CN105810673A - Three-dimensional LED lamp filament production method - Google Patents
Three-dimensional LED lamp filament production method Download PDFInfo
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- CN105810673A CN105810673A CN201410849493.6A CN201410849493A CN105810673A CN 105810673 A CN105810673 A CN 105810673A CN 201410849493 A CN201410849493 A CN 201410849493A CN 105810673 A CN105810673 A CN 105810673A
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Abstract
The invention relates to a three-dimensional LED lamp filament production method. The three-dimensional LED lamp filament production method is characterized in that a three-dimensional light-emitting body (101) is disposed on a two-dimensional planar base plate (102), and the two-dimensional planar base plate (102) provided with the three-dimensional light-emitting body (101) is used to form a three-dimensional LED lamp filament (100) in a combination and/or deformation way. The three-dimensional LED lamp filament production method has advantages of simple technology, stable and reliable working, low costs, fast heat conduction, and ability of realizing 360-degree omnidirectional illumination.
Description
Technical field
The present invention relates to field of LED illumination, the preparation method particularly relating to a kind of 3 D stereo LED filament.
Background technology
It is known that the epoch-making significance that Edison invented electric filament lamp brings to the mankind.The mankind are had inveteracy status by traditional incandescent lighting, but since entering new 21 century, due to the appearance of more environmentally-friendly, energy-conservation LED light source new technique so that people have to gradually abandon using conventional incandescent tengsten lamp.But, the LED bulb on existing market is solid-state illumination one side luminous characteristics because of it, and it is luminous that the overwhelming majority is less than 180 low-angles.At present, although there being some LEDbulb lamp to accomplish, wide-angle light is distributed, and employs the optical elements such as substantial amounts of reflector, lens, the diffusing globe cell-shell that device is bigger.But being so that LED light effect reduces by this kind of mode one, two is make LED bulb need to greatly reduce heat-dissipating space when maintaining and substituting form, so that temperature remains high during LED operation, it is impossible to done greatly by LED power.Meanwhile, existing large-angle LED bulb lamp is required for using diffusion shell to carry out astigmatism, and illuminating effect also has bigger gap with traditional electric filament lamp.
Therefore, LED can not replace conventional incandescent completely.Its wide-angle of traditional electric filament lamp is luminous, the promotion of the feature of three-dimensional illumination and prevailing custom of missing old times or old friends, and it is potential huge market still.The LED pompon bubble technology of similar imitative conventional incandescent now also occurs both at home and abroad successively.For example with bearing substrate as LED chip of transparent glass or pottery, then carry out light-source encapsulation, then proceed to use the equipment of conventional incandescent and technique to carry out.Although this kind of its process stabilizing of scheme is reliable, but the heat radiation of LED light source can not get good solution.This is because have employed heat conductivity to be not as high glass ceramic baseplate as conductor, even if being filled with noble gas at bulb, strengthening convection current, extending the life-span, but LED light source still can not get good heat radiation, thus having a strong impact on the service life of LED bulb.Further, the encapsulation of this kind of scheme, to assemble its technique also more complicated, and production cost is higher.
Chinese patent CN103427001A is separately had to disclose the manufacture method of a kind of omnidirectional luminous LED lamp pearl.The method the invention discloses the manufacture method of a kind of omnidirectional luminous LED lamp pearl, and described method includes: aluminium base carries out punching press, plating and section, adds light-permeable transparent material and be injection-moulded on aluminium base, makes aluminium base be formed and has reeded shell；Bending also cleans formation transparent rack；Secured the wafer on transparent rack negative pole by elargol and toast, completing die bond；Wafer and transparent rack positive pole is connected by connecting line；Packaging plastic is covered in the groove of transparent rack shell；At transparent rack shell and packaging plastic surface-coated anti-reflection film；Material stripping, light splitting, obtain omnidirectional luminous LED lamp pearl.It is by pre-setting transparent material material on substrate that this invention realizes omnibearing luminous LED lamp bead, thus forming transparent rack；Then LED chip is set on transparent rack, specifically LED chip is arranged on transparent material；Omnibearing luminous finally by obtaining the reflection of aluminium base.Such packaged light source can only obtain the big beam angle being positioned at base plate for packaging side, still can not reach the rising angle as electric filament lamp, can not form the three-dimensional light source as electric filament lamp.
Summary of the invention
Deficiency for prior art, the preparation method that the present invention provides a kind of 3 D stereo LED filament, described method is to arrange the luminous body of 3 D stereo shape on the substrate of two dimensional surface shape, by the described two dimensional surface shape substrate with 3 D stereo shape luminous body by combining and/or the mode of texturing described 3 D stereo LED filament of composition.
According to a preferred implementation, described luminous body includes the multiple LED chips arranged on the substrate and the first colloid covered continuously by the plurality of LED chip；And/or
At the second colloid that each LED chip surface is separately provided, and described second colloid is arranged between described LED chip and described first colloid.
