CN107346767B - 双面冷却型电源模块 - Google Patents
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Abstract
本申请涉及双面冷却型电源模块。所述双面冷却型电源模块在两侧上具有冷却器。电源模块包括:第一开关,其在两侧上具有冷却器;第二开关,其与所述第一开关分开地设置,并且在两侧上具有冷却器;以及公共电极,其联接到所述第一开关和所述第二开关二者。
Description
技术领域
本发明涉及一种双面冷却型电源模块,更具体地,涉及这样一种双面冷却型电源模块,其在两侧上包括冷却器并且包括一对开关。
背景技术
电源模块用于在混合动力车辆和电动车辆中驱动电机。通常,具有六个开关的电源模块用于驱动一个电机,每个开关由绝缘栅双极型晶体管(IGBT)和二极管组成,并且通过传输操作信号来控制电流的流动。
图1示出了这样的电源模块的结构(其为相关技术)。如图1中所示,由IGBT和二极管组成的半导体芯片安装在开关中,并且两个开关组成一个单元。第一电线A和第二电线B中的每一个连接一个开关,而开关都连接至第三电线C,其中第一电线A和第二电线B连接至电池,第三电线C连接至电机。
与常用的单侧冷却电源模块相比,双面冷却型电源模块(基板安装在半导体的顶部和底部,并且冷却器安装在基板的外侧)具有更高的冷却性能,并且可以采用更紧凑的尺寸制造,使得双面冷却型电源模块得到广泛地应用。
此外,如图2中所示(其为相关技术),通过顺序地层叠第一基板11或者第三基板13、半导体芯片20、间隔区30以及第三基板13或者第二基板12来制造相关技术的双面冷却型电源模块,其中,通过在这些组件之间设置焊接材料40并且将它们焊接来将这些组件组合。
半导体芯片20部分暴露于焊接材料40的外部,并且用于发送/接收半导体芯片20的控制信号的电线60连接至暴露的表面。经由电线60发送和/或接收的信号经由引线框架50而传输。
需要具有预定高度的空间用于安装电线60,并且设置间隔区30以保证该空间。
然而,间隔区30具有相当大的热阻和电阻,并且热阻和电阻对于冷却能力和信号传输能力具有不利的影响,此外,每一个开关需要一个间隔区30,从而增加了制造成本。
因此,需要这样的双面冷却型电源模块,其可以制造成具有较小尺寸、具有简单的封装结构,并且具有最小的热阻和电阻。
发明内容
本发明提供了这样一种双面冷却型电源模块,其包括由一对开关组成的电源模块单元,通过用公共电极代替间隔区而可以将其制造成更紧凑的尺寸。
根据本发明的实施方案的双面冷却型电源模块包括:第一开关,其在两侧上具有冷却器;第二开关,其与所述第一开关分开地设置,并且在两侧上具有冷却器;以及公共电极,其联接到所述第一开关和所述第二开关两者。
所述第一开关可以通过在第一基板和第三基板之间层叠第一半导体芯片和所述公共电极而形成,其中,所述第一基板连接到电池,所述第三基板连接到电机;所述第二开关可以通过在连接到电机的所第三基板和连接到电池的第二基板之间层叠所述公共电极和第二半导体芯片而形成;所述公共电极可以在所述第一开关和所述第二开关两者中层叠并且可以连接到所述第三基板。
所述第一开关和所述第二开关可以形成为具有相反的形状,并且所述第一开关的第一基板和所述第二开关的第三基板可以位于相同的平面上。
可以通过焊接对所述第一开关的所述第一基板、所述第一半导体芯片、所述公共电极和所述第三基板进行结合,并且可以通过焊接对所述第二开关的所述第三基板、所述公共电极、所述第二半导体芯片和所述第二基板进行结合。
所述第一开关的第一基板和所述第二开关的第三基板可以是分开的基板;所述第一开关的第三基板和所述第二开关的第二基板可以是分开的基板。
在所述第一开关中,所述第一基板可以制成为比所述第三基板宽;在所述第二开关中,所述第三基板制成为比所述第二基板宽。
所述第一基板、所述第二基板和所述第三基板可以分别由外层、内层和中间层组成,所述外层由铜或铝制成并且与冷却器接触,所述内层由铜或铝制成并且与所述第一半导体芯片、所述第二半导体芯片或所述公共电极接触,所述中间层在所述外层和所述内层之间由陶瓷制成;在所述第一开关的第一基板和所述第二开关的第三基板中,所述外层和所述中间层可以形成一体,并且所述内层可以被分开;以及在所述第一开关的第三基板和所述第二开关的第二基板中,所述外层和所述中间层可以形成一体,并且所述内层可以被分开。
通过形成一体所述第一开关的第一基板和所述第二开关的第三基板而形成的基板可以被制成为比通过形成一体所述第一开关的第三基板和所述第二开关的第二基板而形成的基板更宽。
可以利用密封剂而将所述第一开关和所述第二开关密封,所述密封剂由环氧树脂模制化合物或硅胶制成。
电源模块可以进一步包括电线,其分别连接至所述第一半导体芯片和所述第二半导体芯片,以发送和接收信号。
所述公共电极可以是引线框架或由铜或铝制成的薄板。
本发明的双面冷却电源模块具有如下效果。
第一,由于没有间隔区,所以可以防止由于间隔区而造成的冷却效率和导电效率下降。
第二,由于可以将电源模块制造成更紧凑的尺寸,所以可以减小体积。
第三,可以简化电源模块的电路结构。
附图说明
通过下面结合附图所呈现的详细描述,将会更为清楚地理解本发明的以上和其它目的、特征以及其他优点,在这些附图中:
图1为简单地示出通常的2开关电源模块的结构的图(相关技术);
图2为示出传统的双面冷却型电源模块的视图(相关技术);
图3为根据本发明的实施方案的双面冷却型电源模块的视图;以及
图4为根据本发明的另一个实施方案的双面冷却型电源模块的视图。
具体实施方式
应当理解,此处所使用的术语“车辆”或“车辆的”或其它类似术语一般包括机动车辆,例如包括运动型多用途车辆(SUV)、大客车、大货车、各种商用车辆的乘用车辆,包括各种舟艇、船舶的船只,航空器等等,并且包括混合动力车辆、电动车辆、插电式混合动力电动车辆、氢动力车辆以及其它替代性燃料车辆(例如源于非石油的能源的燃料)。正如此处所提到的,混合动力车辆是具有两种或更多动力源的车辆,例如汽油动力和电力动力两者的车辆。
本文中所使用的术语仅出于描述具体实施方案的目的,并非旨在限制本发明。如本文所使用的,单数形式“一个”和“所述”旨在也包括复数形式,除非上下文清楚指明了另外的情况。应该进一步理解的是,当被用在该说明书中时,术语“包括(comprises)”和/或“包括(comprising)”指定了存在陈述的特征、整数、步骤、操作、元件、和/或组件,但不排除存在或增加一个或多个其他特征、整数、步骤、操作、元件、组件、和/或其组合。如本文所使用的,术语“和/或”包括一个或多个相关联的所列出的项目的任何和全部组合。在全文中,除非明确地记载了相反的情况,词语“包括(comprise)”及其变型(比如,“包括(comprises)”或“包括(comprising)”),将会理解成表示包括所述元件而不排除任何其他元件。另外,本说明书中描述的术语“单元”、“…器(er)”、“…设备(or)”、“模块”指的是用于处理至少一个功能和操作的单元,并且可以通过硬件组件、或者软件组件、以及其组合来实现。
此外,本发明的控制逻辑可以实施为在包含由处理器、控制器等执行的可执行程序指令的计算机可读介质上的非易失性计算机可读介质。计算机可读介质的示例包括但不限于ROM、RAM、光盘(CD)-ROM、磁带、软盘、闪存驱动器、智能卡和光学数据存储设备。计算机可读介质也可以分布在网络联接的计算机系统中,使得计算机可读媒介以分布式进行存储和执行,例如,通过远程信息处理服务器或控制器局域网(CAN)。
在下文中,参照附图对根据本发明的实施方案的双面冷却型电源模块进行详细描述。
如图1至图3中所示,本发明涉及一种在两侧上具有冷却器的双面冷却型电源模块,其中,该双面冷却型电源模块包括第一开关、与第一开关分开地设置的第二开关以及联接到第一开关和第二开关两者的公共电极300。
冷却器(未示出)设置在第一开关和第二开关中的每一个的两侧上,并且去除阻热。即,冷却器去除从第一开关和第二开关中的半导体、经由侧面而传递的热量。
第一开关是通过位于第一基板110和第三基板130之间的组件形成的层叠结构;即,顺序地层叠第一基板110、第一半导体芯片210、公共电极300和第三基板130。
类似地,第二开关是通过顺序地层叠第三基板130、公共电极300、第二半导体芯片220和第二基板120而形成的结构。
第一基板110和第二基板120分别连接到电池(未示出),而第三基板130连接到电机(未示出)。
联接到第一开关和第二开关二者的公共电极300将第一开关和第二开关物理地并电学地连接。公共电极300也连接到第三基板130并且将信号传输到电机。
公共电极可以与现存的引线框架相同的材料制成,或者其可以为由铜或铝制成的薄板。当公共电极为由铜或铝制成的薄板时,增加了热传递效率,使得可以提高冷却效率并且可以减小电源模块(即,双面冷却型电源模块)的厚度。
电源模块可以进一步地包括电线60,其分别连接到第一半导体芯片210和第二半导体芯片220,以发送和/或接收信号。电线60连接到引线框架50以发送和/或接收控制信号。
在第一开关和第二开关中的层叠顺序描述了在相同方向上顺序地层叠的层,因此,第一开关的第一基板110和第二开关的第三基板130位于相同的平面上,并且第一开关的第三基板130和第二开关的第二基板120位于相同的平面上。
即,第一开关和第二开关具有相反层叠的结构。具体地,假设连接到电池的第一基板110或第二基板120是第一侧,而连接到电机的第三基板130是第二侧,那么第一开关和第二开关具有相同的层叠顺序(半导体芯片-公共电极)。然而,当安装开关时,第一开关和第二开关中的任意一个倒置,使得层叠顺序彼此相反。
由于第一开关和第二开关安装为具有相反的层叠顺序,所以第一半导体芯片210和第二半导体芯片220之间的干扰最小,因此可以将电源模块制造成更紧凑的尺寸。
此外,通过在组件之间插入焊接材料40并且将它们焊接而将第一开关和第二开关的组件结合。例如,关于第一开关,焊接材料40插入在第一基板110、第一半导体芯片210、公共电极300和第三基板130之间,然后焊接。
焊接材料40的具体配置或者焊接不包括在本发明的范围内,因此,本文中不对其进行描述。
另外,可以通过除了焊接以外的方法将组件进行结合,例如,可以使用烧结。
在第一开关中,第一基板110可以制造成比第三基板130更宽,并且在第二开关中,第三基板130可以制造成比第二基板120更宽,从而保证用于结合电线的空间。即使基板的面积部分地减小,也不会对电源模块的性能具有很大的影响,因此,可以调节基板的面积,以能够容易地结合电线。
第一开关和第二开关可以由密封剂70(由环氧树脂模制化合物或硅胶制成)来密封,以防止第一开关和第二开关的移动,并且防止开关由于外界空气或潮湿而腐蚀。
下文中对本发明的另一个实施方案进行了描述。
如图3和图4中所示,该实施方案的特征是,第一开关的第一基板110和第二开关的第三基板130形成一体,并且第一开关的第三基板130和第二开关的第二基板120形成一体。
为了便于描述,形成一体的第一开关的第一基板110和第二开关的第三基板130称作为下部基板410,形成一体的第一开关的第三基板130和第二开关的第二基板120称作为上部基板420。
下部基板410和上部基板420分别由外层、中间层和内层组成。外层和内层由铝或铜制成以便能够发送/接收电信号,而中间层由用于绝缘的陶瓷制成。
