CN107509324A - A kind of automatic tin jet device of pcb board and its control method - Google Patents
A kind of automatic tin jet device of pcb board and its control method Download PDFInfo
- Publication number
- CN107509324A CN107509324A CN201710922493.8A CN201710922493A CN107509324A CN 107509324 A CN107509324 A CN 107509324A CN 201710922493 A CN201710922493 A CN 201710922493A CN 107509324 A CN107509324 A CN 107509324A
- Authority
- CN
- China
- Prior art keywords
- tin
- pcb board
- manipulator
- machine structure
- clamping jaw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 150
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000005507 spraying Methods 0.000 claims abstract description 114
- 239000007921 spray Substances 0.000 claims abstract description 40
- 238000002203 pretreatment Methods 0.000 claims abstract description 33
- 238000012805 post-processing Methods 0.000 claims abstract description 28
- 238000012545 processing Methods 0.000 claims description 13
- 238000000926 separation method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 210000000078 claw Anatomy 0.000 description 10
- 210000003127 knee Anatomy 0.000 description 8
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
Abstract
The invention discloses a kind of automatic tin jet device of pcb board and its control method, the automatic tin jet device of pcb board includes：Tin-spraying machine structure, pre-treatment mechanism provided with operation window, post processing mechanism and manipulator mechanism；The pre-treatment mechanism, manipulator mechanism and post processing mechanism are set gradually in the horizontal direction, and the tin-spraying machine structure is vertically set gradually with manipulator mechanism, and the manipulator mechanism is located at the front of the tin-spraying machine structure；The manipulator mechanism includes being used for pcb board is transferred into the first manipulator of the tin-spraying machine structure from the pre-treatment mechanism and the second manipulator of mechanism is post-processed for pcb board to be transferred to from the tin-spraying machine structure, and first manipulator and the second manipulator are located at the front of the operation window and mirror image is set centered on the tin-spraying machine structure.The present invention to realize automatic upper plate and lower plate of the pcb board during tin spray, improves production efficiency by manipulator mechanism, and pcb board damage caused by reducing manual operation.
Description
Technical field
The present invention relates to circuit board making engineering device technique field, the automatic tin jet device of more particularly to a kind of pcb board and its control
Method.
Background technology
The such pcb board tin spray process of tradition is all artificial upper and lower plates, and not only production efficiency is low, and manually takes plate operation
Often because the misoperation of personnel causes product rejection.
Thus prior art could be improved and improve.
The content of the invention
The technical problem to be solved in the present invention is, in view of the shortcomings of the prior art, there is provided a kind of pcb board sprays tin dress automatically
Put and its control method, to solve to cause formation efficiency low, product rejection rate using artificial on and off duty in existing tin spray process
The problem of high.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is as follows：
A kind of automatic tin jet device of pcb board, it includes the tin-spraying machine structure provided with operation window, pre-treatment mechanism, post processing mechanism
And manipulator mechanism；The pre-treatment mechanism, manipulator mechanism and post processing mechanism are set gradually in the horizontal direction, described
Before tin-spraying machine structure is vertically set gradually with manipulator mechanism, and the manipulator mechanism is located at the tin-spraying machine structure
Side；The manipulator mechanism includes being used to capture out pcb board from the pre-treatment mechanism and be transferred to the tin-spraying machine structure
First manipulator and for by pcb board captured out from the tin-spraying machine structure and be transferred to post processing mechanism the second manipulator, institute
State the first manipulator and the second manipulator is located at the front of the operation window and mirror image is set centered on the tin-spraying machine structure.
The automatic tin jet device of pcb board, wherein, first manipulator includes first base, rotated with first base
First swing arm of connection and the first clamping jaw for being arranged at one end that first swing arm is not connected with first base, described first
Clamping jaw is located at the top of the pre-treatment mechanism；Second manipulator is identical with first robot manipulator structure.
The automatic tin jet device of pcb board, wherein, it also includes PLC control system, the PLC control system respectively with
The pre-treatment mechanism, tin-spraying machine structure, post processing mechanism and manipulator mechanism are connected.