According to a preferred implementation, the described substrate in two dimensional surface shape forms the substrate of 3 D stereo shape with one or more modes of texturing in folding, bending, torsion, stretching and fashion of extrusion, and described 3 D stereo shape substrate constitutes described 3 D stereo LED filament with the described luminous body being disposed thereon；Or
The substrate of described two dimensional surface shape forms the substrate of 3 D stereo shape with one or more modes of texturing in folding, bending, torsion, stretching, punching press and fashion of extrusion, described luminous body is constituted on the substrate subsequently in the way of being coated with, to bond, engaging and/or be integrally formed, therefore described luminous body followed by the shape of the described substrate after deformation, thus forming 3 D stereo LED filament.
According to a preferred implementation, said method comprising the steps of:
Substrate manufacture, carries out cutting or shearing thus forming two dimensional surface shape substrate according to predetermined shape and size by high metallic plate reflective, that heat conductivity is good；
Multiple LED chip is set at described substrate surface, and multiple LED chips are conductively connected；
Colloid encapsulates, and arranges the first colloid on the substrate and/or arranges the second colloid, described first colloid and/or the second colloid and the luminous body of the LED chip composition 3 D stereo shape arranged on the substrate at each chip surface before arranging described first colloid；With
The two dimensional surface shape substrate setting luminous body is constituted described 3 D stereo LED filament by combination and/or mode of texturing.
According to a preferred implementation, when making substrate, described substrate surface is provided with the line of rabbet joint in order to described substrate to be curved deformation, the quantity of the described line of rabbet joint and described line of rabbet joint distribution situation on the substrate be according to deformation after the shape of 3 D stereo shape substrate and/or structure determine, and
In the way of not affecting described LED chip light extraction, be provided with electrode on the substrate, the quantity of described electrode and described electrode distribution situation on the substrate be according to deformation after the shape of 3 D stereo shape substrate and/or structure determine.
According to a preferred implementation, described substrate is bent according to predetermined angular by predetermined mold, thus forming the substrate with 3-D solid structure.
According to a preferred implementation, described first colloid and the second colloid also can through one or more in vacuum defoamation, curing molding, photoelectricity test and burn-in test step in preparation process.
According to a preferred implementation, it is consecutively provided at least being prepared, by packaging plastic, the first thixotropic agent and luminescent powder, described first colloid formed on described substrate with a glue or injection molding, and described first colloid forms cambered surface or semi-cylindrical structure at described substrate surface；And/or
Before described first colloid is set, described second colloid at least formed by the preparation of packaging plastic, the second thixotropic agent, the second brightener and/or luminescent powder is independently positioned at each described LED chip surface with a glue or injection molding, and described second colloid forms cambered surface or hemisphere face structure on each described LED chip surface.
According to a preferred implementation, described in described first colloid, the weight ratio of packaging plastic and described fluorescent material is 1:2.5～1:10, and described first thixotropic agent to account for the percentage by weight of glue in described first colloid be 1%～4.5%；Described in described second colloid, the weight ratio of packaging plastic and described fluorescent material is 1:2.5～1:10, and it is 1%～4.5% that described second thixotropic agent accounts for the percentage by weight of glue in described second colloid, it is 0.5%～2.5% that described second brightener accounts for the percentage by weight of glue in described second colloid.
According to a preferred implementation, described first thixotropic agent is to be mixed according to the ratio that weight ratio is 1.5:1 by aerosil and borosilicate viscosifier.
According to a preferred implementation, described second thixotropic agent is to be mixed according to the ratio that weight ratio is 1:1 by aerosil and silicon boron viscosifier.
According to a preferred implementation, described second brightener is to have the rare earth compound of high index of refraction, inorganic compound or organic compound.
According to a preferred implementation, described substrate is cut or cuts into and includes light source forming portion and installation portion, wherein,
Described light source forming portion is provided with described first colloid of the plurality of LED chip and its contact surface and described light source forming portion mating shapes and/or is arranged on described second colloid on each LED chip surface, and the plurality of LED chip is arranged into, on described light source forming portion surface, the shape matched with it according to the shape of described light source forming portion
Described installation portion includes installing bayonet socket, and the outer peripheral edge region of installation portion described in described installation card opening's edge is arranged.
According to a preferred implementation, described light source forming portion is rounded, and the first colloid being arranged in described light source forming portion is hemispherical, in the mounted state, two substrates with hemispherical the first colloid form spherical 3 D stereo LED light source by combining.
According to a preferred implementation, described light source forming portion heart-shaped structure in the form of a ring, and it is arranged on the first colloid in described light source forming portion in the heart-shaped structure with arc exiting surface, in the mounted state, at least three combines formation 3 D stereo LED light source with the substrate of heart-shaped first colloid by the mode being folding or bending over.
According to a preferred implementation, three substrates form 120 ° of angles by the mode being folding or bending over.
According to a preferred implementation, described light source forming portion is the laminated structure of plane or cambered surface.
According to a preferred implementation, described light source forming portion is hollow circulus.
Another aspect of the present invention:
A kind of LED, it at least includes lampshade and lamp holder, the described 3 D stereo LED filament that described LED also includes method produced according to the present invention preparation and goes out, and in the mounted state, the illuminating part of described 3 D stereo LED filament is located substantially at the geometric center place of described lampshade.
