CN107329848A - A kind of WAT test datas automatic analysis method - Google Patents
A kind of WAT test datas automatic analysis method Download PDFInfo
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- CN107329848A CN107329848A CN201710496347.3A CN201710496347A CN107329848A CN 107329848 A CN107329848 A CN 107329848A CN 201710496347 A CN201710496347 A CN 201710496347A CN 107329848 A CN107329848 A CN 107329848A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/0703—Error or fault processing not based on redundancy, i.e. by taking additional measures to deal with the error or fault not making use of redundancy in operation, in hardware, or in data representation
- G06F11/079—Root cause analysis, i.e. error or fault diagnosis
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention proposes a kind of WAT test datas automatic analysis method, comprises the following steps：When having new product, all parameter specifications of this product are set up according to customer requirement；The Monitoring Rules and corresponding specification of the product parameters, and the form that generation is reported are defined on demand；After the wafer batch of the product completes WAT tests, judge that the every terms of information of failure parameter, by still failure, is carried out statistics and analysis by each parameter；According to the Monitoring Rules and corresponding specification of definition, when statistical result exceedes corresponding specification, result is generated and reports and sends.WAT test datas automatic analysis method proposed by the present invention, can find rule sex chromosome mosaicism, so as to find out the defect problem of WAT test equipments or making technology from substantial amounts of WAT test datas.The statistical analysis of data is specifically carried out according to the rule of setting, it is possible to achieve the frequency of failure and frequency to each parameter of product exercise supervision.When statistical result reaches setting specification, system can remind correlation engineering teacher with mail he.
Description
Technical field
Number is tested the present invention relates to a kind of WAT in semiconductor integrated circuit manufacture field, more particularly to WAT testing fields
According to automatic analysis method.
Background technology
With advances in technology, integrated circuit fabrication process requirement is increasingly improved, and because the IC manufacturing cycle is long,
Cost is high, therefore, and the manufacture efficiency and quality for improving manufacturing process are particularly important.
, it is necessary to by road processing steps up to a hundred, wafer acceptability test (Wafer in the manufacturing process of product
Acceptance Test, referred to as：WAT important role) is play as the characterization processes of chip quality, wafer is acceptable
Test includes a variety of test events, and is step indispensable in chip manufacturing.Usually said WAT test parameters refer to,
These elements are carried out with the electrical parameter data obtained by electrical property measurement, such as connectivity test, threshold voltage, drain electrode saturation
Electric current etc..
Wafer acceptability test (Wafer Acceptance Test, referred to as：WAT the data after) testing can be passed automatically
Defeated to arrive in statistical Process Control (SPC) system, this system can effectively judge that WAT tests the data of each each test point of parameter
Whether in specification, the data protrusion beyond specification can also be presented to user.The judgement of current WAT test datas has non-
Specification more than often, wherein the one kind judged in report SPC systems, also parameter exceed the calculating of specification ratio, each platelet compasses
Calculating of lattice etc., and SPC systems can not calculate increasing test specification, can only check number by correlation engineering Shi Rengong
According to and judge whether wafer batch (Lot) meets the requirement of shipment, each Lot of shipment is required for correlation engineering teacher to check data
And result is provided, it is very big to the increased workload of engineer, and calculating mistake is likely to occur, it is necessary to more artificial deduplications
Check whether wrong, more manpowers and time will be taken.
Data after current WAT tests can judge in SPC systems WAT test each each test point of parameter data whether
In specification, the data protrusion beyond specification can also be presented to user.And for by WAT test equipments problem or system
Test parameter caused by journey technique is abnormal, and SPC systems can not carry out statistics and analysis, can only be checked by correlation engineering Shi Rengong
Per pen data, and analyze judge whether it is that the workload of engineer is very big, and holds as caused by WAT tests or making technology
Easily ignore rule and unconspicuous parameter problem, so that the production that such issues that problem, increase influences can not in time be found and be solved
Product quantity.
The content of the invention
The present invention proposes a kind of WAT test datas automatic analysis method, and rule can be found from substantial amounts of WAT test datas
Sex chromosome mosaicism is restrained, so as to find out the defect problem of WAT test equipments or making technology.Line number is specifically entered according to the rule of setting
According to statistical analysis, it is possible to achieve the frequency of failure and frequency to each parameter of product exercise supervision.Set when statistical result reaches
During set pattern lattice, system can remind correlation engineering teacher with mail he.
