CN201294704Y - Cooling device for high-power electronic device - Google Patents
Cooling device for high-power electronic device Download PDFInfo
- Publication number
- CN201294704Y CN201294704Y CNU2008201597679U CN200820159767U CN201294704Y CN 201294704 Y CN201294704 Y CN 201294704Y CN U2008201597679 U CNU2008201597679 U CN U2008201597679U CN 200820159767 U CN200820159767 U CN 200820159767U CN 201294704 Y CN201294704 Y CN 201294704Y
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- CN
- China
- Prior art keywords
- power electronic
- electronic device
- mounting panel
- coldplate
- water
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a cooling device used for high-power electronic components, which comprises an electronic component mounting plate, and is characterized in that: the mounting plate is provided with a water pipe interface which is connected with a cooling plate through a sealing element. Because the structure is adopted, a water-flow channel is designed into an 'S' shaped channel to increase the flow path of the water-flow in parts, the heat of the high-power electronic components is absorbed through the heat conduction of the mounting plate and the cooling plate and then is taken away through the water-flow. The thickness of the mounting plate is selected according to the needed thickness of the high-power electronic component, needed mounting size can be processed in prescribed use range according to the demand, and the size can be adjusted at any time to adapt to the mounting requirements of the high-power electronic components.
Description
Technical field
The claimed technical scheme of the utility model relates to a kind of water-cooling apparatus that is used for high-power electronic device.
Background technology
At present, along with science and technology development, especially in the high power pulsed source industry, the utilization of high-power electronic device is more and more, but high-power electronic device to increase caloric value also increasing along with power when using; The conventional radiator heat-dissipation that adopts of past, perhaps radiator adds and forces air-cooledly, causes radiator increasing, and radiating effect is unsatisfactory.The domestic cooled plate that copper coin bending welding is also arranged, the installation of high-power electronic device is adopted and is welded swivel nut in advance, and this cooled plate production technology more complicated is to producing having relatively high expectations of equipment, and can only adapt to the installation of predetermined high-power electronic device after the moulding, not have versatility.
The utility model content
Technical problem to be solved in the utility model is at the deficiencies in the prior art, a kind of water-cooling apparatus of high-power electronic device is provided, can effectively solve the heat radiation of high-power electronic device, not only reduce volume and can also adjust the installation requirements that adapt to multiple high-power electronic device at any time.
For solving the problems of the technologies described above, the technical scheme that the utility model adopted is a kind of cooling device that is used for high-power electronic device, comprise the electronic device mounting panel, it is characterized in that: described mounting panel is provided with waterpipe jointing, is connected with coldplate by seal.
A kind of cooling device that is used for high-power electronic device, the joint face of described coldplate and mounting panel is provided with the serpentine groove, the outside of described serpentine groove is provided with the rectangular seal groove that clamps seal, and the periphery of coldplate is provided with the mounting panel connecting hole is corresponding and is connected screw and is connected to form water stream channel by screw and mounting panel.
A kind of cooling device that is used for high-power electronic device, described coldplate, mounting panel adopt aluminium sheet.
A kind of cooling device that is used for high-power electronic device, owing to adopt said structure, water stream channel is designed to the serpentine passage, increases the flow process of current in part, utilize the heat conduction of mounting panel, coldplate that the absorption of high-power electronic device heat is taken away heat by current again.Mounting panel selects for use high-power electronic device that desired thickness is installed, and can process required installation dimension in the regulation scope of application as required, can adjust the installation requirements that adapt to multiple high-power electronic device at any time.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail;
Fig. 1 is a kind of cooling device structural representation that is used for high-power electronic device of the utility model;
Fig. 2 is that cooling device A-A shown in Figure 1 is to cross-sectional view;
Fig. 3 is a plate structure of cooling schematic diagram shown in Figure 1;
Fig. 4 is that coldplate A-A shown in Figure 3 is to cross-sectional view;
In Fig. 1～Fig. 4,1, mounting panel; 2, coldplate; 3, waterpipe jointing; 4, electronic device; 5, sealed groove; 6, serpentine groove; 7, connect screw.
Embodiment
As Fig. 1～shown in Figure 4, a kind of cooling device that is used for high-power electronic device comprises electronic device mounting panel 1, and described mounting panel is provided with waterpipe jointing 3, is connected with coldplate 2 by seal.Coldplate 2, mounting panel 1 adopt aluminium sheet.Described coldplate 2 is provided with serpentine groove 6 with the joint face of mounting panel 1, the outside of described serpentine groove 6 is provided with the rectangular seal groove 5 that clamps seal, and the periphery of coldplate 2 is provided with mounting panel 1 connecting hole is corresponding and is connected screw 7 and is connected to form water stream channel by screw and mounting panel 1.
Be processed into a water-cooling apparatus with two aluminium sheet combinations, a mounting panel 1 as high-power electronic device 4, another piece is processed into the coldplate 2 of water stream channel; Utilize the heat conduction of metallic plate that the absorption of high-power electronic device 4 heats is taken away heat by current again; Rectangular seal groove 5 and seal sealing by clamping seal during two metallic plate combine and assemble.
In order to improve the water cooling effect, water stream channel is designed to the serpentine passage, increase the flow process of current in part.
In order to adapt to the installation requirements of various high-power electronic devices, mounting panel 1 selects for use high-power electronic device 4 that desired thickness is installed, and can process required installation dimension at any time as required in the regulation scope of application.It is main that coldplate 2, mounting panel 1 are selected aluminium sheet for use, because aluminium sheet proportion gentlier can reduce weight.
Waterpipe jointing 3 usefulness hickey connection plates 1 Figure 1 shows that copper pipe connects water nozzle; Changing waterpipe jointing 3 can adapt to outer flexible tube or hard tube connection required.
The effect that the utility model uses is the heat dissipation problem that has not only solved high-power electronic device, can adapt to the use of multiple different installation dimension high-power electronic devices simultaneously, is particularly suitable for the application of multi-varieties and small-batch single-piece production product.
Claims (3)
1, a kind of cooling device that is used for high-power electronic device comprises electronic device mounting panel (1), it is characterized in that: described mounting panel is provided with waterpipe jointing (3), is connected with coldplate (2) by seal.
2, a kind of cooling device that is used for high-power electronic device according to claim 1, it is characterized in that: described coldplate (2) is provided with serpentine groove (6) with the joint face of mounting panel (1), the outside of described serpentine groove (6) is provided with the rectangular seal groove (5) that clamps seal, and the periphery of coldplate (2) is provided with mounting panel (1) connecting hole is corresponding and is connected screw (7) and is connected to form water stream channel by screw and mounting panel (1).
3, a kind of cooling device that is used for high-power electronic device according to claim 1 and 2 is characterized in that: described coldplate (2), mounting panel (1) adopt aluminium sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201597679U CN201294704Y (en) | 2008-10-17 | 2008-10-17 | Cooling device for high-power electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201597679U CN201294704Y (en) | 2008-10-17 | 2008-10-17 | Cooling device for high-power electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201294704Y true CN201294704Y (en) | 2009-08-19 |
Family
ID=41008186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201597679U Expired - Fee Related CN201294704Y (en) | 2008-10-17 | 2008-10-17 | Cooling device for high-power electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201294704Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
-
2008
- 2008-10-17 CN CNU2008201597679U patent/CN201294704Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 Termination date: 20161017 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |