CN208705823U - PCIE module radiating device - Google Patents

PCIE module radiating device Download PDF

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Publication number
CN208705823U
CN208705823U CN201821551969.8U CN201821551969U CN208705823U CN 208705823 U CN208705823 U CN 208705823U CN 201821551969 U CN201821551969 U CN 201821551969U CN 208705823 U CN208705823 U CN 208705823U
Authority
CN
China
Prior art keywords
cooling fin
heat sink
master chip
radiating device
pcba mainboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821551969.8U
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Chinese (zh)
Inventor
欧玉鹏
黄浩
汪超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai circulation Quantum Technology Co.,Ltd.
Original Assignee
Shanghai Follow Mdt Infotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Follow Mdt Infotech Ltd filed Critical Shanghai Follow Mdt Infotech Ltd
Priority to CN201821551969.8U priority Critical patent/CN208705823U/en
Application granted granted Critical
Publication of CN208705823U publication Critical patent/CN208705823U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of PCIE module radiating device, including PCBA mainboard, master chip, radiator and centrifugal fan, in which: master chip is set on PCBA mainboard;Radiator includes heat sink and multiple cooling fins, and heat sink lower surface is fitted closely with master chip;Heat sink is fastened on PCBA mainboard;Centrifugal fan and multiple cooling fins are all set in heat sink upper surface, the wind passage mouth of the air outlet face cooling fin of centrifugal fan.The utility model simple structure and reasonable design and easy for installation;The utility model enables the heat of master chip to be promptly released into surrounding air by the improvement of structure, ensure that the normal work of master chip.

Description

PCIE module radiating device
Technical field
The utility model relates to the field of radiating of server module, and in particular, to a kind of PCIE module radiating device.
Background technique
PCIE module is because there are many improvement, higher maximum system bus throughput, lower I/O than pervious standard Pin number and smaller physical size, better bus apparatus performance scaling and the machine warm connection function, therefore be widely applied In server and all kinds of host equipments.PCIE module is because own dimensions are smaller, module biggish for some chip powers, How lesser heat dissipation design Structure of need engineer physically is from heat sink design, wind to the chip of relatively high power Fan type selecting and air duct arrangement are carried out and are considered, the successful design that the utility model is done based on this.
Utility model content
For the defects in the prior art, the purpose of the utility model is to provide a kind of PCIE module radiating devices.
According to a kind of PCIE module radiating device provided by the utility model, including PCBA mainboard, master chip, radiator with And centrifugal fan, in which: master chip is set on PCBA mainboard;Radiator includes heat sink and multiple cooling fins, under heat sink Surface is fitted closely with master chip;Heat sink is fastened on PCBA mainboard;Centrifugal fan and multiple cooling fins are all set in Heat sink upper surface, the wind passage mouth of the air outlet face cooling fin of centrifugal fan.
Preferably, the cooling fin includes vertical cooling fin and horizontal cooling fin, and the horizontal cooling fin is from described vertical The top edge of cooling fin is extended to form perpendicular to vertical cooling fin direction.
Preferably, the width of the horizontal cooling fin is identical with the spacing of adjacent cooling fin.
Preferably, the surface of the master chip is coated with heat-conducting silicone grease.
Preferably, the heat sink is fastened on PCBA mainboard by screw, is set between heat sink and PCBA mainboard It is equipped with washer.
Compared with prior art, the utility model have it is following the utility model has the advantages that
1, the utility model simple structure and reasonable design and easy for installation;
2, the utility model enables the heat of master chip to be promptly released into surrounding air by the improvement of structure, protects The normal work of master chip is demonstrate,proved.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model Sign, objects and advantages will become more apparent upon:
Fig. 1 is the assembling explosive view of PCIE module radiating device;
Fig. 2 is the assembling view of PCIE module radiating device;
Fig. 3 is the assembling stereogram of PCIE module radiating device.
It is shown in figure:
PCBA mainboard 1
Master chip 2
Radiator 3
Washer 4
Radiator fixing screws 5
Centrifugal fan 6
Fan fixing screws 7
Specific embodiment
The utility model is described in detail combined with specific embodiments below.Following embodiment will be helpful to this field Technical staff further understands the utility model, but does not limit the utility model in any form.It should be pointed out that ability For the those of ordinary skill in domain, without departing from the concept of the premise utility, several changes and improvements can also be made. These are all within the protection scope of the present invention.
As shown in Figure 1 to Figure 3, according to a kind of PCIE module radiating device provided by the utility model, including PCBA mainboard 1, master chip 2, radiator 3 and centrifugal fan 6, in which: master chip 2 is set on PCBA mainboard 1;Radiator 3 includes heat dissipation Plate and multiple cooling fins, heat sink lower surface are fitted closely with master chip 2, and the surface of master chip 2 is coated with heat-conducting silicone grease, described to dissipate Hot plate is fastened on PCBA mainboard 1 by 3 fixing screws of radiator, is provided with washer between heat sink and PCBA mainboard 1 4.Centrifugal fan 6 and multiple cooling fins are all set in heat sink upper surface, the air duct of the air outlet face cooling fin of centrifugal fan 6 Mouthful.
Further, cooling fin uses teeth technique, specifically, cooling fin includes vertical cooling fin and horizontal cooling fin, The horizontal cooling fin is extended to form from the top of vertical cooling fin edge perpendicular to vertical cooling fin direction, horizontal cooling fin Width it is identical with the spacing of adjacent cooling fin so that adjacent two cooling fins, which are formed, encloses shape, so that thermovent Concentrate on the two sides of cooling fin, and the centrifugal fan 6 for being set to the thermovent of cooling fin side hot wind can be quickly blown to it is scattered The air outlet of backing other side.
The utility model is laid out using centrifugal fan 6, radiator 3 by reasonable air duct, keeps the heat of master chip 2 rapid In the air for being transmitted on cooling fin, and being discharged into surrounding under the action of centrifugal fan 6 is dried.
Specific embodiment of the utility model is described above.It is to be appreciated that the utility model not office It is limited to above-mentioned particular implementation, those skilled in the art can make a variety of changes or modify within the scope of the claims, This has no effect on the substantive content of the utility model.In the absence of conflict, the spy in embodiments herein and embodiment Sign can be arbitrarily combined with each other.