According to a preferred implementation, described LED also includes the fixing plate of light source being connected with described lamp holder, and the fixing plate of described light source is provided with the slot with described 3 D stereo LED filament Corresponding matching and the solder joint that described 3 D stereo LED filament is conductively connected with extraneous power supply.
According to a preferred implementation, described lampshade is spherical in shape, Pear-Shaped or hemispherical or for constituting the flame-shaped of LED candle lamp.
The substrate of two dimensional surface shape is formed the substrate of 3 D stereo shape by the preparation method of the 3 D stereo LED filament of the present invention by deformation, thus the light-emitting section being arranged on substrate can with the deformation construction 3 D stereo LED filament of substrate；The packaged type of the present invention is also different from prior art, by hemisphere planar second colloid on separately formed LED chip surface, its refractive index is high, the light that LED chip can be sent fully projects, improve light efficiency and owing to the second colloid is arranged between LED chip and the first colloid being arranged on top layer, second colloid can reduce the stress impact on encapsulating structure after light source generates heat, and can also be substantially reduced dead lamp rate simultaneously.And, the present invention need not additionally arrange not only lens that are heavy but also that take up space and achieve that all-directional illumination, and rising angle is big, it is possible to reach 360 degree of illuminations；Simple in construction, solder joint are few, easy for installation, filament is only directly inserted in the slot matched and can complete to install.The present invention has abandoned radiator that is not only heavy but also that be in the light equally, and select the metal that high-termal conductivity is good as substrate material, directly LED chip paster is encapsulated on substrate simultaneously, this with by noble gas or noble gas and the mixing gas that hydrogen is formed as compared with heat eliminating medium, its heat conduction efficiency is faster.In addition, the 3 D stereo LED filament moulding of the present invention is unique, various structures and creating an aesthetic feeling, and user can according to respective demand designed, designed.
Accompanying drawing explanation
Fig. 1 is the flow chart of the preparation method of the 3 D stereo LED filament of the present invention；
Fig. 2 is that under a preferred embodiment of the invention, metallic plate is cut or cuts into the schematic diagram of substrate；
Fig. 3 is the structural representation of a preferred embodiment of the invention infrabasal plate；
Fig. 4 is the 3 D stereo LED filament under a preferred embodiment of the invention；
Fig. 5 is the structural representation of the fixing version of the light source under a preferred embodiment of the invention；
Fig. 6 is the 3 D stereo LED under a preferred embodiment of the invention；
Fig. 7 is that under presently preferred embodiment, metallic plate is cut or cuts into the schematic diagram of substrate；
Fig. 8 is the structural representation of presently preferred embodiment infrabasal plate；
Fig. 9 is the 3 D stereo LED filament under presently preferred embodiment；
Figure 10 is the structural representation of the fixing version of the light source under presently preferred embodiment；With
Figure 11 is the 3 D stereo LED under presently preferred embodiment.
Reference numerals list
100: 3 D stereo LED filament 101: luminous body 102: substrate
103:LED chip 104: the first colloid 105: the second colloid
110: light source forming portion 111: installation portion 112: the folding line of rabbet joint
113: electrode 114: bayonet socket 200:LED lamp is installed
201: lampshade 202: metallic plate 203: lamp holder
204: light source fixes plate 205: slot 206: solder joint
Detailed description of the invention
Need to carry out following description about term involved in the present invention:
" luminous body " is also known as light-emitting component, luminescent device, light source body, luminescent layer, illuminated component etc.；" colloid " is also known as fluorescent powder, phosphor powder layer, phosphor structure, phosphor gel, colloid layer, wavelength conversion body, Wavelength transformational structure, arogel layer, encapsulated layer etc.；" light source forming portion " is also known as base plate for packaging, light source substrate, encapsulation top layer etc.；" glue " also can be known as packaging plastic, transparent adhesive tape, potting resin, resin bed, organic resin etc..Involved in the present invention " 3 D stereo " refers to have certain size size in two dimensional surface, has again certain thickness in the direction being perpendicular to two dimensional surface simultaneously.
Below in conjunction with drawings and Examples, the present invention is described in detail.
The preparation method that the invention provides a kind of 3 D stereo LED filament, the total technical scheme of the method is to arrange the luminous body 101 of 3 D stereo shape on the substrate 102 of two dimensional surface shape, then by the two dimensional surface shape substrate 102 with 3 D stereo shape luminous body 101 by combining and/or mode of texturing constitutes 3 D stereo LED filament 100.
Fig. 1 is the process chart preparing 3 D stereo LED filament provided under the instruction of the total technical scheme of the present invention.Technological process shown in Fig. 1, the preparation method of 3 D stereo LED filament of the present invention mainly comprises the steps that
Step 1: substrate manufacture, carries out cutting or shearing thus forming two dimensional surface shape substrate 102 by high metallic plate 202 reflective, that heat conductivity is good according to predetermined shape and size, as shown in Fig. 2 or Fig. 7；
Step 2: multiple LED chip 103 is set at substrate surface, and multiple LED chips are conductively connected；
Step 3: colloid encapsulates, substrate arranges the first colloid 104 and/or before the first colloid 104 is set, the second colloid 105 is set at each chip surface, first colloid 104 and/or the second colloid 105 constitute the luminous body 101 of 3 D stereo shape with the LED chip being arranged on substrate, as shown in Figure 4；With
Step 4: the two dimensional surface shape substrate 102 setting luminous body 101 is constituted 3 D stereo LED filament 100 by combination and/or mode of texturing, as shown in Fig. 4 or Fig. 9.