A kind of control method of the automatic tin jet device of pcb board, its be used for the automatic tin jet device of pcb board as described above,
It includes：
A, when currently processed mechanism clappers are completed, the first manipulator captures pcb board from the pre-treatment mechanism, and by described in
Pcb board is transferred to tin-spraying machine structure；
B, when tin-spraying machine structure detects pcb board, control tin spraying fixture clamps the pcb board, and by pcb board under initial position
Move, carry out spraying tin processing to be sent into tin cylinder；
C, when spray tin has been handled, tin spraying fixture drives pcb board to return to the initial position；
D, the second manipulator is moved to tin-spraying machine structure, and captures and the pcb board is transferred into post processing mechanism after the pcb board.
The control method of the automatic tin jet device of pcb board, wherein, the step A is specifically included：
When A1, currently processed mechanism clappers are completed, the first manipulator moves down, and controls the first clamping jaw to capture the pcb board；
The gathering hole that the pcb board is transferred to the tin-spraying machine structure by A2, the first manipulator is intraoral, and is tilted in advance along spray tin guide rail
If angle down send plate until the first clamping jaw reaches the first specified location；
A3, the jaws of tin spraying fixture is controlled to open, first clamping jaw puts pcb board from the position for tilting the predetermined angle
Just, plate and is up sent until the first clamping jaw reaches the second specified location.
The control method of the automatic tin jet device of pcb board, wherein, the predetermined angle is 15 °.
The control method of the automatic tin jet device of pcb board, wherein, between first specified location and tin spraying fixture
Distance is 5-10cm, and within 5cm, upper and lower distance exists the longitudinal separation between second specified location and the tin spraying fixture
Within 7cm.
The control method of the automatic tin jet device of pcb board, wherein, the step B is specifically included：
B1, when sensing that the first clamping jaw is located at the second specified location on tin-spraying machine structure, control tin spraying fixture jaws closure is to press from both sides
Tight pcb board；
B2, the first clamping jaw unclamp pcb board in preset time, and return to the top of the pre-treatment mechanism；
B3, the tin spraying fixture drive the pcb board to be displaced downwardly to from initial position in tin cylinder, spray tin processing.
The control method of the automatic tin jet device of pcb board, wherein, the step D is specifically included：
D1, the second manipulator are moved to that gathering hole is intraoral, and first infrared inductor for passing through its configuration senses pcb board；
D2, when sensing pcb board, second the second clamping jaw of manipulator control open, then close to clamp pcb board, and control
Tin spraying fixture unclamps pcb board in preset time；
D3, the second clamping jaw clamping pcb board first down send plate until the second clamping jaw reaches first specified location, then along spray tin
The direction that guide rail tilts the predetermined angle moves up PCB, to remove operation window, and is transferred to post processing mechanism.
The control method of the automatic tin jet device of pcb board, wherein, the preset time is 0.1S.
Beneficial effect：Compared with prior art, the invention provides a kind of automatic tin jet device of pcb board and its controlling party
Method, the automatic tin jet device of pcb board include：Tin-spraying machine structure, pre-treatment mechanism provided with operation window, post processing mechanism and
Manipulator mechanism；The pre-treatment mechanism, manipulator mechanism and post processing mechanism in the horizontal direction on set gradually, the spray
Before tin mechanism is set gradually with manipulator mechanism on vertically, and the manipulator mechanism is located at the tin-spraying machine structure
Side；The manipulator mechanism includes being used for the first machinery that pcb board is transferred to the tin-spraying machine structure from the pre-treatment mechanism
Hand and the second manipulator for pcb board to be transferred to post processing mechanism from the tin-spraying machine structure, first manipulator and the
Two manipulators are located at the front of the operation window and mirror image is set centered on the tin-spraying machine structure.The present invention is by setting phase
The first manipulator, clamp assemblies and the second manipulator mutually coordinated is saved artificial with realizing the automatic spray tin process of pcb board
Upper plate and next process, improve production efficiency, and pcb board caused by reducing manual operation damages, so as to reduce life
Produce cost.
