CN107418504A - 可替代石墨片导热硅胶及制备工艺 - Google Patents

可替代石墨片导热硅胶及制备工艺 Download PDF

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CN107418504A
CN107418504A CN201710761314.7A CN201710761314A CN107418504A CN 107418504 A CN107418504 A CN 107418504A CN 201710761314 A CN201710761314 A CN 201710761314A CN 107418504 A CN107418504 A CN 107418504A
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闫森源
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Strong New Genuine (suzhou) Environmental Mstar Technology Ltd
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Abstract

本发明涉及一种可替代石墨片导热硅胶及制备工艺，由10‑20份液态硅胶、50‑60份氢氧化铝、30‑50份二甲基硅油、3‑5份羟基硅油、5‑8份分散剂、0.5‑1.0份固化剂组成，份数为重量份数。制备过程为：配料得到导热硅胶混合体，将导热硅胶混合体放入液态压延机进行压延出片，得到未固化导热硅胶片材；随后将片料平放入隧道炉进行烘烤固化，固化温度50℃‑180℃。相对于现有技术，本发明导热硅胶片具有良好的粘性、柔性、良好的压缩性能以及具有优良的热传导率，使其在使用中能完全使电子原件和散热片之间的空气排出，以达到接触充分，散热效果明显增加。导热硅胶片同时具有一定的粘性，相比普通的绝缘导热材料在产品的安装过程中带来很大的方便性，不易脱落，便于操作。

Description

可替代石墨片导热硅胶及制备工艺
技术领域
本发明涉及一种可替代石墨片导热硅胶及制备工艺，用于电子设备与散热片或产品外壳间的传递界面。
背景技术
电子设备与散热片或产品外壳间的传递界面通常采用石墨片，石墨片较硬、易掉粉，而且石墨片需要进行包边背胶或涂胶黏剂才能与电器元件进行粘接，安装不方便；石墨易破碎，会影响产品结构。
发明内容
本发明针对现有技术的不足，提供了一种胶片柔软度较好、不易破损、不会有粉状物脱落、自带黏性有吸附性无需背胶可自行与电子软件进行粘接、可塑性强、可裁切任意形状的可替代石墨片导热硅胶及制备工艺，应用于线路板和散热片之间的填充IC和散热片或产品外壳间的填充、IC和类似散热材料(如金属屏蔽罩)之间的填充，常用于通信设备。
为了实现上述发明目的，本发明采用以下技术方案：可替代石墨片导热硅胶，其特征在于，由10-20份液态硅胶、50-60份氢氧化铝、30-50份二甲基硅油、3-5份羟基硅油、5-8份分散剂、0.5-1.0份固化剂组成，份数为重量份数。
可替代石墨片导热硅胶的制备工艺，包括如下步骤：
(1)把液态硅胶、二甲基硅油加温到100-150摄氏度进行搅拌得到硅胶混合物；
(2)搅拌后的硅胶混合物放入分散搅拌机内并依次加入氢氧化铝、羟基硅油、分散剂，进行分散搅拌，搅拌一定时间后加入固化剂再进行搅拌，20-30分钟后取出即得到导热硅胶混合体。
得到导热硅胶混合体后，还包括如下步骤：
(3)将导热硅胶混合体放入液态压延机进行压延出片，压延机滚轮需要进行冷却循环，滚轮表面温度在5-10摄氏度之间，以每分钟1-2m的生产速度进行压延出片，得到未固化导热硅胶片材；
(3)随后将片料平放入隧道炉进行烘烤固化，固化温度50℃-180℃。
在步骤(1)中，把液态硅胶、二甲基硅油放到密炼机中加温到100-150摄氏度，搅拌速度为3000转/分钟，搅拌时间为30-50分钟。
在步骤(2)中，分散搅拌过程的温度最低不低于5摄氏度，最高温度不超过20摄氏度，分散搅拌时间为30-40min。
在步骤(4)中，固化时间20-30分钟。
相对于现有技术，本发明导热硅胶片是高性能间隙填充导热材料，主要用于电子设备与散热片或产品外壳间的传递界面。导热硅胶片具有良好的的粘性、柔性、良好的压缩性能以及具有优良的热传导率，使其在使用中能完全使电子原件和散热片之间的空气排出，以达到接触充分，散热效果明显增加。导热硅胶片同时具有一定的粘性，相比普通的绝缘导热材料在产品的安装过程中带来很大的方便性，不易脱落，便于操作。
具体实施方式
下面结合具体实施例对本发明作进一步详细介绍。
下列表1为本发明和实施例1-2的材料配方。
表1材料配方
材料名称 产品添加比例/份 实施例1 实施例2
液态硅胶 10-20 12 20
氢氧化铝 50-60 50 58
二甲基硅油 30-50 35 50
羟基硅油 3-5 3 5
分散剂 5-8 5 8
固化剂 0.5-1.0 0.5 1.0
配料工艺1、先把液态硅胶、二甲基硅油放入密炼机加温到100-150摄氏度进行高速搅拌，搅拌速度(3000转/分钟)，搅拌30-50分钟；
2、搅拌后的硅胶混合物放入分散搅拌机内依次加入氢氧化铝、羟基硅油、分散剂进分散搅拌，分散搅拌温度(温度最低不可低于5摄氏度最高温度不可超过20摄氏度)，搅拌分散时间30-40分钟，随后加入固化剂进行搅拌20-30分钟后取出硅胶原料即得到导热硅胶混合体。
生产工艺1、将搅拌好的原料放入液态压延机进行压延出片，压延机滚轮需要进行冷却循环，滚轮表面温度在5-10摄氏度之间，以每分钟1-2m生产速度进行压延出片，得到未固化原材料片材；
2、随后将得到的片料平放进入隧道炉进行烘烤固化，固化温度50℃-180℃，固化时间20-30分钟。
3、烘烤后的成品检出固化效果测量发泡孔径的均匀度，最终得到的孔径均匀度好，并测试产品的性能指标均为合格。
需要说明的是，以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所做的等效结构或等效流程变换，或直接或间接运用在其他相关技术领域，均同理包括在本发明的专利保护范围内。