Below in conjunction with drawings and Examples, above-mentioned each preparation process is described in detail.
Step 1: substrate manufacture
Referring to Fig. 2 or Fig. 7, according to the shape and size of predetermined substrate 102, shear or cut into, at high metallic plate 202 reflective, that heat conductivity is good, the multiple two dimensional surface shape substrates 102 including light source forming portion 110 and installation portion 111.Wherein, installation portion 111 includes installing bayonet socket 114.Installation bayonet socket 114 is arranged along the outer peripheral edge region of installation portion 111.
It is copper base or aluminium base according to a preferred implementation substrate 102.The light that the LED chip 103 being disposed thereon sends can be reflected by the substrate 102 of high heat conduction reflective, high, thus improving the light extraction efficiency of chip；And also heat produced by LED chip 103 quickly can be transmitted, thus improving radiating efficiency.Basic the 102 of the present invention can occur bending and deformation under external force, the hardness that substrate has and the thickness difference slightly difference according to product specification.In installation process, by with hands or the substrate that by extraneous instrument, the substrate 102 of two dimensional surface shape is deformed into 3 D stereo shape.In the diastrophic process of substrate 102,3 D stereo shape luminous body 101 on substrate 102 is set and constitutes 3 D stereo LED light source with substrate deformation, thus forming the light source being close to 360 degree of beam angles.
For Simplified flowsheet program, under normal circumstances in the process preparing substrate, the shape of its installation portion of substrate under different embodiments can keep consistent with structure, as illustrated in figs. 2 and 7.
According to a preferred implementation illustrated in fig. 2, light source forming portion 110 is rounded, but the present invention is not limited to this.Light source forming portion 110 can be arranged to other geometries such as square, rhombus, polygon or ellipse by those skilled in the art as required.
According to a preferred implementation illustrated in fig. 7, light source forming portion 110 is in hollow circulus.Light source forming portion 110 under present embodiment can the geometric circulus such as circular rings, Q-RING, straight-flanked ring, vesica piscis, rhombus ring, thimble, it is also possible to be simulation architecture.The simulation architecture of indication refers to herein: artificial animal, such as butterfly, beetle, Aeschna melanictera etc.；Emulation plant, such as Herba Galii Bungei, Flos Mume, ginkgo leaf etc..In a word, when light source forming portion is embodied as simulation architecture, it is preferable that there is symmetric shape and emulation object easily processed into type.
By substrate cut or after cutting into the structure of reservation shape and size, substrate surface is provided with the line of rabbet joint 112 in order to substrate to be curved deformation, as shown in Fig. 7 or Fig. 8.The quantity of the line of rabbet joint 112 and line of rabbet joint distribution situation on substrate 102 be according to deformation after the shape of 3 D stereo shape substrate and/or structure determine.Illustrate for a preferred implementation illustrated in fig. 8.The light source forming portion 110 of basic 102 heart-shaped structure in the form of a ring so that substrate moulding is unique, is rich in aesthetic feeling.Architectural feature according to heart-shaped light source forming portion, offers the line of rabbet joint 112 on its Axisymmetric Distributed Line so that substrate 102 is along line of rabbet joint symmetric curvature or folds.Substrate 102 after bending three or be folding is combined, and just obtains 3 D stereo LED filament as shown in Figure 9.
According to a preferred implementation, the line of rabbet joint 112 being arranged on substrate can be one side V groove, circular trough or square groove.
According to a preferred implementation, the substrate of the present invention can also be bent according to predetermined angular by predetermined mold, thus forming the substrate 102 with 3-D solid structure.This predetermined mold refers to machining equipment such as punch press.Concrete mode is, according to the bending angle that predetermined design is good, substrate 102 is carried out bending by punch press and deforms.
Step 2: LED chip and electrode are set
Multiple LED chips 103 are arranged in the light source forming portion 110 of substrate 102 directly to paste packaged type.Referring to Fig. 3 or Fig. 8, multiple LED chips 103 are arranged into, on light source forming portion 110 surface, the shape matched with it according to the shape of light source forming portion 110.Such as, in figure 3, LED chip is arranged into the circle substantially matching with light source forming portion in light source forming portion 110；In fig. 8, LED chip is arranged into the heart substantially matching with light source forming portion in light source forming portion 110.Multiple LED chips 103 make LED light source be evenly distributed on light source forming portion surface with light source forming portion 110 form fit, so that filament uniform in light emission, and the quantity of conservative control chip, economize on resources.
