CN107404833A - A kind of cooling device for high-power electronic device - Google Patents
A kind of cooling device for high-power electronic device Download PDFInfo
- Publication number
- CN107404833A CN107404833A CN201710874993.9A CN201710874993A CN107404833A CN 107404833 A CN107404833 A CN 107404833A CN 201710874993 A CN201710874993 A CN 201710874993A CN 107404833 A CN107404833 A CN 107404833A
- Authority
- CN
- China
- Prior art keywords
- electronic device
- installing plate
- power electronic
- coldplate
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of cooling device for high-power electronic device, including electronic device installing plate, it is characterised in that：Described installing plate is provided with waterpipe jointing, is connected by seal with coldplate.Due to using said structure, water stream channel being designed into passage in "S" shape, flow of the increase current in part, heat taken away to the absorption of high-power electronic device heat by current again using the heat conduction of installing plate, coldplate.Installing plate can provided installation dimension needed for processing in use range as needed, can adjusted the installation requirements for adapting to a variety of high-power electronic devices at any time from thickness needed for high-power electronic device installation.
Description
Technical field
The claimed technical scheme of the present invention is related to a kind of water-cooling apparatus for high-power electronic device.
Background technology
At present, with the development of science and technology, especially in high power pulsed source industry, the fortune of high-power electronic device
With more and more, but with power, to increase caloric value also increasing when high-power electronic device uses；Past is routinely using scattered
Hot device radiating, or radiator add forced air cooling again, cause radiator increasing, radiating effect is unsatisfactory.The country also has
The cooled plate of copper coin bending welding, the installation of high-power electronic device is using welding swivel nut in advance, this water cooling board production technology
More complicated, the requirement to producing equipment is higher, and the installation of predetermined high-power electronic device can only be adapted to after being molded,
There is no versatility.
The content of the invention
The technical problems to be solved by the invention are in view of the shortcomings of the prior art, there is provided a kind of high-power electronic device
Water-cooling apparatus, can effectively solve the radiating of high-power electronic device, not only reduce volume and can also adjust adaptation at any time
The installation requirements of a variety of high-power electronic devices.
In order to solve the above technical problems, the technical solution adopted in the present invention is a kind of to be used for high-power electronic device
Cooling device, including electronic device installing plate, it is characterised in that：Described installing plate is provided with waterpipe jointing, by seal with
Coldplate is connected.
The joint face of a kind of cooling device for high-power electronic device, described coldplate and installing plate is provided with
Serpentine groove, the outside of the serpentine groove are provided with the rectangular seal groove for clamping seal, the periphery of coldplate be provided with
The corresponding connecting screw hole of installing plate connecting hole is simultaneously connected to form water stream channel by screw and installing plate.
A kind of cooling device for high-power electronic device, described coldplate, installing plate use aluminium sheet.
A kind of cooling device for high-power electronic device, due to using said structure, water stream channel being designed to
Serpentine passage, flow of the increase current in part, using the heat conduction of installing plate, coldplate by high-power electronic device heat
Absorption is again taken away heat by current.Installing plate, as needed can be from thickness needed for high-power electronic device installation
Installation dimension needed for processing in use range is provided, the installation requirements for adapting to a variety of high-power electronic devices can be adjusted at any time.
Brief description of the drawings
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description；
Fig. 1 is a kind of cooling device structural representation for high-power electronic device of the invention；
Fig. 2 is the cooling device A-A profile structure diagram shown in Fig. 1；
Fig. 3 is the plate structure of cooling schematic diagram shown in Fig. 1；
Fig. 4 is the coldplate A-A profile structure diagram shown in Fig. 3；
In Fig. 1~Fig. 4,1, installing plate；2nd, coldplate；3rd, waterpipe jointing；4th, electronic device；5th, sealed groove；6th, serpentine
Groove；7th, connecting screw hole.
Embodiment
As shown in Figure 1 to 4, a kind of cooling device for high-power electronic device, including electronic device installing plate 1,
Described installing plate is provided with waterpipe jointing 3, is connected by seal with coldplate 2.Coldplate 2, installing plate 1 use aluminium sheet.
The joint face of described coldplate 2 and installing plate 1 is provided with serpentine groove 6, and the outside of the serpentine groove 6, which is provided with, to be clamped
The rectangular seal groove 5 of seal, the periphery of coldplate 2 are provided with the connecting screw hole 7 corresponding with the connecting hole of installing plate 1 and led to
Cross screw and be connected to form water stream channel with installing plate 1.
With two pieces of aluminium sheet Combined machinings into a water-cooling apparatus, one piece of installing plate 1 for being used as high-power electronic device 4,
Another piece of coldplate 2 for being processed into water stream channel；The absorption of the heat of high-power electronic device 4 is led to again using the heat conduction of metallic plate
Current are crossed to take away heat；It is close by the rectangular seal groove 5 and seal that clamp seal during two pieces of metal plates combine assemblings
Envelope.
In order to improve water cooling effect, water stream channel is designed into passage in "S" shape, flow of the increase current in part.
In order to adapt to the installation requirements of various high-power electronic devices, installing plate 1 is installed from high-power electronic device 4
Required thickness, as needed can regulation use range at any time processing needed for installation dimension.Coldplate 2, installing plate 1 select
Based on aluminium sheet, because aluminium sheet proportion can gentlier reduce weight.
The hickey connection plate 1 of waterpipe jointing 3, Fig. 1 show copper pipe connection water nozzle；Changing waterpipe jointing 3 can
To adapt to needed for outer flexible tube or hard tube connection.
The effect that the present invention uses is to not only solve the heat dissipation problem of high-power electronic device, at the same adapt to it is a variety of not
With the use of installation sized high-power electronic device, it is particularly suitable for the application of multi-varieties and small-batch single-piece production product.
Claims (3)
1. a kind of cooling device for high-power electronic device, including electronic device installing plate (1), it is characterised in that：It is described
Installing plate be provided with waterpipe jointing (3), be connected by seal with coldplate (2).
A kind of 2. cooling device for high-power electronic device according to claim 1, it is characterised in that：Described
The joint face of coldplate (2) and installing plate (1) is provided with serpentine groove (6), and the outside of the serpentine groove (6) is provided with card
The rectangular seal groove (5) of seal is filled, the periphery of coldplate (2) is provided with the connection spiral shell corresponding with installing plate (1) connecting hole
Hole (7) is simultaneously connected to form water stream channel by screw and installing plate (1).
A kind of 3. cooling device for high-power electronic device according to claim 1 or 2, it is characterised in that：It is described
Coldplate (2), installing plate (1) use aluminium sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710874993.9A CN107404833A (en) | 2017-09-25 | 2017-09-25 | A kind of cooling device for high-power electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710874993.9A CN107404833A (en) | 2017-09-25 | 2017-09-25 | A kind of cooling device for high-power electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107404833A true CN107404833A (en) | 2017-11-28 |
Family
ID=60388873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710874993.9A Pending CN107404833A (en) | 2017-09-25 | 2017-09-25 | A kind of cooling device for high-power electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107404833A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220355694A1 (en) * | 2019-03-08 | 2022-11-10 | Auto Motive Power Inc. | Combined bms, charger, and dc-dc in electric vehicles |
-
2017
- 2017-09-25 CN CN201710874993.9A patent/CN107404833A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220355694A1 (en) * | 2019-03-08 | 2022-11-10 | Auto Motive Power Inc. | Combined bms, charger, and dc-dc in electric vehicles |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171128 |