Brief description of the drawings
Fig. 1 is the structure chart of the automatic tin jet device of pcb board provided by the invention.
Fig. 2 is the front view of the automatic tin jet device of pcb board provided by the invention.
Fig. 3 is the top view of the first clamping jaw provided by the invention.
Fig. 4 is the front view of the first clamping jaw provided by the invention.
Fig. 5 is the partial enlarged drawing at A in Fig. 4.
Fig. 6 is the preferred embodiment flow chart of the control method of the automatic tin jet device of pcb board provided by the invention.
Embodiment
The present invention provides a kind of automatic tin jet device of pcb board and its control method, to make the purpose of the present invention, technical scheme
And effect is clearer, clear and definite, the present invention is described in more detail for the embodiment that develops simultaneously referring to the drawings.It should be appreciated that this
The specific embodiment of place description is not intended to limit the present invention only to explain the present invention.
Below in conjunction with the accompanying drawings, by the description to embodiment, the content of the invention is described further.
Fig. 1 is refer to, Fig. 1 is the structure chart of the preferred embodiment of the automatic tin jet device of pcb board provided by the invention.It is described
The automatic tin jet device of pcb board includes the tin-spraying machine structure 1 provided with operation window 14, pre-treatment mechanism 2, post processing mechanism 3 and machine
Tool mobile phone structure；The pre-treatment mechanism 2, manipulator mechanism and post processing mechanism 3 are set gradually in the horizontal direction, the spray tin
Mechanism 1 is vertically set gradually with manipulator mechanism, and the manipulator mechanism is located at the front of the tin-spraying machine structure；Institute
Stating manipulator mechanism includes being used to capture out pcb board 100 from the pre-treatment mechanism 2 and be transferred to the tin-spraying machine structure 1
First manipulator 4 and for by pcb board 100 captured out from the tin-spraying machine structure 1 and be transferred to post processing mechanism 3 second machinery
Hand 5, during the manipulator 5 of the first manipulator 4 and second is located at the front of the operation window 14 and is with the tin-spraying machine structure 1
Heart mirror image is set.By being set in tin-spraying machine structure 1 and preceding handle in the placement space surrounded between mechanism 2 and post processing mechanism 3
First manipulator 4 and the second manipulator 5, to realize automatically from the preceding upper plate of processing mechanism 2 to tin-spraying machine structure 1, and automatically from spray
The lower plate of tin mechanism 1, so as to instead of artificial upper and lower plates, so improves the efficiency of upper plate and lower plate to mechanism 3 is post-processed, and
Avoid due to the problem of pcb board 100 is scrapped caused by human error, so as to improve the quality that pcb board 100 sprays tin, reduce
Manufacturing cost.
As described in Figure 1, the tin-spraying machine structure 1 includes frame 11, the clamp assemblies 12 being arranged in the frame 11.It is described
The operation window 14 for spraying tin operation is provided with frame 11, the operation window 14 is a cavity, and it is used to accommodate described
The up/down pcb board 100 of one 4/ second manipulator of manipulator 5.The opening of the operation window 14 and the pre-treatment mechanism 2 and after
Processing mechanism 3 in the same side, be achieved in that by the manipulator 5 of the first manipulator 4/ second clamp the pcb board 100 from
The opening upper plate of the operation window 14 is to tin-spraying machine structure 1 or from the lower plate of tin-spraying machine structure 1.
The clamp assemblies 12 include drive cylinder and tin spraying fixture, and the drive cylinder is arranged in the frame 11,
The tin spraying fixture is connected with the piston rod of the drive cylinder, to be moved up and down under the drive of the piston rod.It is described
Tin spraying fixture is placed in the operation window 14, and is moved up and down under the drive of drive cylinder in the operation window 14.
Further, the bottom of the operation window 14 is provided with the tin cylinder for spraying tin processing（Not shown in figure）, the tin cylinder with it is described
Operation window 14 is connected, i.e., the opening of described tin cylinder is on the bottom wall of the operation window 14.When the tin spraying fixture exists
It can be displaced downwardly under the drive of the drive cylinder in the tin cylinder, so, can be with when being clamped with pcb board 100 on tin spraying fixture
Pcb board 100 is driven to be displaced downwardly in tin cylinder, so as to realize that the spray tin of pcb board 100 is handled.