Referring to Fig. 3 or Fig. 8, substrate is provided with electrode 113 not affecting in the way of LED chip 103 goes out light.The quantity of electrode and electrode distribution situation on substrate 102 be according to deformation after the shape of 3 D stereo shape substrate and/or structure determine.Electrode 113 in order to access to extraneous power supply or as the conduction connector between chip using the multiple LED chips 103 arranged in light source forming portion 110 conduction.
Step 3: colloid encapsulates
Referring to Fig. 4, it is consecutively provided at least being prepared, by packaging plastic, the first thixotropic agent and luminescent powder, the first colloid 104 formed on substrate 102 with a glue or injection molding.First colloid automatically forms cambered surface or semi-cylindrical structure by the continuous encapsulating of point gum machine or by injection molding on light source forming portion surface.And the multiple LED chips 103 on substrate 102 are covered by the first colloid continuously, specifically, multiple LED chips that the first colloid 104 will be distributed in light source forming portion 110 cover continuously.
LED chip can be covered all around by first colloid 104 of the present invention, the light that only LED chip front sends enters into the first colloid, the light that its each side sends likewise enters in the first colloid, will not omit any light, is greatly improved the utilization rate to LED chip light.Simultaneously for whole 3 D stereo LED filament 100, not only define continuous light source, it is to avoid the situation of local shades occurs so that uniform in light emission, and substantially increases the light extraction efficiency of product.The exiting surface of first colloid 104 of the present invention is not limited in cambered surface or semi-cylindrical, it is possible to be plane, or even non-planar surface.The first colloid 104 that exiting surface is non-planar surface makes light that diffuse-reflectance or refraction occur in the cross section of air and fluorescent powder, can also be greatly improved light extraction efficiency equally, and then increase beam angle.
Selectively, before the first colloid 104 is set, the second colloid 105 at least formed by the preparation of packaging plastic, the second thixotropic agent, the second brightener and/or luminescent powder is independently positioned at each LED chip 103 surface with a glue or injection molding, and the second colloid 105 is arranged between LED chip 103 and the first colloid 104, as shown in Figure 4.By precise quantitative positive displacement point gum machine equipment, each LED chip is carried out single-point, thus automatically form cambered surface or hemisphere face structure on each LED chip surface.
Second colloid 105 of the present invention is arranged on each LED chip surface independently of one another, it expands with heat and contract with cold the impact being with because of colloid after can reducing conventional light source heating, light leak and the problem such as the chip brought because of glue internal stress is unstable, reliability is low can be avoided simultaneously, reduce the dead lamp rate of light source.Further, in cambered surface or the second colloid 105 of hemisphere face structure make light at chip and the second colloidal interface and the second colloid and the first colloidal interface, twice refraction occur before entering mixed with the first colloid 104 of fluorescent material, considerably increase beam angle.
Thixotropic agent in first colloid of the present invention and the second colloid is mainly used as thickening sizing, increase colloid on chip or substrate attached power so that the first colloid and the second colloid can keep fixing shape on chip and substrate.
According to a preferred implementation, the first colloid 104 and the second colloid 105 also can through one or more in vacuum defoamation, curing molding, photoelectricity test and burn-in test step in preparation process.
According to a preferred implementation, in the first colloid 104, the weight ratio of packaging plastic and fluorescent material is 1:2.5～1:10, and the first thixotropic agent to account for the percentage by weight of glue in the first colloid be 1%～4.5%.
According to a preferred implementation, in second colloid 105, the weight ratio of packaging plastic and fluorescent material is 1:2.5～1:10, and it is 1%～4.5% that the second thixotropic agent accounts for the percentage by weight of glue in the second colloid, it is 0.5%～2.5% that the second brightener accounts for the percentage by weight of glue in the second colloid.
According to a preferred implementation, the first thixotropic agent is to be mixed according to the ratio that weight ratio is 1.5:1 by aerosil and borosilicate viscosifier.
According to a preferred implementation, the second thixotropic agent is to be mixed according to the ratio that weight ratio is 1:1 by aerosil and silicon boron viscosifier.
According to a preferred implementation, the second brightener is to have the rare earth compound of high index of refraction, inorganic compound or organic compound.Second brightener can be zinc oxide, aluminium sesquioxide, it is also possible to is spherical high molecular nanometer silicone powder, or their mixture, but second brightener of the present invention is not limited to that.
Set the first colloid and/or the second colloid and constitute luminous body 101 with the multiple LED chips 103 in light source forming portion 110.
Step 4: form 3 D stereo LED filament
The two dimensional surface shape substrate 102 setting luminous body 101 is constituted 3 D stereo LED filament 100 by combination and/or mode of texturing, as shown in Fig. 4 or Fig. 9.
According to a preferred implementation, the substrate 102 in two dimensional surface shape forms the substrate 102 of 3 D stereo shape with one or more modes of texturing in folding, bending, torsion, stretching and fashion of extrusion.3 D stereo shape substrate 102 constitutes 3 D stereo LED filament 100 with the luminous body 101 being disposed thereon.
