CN107301988A - Camera module and its assembly method - Google Patents
Camera module and its assembly method Download PDFInfo
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- CN107301988A CN107301988A CN201710388252.XA CN201710388252A CN107301988A CN 107301988 A CN107301988 A CN 107301988A CN 201710388252 A CN201710388252 A CN 201710388252A CN 107301988 A CN107301988 A CN 107301988A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The present invention provides a kind of assembly method of camera module, comprises the following steps：The image sensor chip with hanging plain conductor is provided, the first end of the plain conductor is bonded to the pad of described image sensor chip, and the second end is suspended on described image sensor chip；Described image sensor chip and the support frame for being provided with optical transmission window are assembled into image sensor chip in a packaging part, the packaging part, optical transmission window and support frame formation cavity, pollution of the foreign to image sensor chip is reduced；Then the packaging part and circuit board and camera lens module are assembled to form by camera module by the second end of the plain conductor.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly to a kind of assembly method of camera module.
Background technology
At present, the imaging sensor of main flow（CIS：CMOS Image Sensor）Method for packing include：Wafer-level package
（Chip Scale Package, CSP）, integration packaging on plate（Chip On Board, COB）And Flip-Chip Using（Flip
Chip, FC）.
CIS CSP are that one kind is commonly utilized in low and middle-end, low pixel at present（2M pixels are following）The envelope of imaging sensor
Dress technology, can use Die level（Chip-scale）Or Wafer level（Wafer scale）Encapsulation technology.The encapsulation technology generally makes
Separated with wafer scale glass and wafer bonding and between the image sensor chip of wafer using cofferdam, then in grinding
The welding disking area of wafer afterwards is by making the silicon perforation technology that bond pad surface or pad face endoporus side ring metal are connected（TSV：
Through Silicon Via）Or cutting after pad side T-shaped metal contact chip scale packaging techniques, and wafer the back of the body
Solder ball grid array is made after the extended link of face（BGA：Ball Grid Array）, single sealing cavity is formed after then cutting
Image sensor cell.The method formation module assembled structure that rear end passes through SMT.But, CSP encapsulation has asks as is evident below
Topic：1 influence properties of product：Thick support glass is to the absorption of light, refraction, reflection and scatters especially small to imaging sensor
The performance of Pixel Dimensions product has a very big impact；2 integrity problems：Thermal expansion system between component in encapsulating structure
There is integrity problem in the change of the SMT techniques or product use environment of number difference and cavity interior sealing gas below；3
Scale of investment is big, environment pollution control requirement is big, and the production cycle is longer, and unit chip cost is higher particularly with the big chi of high pixel
Very little image sensor products.
CIS COB encapsulation is that one kind is commonly utilized in high-end, high pixel product at present（5M pixels or more）Imaging sensor
Die Level（Chip-scale）Encapsulation technology.The encapsulation technology is the chip back bonding after ground cutting in pcb board
Bond wire wire is used on pad, support and camera lens with IR sheet glass is loaded onto, assembling modular structure is formed.But, COB
Encapsulate problem as is evident below：1st, micronic dust control is extremely difficult, it is necessary to which the proper clean room grade of superelevation, manufacture maintains cost high；2、
Product design customization, cycle length, flexibility ratio are inadequate；3 are not easy large-scale production；
High-end, the high pixel that CIS FC encapsulation is risen recently（5M pixels or more）The Die Level of imaging sensor（Chip
Level）Encapsulation technology.The encapsulation technology is carrying out pad of the chip bonding pad of the golden plain ground cutting of projection directly with PCB in pad
It is attached by the disposable all contact tabs of the effect of hot ultrasound with pad, forms encapsulating structure.Rear end passes through on the outside of PCB
Pad or tin ball using SMT method formation module assembled structure.But, FC encapsulates problem as is evident below：1 encapsulation
Very high is required to PCB substrate, there is close thermal coefficient of expansion with Si, cost is very high；2 manufacture reliability difficulty are very big, and heat is super
The coherence request that all projections of sound are connected with pad is very high, and projection and pad Hard link, ductility are bad；3 micronic dusts are controlled
Difficulty is big, process environments require high, and cost is very high；
In addition, the assembly method of conventional CIS modules is：
Step 1, image sensor chip is welded on circuit board, forms first part；
Step 2, by camera lens module and sleeve module assembled, second part is formed；
Step 3, first part and second part are assembled, so as to form a complete camera module.
The assembly method of such a camera module has a disadvantage that：, it is necessary to using high-accuracy for camera module
Installation equipment could carry out the accurate installation of above-mentioned steps 3, otherwise will have influence on the imaging effect of camera module, and then fill
With camera module product qualified rate it is not high；Especially for the camera module of high pixel, common peace is used
Installing standby is difficult the accurate installation for preferably completing above-mentioned steps 3 so that the imaging effect of the camera module of high pixel by
Considerable influence, into image image quality it is poor, the image quality of especially image surrounding is substantially bad.
Also, in the image sensor chip packaging technology being bonded using plain conductor, generally first by imaging sensor
Chip die bond（For example adhere to）To pinboard（Flexible PCB）On, bonding bonding wire is then carried out, by the first end of plain conductor
It is connected on the pad of image sensor chip, the second end is connected on pinboard, is achieved in image sensor chip and turns
The electrical connection of fishplate bar, is then connected to electricity by the image sensor chip after encapsulation by the lead on pinboard or tin ball again
On the plate of road.
The configuration flexibility that existing wire bonding method is easily caused after encapsulation is poor, the follow-up assembling essence of camera module
Degree requires high, and the relative position of camera lens and image sensor chip is difficult to control to influence the performance of camera module；And due to
The flow of existing method is longer, and packaging efficiency is relatively low, causes the image sensor chip long period to be exposed in air, it is necessary to many
Secondary detection and cleaning, reduces yields, increases the cost of camera module.Especially, for some ends of plain conductor second
The image sensor chip that is attached using other techniques is, it is necessary to a kind of new bonding method and device, so that the of wire
One end is connected to the pad of image sensor chip, and the second end is suspended on outside image sensor chip.
In summary, need badly and a kind of realize high pixel, the low cost of large chip size image sensor, high-performance, Gao Ke
By property, ultra-thin encapsulating structure technology.
The content of the invention
Based on considerations above, a kind of assembly method of camera module is proposed, is comprised the following steps：
The image sensor chip with hanging plain conductor is provided, the first end of the plain conductor is bonded to described image biography
The pad of sensor chip, the second end is suspended on described image sensor chip；
Described image sensor chip and the support frame for being provided with optical transmission window are assembled into a packaging part, the packaging part
Image sensor chip, optical transmission window and support frame formation cavity, reduce pollution of the foreign to image sensor chip；
Then the packaging part and circuit board and camera lens module are assembled to form by camera module by the second end of the plain conductor.
It is preferred that, the plain conductor forms elastic construction, and the second end of the plain conductor is passed less than described image
5 microns to 300 microns of sensor chip lower surface.
It is preferred that, during the electrical testing of the packaging part, elastic shape occurs for the elastic construction of the plain conductor
Become to provide contact, that improves plain conductor and test device is electrically connected performance；In the packaging part and circuit board
In assembling process, elastic deformation occurs for the elastic construction of the plain conductor to provide contact, improves plain conductor and electricity
Road plate is electrically connected performance.
It is preferred that, by welding manner, the pressing way of contact, ultrasonic bond mode, conducting resinl bonding mode by the gold
Second end of category wire is electrically connected with the circuit board.
It is preferred that, in the packaging part and board fabrication process,
When the cavity of the packaging part is sealing, by controlling P/ (273+t) value to change within a certain range so that described
Inside cavity, the draught head of containment portion are less than 20%, and wherein P is the external pressure of cavity, and t is the Celsius temperature of containment portion,
To reduce damage of the assembling process lumen inside and outside draught head to packaging part；
When the cavity of the packaging part is non-tight, by controlling P/ (273+t) value to change within a certain range so that institute
State inside cavity, the draught head of containment portion is less than 20%, wherein P is the external pressure of cavity, and t is the temperature Celsius of containment portion
Degree, reduces air current flow inside and outside cavity, so as to reduce contamination of the extraneous foreign matter to chip in assembling process.
The present invention also provides a kind of camera module, including：
Image sensor chip, described image sensor chip is electrically connected hanging plain conductor, the plain conductor
First end is bonded to the pad of described image sensor chip, and the second end is suspended on described image sensor chip；
Support frame, is provided with optical transmission window, suitable for being assembled into a packaging part with image sensor chip；
Camera lens module, suitable for being assemblied in the support frame in packaging part and being assembled into camera module with circuit board；
Circuit board, the circuit board is electrically connected with the packaging part by the second end of the plain conductor.
It is preferred that, the second end of the plain conductor formation elastic construction and the plain conductor is sensed less than described image
5 microns to 300 microns of device chip lower surface.
It is preferred that, the second end and the circuit board of the plain conductor pass through welding manner, the pressing way of contact, ultrasound
Bonding pattern, conducting resinl bonding mode are electrically connected
The assembly method of the camera module of the present invention just can be carried out accurately using common installation equipment to camera module
Assembling, overcoming the assembly method of camera module in the prior art needs the deficiency using high-precision installation equipment, this hair
Bright assembly method is simple and easy to apply, it is easy to adjust image sensor chip to the focal plane of camera lens, it is easy to correct camera lens and image
The gradient of sensor chip, to ensure the optical property after the completion of camera module assembling, installation step of the invention causes
The camera module has high-quality imaging effect, especially for the camera module of high pixel, can make its image
The image quality of surrounding is significantly improved.
The present invention by the way that hanging plain conductor is formed after the chip cutting by imaging sensor by bond wire wire,
And further the free end on lens module group assembling to image sensor chip, then by plain conductor and circuit board are carried out
It is electrically connected, and plain conductor is elastic construction, can occur elastic deformation, electric property can be preferably improved, than traditional C/S P
Pad, BGA and scolding tin three SMT connections have more process advantage
The present invention is directly connected to chip and PCB substrate pad using gold thread, and gold thread ductility is good, and environmental suitability is strong, reliably
Property is good.The support frame of the present invention can be with image sensor chip formation open architecture, and the effective light that reduces is in shooting head mould
There is provided module performance for veiling glare in group..
