CN107390840A - A kind of desktop computer radiator structure - Google Patents
A kind of desktop computer radiator structure Download PDFInfo
- Publication number
- CN107390840A CN107390840A CN201710642914.1A CN201710642914A CN107390840A CN 107390840 A CN107390840 A CN 107390840A CN 201710642914 A CN201710642914 A CN 201710642914A CN 107390840 A CN107390840 A CN 107390840A
- Authority
- CN
- China
- Prior art keywords
- fin
- cpu
- desktop computer
- heat
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of desktop computer radiator structure, including a cpu heat being located on CPU, radiator fan is installed on cpu heat；The cpu heat at least sets in the side of fin and protruded, and the fin of the protrusion extends to radiation air above memory bar.The present invention protrudes due to the radiator of existing square being set in fin both sides, the area of fin is expanded, dust can be blown away because of the design of prominent fin simultaneously, the amount accumulated on a heat sink is greatly reduced, and the prominent cool breeze for simultaneously blowing down radiator fan is sent to memory bar and south bridge etc.；This structure design is simple, and radiating effect is but greatly improved, and is not easy dust stratification, and price hardly increases, and solves heat dissipation problem.
Description
Technical field
The present invention relates to a kind of radiator structure, more particularly to a kind of desktop computer radiator structure.
Background technology
The radiator of desktop computer is typically all arranged on CPU and south bridge, and power supply heat sinking and display card radiating have
Its independent radiator fan；In real work, we can occur overheat and crash, and its main cause is that cpu fan radiating is inadequate,
And the reason for inadequate of radiating is mainly the fin use for a long time under radiator fan, being blocked by dust causes, and such a overheat is dead
Machine easily causes CPU or mainboard is burnt out.
Prior art gives many designs to solve this problem, even with water cooling etc., but the problem of exist
It is that these designs are that solve the problems, such as cooling, but big to requirements of installation space, it is often more important that cost is too high, generally the least expensive
And more than 6 times of price of existing radiator, therefore a kind of, it is necessary to cheap, good heat dissipation heat spreader structures.
The content of the invention
The present invention is not easy dust stratification, price is almost unchanged, to mainboard to solve the above problems, provide a kind of good heat dissipation effect
Main devices have the desktop computer radiator structure of radiating effect.
The present invention is adopted the technical scheme that to reach above-mentioned purpose：A kind of desktop computer radiator structure, including one
The individual cpu heat on CPU, radiator fan is installed on cpu heat；The cpu heat is at least in fin
Side set and protrude, the fin of the protrusion extends to radiation air above memory bar.
Further, the fin shape of the protrusion be triangle, it is sector, square, trapezoidal.
Further, the both sides of the cpu heat fin are respectively provided with protrusion.
Further, the fin shape of the protrusion is right angled triangle, and right angled triangle is with positioned at fan side
While being right-angle side, hypotenuse is used as using the summit of the right-angle side to positioned at CPU side inclined side.
The beneficial effects of the invention are as follows：Protrude, will dissipate due to the radiator of existing square being set in fin both sides
The area of backing expands, while dust can be blown away because of the design of prominent fin, greatly reduce and accumulate on a heat sink
The amount deposited, and the prominent cool breeze for simultaneously blowing down radiator fan is sent to memory bar and south bridge etc.；This structure design is simple, but greatly
Amplitude improves radiating effect, is not easy dust stratification, and price hardly increases, and solves heat dissipation problem.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the structural representation of the present invention.
In figure：1st, cpu heat, 2, radiator fan, 3, prominent.
Embodiment
As shown in figure 1, a kind of desktop computer radiator structure, including a cpu heat 1 being located on CPU, in CPU
Radiator fan 2 is installed on radiator 1；The cpu heat 1 at least sets prominent 3 in the side of fin, the protrusion
Fin extends to radiation air above memory bar.
During due to motherboard design, CPU and memory bar are adjacent, and therefore, setting to protrude be able to will at least radiate to memory bar.
The fin shape of the protrusion 3 is triangle, sector, square, trapezoidal.
The both sides of the fin of cpu heat 1 are respectively provided with prominent 3.
Fin is still by the way of the arrangement of existing multi-disc parallel interval.
Preferably, the fin shape of the protrusion 3 is right angled triangle, right angled triangle is with positioned at the side of fan side
For right-angle side, hypotenuse is used as using the summit of the right-angle side to positioned at CPU side inclined side.
Right angled triangle is that the chance of mainboard is not had an impact as the reason for decision design.
Inventor is had found, by said structure, the area of fin is expanded, can dissipating original square radiator
While thermal effect improves, dust can be blown away because of the design of prominent fin, greatly reduce and accumulate on a heat sink
Amount, and protrusion forms air channel, while the cool breeze that radiator fan is blown down is sent to memory bar and south bridge etc., is on whole board
The place for needing to radiate carries out wind-cooling heat dissipating；This structure design is simple, and radiating effect is but greatly improved, and is not easy dust stratification, valency
Lattice hardly increase, and solve heat dissipation problem.
The embodiment of the present application is only intended to illustrate technical characteristic disclosed in the present application, and those skilled in the art pass through simple
The change that is carried out of replacement, still fall within the scope that the application is protected.
Claims (4)
1. a kind of desktop computer radiator structure, including a cpu heat being located on CPU, are provided with cpu heat
Radiator fan；The cpu heat at least sets in the side of fin and protruded, and the fin of the protrusion extends radiation air
Above to memory bar.
2. desktop computer radiator structure according to claim 1, it is characterised in that：The cpu heat fin
Both sides are respectively provided with protrusion.
3. desktop computer radiator structure according to claim 1, it is characterised in that：The fin shape of the protrusion is
It is triangle, sector, square, trapezoidal.
4. desktop computer radiator structure according to claim 3, it is characterised in that：The fin shape of the protrusion is
Right angled triangle, right angled triangle with the summit of the right-angle side positioned at the side of fan side to positioned at CPU side, as right-angle side, to be tilted
Side is as hypotenuse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710642914.1A CN107390840A (en) | 2017-07-31 | 2017-07-31 | A kind of desktop computer radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710642914.1A CN107390840A (en) | 2017-07-31 | 2017-07-31 | A kind of desktop computer radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107390840A true CN107390840A (en) | 2017-11-24 |
Family
ID=60343130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710642914.1A Pending CN107390840A (en) | 2017-07-31 | 2017-07-31 | A kind of desktop computer radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107390840A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203643932U (en) * | 2013-12-25 | 2014-06-11 | 浪潮电子信息产业股份有限公司 | Novel cooling fin |
| CN206133451U (en) * | 2016-09-30 | 2017-04-26 | 漯河医学高等专科学校 | Special radiator of desktop computer |
| CN206224332U (en) * | 2016-11-15 | 2017-06-06 | 缙云县国品韩智能科技有限公司 | A kind of high life computer host box for being provided with multilayer damping |
-
2017
- 2017-07-31 CN CN201710642914.1A patent/CN107390840A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203643932U (en) * | 2013-12-25 | 2014-06-11 | 浪潮电子信息产业股份有限公司 | Novel cooling fin |
| CN206133451U (en) * | 2016-09-30 | 2017-04-26 | 漯河医学高等专科学校 | Special radiator of desktop computer |
| CN206224332U (en) * | 2016-11-15 | 2017-06-06 | 缙云县国品韩智能科技有限公司 | A kind of high life computer host box for being provided with multilayer damping |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171124 |