According to a preferred implementation, the substrate 102 of two dimensional surface shape forms the substrate 102 of 3 D stereo shape with one or more modes of texturing in folding, bending, torsion, stretching, punching press and fashion of extrusion.Luminous body 101 is constituted on substrate 102 subsequently in the way of being coated with, to bond, engaging and/or be integrally formed.Therefore luminous body followed by the shape of the substrate after deformation, thus forming 3 D stereo LED filament 100.
Shown in Figure 4 go out a preferred implementation, light source forming portion 110 is rounded.The first colloid 104 being arranged in light source forming portion 110 is hemispherical.In the mounted state, two form spherical 3 D stereo LED filament 100 with the substrate 102 of hemispherical fluorescent powder 104 by combining.
Shown in Figure 9 go out another preferred implementation, light source forming portion 110 heart-shaped structure in the form of a ring, and be arranged on the first colloid 104 in light source forming portion 110 in the heart-shaped structure with arc exiting surface.Light source forming portion 110 heart-shaped structure in the form of a ring, correspondingly, is arranged on first colloid 104 on its surface also heart-shaped structure in the form of a ring.In installation process, at least three is combined formation 3 D stereo LED light source with the substrate 102 of heart-shaped fluorescent powder 104 by the mode being folding or bending over.As shown in Figure 7, substrate 102 folds according to the line of rabbet joint 112, become 3 D stereo shape structure by two dimensional surface shape structure or say that substrate 102 bends by machining equipment such as punch press according to the bending angle designed, then the substrate in combination of three 3 D stereo shapes being formed 3 D stereo LED filament as shown in Figure 9.
Step according to the method described above, it is thus achieved that the embodiment in table 1～table 3.Following embodiment all adopts Tsing Hua Tong Fang's P1428BLED chip, and is packaged test exporting when electric current is 60mA.And specifying, the index request of light source performance is color rendering index (CRI) is more than 80, and color temperature value is 3000K.
The photoelectricity test of table 1 second colloid
The photoelectricity test of table 2 first colloid
The product aging dead lamp rate of table 3 light source compares
In table 1～table 3, " shore " represents Shore hardness, and " shoreA " represents Xiao A hardness, and " shoreD " represents Shore D hardness, and " A1 " represents the first thixotropic agent, and " A2 " represents the second thixotropic agent, and " B2 " represents the second brightener.
It is the glue of 40 or 70 for preparing glue (or packaging plastic or resin) the preferably Xiao A hardness of the first colloid 104 and the second colloid 105, or to select Shore D hardness be the glue of 55.And under irradiating preferably in the light that wavelength is 598nm, its refractive index glue at least above 1.41.
Table 1 illustrates proportioning and its test result of the second colloid 105 of section Example of the present invention.Data according to table 1 are it can be seen that the weight ratio applying fluorescent material and glue is preferably 1:2.5～1:10, and its respective weight ratio preferable range of the second thixotropic agent A2 added and the second brightener B2 is 1wt%～4.5wt% and 0～2.5wt% respectively.The second colloid prepared is carried out viscosity, light efficiency, dead lamp rate and light leak test.Result according to test, embodiment 22 combination property is best, and its selection be Shore D hardness is 55, and refractive index is the glue of 1.51, and Ratio of filler bitumen (weight ratio) is 1:6, weight ratio each shared for the second thixotropic agent A2 and the second brightener B2 of its interpolation respectively 2.8%, 1%.Through photoelectricity test, the light efficiency of embodiment 22 is 102LM/W, and dead lamp rate is 0.05%.Can also draw from table 1, when Ratio of filler bitumen is 1:10 or the second thixotropic agent A2 proportion is 1wt%, light leakage phenomena can be caused.When shared by the second thixotropic agent, weight ratio is 4.5%, now colloid not easily flows, and not easily operates in preparation process.It is therefore preferable that weight ratio shared by the second thixotropic agent A2 is 1% < A2 < 5%.
Table 2 illustrates proportioning and its test result of the first colloid 104 of section Example of the present invention.Owing to the second colloid is arranged on the outermost layer of chip, except coordinating chip to obtain the light of required colour temperature or required color, the first colloid also has the effect that the light that each face of LED chip sends carries out comprehensive reflection or refraction.Therefore, when evaluating the first colloidal property, mainly overall merit is carried out from color rendering index, light efficiency, finished product rising angle.Test result according to table 2 is it can be seen that embodiment 34 combination property is best.Further, when Ratio of filler bitumen is 1:10 or the first thixotropic agent A1 proportion is 1wt%, causing the glue that overflows, now the first colloid can not automatically form cambered surface or semi-cylindrical structure on substrate.Therefore, more preferably: Ratio of filler bitumen is 1:2.5～1:6；Weight ratio shared by first thixotropic agent A1 is more than 1%, more preferably 2.8%～4.5%.
Table 3 illustrates proportioning and the ageing test result of the light source finished product of section Example of the present invention.Embodiment in table 3 is the test that the light source to packaged first colloid carries out.When testing, selection hardness be 40A, 70A and 55D glue carry out burn-in test.Test result according to table 3 shows, the 3 D stereo LED filament of the present invention can big beam angle at least up to 310 °, and its color rendering properties is good, and light efficiency is high；Dead lamp rate is 0.08%～0.9%.