Claims (6)

1.可替代石墨片导热硅胶，其特征在于，由10-20份液态硅胶、50-60份氢氧化铝、30-50份二甲基硅油、3-5份羟基硅油、5-8份分散剂、0.5-1.0份固化剂组成，份数为重量份数。
2.权利要求1所述的可替代石墨片导热硅胶的制备工艺，包括如下步骤：
（1）把液态硅胶、二甲基硅油加温到100-150摄氏度进行搅拌得到硅胶混合物；
（2）搅拌后的硅胶混合物放入分散搅拌机内并依次加入氢氧化铝、羟基硅油、分散剂，进行分散搅拌，搅拌一定时间后加入固化剂再进行搅拌，20-30分钟后取出即得到导热硅胶混合体。
3.根据权利要求2所述的制备工艺，其特征在于：得到导热硅胶混合体后，还包括如下步骤：
（3）将导热硅胶混合体放入液态压延机进行压延出片，压延机滚轮需要进行冷却循环，滚轮表面温度在5-10 摄氏度之间，以每分钟1-2m的生产速度进行压延出片，得到未固化导热硅胶片材；
（4）随后将片料平放入隧道炉进行烘烤固化，固化温度50℃-180℃。
4.根据权利要求2所述的制备工艺，其特征在于：在步骤（1）中，把液态硅胶、二甲基硅油放到密炼机中加温到100-150摄氏度，搅拌速度为3000转/分钟，搅拌时间为30-50分钟。
5.根据权利要求2所述的制备工艺，其特征在于：在步骤（2）中，分散搅拌过程的温度最低不低于5摄氏度，最高温度不超过20摄氏度，分散搅拌时间为30-40min。
6.根据权利要求3所述的制备工艺，其特征在于：在步骤（4）中，固化时间20-30分钟。
CN201710761314.7A 2017-08-30 2017-08-30 可替代石墨片导热硅胶及制备工艺 Pending CN107418504A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108419418A (zh) * 2018-03-29 2018-08-17 昆山市飞荣达电子材料有限公司 一种导热垫的生产方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558876A (zh) * 2011-12-29 2012-07-11 深圳德邦界面材料有限公司 一种低成本的散热硅胶片及其制备方法
CN103333502A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种超薄导热硅胶片及其制备方法
CN103545273A (zh) * 2013-09-30 2014-01-29 深圳市鸿富诚屏蔽材料有限公司 一种储能散热片及其制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102558876A (zh) * 2011-12-29 2012-07-11 深圳德邦界面材料有限公司 一种低成本的散热硅胶片及其制备方法
CN103333502A (zh) * 2013-06-26 2013-10-02 苏州天脉导热科技有限公司 一种超薄导热硅胶片及其制备方法
CN103545273A (zh) * 2013-09-30 2014-01-29 深圳市鸿富诚屏蔽材料有限公司 一种储能散热片及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108419418A (zh) * 2018-03-29 2018-08-17 昆山市飞荣达电子材料有限公司 一种导热垫的生产方法

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Application publication date: 20171201