Further, as illustrated in fig. 1 and 2, in order to ensure the held stationary in moving process of pcb board 100, to avoid causing
The damage of pcb board 100, is provided with two guide rails being parallel to each other in the tin cylinder, between described two spray tin guide rails 13 away from
Be adapted from the width with the pcb board 100, with cause the both ends of pcb board 100 be respectively placed in described two spray tin guide rails 13 it
Between, so as to which described two spray tin guide rails 13 play guiding and stable effect in the moving process of pcb board 100.Further, institute
State two spray tin guide rails 13 to extend in the operation window 14 from the tin cylinder, and described two spray tin guide rails 13 are positioned at described
The lower section of tin spraying fixture.So, can be direct when the first manipulator 4 clamping pcb board 100 is transferred in the operation window 14
The pcb board 100 is positioned to described two spray tin guide rails 13, then transmits a signal to tin spraying fixture again to cause Tin spray clamp
The pcb board 100 that tool clamping has been positioned on two spray tin guide rails 13.So as to ensure the positioning precision of pcb board 100, avoid
There is deviation and influences to spray tin quality in displacement during spray tin.
In the present embodiment, the 100 automatic tin jet device of pcb board also includes PLC control system, the PLC controls system
System is connected with the pre-treatment mechanism 2, tin-spraying machine structure 1, post processing mechanism 3 and manipulator mechanism respectively.Pass through the PLC
Signal transmission and behaviour between control system control pre-treatment mechanism 2, tin-spraying machine structure, post processing mechanism 3 and manipulator mechanism
Make program.
In the present embodiment, the pre-treatment mechanism 2 is used to pcb board carrying out pre-treatment and carries out proper alignment, and
Arrange arrangement and be sent to partitioned signal to the first manipulator 4 afterwards.First manipulator 4 includes first base 41 and the first bottom
Seat 41 rotation connection the first swing arms 42 and be arranged at first swing arm 42 end the first clamping jaw 43, it is described first folder
Pawl is located at the top of the pre-treatment mechanism 2.Further, drive component is provided with the first base, to drive described
One swing arm 42 rotates, translates or rotated relative to the first base 41, drives first clamping jaw 43 relative to described the
One swing arm 42 rotates, translates or rotated.First clamping jaw 43 opening/closing chuck under the driving of drive component simultaneously,
So as to realize release/crawl for pcb board 100.
As described in Fig. 3-5, first clamping jaw 43 is one side clamping jaw, and it includes crossbeam 431 and is vertically installed in crossbeam
Holder 432 on 431.The crossbeam 431 is rotatablely connected with the first swing arm 42.The holder 432 is used to clamp pcb board
100, and the holder 432 is slidably connected with the crossbeam 431, can so adjust the holder 432 relative to crossbeam
431 position, so as to adjust the gripping width of holder 432, to be applicable the pcb board 100 of different in width.Further, the folder
Gripping member 432 includes the first slide bar 4321 and the second slide bar being parallel to each other（Do not marked in figure）, set on first slide bar 4321
There are some first claws 4323, second slide bar is provided with some second claws corresponding with first claw 4323
4322, i.e., the second corresponding claw 4322 of described first claw 4323 mirror image centered on the center line of crossbeam 431 is set.
That is one end of pcb board 100 is captured respectively by the claw 4322 of the first claw 4323 and second, steadily to clamp pcb board
100.The slide bar of first slide bar 4321 and second is slidably connected with the crossbeam 431, and vertical with crossbeam 431, passes through regulation
The distance between described slide bar of first slide bar 4321 and second is with the gripping width of the first clamping jaw 43 of regulation.First slide bar
4321 can be located at the optional position of the crossbeam 431 with second slide bar, it is preferable that in the present embodiment, described two
Slide bar is symmetrical arranged centered on the center line of crossbeam 431 respectively.It can so ensure that the both ends stress of crossbeam 431 is equal, be advantageous to
Crossbeam 431 is kept to keep balance in moving process, so as to realize steady mobile pcb board 100.