Below in conjunction with accompanying drawing, the LED that the present invention relates to is illustrated.
Referring to Fig. 5 and a preferred implementation illustrated in fig. 6, the fixing plate 204 of light source is connected with lamp holder 203.The fixing plate 204 of light source is provided with the slot 205 with 3 D stereo LED filament 100 Corresponding matching and the solder joint 206 that 3 D stereo LED filament 100 is conductively connected with extraneous power supply.In the present embodiment, slot 205 is in yi word pattern, and slot both sides are provided with both positive and negative polarity.Shown in Fig. 5 is 360 degree of LED, including 3 D stereo LED filament 100, lampshade 201 and lamp holder 203.In the mounted state, the illuminating part of 3 D stereo LED filament 100 is located substantially at the geometric center place of lampshade 201.A preferred implementation as shown in Figure 5, lampshade 201 is in flame type, but the present invention is not limited to this.
Referring to Figure 10 and another preferred implementation illustrated in fig. 11, in the present embodiment, slot 205 is substantially in Y-shaped.Three jacks that the slot 205 of Y-shaped includes three shapes, size is identical, each jack is respectively provided on two sides with positive and negative electrode.Wherein, the quantity of jack is that the quantity according to substrate is determined.Referring to being corresponding LED shown in Figure 11, including 3 D stereo LED filament 100, lampshade 201 and lamp holder 203.In the mounted state, the illuminating part of 3 D stereo LED filament 100 is located substantially at the geometric center place of lampshade 201.A preferred implementation as shown in Figure 11, lampshade 201 is spherical in shape, but the present invention is not limited to this.In order to ensure that 3 D stereo LED filament one way or another sends uniform light, three substrates 102 form 120 ° of angles by the mode being folding or bending over.
The lampshade 201 of the LED of the present invention except in flame type or spherical except, it is also possible to be Pear-Shaped or hemispherical or polyhedral structure.
What deserves to be explained is, above-mentioned two embodiment is two preferred embodiments of the present invention, and the present invention is not limited to this.Wherein, the planform of light source forming portion 110 of substrate, lampshade 201 shape, the planform of fluorescent powder 104 can carry out multiple change under the guidance of technical solution of the present invention.Further, the arrangement mode on substrate 102 of the line of rabbet joint 112 and electrode 113 needs the concrete structure according to substrate to form corresponding adjustment, is not limited in the mode described in above-mentioned two embodiment or accompanying drawing.
Preparation method of the present invention preparation and the 3 D stereo LED filament that goes out and be consequently formed 360 degree of LED there is following Advantageous Effects:
1) can realizing 360 degree of full angles luminous, filament shape can freely design collocation, very flexibly, it may be achieved close to the three-dimensional illumination luminous environment of conventional incandescent, distribution curve flux also can freely design.
2) because material and radiator structure and common LED bulb are more or less the same, being all the metal basal board heat transfer adopting mature and reliable, its radiating effect is close to the LED bulb of original technology, so its technology comparatively mature and reliable.
3) by unique some plastic structure, according to light source luminescent principle, its light-out effect is better, it may be achieved higher performance indications, as whole light effect 80Lm/W can be realized, and double; two 80 indexs of aobvious finger more than 80.
4) present configuration is simple, and preparation section is simple.Without each chip on substrate is put glue one by one, it is possible to disposable glue dispensing and packaging or the fluorescent powder prepared is set directly on substrate by model, convenient and swift.
5) uniform in light emission of the present invention, light efficiency are high.
As described above, accompanying drawing and description have described that and exemplified one exemplary embodiment.Those who familiarize themselves with the technology selects and describes these one exemplary embodiment to explain some principle and the practical application of the present invention, so that can make and utilize the various one exemplary embodiment of the present invention and various replacement thereof and amendment.As can be seen that from the description above, some aspect of the present invention by illustrated herein go out the restriction of detail of example, and therefore contain those who familiarize themselves with the technology it is appreciated that other amendments and application or its equivalent.But, after research this specification and accompanying drawing, those who familiarize themselves with the technology is by numerous changes of clear structure, amendment, change and other purposes and application.Should being considered to be contained by the present invention without departing from these type of changes all of spirit and scope of the invention, amendment, change and other purposes and application, the present invention is limited only by the restriction of the claims in the present invention.
Claims (10)
1. the preparation method of a 3 D stereo LED filament, it is characterized in that, described method is to arrange the luminous body (101) of 3 D stereo shape on the substrate (102) of two dimensional surface shape, will with described two dimensional surface shape substrate (102) of 3 D stereo shape luminous body (101) by combining and/or the mode of texturing described 3 D stereo LED filament (100) of composition.
2. the preparation method of 3 D stereo LED filament as claimed in claim 1, it is characterized in that, described luminous body (101) includes the multiple LED chips (103) being arranged on described substrate (102) and the first colloid (104) covered continuously by the plurality of LED chip (103)；And/or
The second colloid (105) being separately provided on each LED chip surface, and described second colloid (105) is arranged between described LED chip (103) and described first colloid (104).
