CN107482297A - 一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺 - Google Patents
一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺 Download PDFInfo
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Abstract
本发明公开了一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,包括以下步骤:先将整体被聚四氟乙烯绝缘的射频电缆放入二氯乙烷中采用超声清洗;然后进行粗化、敏化、活化处理;将活化后的射频电缆置于KOH和甲醛混合溶液中30S;将射频电缆放入配制好的化学镀银溶液中化学镀银;化学镀银处理后的射频电缆再经连续镀银加厚银层并干燥得到镀银射频电缆。本工艺自配表面金属化试剂,对射频电缆外的聚四氟乙烯材料表面改性具有非常显著的效果;制得的整体被聚四氟乙烯绝缘的射频电缆形成的纯银外导体具有良好的致密性,连续性,均匀性,优良的结合力以及优良的导电性能和屏蔽性能。
Description
技术领域
本发明涉及化学镀银技术领域,特别是一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺。
背景技术
随着通讯设备的小型化,要求电缆尺寸小型化并具有更好的机械性能,例如柔软性、弯曲成形性能和端接性能,以适应个人通信业务、无线移动蜂窝基站等紧密布线系统的电缆敷设使用。为适应这种需求,在射频同轴电缆领域,一种替代半硬射频同轴电缆的新型电缆——半柔软射频同轴电缆应运而生。
半柔软同轴电缆兼有半硬同轴电缆优越的电性能和柔软同轴电缆柔软、易弯曲的特点。半柔软电缆具有优秀的电性能和独特的机械优势,它的主要结构组成是镀银铜内导体,PTFE绝缘以及浸(涂)锡编织。
在电缆绝缘表面(该表面材料为四氟乙烯),直接镀覆上金属银层,作为外导体,即可同时起到电缆的屏蔽性能,又能大大的减轻电缆的重量。但由于膨胀聚四氟乙烯的分子机构决定其化学性能极其稳定,表面活性极低,其材料表面改性困难,因此要在其表面镀一层结合力,镀层致密性,连续性和均匀性良好的镀层难度很大。
发明内容
本发明的目的是要解决现有技术的问题,提供一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺。
为达到上述目的,本发明是按照以下技术方案实施的:
一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,包括以下步骤:
S1、先将整体被聚四氟乙烯绝缘的射频电缆放入百分比浓度为25%的二氯乙烷中采用超声波进行清洗25-35min,在90℃条件下烘干;
S2、将步骤S1中烘干后的射频电缆置于百分比浓度10%的NaH-DMSO溶液中,进行粗化,并用超声波震荡;
S3、将经过粗化的射频电缆,放入25℃的敏化液中超声波震荡8min,然后取出射频电缆用去离子水进行充分漂洗;
S4、将敏化后的射频电缆,放入25℃的活化液中超声波震荡5min,使其充分活化,然后取出射频电缆用去离子水进行充分漂洗;
S5、将活化后的射频电缆置于10g/L的KOH和20ml/L的甲醛混合溶液中30S,然后取出射频电缆用去离子水进行充分漂洗;
S6、将步骤S5处理后的射频电缆放入配制好的化学镀银溶液中,其中所述化学镀银溶液中各组分的浓度为:硝酸银:6-14g/L,葡萄糖:4-12g/L,氨水:30-80ml/L,酒石酸钾钠:1-4g/L,乙二胺:20ml/L,乙醇:40ml/L,氢氧化钾:3-10g/L,聚乙二醇:75ml/L,在该化学镀银溶液温度为25-30℃条件下化学镀银10-30min;
S7、将经过S6化学镀银处理后的射频电缆用纯水进行充分漂洗,再经连续镀银加厚银层并用去离子水进行充分漂洗,烘干得到镀银射频电缆。
进一步,所述步骤S3中的敏化液由15g/L的SnCl2溶液和20ml/L的HCl溶液组成。
进一步,所述步骤S4中的活化液由0.5g/L的PdCl2溶液和10ml/L的HCl溶液组成。
与现有技术相比,本发明具有以下有益效果:
1、本工艺自配表面金属化试剂,对射频电缆外的聚四氟乙烯材料表面改性具有非常显著的效果。
2、本工艺的镀银液更加稳定,且镀银增重率为传统工艺的2倍。
3、本工艺制得的整体被聚四氟乙烯绝缘的射频电缆形成的纯银外导体具有良好的致密性,连续性,均匀性,优良的结合力以及优良的导电性能和屏蔽性能,使的射频电缆具有轻型及小尺寸。
具体实施方式
下面结合具体实施例对本发明作进一步描述,在此发明的示意性实施例以及说明用来解释本发明,但并不作为对本发明的限定。
实施例1