Claims (5)

1. a kind of PCIE module radiating device, which is characterized in that including PCBA mainboard, master chip, radiator and centrifugal fan, Wherein: master chip is set on PCBA mainboard;Radiator includes heat sink and multiple cooling fins, heat sink lower surface and master chip It fits closely;Heat sink is fastened on PCBA mainboard;Centrifugal fan and multiple cooling fins are all set in heat sink upper surface, The wind passage mouth of the air outlet face cooling fin of centrifugal fan.
2. PCIE module radiating device according to claim 1, which is characterized in that the cooling fin includes vertical cooling fin With horizontal cooling fin, the horizontal cooling fin extends shape along perpendicular to vertical cooling fin direction from the top of the vertical cooling fin At.
3. PCIE module radiating device according to claim 2, which is characterized in that the width and phase of the horizontal cooling fin The spacing of adjacent cooling fin is identical.
4. PCIE module radiating device according to claim 1, which is characterized in that the surface of the master chip is coated with thermally conductive Silicone grease.
5. PCIE module radiating device according to claim 1, which is characterized in that the heat sink is fastened by screw pacifies Loaded on PCBA mainboard, washer is provided between heat sink and PCBA mainboard.
CN201821551969.8U 2018-09-21 2018-09-21 PCIE module radiating device Active CN208705823U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821551969.8U CN208705823U (en) 2018-09-21 2018-09-21 PCIE module radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821551969.8U CN208705823U (en) 2018-09-21 2018-09-21 PCIE module radiating device

Publications (1)

Publication Number Publication Date
CN208705823U true CN208705823U (en) 2019-04-05

Family

ID=65947124

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821551969.8U Active CN208705823U (en) 2018-09-21 2018-09-21 PCIE module radiating device

Country Status (1)

Country Link
CN (1) CN208705823U (en)

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 200241 room 1139, building 555, Dongchuan Road, Minhang District, Shanghai.

Patentee after: Shanghai circulation Quantum Technology Co.,Ltd.

Address before: 200241 room 1139, building 555, Dongchuan Road, Minhang District, Shanghai.

Patentee before: SHANGHAI XUNTAI INFORMATION TECHNOLOGY CO.,LTD.

CP01 Change in the name or title of a patent holder