Further, first claw 4323 includes fixed part 4324, the first driving gas being arranged on fixed part 4324
Cylinder 4325 and holding section 4327, and the J-type grab 4326 to be fastened with the holding section 4327.The fixed part 4324 and institute
State the first slide bar 4321 to be fixedly connected, the first claw 4323 is fixed on the first slide bar 4321.The J-type grab 4326 is one
Body structure, it includes straight-bar portion and knee portion, the one end of the straight-bar portion away from knee portion and first drive cylinder 4325
Piston rod rotation connection, the joint in the straight-bar portion and knee portion is rotatablely connected with the holding section 4327, when the first drive
Take offence cylinder 4325 piston rod to when being moved away from the direction of slide bar, drive the knee portion to engage with the holding section 4327,
To clamp pcb board 100；When the direction of piston to the close slide bar of the first drive cylinder 4325 is moved, the knee portion is driven
Separated with above-mentioned holding section 4327, to unclamp pcb board 100.
Further, the holding section 4327 is provided with the projection being in contact with the knee portion, and the raised surface is provided with
Sawtooth, the surface that the knee portion is in contact with the projection are provided with sawtooth.So, described in being fastened when knee portion and lug boss
During pcb board 100, the frictional force between pcb board 100 can be increased, so as to increase chucking power, avoid pcb board 100 come off or
Skid off.
In the present embodiment, the post processing mechanism 3 is used for after the pcb board 100 that second manipulator 5 captures is carried out
Processing.Second manipulator 5 include second base 51, with the second base 51 be rotatablely connected the second swing arm, with it is described
Second clamping jaw of the second swing arm rotation connection, second clamping jaw is positioned at the top of the post processing mechanism 3.Further, it is described
Second base 51 is provided with drive component, to drive the 3rd swing arm to rotate, translate relative to the second base 51 or
Rotate, drive the 4th cantilever to rotate, translate or rotate relative to the 3rd swing arm.Second clamping jaw is driving simultaneously
Opening/closing man head under the driving of dynamic component, so as to realize release/crawl to pcb board 100.In the present embodiment, described
The structure of two clamping jaws is identical with the structure of second clamping jaw, will not be repeated here.
Present invention also offers a kind of control method of the automatic tin jet device of pcb board, as shown in fig. 6, it includes：
When S10, currently processed mechanism clappers are completed, the first manipulator captures pcb board from the pre-treatment mechanism, and by described in
Pcb board is transferred to tin-spraying machine structure；
When S20, tin-spraying machine structure detect pcb board, control tin spraying fixture clamps the pcb board, and by pcb board under initial position
Move, carry out spraying tin processing to be sent into tin cylinder；
S30, when spraying tin and handle, tin spraying fixture drives the pcb board return initial position；
S40, the second manipulator are moved to tin-spraying machine structure, and capture and the pcb board is transferred into post-processor after the pcb board
Structure.
Specifically, when currently processed mechanism clappers are completed, pre-treatment mechanism is sent to partitioned signal to PCL control systems, PLC
Control system controls the first manipulator to move down and capture pcb board from the pre-treatment mechanism.Certainly, also include between pre-
The grasp width of first clamping jaw hand and the second clamping jaw is first set, wherein, the grasp width is relative with the width of the pcb board
Should.Further, the first manipulator needs to consider to keep away position requirement between tin spraying fixture during pcb board is transferred, with
Collision free is to tin spraying fixture.Therefore the step S10 can specifically include：
When S11, currently processed mechanism clappers are completed, the first manipulator moves down, and controls the first clamping jaw to capture the pcb board；
S12, the gathering hole that the pcb board is transferred to the tin-spraying machine structure are intraoral, and tilt predetermined angle along spray tin guide rail
Plate is down sent in direction until the first clamping jaw reaches the first specified location；
S13, the jaws of tin spraying fixture is controlled to open, first clamping jaw puts pcb board from the position for tilting the predetermined angle
Just, plate and is up sent until the first clamping jaw reaches the second specified location.