In order to achieve the above object, the present invention proposes a kind of WAT test datas automatic analysis method, comprises the following steps：
When having new product, all parameter specifications of this product are set up according to customer requirement；
The Monitoring Rules and corresponding specification of the product parameters, and the form that generation is reported are defined on demand；
After the wafer batch of the product completes WAT tests, each parameter is judged by still failure, by each of failure parameter
Item information carries out statistics and analysis；
According to the Monitoring Rules and corresponding specification of definition, when statistical result exceedes corresponding specification, result is generated and reported
And send.
Further, the information of the failure parameter includes：Testing time, failure frequency, wafer batch information, test machine
Platform and probe card information, failure position.
Further, the statistical result generation report uses the form of chart.
Further, the statistical result generation report is sent to engineer's mailbox of setting by mail.
Further, failure parameter information is carried out highlighted mark display by the statistical result generation report.
WAT test datas automatic analysis method proposed by the present invention, can count the test result of each product with chart
The form of report is presented to engineer, wherein the cumulative information of each parameter failure of each product, such as lot ID, failure can be shown
Number of times, testing time, tester table, test probe card used etc., reach that engineer can reduce engineering with open-and-shut purpose
The workload of teacher, and avoid the careless omission manually counted；Statistical analysis also with mail can be sent to engineer by simultaneity factor,
Engineer is set to find in time and energy process problem.
Brief description of the drawings
Fig. 1 show the WAT test data automatic analysis method flow charts of present pre-ferred embodiments.
Embodiment
The embodiment of the present invention is provided below in conjunction with accompanying drawing, but the invention is not restricted to following embodiment.Root
According to following explanation and claims, advantages and features of the invention will become apparent from.It should be noted that, accompanying drawing is using very simple
The form of change and use non-accurately ratio, be only used for conveniently, lucidly aid in illustrating the embodiment of the present invention purpose.
Fig. 1 is refer to, Fig. 1 show the WAT test data automatic analysis method flow charts of present pre-ferred embodiments.This
Invention proposes a kind of WAT test datas automatic analysis method, comprises the following steps：
Step S100：When having new product, all parameter specifications of this product are set up according to customer requirement；
Step S200：The Monitoring Rules and corresponding specification of the product parameters, and the form that generation is reported are defined on demand；
Step S300：After the wafer batch of the product completes WAT tests, judge that each parameter, by still failure, will be lost
The every terms of information for losing parameter carries out statistics and analysis；
Step S400：According to the Monitoring Rules and corresponding specification of definition, when statistical result exceedes corresponding specification, by result
Generation is reported and sent.
According to present pre-ferred embodiments, the information of the failure parameter includes：Testing time, failure frequency, wafer lot
Secondary information, tester table and probe card information, failure position.The statistical result generation report uses the form of chart.It is described
Statistical result generation report is sent to engineer's mailbox of setting by mail.The statistical result generation report will failure parameter
Information carries out highlighted mark display.
Of the invention main to failure parameter progress statistical analysis, engineer can need to set corresponding prison according to different product
Gauge then, for example, carries out management and control to certain parameter frequency of failure in the setting cycle；Specified parameter is unsuccessfully to be highlighted；Same position
Failure parameter number, it can set rule with indexs such as probe card crash wafer lot time numbers with board and be monitored.
Rule is exemplified below：
Rule1：Important parameter fails, for example：Resistance, leakage current；
Rule2：In 24 hours, the same batch same parameters frequency of failure exceedes setting specification, for example：Parameter Tinv loses
Number of times is lost more than 10 times；
Rule3：Ratio or number with the parameter that fails on wafer exceed setting specification；
Rule4：For a certain parameter, failure wafer number accumulated quantity exceedes setting specification；
Rule5：Exceed setting specification with probe card crash batch or the number of wafer with board；
Rule6：Result passes through after same batch same wafer same position identical parameters retest.
