice arrangements.
- 5. LED encapsulation method as claimed in claim 4, it is characterised in that the shape of multiple grooves is identical.
- 6. LED encapsulation method as claimed in claim 5, it is characterised in that the cross section of the groove is square or circular.
- 7. LED encapsulation method as claimed in claim 6, it is characterised in that the longitudinal section of the groove is circular arc, isosceles trapezoid Or rectangle.
- A kind of 8. LED encapsulation structure, it is characterised in that including support bottom of bowl, be arranged on the bottom of bowl upper surface silver slurry layer and The chip of silver paste layer upper surface is arranged on, the support bottom of bowl setting is fluted, and silver paste layer enters the groove.
- 9. LED encapsulation structure as claimed in claim 8, it is characterised in that at least one groove is arranged on the chip Underface.
- 10. LED encapsulation structure as claimed in claim 9, it is characterised in that the summation of the top cross-section of the groove is the crystalline substance The 30%~60% of the floor space of piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710866091.0A CN107525025A (en) | 2017-09-22 | 2017-09-22 | A kind of LED encapsulation method and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710866091.0A CN107525025A (en) | 2017-09-22 | 2017-09-22 | A kind of LED encapsulation method and structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107525025A true CN107525025A (en) | 2017-12-29 |
Family
ID=60737247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710866091.0A Pending CN107525025A (en) | 2017-09-22 | 2017-09-22 | A kind of LED encapsulation method and structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN107525025A (en) |
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|---|---|---|---|---|
| JP2005171185A (en) * | 2003-12-15 | 2005-06-30 | Hori Glass Kk | Adhesion method and adhesion structure |
| CN201430161Y (en) * | 2009-06-17 | 2010-03-24 | 宁波升谱光电半导体有限公司 | LED device package structure |
| WO2012053550A1 (en) * | 2010-10-19 | 2012-04-26 | 国立大学法人九州工業大学 | Led module device, method for manufacturing same, led package used for led module device, and method for manufacturing same |
| US20120299222A1 (en) * | 2010-12-22 | 2012-11-29 | Qingdao Technological University | Method and device for full wafer nanoimprint lithography |
| CN103337583A (en) * | 2013-06-26 | 2013-10-02 | 深圳雷曼光电科技股份有限公司 | LED inverted structure and inversion process |
| CN203339217U (en) * | 2013-06-26 | 2013-12-11 | 深圳雷曼光电科技股份有限公司 | Led flip-chip structure |
| CN104009146A (en) * | 2014-06-09 | 2014-08-27 | 深圳雷曼光电科技股份有限公司 | SMD LED panel support structure and LED chip |
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-
2017
- 2017-09-22 CN CN201710866091.0A patent/CN107525025A/en active Pending
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| JP2005171185A (en) * | 2003-12-15 | 2005-06-30 | Hori Glass Kk | Adhesion method and adhesion structure |
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| WO2012053550A1 (en) * | 2010-10-19 | 2012-04-26 | 国立大学法人九州工業大学 | Led module device, method for manufacturing same, led package used for led module device, and method for manufacturing same |
| US20120299222A1 (en) * | 2010-12-22 | 2012-11-29 | Qingdao Technological University | Method and device for full wafer nanoimprint lithography |
| US20140247397A1 (en) * | 2011-10-06 | 2014-09-04 | Sharp Kabushiki Kaisha | Display device and television receiver device |
| CN103337583A (en) * | 2013-06-26 | 2013-10-02 | 深圳雷曼光电科技股份有限公司 | LED inverted structure and inversion process |
| CN203339217U (en) * | 2013-06-26 | 2013-12-11 | 深圳雷曼光电科技股份有限公司 | Led flip-chip structure |
| CN104009146A (en) * | 2014-06-09 | 2014-08-27 | 深圳雷曼光电科技股份有限公司 | SMD LED panel support structure and LED chip |
| CN106098901A (en) * | 2016-08-02 | 2016-11-09 | 王川 | A kind of high-heat-dispersion LED substrate, LED encapsulation and LED |
| CN106763042A (en) * | 2017-01-20 | 2017-05-31 | 维沃移动通信有限公司 | A kind of bond and adhering method |
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