Specifically, in the step S11, when currently processed mechanism clappers are completed, first manipulator control the
One clamping jaw moves down, and opens and then closes to capture pcb board；Then the first swing arm and the second swing arm rotate and swung to cause simultaneously
The pcb board being clamped on the first clamping jaw is changed into vertical direction from horizontal direction, and last first clamping jaw rotates and drives PCB to revolve
Turn to spray tin guide rail with alignment.
In the step S12, the initial position refers to the position of the tin spraying fixture clamping pcb board, the spray
Tin fixture drives pcb board to be displaced downwardly to tin cylinder from the initial position, then returns the initial position.First specific bit
Put and refer to home residing for the first clamping jaw, its apart from tin spraying fixture distance within 5-10cm, so not only can be with
Manipulator is avoided to collide fixture, it is ensured that the both ends of pcb board are completely nested in two guide rails.The predetermined angle is 15 °, this
Sample is easy to pcb board to be inserted in two guide rails, so as to ensure follow-up steady movement.Specifically, the first manipulator moves pcb board
Gathering hole to tin-spraying machine structure is intraoral, and clamps pcb board and down send plate along the direction for spraying 15 ° of tin guide rail inclination, until the first folder
Pawl is apart from tin spraying fixture 10cm；Now, the jaws of tin spraying fixture is opened, and the first clamping jaw ajusts PCB from the position for tilting 15 °,
And plate is up sent until the first clamping jaw reaches the second specified location.Wherein, second specified location refers to the first manipulator
With tin-spraying machine structure handing-over pcb board position, i.e., tin spraying fixture close and clamp pcb board and the first clamping jaw release pcb board position.
When the first clamping jaw is in the second specified location, the longitudinal separation between first clamping jaw and tin spraying fixture within 5cm, on
Lower distance can so avoid bumping against fixture within 7cm.
In the step S20, due to, when the first clamping jaw for being clamped with pcb board reaches the second specified location, the spray
Tin fixture just closes and clamps pcb board, that is, performs the operation with the first clamping jaw handing-over pcb board.Therefore the tin-spraying machine structure detection
Refer to detecting that the first clamping jaw reaches second specified location to pcb board.In actual applications, can also be specified second
Position sets the first infrared inductor to be used to sense the second clamping jaw/pcb board.
Exemplary, when the tin-spraying machine structure detects pcb board, control tin spraying fixture clamps the pcb board, and by PCB
Spray tin processing is carried out in plate feeding tin cylinder to specifically include：
S21, when tin-spraying machine structure senses that the first clamping jaw is located at the second specified location, control tin spraying fixture jaws closure is to clamp
Pcb board；
S22, first clamping jaw unclamp pcb board in preset time, and return to the top of the pre-treatment mechanism；
S23, the tin spraying fixture drive the pcb board to be displaced downwardly to from initial position in tin cylinder, spray tin processing.
Specifically, because in step s 13, when clamping jaw reaches the first specified location, the jaws of the tin spraying fixture is
Through opening, therefore when the first clamping jaw reaches the second specified location（I.e. the first infrared inductor senses pcb board）, control spray tin
Fixture closure controls the first clamping jaw to unclamp pcb board in preset time to clamp pcb board.Wherein, the time is extremely short
Time, such as 0.1S.So cause the first clamping jaw is clamped in the very short time of pcb board in tin-spraying machine structure to unclamp pcb board, with reality
Existing smooth handing-over process, saves the time.After first manipulator unclamps pcb board, and gathering hole is intraoral exits, and is then return to
The top of pre-treatment mechanism, and wait and receive partitioned signal.After the tin spraying fixture clamps pcb board, tin spraying fixture is from its institute
Place's initial position drives pcb board to be displaced downwardly in tin cylinder until reaching its range, spray tin processing.Wherein, it is described first
Beginning position refer to tin spraying fixture move down before position（Clamp the position of pcb board）, the range refers to tin spraying fixture
The maximum position moved down under the driving of drive cylinder.Positioned for the ease of tin spraying fixture, in the present embodiment, the Tin spray clamp
Tool only exists two kinds of location status, i.e. initial position and maximum travel position.