下部基板410由外层411、中间层412、第一开关侧内层413和第二开关侧内层414组成,其中,外层411和中间层412形成一体,内层分别被分开并结合至第一开关和第二开关。
由于内层被分开,所以可以实现与第一基板110和第三基板130分开的之前的实施方案相同的效果。而且,由于外层和中间层形成一体,所以可以增强抗物理变形。
类似地,在上部基板420中,外层421和中间层422形成一体,并且内层被分开成第一开关侧内层423和第二开关侧内层424,因此上部基板与下部基板410的操作类似。
有利的是,通过使得上部基板420的面积小于下部基板410的面积,来保证用于结合电线60的空间。
尽管上面已经参照附图对本发明的示例性实施方案进行了描述,但是,本领域技术人员应该理解,可以以各种方式来实施本发明,而不改变本发明的必要特征或精神。
因此,应该理解,示例性实施方案不是限制性的,而在各个方面是示例性的。本发明的范围不是由说明书进行限定的,而是由所附权利要求书进行限定的,并且,根据权利要求的含义和范围而获得的所有改变和修改以及等同构思应该理解为包括在本发明的范围内。
Claims (10)
1.一种双面冷却型电源模块,其包括:
第一开关,其在两侧上具有冷却器;
第二开关,其与所述第一开关分开地设置,并且在两侧上具有冷却器;
公共电极,其联接到所述第一开关和所述第二开关二者;
所述第一开关通过在连接到电池的第一基板和连接到电机的第三基板之间层叠第一半导体芯片和公共电极而形成,
所述第二开关通过在连接到电机的第三基板和连接到电池的第二基板之间层叠公共电极和第二半导体芯片而形成;
所述公共电极在所述第一开关和所述第二开关二者中层叠,并且连接到所述第三基板;
所述第一半导体芯片设置在所述公共电极的一侧,所述第二半导体芯片设置在所述公共电极的另一侧。
2.根据权利要求1所述的双面冷却型电源模块,其中,第一开关和第二开关形成为相反的形状,并且第一开关的第一基板和第二开关的第三基板位于相同的平面上。
3.根据权利要求1所述的双面冷却型电源模块,其中,通过焊接对第一开关的第一基板、第一半导体芯片、公共电极和第三基板进行结合,
通过焊接对第二开关的第三基板、公共电极、第二半导体芯片和第二基板进行结合。
4.根据权利要求1所述的双面冷却型电源模块,其中,第一开关的第一基板和第二开关的第三基板是分开的基板;
第一开关的第三基板和第二开关的第二基板是分开的基板。
5.根据权利要求4所述的双面冷却型电源模块,其中,在第一开关中,第一基板制成为比第三基板更宽;
在第二开关中,第三基板制成为比第二基板更宽。
6.根据权利要求1所述的双面冷却型电源模块,其中,第一基板、第二基板和第三基板分别由外层、内层和中间层组成,所述外层由铜或铝制成,所述内层由铜或铝制成并且与第一半导体芯片、第二半导体芯片或公共电极接触,所述中间层在外层和内层之间由陶瓷制成,
在第一开关的第一基板和第二开关的第三基板中,外层和中间层形成一体,并且内层被分开;以及
在第一开关的第三基板和第二开关的第二基板中,外层和中间层形成一体,并且内层被分开。
7.根据权利要求6所述的双面冷却型电源模块,其中,通过集成第一开关的第一基板和第二开关的第三基板而形成的基板被制成为比通过集成第一开关的第三基板和第二开关的第二基板而形成的基板更宽。
8.根据权利要求1所述的双面冷却型电源模块,其中,第一开关和第二开关通过密封剂来密封,所述密封剂由环氧树脂模制化合物或硅胶制成。
9.根据权利要求1所述的双面冷却型电源模块,进一步包括电线,其分别连接至第一半导体芯片和第二半导体芯片,以发送和接收信号。
10.根据权利要求1所述的双面冷却型电源模块,其中,公共电极是引线框架或由铜或铝制成的薄板。
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