CN107432090B - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
CN107432090B
CN107432090B CN201580066300.2A CN201580066300A CN107432090B CN 107432090 B CN107432090 B CN 107432090B CN 201580066300 A CN201580066300 A CN 201580066300A CN 107432090 B CN107432090 B CN 107432090B
Authority
CN
China
Prior art keywords
heat
electronic component
compartment
generating electronic
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580066300.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN107432090A (zh
Inventor
大门裕司
藤井则男
须永英树
铃木春夫
岛村雄三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marilyn Co ltd
Original Assignee
Kisammori Nannin Seisei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kisammori Nannin Seisei Co Ltd filed Critical Kisammori Nannin Seisei Co Ltd
Publication of CN107432090A publication Critical patent/CN107432090A/zh
Application granted granted Critical
Publication of CN107432090B publication Critical patent/CN107432090B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
CN201580066300.2A 2014-12-09 2015-09-04 电子设备 Active CN107432090B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014248663A JP6328044B2 (ja) 2014-12-09 2014-12-09 電子ユニット
JP2014-248663 2014-12-09
PCT/JP2015/075196 WO2016092919A1 (ja) 2014-12-09 2015-09-04 電子ユニット

Publications (2)

Publication Number Publication Date
CN107432090A CN107432090A (zh) 2017-12-01
CN107432090B true CN107432090B (zh) 2019-10-29

Family

ID=56107115

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580066300.2A Active CN107432090B (zh) 2014-12-09 2015-09-04 电子设备

Country Status (5)

Country Link
US (1) US9943010B2 (enExample)
EP (1) EP3232748A1 (enExample)
JP (1) JP6328044B2 (enExample)
CN (1) CN107432090B (enExample)
WO (1) WO2016092919A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid
FR3115653B1 (fr) * 2020-10-22 2022-09-09 Continental Automotive Gmbh Elément de boitier électronique comprenant un radiateur et procédé d’ajustement associé
CN113301756B (zh) * 2021-06-07 2022-11-01 国网黑龙江省电力有限公司供电服务中心 一种高寒地区电能表数据采集信号强化器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614108B1 (en) * 2000-10-23 2003-09-02 Delphi Technologies, Inc. Electronic package and method therefor
JP2004228159A (ja) * 2003-01-20 2004-08-12 Calsonic Kansei Corp Ｐｗｍモジュール
JP2010147260A (ja) * 2008-12-19 2010-07-01 Stanley Electric Co Ltd 回路モジュール及びその密封方法
CN102656961A (zh) * 2009-12-10 2012-09-05 罗伯特·博世有限公司 电子控制设备
JP2013165139A (ja) * 2012-02-10 2013-08-22 Honda Motor Co Ltd 電子部品ユニットの封止構造及び製造方法
CN103348467A (zh) * 2011-04-22 2013-10-09 三菱电机株式会社 半导体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2537539Y2 (ja) 1991-09-19 1997-06-04 三菱重工業株式会社 コントロールボックスのトランス固定構造
JPH0550788U (ja) 1991-12-02 1993-07-02 株式会社東芝 パネルの取付構造
JP2924387B2 (ja) * 1991-12-16 1999-07-26 株式会社デンソー Ｉｃ応用製品の防水構造
JP4043930B2 (ja) * 2002-12-05 2008-02-06 カルソニックカンセイ株式会社 Ｐｗｍモジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614108B1 (en) * 2000-10-23 2003-09-02 Delphi Technologies, Inc. Electronic package and method therefor
JP2004228159A (ja) * 2003-01-20 2004-08-12 Calsonic Kansei Corp Ｐｗｍモジュール
JP2010147260A (ja) * 2008-12-19 2010-07-01 Stanley Electric Co Ltd 回路モジュール及びその密封方法
CN102656961A (zh) * 2009-12-10 2012-09-05 罗伯特·博世有限公司 电子控制设备
CN103348467A (zh) * 2011-04-22 2013-10-09 三菱电机株式会社 半导体装置
JP2013165139A (ja) * 2012-02-10 2013-08-22 Honda Motor Co Ltd 電子部品ユニットの封止構造及び製造方法

Also Published As

Publication number Publication date
JP6328044B2 (ja) 2018-05-23
US9943010B2 (en) 2018-04-10
CN107432090A (zh) 2017-12-01
JP2016111249A (ja) 2016-06-20
US20170347491A1 (en) 2017-11-30
EP3232748A1 (en) 2017-10-18
WO2016092919A1 (ja) 2016-06-16

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GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Saitama Prefecture, Japan

Patentee after: Marilyn Co.,Ltd.

Address before: Saitama Prefecture, Japan

Patentee before: CALSONIC KANSEI Corp.