CN107470804A - 一种电子组装工艺 - Google Patents
一种电子组装工艺 Download PDFInfo
- Publication number
- CN107470804A CN107470804A CN201710692428.0A CN201710692428A CN107470804A CN 107470804 A CN107470804 A CN 107470804A CN 201710692428 A CN201710692428 A CN 201710692428A CN 107470804 A CN107470804 A CN 107470804A
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- CN
- China
- Prior art keywords
- welding
- welding sequence
- temperature section
- sequence
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710692428.0A CN107470804B (zh) | 2017-08-14 | 2017-08-14 | 一种电子组装工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710692428.0A CN107470804B (zh) | 2017-08-14 | 2017-08-14 | 一种电子组装工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107470804A true CN107470804A (zh) | 2017-12-15 |
CN107470804B CN107470804B (zh) | 2019-09-17 |
Family
ID=60600295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710692428.0A Active CN107470804B (zh) | 2017-08-14 | 2017-08-14 | 一种电子组装工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN107470804B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3608009A1 (de) * | 1986-03-11 | 1987-09-17 | Philips Patentverwaltung | Verfahren zur herstellung von mikroverbindungen mittels festkoerperschweissen |
CN102139412A (zh) * | 2011-03-18 | 2011-08-03 | 上海镭基光电技术有限公司 | 一种激光焊接方法 |
JP2011192739A (ja) * | 2010-03-12 | 2011-09-29 | Seiko Instruments Inc | パッケージ製造方法、および電子部品パッケージ |
CN102950350A (zh) * | 2012-10-05 | 2013-03-06 | 中国电子科技集团公司第十研究所 | 多温度梯级焊接电子微组件的工艺方法 |
CN103165480A (zh) * | 2011-12-15 | 2013-06-19 | 北京大学深圳研究生院 | 倒装芯片凸点的制备方法 |
CN103717340A (zh) * | 2012-08-02 | 2014-04-09 | 株式会社谷黑组 | 具有电极熔蚀防止层的部件及其制造方法 |
CN107041081A (zh) * | 2017-06-02 | 2017-08-11 | 奇酷互联网络科技(深圳)有限公司 | Pcb表面贴装方法和印刷电路板 |
-
2017
- 2017-08-14 CN CN201710692428.0A patent/CN107470804B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3608009A1 (de) * | 1986-03-11 | 1987-09-17 | Philips Patentverwaltung | Verfahren zur herstellung von mikroverbindungen mittels festkoerperschweissen |
JP2011192739A (ja) * | 2010-03-12 | 2011-09-29 | Seiko Instruments Inc | パッケージ製造方法、および電子部品パッケージ |
CN102139412A (zh) * | 2011-03-18 | 2011-08-03 | 上海镭基光电技术有限公司 | 一种激光焊接方法 |
CN103165480A (zh) * | 2011-12-15 | 2013-06-19 | 北京大学深圳研究生院 | 倒装芯片凸点的制备方法 |
CN103717340A (zh) * | 2012-08-02 | 2014-04-09 | 株式会社谷黑组 | 具有电极熔蚀防止层的部件及其制造方法 |
CN102950350A (zh) * | 2012-10-05 | 2013-03-06 | 中国电子科技集团公司第十研究所 | 多温度梯级焊接电子微组件的工艺方法 |
CN107041081A (zh) * | 2017-06-02 | 2017-08-11 | 奇酷互联网络科技(深圳)有限公司 | Pcb表面贴装方法和印刷电路板 |
Also Published As
Publication number | Publication date |
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CN107470804B (zh) | 2019-09-17 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Long Xiusen Inventor after: Li Yuexing Inventor after: Liu Gengye Inventor before: Long Xiusen |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Long Xiusen Inventor after: Li Yuexing Inventor after: Liu Gengye Inventor after: Wang Anqi Inventor before: Long Xiusen Inventor before: Li Yuexing Inventor before: Liu Gengye |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An electronic assembly process Effective date of registration: 20210908 Granted publication date: 20190917 Pledgee: China Everbright Bank Co.,Ltd. Xiangtan sub branch Pledgor: TIME VARYING TRANSMISSION Co.,Ltd. Registration number: Y2021430000044 |