In the step S30, tin spraying fixture drives pcb board to return back to initial position after the completion of spray tin processing, and waits
Treat the pcb board that the second manipulator crawl spray tin is completed.
, can also be in order to avoid the second manipulator the phenomenon to use leisure moments occurs gathering hole is intraoral in the step S40
An infrared inductor is configured on second manipulator, pcb board is sensed by the infrared inductor so that only in operation window
When pcb board inside be present, grasping manipulation is just performed.Therefore, the step S40 can specifically include：
S41, the second manipulator are moved to that gathering hole is intraoral, and second infrared inductor for passing through its configuration senses pcb board；
S42, when sensing pcb board, second the second clamping jaw of manipulator control open, then close to clamp pcb board, and control
Tin spraying fixture unclamps pcb board in preset time；
S43, the second clamping jaw clamping pcb board first down send plate until the second clamping jaw reaches first specified location, then along spray
The direction that tin guide rail tilts the predetermined angle moves up PCB, to remove operation window, and is transferred to post processing mechanism.
Specifically, in the step S41, when the second manipulator is moved in the application window of tin-spraying machine structure, pass through
Its dish thermal infrared inductor configured sensing pcb board.Step S42 is performed when sensing；When being not sensed by, crawl is not performed
Operate and return to the top of post processing mechanism.In the step S42, when sensing pcb board, second manipulator control
Second clamping jaw opens, and then closes to clamp pcb board.When sensing that the second clamping jaw clamps pcb board, the tin spraying fixture is pre-
If pcb board is unclamped in the time.Wherein, the time is the extremely short time, such as 0.1S.So cause tin spraying fixture in the second folder
Pcb board is unclamped in the very short time of the tight pcb board of claw clip, to realize smooth handing-over process, saves the time.In the step S43
In, it is identical during with the first manipulator upper plate, in order to avoid being collided with tin spraying fixture, second clamping jaw clamp pcb board it
Afterwards, plate is down sent first until the second clamping jaw reaches the first specified location, i.e. peace of the second clamping jaw apart from tin spraying fixture 5-10cm
Full distance and then tilt 15 ° along spray tin guide rail and up send plate, most pcb board removes operation window at last, and is moved to post processing
Mechanism.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (10)
1. a kind of automatic tin jet device of pcb board, it is characterised in that it includes tin-spraying machine structure, pretreating machine provided with operation window
Structure, post processing mechanism and manipulator mechanism；The pre-treatment mechanism, manipulator mechanism and post processing mechanism are in the horizontal direction
Set gradually, the tin-spraying machine structure is vertically set gradually with manipulator mechanism, and the manipulator mechanism is positioned at described
The front of tin-spraying machine structure；The manipulator mechanism includes being used to capture out pcb board from the pre-treatment mechanism and be transferred to institute
State the first manipulator of tin-spraying machine structure and for being captured out pcb board from the tin-spraying machine structure and being transferred to the of post processing mechanism
Two manipulators, first manipulator and the second manipulator are located at the front of the operation window and using the tin-spraying machine structure in
Heart mirror image is set.
2. the 1 automatic tin jet device of pcb board to be gone according to right, it is characterised in that first manipulator includes the first bottom
Seat, the first swing arm being rotatablely connected with first base and it is arranged at one end that first swing arm is not connected with first base
First clamping jaw, first clamping jaw are located at the top of the pre-treatment mechanism；Second manipulator and first manipulator
Structure is identical.
3. the automatic tin jet device of pcb board according to claim 1, it is characterised in that it also includes PLC control system, described
PLC control system is connected with the pre-treatment mechanism, tin-spraying machine structure, post processing mechanism and manipulator mechanism respectively.