3. the preparation method of 3 D stereo LED filament as claimed in claim 2, it is characterized in that, the described substrate in two dimensional surface shape (102) forms the substrate (102) of 3 D stereo shape with one or more modes of texturing in folding, bending, torsion, stretching and fashion of extrusion, and described 3 D stereo shape substrate (102) constitutes described 3 D stereo LED filament (100) with the described luminous body (101) being disposed thereon；Or
The substrate (102) of described two dimensional surface shape forms the substrate (102) of 3 D stereo shape with one or more modes of texturing in folding, bending, torsion, stretching, punching press and fashion of extrusion, in the way of being coated with, to bond, engaging and/or be integrally formed, described luminous body (101) is constituted subsequently on described substrate (102), therefore described luminous body followed by the shape of the described substrate after deformation, thus forming 3 D stereo LED filament (100).
4. the preparation method of 3 D stereo LED filament as claimed in claim 1, it is characterised in that said method comprising the steps of:
Substrate manufacture, carries out cutting or shearing thus forming two dimensional surface shape substrate (102) according to predetermined shape and size by high metallic plate (202) reflective, that heat conductivity is good；
Multiple LED chip (103) is set at described substrate surface, and multiple LED chips are conductively connected；
Colloid encapsulates, first colloid (104) is set on the substrate and/or described first colloid (104) is front arranges the second colloid (105), described first colloid (104) and/or the second colloid (105) and the luminous body (101) arranging LED chip on the substrate and constituting 3 D stereo shape at each chip surface arranging；With
Two dimensional surface shape substrate (102) of luminous body (101) will be set by combining and/or the mode of texturing described 3 D stereo LED filament (100) of composition.
5. the preparation method of 3 D stereo LED filament as claimed in claim 4, it is characterized in that, when making substrate, described substrate surface is provided with the line of rabbet joint (112) in order to described substrate to be curved deformation, the quantity of the described line of rabbet joint (112) and described line of rabbet joint distribution situation on described substrate (102) be according to deformation after the shape of 3 D stereo shape substrate and/or structure determine, and
Be provided with electrode (113) not affecting in the way of described LED chip (103) goes out light on the substrate, the quantity of described electrode and described electrode distribution situation on described substrate (102) be according to deformation after the shape of 3 D stereo shape substrate and/or structure determine.
6. the preparation method of 3 D stereo LED filament as claimed in claim 4, it is characterised in that described substrate (102) is bent according to predetermined angular by predetermined mold, thus forming the substrate (102) with 3-D solid structure.
7. the preparation method of 3 D stereo LED filament as claimed in claim 4, it is characterized in that, described first colloid (104) and the second colloid (105) also can through one or more in vacuum defoamation, curing molding, photoelectricity test and burn-in test step in preparation process.
8. the preparation method of 3 D stereo LED filament as claimed in claim 4, it is characterised in that
It is consecutively provided at least being prepared, by packaging plastic, the first thixotropic agent and luminescent powder, described first colloid (104) formed on described substrate (102) with a glue or injection molding, and described first colloid forms cambered surface or semi-cylindrical structure at described substrate surface；And/or
Before described first colloid (104) is set, described second colloid (105) at least formed by the preparation of packaging plastic, the second thixotropic agent, the second brightener and/or luminescent powder is independently positioned at each described LED chip (103) surface with a glue or injection molding, and described second colloid forms cambered surface or hemisphere face structure on each described LED chip (103) surface.
9. the preparation method of 3 D stereo LED filament as claimed in claim 8, it is characterised in that
Described in described first colloid (104), the weight ratio of packaging plastic and described fluorescent material is 1:2.5～1:10, and described first thixotropic agent to account for the percentage by weight of glue in described first colloid be 1%～4.5%；
Described in described second colloid (105), the weight ratio of packaging plastic and described fluorescent material is 1:2.5～1:10, and it is 1%～4.5% that described second thixotropic agent accounts for the percentage by weight of glue in described second colloid, it is 0.5%～2.5% that described second brightener accounts for the percentage by weight of glue in described second colloid.
10. the preparation method of the 3 D stereo LED filament as described in one of claim 2 to 9, it is characterised in that described substrate (102) is cut or cuts into and includes light source forming portion (110) and installation portion (111), wherein,
Described light source forming portion (110) is provided with described first colloid (104) of the plurality of LED chip (103) and its contact surface and described light source forming portion mating shapes and/or is arranged on described second colloid (105) on each LED chip surface, and the plurality of LED chip (103) is arranged into, on described light source forming portion (110) surface, the shape matched with it according to the shape of described light source forming portion (110)
Described installation portion (111) includes installing bayonet socket (114), and described installation bayonet socket (114) is arranged along the outer peripheral edge region of described installation portion (111).
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| CN201410849493.6A CN105810673A (en) | 2014-12-30 | 2014-12-30 | Three-dimensional LED lamp filament production method |
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| CN201410849493.6A CN105810673A (en) | 2014-12-30 | 2014-12-30 | Three-dimensional LED lamp filament production method |
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Application publication date: 20160727 |