CN107331641A - 一种翻转装置 - Google Patents
一种翻转装置 Download PDFInfo
- Publication number
- CN107331641A CN107331641A CN201710500267.0A CN201710500267A CN107331641A CN 107331641 A CN107331641 A CN 107331641A CN 201710500267 A CN201710500267 A CN 201710500267A CN 107331641 A CN107331641 A CN 107331641A
- Authority
- CN
- China
- Prior art keywords
- connector
- drive
- retainer ring
- turning device
- clamping device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Clamps And Clips (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710500267.0A CN107331641B (zh) | 2017-06-27 | 2017-06-27 | 一种翻转装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710500267.0A CN107331641B (zh) | 2017-06-27 | 2017-06-27 | 一种翻转装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107331641A true CN107331641A (zh) | 2017-11-07 |
CN107331641B CN107331641B (zh) | 2020-06-30 |
Family
ID=60197714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710500267.0A Active CN107331641B (zh) | 2017-06-27 | 2017-06-27 | 一种翻转装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107331641B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108031621A (zh) * | 2017-12-26 | 2018-05-15 | 重庆英拓机电设备有限公司 | 雨刮连杆制造用翻转机构 |
CN108115648A (zh) * | 2017-12-26 | 2018-06-05 | 重庆英拓机电设备有限公司 | 雨刮连杆自动注油系统 |
CN112309952A (zh) * | 2020-12-23 | 2021-02-02 | 西安奕斯伟硅片技术有限公司 | 一种晶圆翻转设备 |
CN114476655A (zh) * | 2022-02-21 | 2022-05-13 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种夹片机构 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10209243A (ja) * | 1997-01-23 | 1998-08-07 | Dainippon Screen Mfg Co Ltd | 基板搬送装置およびそれを用いた基板搬送方法ならびに基板姿勢変換装置 |
JP2004327674A (ja) * | 2003-04-24 | 2004-11-18 | Dainippon Screen Mfg Co Ltd | 基板反転装置およびそれを備えた基板処理装置 |
CN1712333A (zh) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | 基板翻转装置及方法、基板运送装置及方法、基板处理装置及方法 |
KR20090036700A (ko) * | 2007-10-10 | 2009-04-15 | 세메스 주식회사 | 반도체 세정 설비의 웨이퍼 반전 장치 및 그의 웨이퍼 감지방법 |
JP2011029241A (ja) * | 2009-07-21 | 2011-02-10 | Nikon Corp | 基板搬送装置および基板貼り合わせ装置 |
CN103567860A (zh) * | 2012-07-27 | 2014-02-12 | 株式会社荏原制作所 | 工件输送装置 |
CN104380456A (zh) * | 2012-06-15 | 2015-02-25 | 斯克林集团公司 | 基板翻转装置以及基板处理装置 |
-
2017
- 2017-06-27 CN CN201710500267.0A patent/CN107331641B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10209243A (ja) * | 1997-01-23 | 1998-08-07 | Dainippon Screen Mfg Co Ltd | 基板搬送装置およびそれを用いた基板搬送方法ならびに基板姿勢変換装置 |
JP2004327674A (ja) * | 2003-04-24 | 2004-11-18 | Dainippon Screen Mfg Co Ltd | 基板反転装置およびそれを備えた基板処理装置 |
CN1712333A (zh) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | 基板翻转装置及方法、基板运送装置及方法、基板处理装置及方法 |
KR20090036700A (ko) * | 2007-10-10 | 2009-04-15 | 세메스 주식회사 | 반도체 세정 설비의 웨이퍼 반전 장치 및 그의 웨이퍼 감지방법 |
JP2011029241A (ja) * | 2009-07-21 | 2011-02-10 | Nikon Corp | 基板搬送装置および基板貼り合わせ装置 |
CN104380456A (zh) * | 2012-06-15 | 2015-02-25 | 斯克林集团公司 | 基板翻转装置以及基板处理装置 |
CN103567860A (zh) * | 2012-07-27 | 2014-02-12 | 株式会社荏原制作所 | 工件输送装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108031621A (zh) * | 2017-12-26 | 2018-05-15 | 重庆英拓机电设备有限公司 | 雨刮连杆制造用翻转机构 |
CN108115648A (zh) * | 2017-12-26 | 2018-06-05 | 重庆英拓机电设备有限公司 | 雨刮连杆自动注油系统 |
CN112309952A (zh) * | 2020-12-23 | 2021-02-02 | 西安奕斯伟硅片技术有限公司 | 一种晶圆翻转设备 |
CN114476655A (zh) * | 2022-02-21 | 2022-05-13 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种夹片机构 |
CN114476655B (zh) * | 2022-02-21 | 2024-05-28 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 一种夹片机构 |
Also Published As
Publication number | Publication date |
---|---|
CN107331641B (zh) | 2020-06-30 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Wang Haiming Inventor after: Zhang Wenbin Inventor after: Yang Shengrong Inventor after: Yi Zhongbo Inventor after: Zhang Jingrui Inventor after: Qi Haomei Inventor after: He Dongge Inventor after: Wang Xin Inventor before: Zhang Wenbin Inventor before: Yang Shengrong Inventor before: Yi Zhongbo Inventor before: Zhang Jingrui Inventor before: Qi Haoshu Inventor before: He Dongge Inventor before: Wang Xin |
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GR01 | Patent grant |