4. a kind of control method of the automatic tin jet device of pcb board, it is characterised in that it is applied to as described in claim 1-3
The automatic tin jet device of pcb board, it includes：
A, when currently processed mechanism clappers are completed, the first manipulator captures pcb board from the pre-treatment mechanism, and by described in
Pcb board is transferred to tin-spraying machine structure；
B, when tin-spraying machine structure detects pcb board, control tin spraying fixture clamps the pcb board, and by pcb board under initial position
Move, carry out spraying tin processing to be sent into tin cylinder；
C, when spray tin has been handled, tin spraying fixture drives pcb board to return to the initial position；
D, the second manipulator is moved to tin-spraying machine structure, and captures and the pcb board is transferred into post processing mechanism after the pcb board.
5. the control method of the automatic tin jet device of pcb board according to claim 4, it is characterised in that the step A is specifically wrapped
Include：
When A1, currently processed mechanism clappers are completed, the first manipulator moves down, and controls the first clamping jaw to capture the pcb board；
The gathering hole that the pcb board is transferred to the tin-spraying machine structure by A2, the first manipulator is intraoral, and is tilted in advance along spray tin guide rail
If angle down send plate until the first clamping jaw reaches the first specified location；
A3, the jaws of tin spraying fixture is controlled to open, first clamping jaw puts pcb board from the position for tilting the predetermined angle
Just, plate and is up sent until the first clamping jaw reaches the second specified location.
6. the control method of the automatic tin jet device of pcb board according to claim 5, it is characterised in that the predetermined angle is
15°。
7. the control method of the automatic tin jet device of pcb board according to claim 5, it is characterised in that first specific bit
It is 5-10cm to put the distance between tin spraying fixture, and the longitudinal separation between second specified location and the tin spraying fixture exists
Within 5cm, upper and lower distance is within 7cm.
8. the control method of the automatic tin jet device of pcb board according to claim 5, it is characterised in that the step B is specifically wrapped
Include：
B1, when tin-spraying machine structure senses that the first clamping jaw is located at the second specified location, control tin spraying fixture jaws closure is to clamp
Pcb board；
B2, the first clamping jaw unclamp pcb board in preset time, and return to the top of the pre-treatment mechanism；
B3, the tin spraying fixture drive the pcb board to be displaced downwardly to from initial position in tin cylinder, spray tin processing.
9. the control method of the automatic tin jet device of pcb board according to claim 5, it is characterised in that the step D is specifically wrapped
Include：
D1, the second manipulator are moved to that gathering hole is intraoral, and first infrared inductor for passing through its configuration senses pcb board；
D2, when sensing pcb board, second the second clamping jaw of manipulator control open, then close to clamp pcb board, and control
Tin spraying fixture unclamps pcb board in preset time；
D3, the second clamping jaw clamping pcb board first down send plate until the second clamping jaw reaches first specified location, then along spray tin
The direction that guide rail tilts the predetermined angle moves up PCB, to remove operation window, and is transferred to post processing mechanism.
10. the control method of the automatic tin jet device of pcb board according to claim 8 or claim 9, it is characterised in that when described default
Between be 0.1S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710922493.8A CN107509324B (en) | 2017-09-30 | 2017-09-30 | Automatic tin spraying device for PCB and control method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710922493.8A CN107509324B (en) | 2017-09-30 | 2017-09-30 | Automatic tin spraying device for PCB and control method thereof |
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| Publication Number | Publication Date |
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| CN107509324A true CN107509324A (en) | 2017-12-22 |
| CN107509324B CN107509324B (en) | 2023-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710922493.8A Active CN107509324B (en) | 2017-09-30 | 2017-09-30 | Automatic tin spraying device for PCB and control method thereof |
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| Country | Link |
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| CN108337808A (en) * | 2018-02-05 | 2018-07-27 | 江西景旺精密电路有限公司 | A kind of PCB anti-welding production line automatically |
| CN108977742A (en) * | 2018-10-19 | 2018-12-11 | 深圳市克鲁斯机器人科技有限公司 | A kind of spray tin automatic loading and unloading device |
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| CN107509324B (en) | 2023-12-26 |
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