In summary, WAT test datas automatic analysis method proposed by the present invention, can unite the test result of each product
Meter is presented to engineer in the form of chart is reported, wherein the cumulative information of each parameter failure of each product, such as lot can be shown
ID, the frequency of failure, testing time, tester table, test probe card used etc., reach engineer can with open-and-shut purpose,
The workload of engineer is reduced, and avoids the careless omission manually counted；Simultaneity factor also can be sent statistical analysis with mail
To engineer, engineer is set to find in time and energy process problem.
Although the present invention is disclosed above with preferred embodiment, so it is not limited to the present invention.Skill belonging to of the invention
Has usually intellectual in art field, without departing from the spirit and scope of the present invention, when can be used for a variety of modifications and variations.Cause
This, the scope of protection of the present invention is defined by those of the claims.
Claims (5)
1. a kind of WAT test datas automatic analysis method, it is characterised in that comprise the following steps：
When having new product, all parameter specifications of this product are set up according to customer requirement；
The Monitoring Rules and corresponding specification of the product parameters, and the form that generation is reported are defined on demand；
After the wafer batch of the product completes WAT tests, each parameter is judged by still failure, every by failure parameter believes
Breath carries out statistics and analysis；
It is when statistical result exceedes corresponding specification, result generation report is concurrent according to the Monitoring Rules and corresponding specification of definition
Send.
2. WAT test datas automatic analysis method according to claim 1, it is characterised in that the letter of the failure parameter
Breath includes：Testing time, failure frequency, wafer batch information, tester table and probe card information, failure position.
3. WAT test datas automatic analysis method according to claim 1, it is characterised in that the statistical result generation
Report uses the form of chart.
4. WAT test datas automatic analysis method according to claim 1, it is characterised in that the statistical result generation
Report is sent to engineer's mailbox of setting by mail.
5. WAT test datas automatic analysis method according to claim 1, it is characterised in that the statistical result generation
Failure parameter information is carried out highlighted mark display by report.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710496347.3A CN107329848A (en) | 2017-06-26 | 2017-06-26 | A kind of WAT test datas automatic analysis method |
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| CN201710496347.3A CN107329848A (en) | 2017-06-26 | 2017-06-26 | A kind of WAT test datas automatic analysis method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111506464A (en) * | 2019-01-31 | 2020-08-07 | 杭州广立微电子有限公司 | System for rapidly generating chart report aiming at WAT data |
| CN114924544A (en) * | 2022-04-13 | 2022-08-19 | 江铃汽车股份有限公司 | Method and system for matching and detecting automobile ECU software |
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| CN1314702A (en) * | 2000-03-21 | 2001-09-26 | 日本电气株式会社 | Producing system of semiconductor storage and method for producing semiconductor storage |
| US7386420B2 (en) * | 2006-06-02 | 2008-06-10 | United Microelectronics Corp. | Data analysis method for integrated circuit process and semiconductor process |
| CN102117730A (en) * | 2009-12-31 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Method for processing parameter data of machine station in manufacturing process of semiconductor and device thereof |
| CN103646888A (en) * | 2013-11-28 | 2014-03-19 | 上海华力微电子有限公司 | A wafer acceptance testing system and method |
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2017
- 2017-06-26 CN CN201710496347.3A patent/CN107329848A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1314702A (en) * | 2000-03-21 | 2001-09-26 | 日本电气株式会社 | Producing system of semiconductor storage and method for producing semiconductor storage |
| US7386420B2 (en) * | 2006-06-02 | 2008-06-10 | United Microelectronics Corp. | Data analysis method for integrated circuit process and semiconductor process |
| CN102117730A (en) * | 2009-12-31 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Method for processing parameter data of machine station in manufacturing process of semiconductor and device thereof |
| CN103646888A (en) * | 2013-11-28 | 2014-03-19 | 上海华力微电子有限公司 | A wafer acceptance testing system and method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111506464A (en) * | 2019-01-31 | 2020-08-07 | 杭州广立微电子有限公司 | System for rapidly generating chart report aiming at WAT data |
| CN111506464B (en) * | 2019-01-31 | 2023-09-15 | 杭州广立微电子股份有限公司 | System for generating chart report rapidly aiming at WAT data |
| CN114924544A (en) * | 2022-04-13 | 2022-08-19 | 江铃汽车股份有限公司 | Method and system for matching and detecting automobile ECU software |
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