CN107422612B - 液浸构件、曝光装置、液浸曝光装置、液浸曝光方法及元件制造方法 - Google Patents

液浸构件、曝光装置、液浸曝光装置、液浸曝光方法及元件制造方法 Download PDF

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Publication number
CN107422612B
CN107422612B CN201710675381.7A CN201710675381A CN107422612B CN 107422612 B CN107422612 B CN 107422612B CN 201710675381 A CN201710675381 A CN 201710675381A CN 107422612 B CN107422612 B CN 107422612B
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substrate
liquid
liquid immersion
exposure
space
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CN107422612A (zh
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佐藤真路
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Nikon Corp
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Nikon Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201710675381.7A 2012-07-20 2013-07-16 液浸构件、曝光装置、液浸曝光装置、液浸曝光方法及元件制造方法 Active CN107422612B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261674078P 2012-07-20 2012-07-20
US61/674,078 2012-07-20
US201361790328P 2013-03-15 2013-03-15
US61/790,328 2013-03-15
CN201380038451.8A CN104487897B (zh) 2012-07-20 2013-07-16 液浸构件及曝光装置

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CN201380038451.8A Division CN104487897B (zh) 2012-07-20 2013-07-16 液浸构件及曝光装置

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CN107422612A CN107422612A (zh) 2017-12-01
CN107422612B true CN107422612B (zh) 2020-05-26

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CN201380038451.8A Active CN104487897B (zh) 2012-07-20 2013-07-16 液浸构件及曝光装置

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US (3) US9823580B2 (https=)
EP (1) EP2875405B1 (https=)
JP (1) JP6406250B2 (https=)
KR (1) KR102139033B1 (https=)
CN (2) CN107422612B (https=)
HK (1) HK1208914A1 (https=)
TW (3) TWI617894B (https=)
WO (1) WO2014014123A1 (https=)

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Also Published As

Publication number Publication date
TWI700557B (zh) 2020-08-01
US10739683B2 (en) 2020-08-11
JP2015528132A (ja) 2015-09-24
US20180314166A1 (en) 2018-11-01
US20150124230A1 (en) 2015-05-07
US10007189B2 (en) 2018-06-26
US9823580B2 (en) 2017-11-21
TW201925928A (zh) 2019-07-01
KR102139033B1 (ko) 2020-08-11
HK1208914A1 (en) 2016-03-18
TW201405256A (zh) 2014-02-01
CN107422612A (zh) 2017-12-01
TWI661277B (zh) 2019-06-01
KR20150038075A (ko) 2015-04-08
JP6406250B2 (ja) 2018-10-17
US20140022522A1 (en) 2014-01-23
CN104487897A (zh) 2015-04-01
TWI617894B (zh) 2018-03-11
WO2014014123A1 (en) 2014-01-23
TW201809910A (zh) 2018-03-16
HK1206435A1 (en) 2016-01-08
EP2875405B1 (en) 2020-02-26
CN104487897B (zh) 2017-08-29
EP2875405A1 (en) 2015-05-27

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