一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,包括以下步骤:
S1、先将整体被聚四氟乙烯绝缘的射频电缆放入百分比浓度为25%的二氯乙烷中采用超声波进行清洗25min,在90℃条件下烘干;
S2、将步骤S1中烘干后的射频电缆置于百分比浓度10%的NaH-DMSO溶液中,进行粗化,并用超声波震荡;
S3、将经过粗化的射频电缆,放入25℃的敏化液中超声波震荡8min,其中敏化液由15g/L的SnCl2溶液和20ml/L的HCl溶液组成,然后取出射频电缆用去离子水漂洗;
S4、将敏化后的射频电缆,放入25℃的活化液中超声波震荡5min,其中,活化液由0.5g/L的PdCl2溶液和10ml/L的HCl溶液组成,使其充分活化,然后取出射频电缆用去离子水漂洗;
S5、将活化后的射频电缆置于10g/L的KOH和20ml/L的甲醛混合溶液中30S,然后取出射频电缆用去离子水漂洗;
S6、将步骤S5处理后的射频电缆放入配制好的化学镀银溶液中,其中所述化学镀银溶液中各组分的浓度为:硝酸银:6g/L,葡萄糖:4g/L,氨水:30ml/L,酒石酸钾钠:1g/L,乙二胺:20ml/L,乙醇:40ml/L,氢氧化钾:3g/L,聚乙二醇:75ml/L,在该化学镀银溶液温度为25℃条件下化学镀银10min;
S7、将经过S6化学镀银处理后的射频电缆用去离子水进行充分漂洗,再经连续镀银加厚银层并用去离子水进行充分漂洗,烘干得到镀银射频电缆。
实施例2
一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,包括以下步骤:
S1、先将整体被聚四氟乙烯绝缘的射频电缆放入百分比浓度为25%的二氯乙烷中采用超声波进行清洗35min,在90℃条件下烘干;
S2、将步骤S1中烘干后的射频电缆置于百分比浓度10%的NaH-DMSO溶液中,进行粗化,并用超声波震荡;
S3、将经过粗化的射频电缆,放入25℃的敏化液中超声波震荡8min,其中敏化液由15g/L的SnCl2溶液和20ml/L的HCl溶液组成,然后取出射频电缆用去离子水漂洗;
S4、将敏化后的射频电缆,放入25℃的活化液中超声波震荡5min,其中,活化液由0.5g/L的PdCl2溶液和10ml/L的HCl溶液组成,使其充分活化,然后取出射频电缆用去离子水漂洗;
S5、将活化后的射频电缆置于10g/L的KOH和20ml/L的甲醛混合溶液中30S,然后取出射频电缆用去离子水漂洗;
S6、将步骤S5处理后的射频电缆放入配制好的化学镀银溶液中,其中所述化学镀银溶液中各组分的浓度为:硝酸银:14g/L,葡萄糖:12g/L,氨水:80ml/L,酒石酸钾钠:4g/L,乙二胺:20ml/L,乙醇:40ml/L,氢氧化钾:10g/L,聚乙二醇:75ml/L,在该化学镀银溶液温度为30℃条件下化学镀银30min;
S7、将经过S6化学镀银处理后的射频电缆用去离子水进行充分漂洗,再经连续镀银加厚银层并用去离子水进行充分漂洗,烘干得到镀银射频电缆。
实施例3
一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,包括以下步骤:
S1、先将整体被聚四氟乙烯绝缘的射频电缆放入百分比浓度为25%的二氯乙烷中采用超声波进行清洗30min,在90℃条件下烘干;
S2、将步骤S1中烘干后的射频电缆置于百分比浓度10%的NaH-DMSO溶液中,进行粗化,并用超声波震荡;
S3、将经过粗化的射频电缆,放入25℃的敏化液中超声波震荡8min,其中敏化液由15g/L的SnCl2溶液和20ml/L的HCl溶液组成,然后取出射频电缆用去离子水漂洗;
S4、将敏化后的射频电缆,放入25℃的活化液中超声波震荡5min,其中,活化液由0.5g/L的PdCl2溶液和10ml/L的HCl溶液组成,使其充分活化,然后取出射频电缆用去离子水漂洗;
S5、将活化后的射频电缆置于10g/L的KOH和20ml/L的甲醛混合溶液中30S,然后取出射频电缆用去离子水漂洗;
S6、将步骤S5处理后的射频电缆放入配制好的化学镀银溶液中,其中所述化学镀银溶液中各组分的浓度为:硝酸银:10g/L,葡萄糖:8g/L,氨水:60ml/L,酒石酸钾钠:3g/L,乙二胺:20ml/L,乙醇:40ml/L,氢氧化钾:7g/L,聚乙二醇:75ml/L,在该化学镀银溶液温度为28℃条件下化学镀银20min;
S7、将经过S6化学镀银处理后的射频电缆用去离子水进行充分漂洗,再经连续镀银加厚银层并用去离子水进行充分漂洗,烘干得到镀银射频电缆。
本发明的技术方案不限于上述具体实施例的限制,凡是根据本发明的技术方案做出的技术变形,均落入本发明的保护范围之内。
Claims (3)
1.一种聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,其特征在于,包括以下步骤:
S1、先将整体被聚四氟乙烯绝缘的射频电缆放入百分比浓度为25%的二氯乙烷中采用超声波进行清洗25-35min,在90℃条件下烘干;
S2、将步骤S1中烘干后的射频电缆置于百分比浓度10%的NaH-DMSO溶液中,进行粗化,并用超声波震荡;
S3、将经过粗化的射频电缆,放入25℃的敏化液中超声波震荡8min,然后取出射频电缆用去离子水进行充分漂洗;
S4、将敏化后的射频电缆,放入25℃的活化液中超声波震荡5min,使其充分活化,然后取出射频电缆用去离子水进行充分漂洗;
S5、将活化后的射频电缆置于10g/L的KOH和20ml/L的甲醛混合溶液中30S,然后取出射频电缆用去离子水进行充分漂洗;
S6、将步骤S5处理后的射频电缆放入配制好的化学镀银溶液中,其中所述化学镀银溶液中各组分的浓度为:硝酸银:6-14g/L,葡萄糖:4-12g/L,氨水:30-80ml/L,酒石酸钾钠:1-4g/L,乙二胺:20ml/L,乙醇:40ml/L,氢氧化钾:3-10g/L,聚乙二醇:75ml/L,在该化学镀银溶液温度为25-30℃条件下化学镀银10-30min;
S7、将经过S6化学镀银处理后的射频电缆用纯水进行充分漂洗,再经连续镀银加厚银层并用去离子水进行充分漂洗,烘干得到镀银射频电缆。
2.根据权利要求1所述的聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,其特征在于:所述步骤S3中的敏化液由15g/L的SnCl2溶液和20ml/L的HCl溶液组成。
3.根据权利要求1所述的聚四氟乙烯表面镀银的耐高温射频电缆的加工工艺,其特征在于:所述步骤S4中的活化液由0.5g/L的PdCl2溶液和10ml/L的HCl溶液组成。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109338342A (zh) * | 2018-08-08 | 2019-02-15 | 中纺院(天津)科技发展有限公司 | 一种镀银聚四氟乙烯微孔薄膜及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101705614A (zh) * | 2009-11-03 | 2010-05-12 | 上海大学 | 镀镍镀银芳香族聚酰胺导电纤维的制备方法 |
CN102899890A (zh) * | 2012-10-31 | 2013-01-30 | 昆明理工大学 | 一种芳纶纤维表面金属化处理方法 |
CN104681907A (zh) * | 2015-02-09 | 2015-06-03 | 中国电子科技集团公司第二十三研究所 | 整体聚四氟乙烯绝缘表面镀银外导体射频电缆及加工方法 |
CN105780493A (zh) * | 2016-04-19 | 2016-07-20 | 东华大学 | 一种具有导电及电磁屏蔽性能棉织物的制备方法 |
CN105986255A (zh) * | 2015-02-16 | 2016-10-05 | 潘启荣 | 工件的表面处理方法 |
-
2017
- 2017-08-07 CN CN201710666220.1A patent/CN107482297A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101705614A (zh) * | 2009-11-03 | 2010-05-12 | 上海大学 | 镀镍镀银芳香族聚酰胺导电纤维的制备方法 |
CN102899890A (zh) * | 2012-10-31 | 2013-01-30 | 昆明理工大学 | 一种芳纶纤维表面金属化处理方法 |
CN104681907A (zh) * | 2015-02-09 | 2015-06-03 | 中国电子科技集团公司第二十三研究所 | 整体聚四氟乙烯绝缘表面镀银外导体射频电缆及加工方法 |
CN105986255A (zh) * | 2015-02-16 | 2016-10-05 | 潘启荣 | 工件的表面处理方法 |
CN105780493A (zh) * | 2016-04-19 | 2016-07-20 | 东华大学 | 一种具有导电及电磁屏蔽性能棉织物的制备方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109338342A (zh) * | 2018-08-08 | 2019-02-15 | 中纺院(天津)科技发展有限公司 | 一种镀银聚四氟乙烯微孔薄膜及其制备方法 |
CN109338342B (zh) * | 2018-08-08 | 2020-09-15 | 中纺院(天津)科技发展有限公司 | 一种镀银聚四氟乙烯微孔薄膜及其制备方法 |
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