Various aspects of the invention will be become apparent from by the explanation of embodiment in detail below.
Brief description of the drawings
The following detailed description to non-limiting example, other spies of the invention are read by referring to accompanying drawing
Levy, objects and advantages will become more apparent upon.
Fig. 1 is the schematic diagram of the image sensor chip with hanging plain conductor according to the embodiment of the present invention；
Fig. 2 is the schematic diagram of the packaging part according to the embodiment of the present invention；
Fig. 3 is the assembling original state schematic diagram of the camera module according to the embodiment of the present invention；
Fig. 4 is the assembling completion status schematic diagram of the camera module according to the embodiment of the present invention；
Fig. 5 is the flow chart of the assembly method of the camera module according to the present invention.
In figure, through different diagrams, same or similar reference represents same or analogous device（Module）
Or step.
Embodiment
In the specific descriptions of following preferred embodiment, by the accompanying drawing with reference to appended by constituting a present invention part.Institute
Attached accompanying drawing, which has been illustrated by way of example, can realize specific embodiment.The embodiment of example is not intended as
Limit is according to all embodiments of the invention.It is appreciated that without departing from the scope of the present invention, it is possible to use other
Embodiment, can also carry out structural or logicality modification.Therefore, following specific descriptions and nonrestrictive, and this
The scope of invention is defined by the claims appended hereto.
In order to more clearly illustrate the method for packing of the present invention, in the following embodiments, substrate is used as using glass.This
Art personnel are, it is understood that substrate can also be made up of other transparent materials.
Fig. 1 is the schematic diagram of the image sensor chip with hanging plain conductor according to the embodiment of the present invention；Fig. 2 is
Schematic diagram according to the packaging part of the embodiment of the present invention；Fig. 3 is that the assembling of the camera module according to the embodiment of the present invention is initial
View；Fig. 4 is the assembling completion status schematic diagram of the camera module according to the embodiment of the present invention；Fig. 5 is according to this
The flow chart of the assembly method of the camera module of inventive embodiments.
As shown in figure 5, and please also refer to Fig. 1 to Fig. 4 method for packing and comprise the following steps：
First, step S11 is performed：Image sensor chip 110 with hanging plain conductor 120, the plain conductor are provided
120 first end 121 is bonded to the pad 111 of described image sensor chip 110, and the second end 122 is suspended on described image biography
Sensor chip 110.
In this step, there is image sensing area 112 in the front of image sensor chip 110, and around image sensing area
112 welding disking area 113, welding disking area 113 includes some pads 111.The second end of plain conductor 120 is hanging in this step
It is not bonded mutually with any medium, plain conductor is that gold thread, silver wire, copper cash etc. have good wire performance, and is elastic construction,
Elastic deformation can occur when the second end 122 for active force；
It please also refer to Fig. 2 to Fig. 4, step S12：By described image sensor chip 110 and the branch for being provided with optical transmission window 133
Support frame frame 131 is assembled into image sensor chip 110 in a packaging part 200, the packaging part 200, optical transmission window 133 and support
The formation cavity 134 of framework 131, reduces pollution of the foreign to image sensor chip 110；Then the plain conductor is passed through
The second end 122 packaging part 200 and circuit board 300 and camera lens module 130 are assembled to form camera module.
In this step, the image sensor chip 110 with hanging plain conductor is assemblied in one with support frame 131
Rise, the inner surface of support frame 131 also has step 1311 in one embodiment, suitable for one package substrate 140 of assembling, encapsulate base
Plate 140 is glass material, plastic material, and the surface of package substrate 140 is covered with IR films or AR films；Do not set in another embodiment
Step 1311 and package substrate 140 are put, IR films or AR are directly covered close to the surface in image sensing area 112 in camera lens module 130
Film.
After assembling of the image sensor chip 110 with support frame 131 is completed, pass through the second end 122 of plain conductor
By welding manner, the pressing way of contact, ultrasonic bond mode, conducting resinl bonding mode by packaging part 200 and circuit board 300,
Camera lens module 130 is assembled to form camera module 400, it should be pointed out that camera lens module 130 is assemblied in 131 pairs of support frame
Both the weldering of circuit board 300 should can be electrically connected in the region of optical transmission window, the order of assembling at the second end of plain conductor 122
Before disk 310, it can be also electrically connected at the second end of plain conductor 122 after the pad 310 of circuit board 300.
In the packaging part and board fabrication process, when the cavity of the packaging part is sealing, by controlling P/
The value of (273+t) changes within a certain range so that the inside cavity, the draught head of containment portion are less than 20%, and wherein P is
The external pressure of cavity, t is the Celsius temperature of containment portion, to reduce assembling process lumen inside and outside draught head to packaging part
Damage；When the cavity of the packaging part is non-tight, by controlling P/ (273+t) value to change within a certain range so that
The inside cavity, the draught head of containment portion are less than 20%, and wherein P is the external pressure of cavity, and t is Celsius for containment portion
Temperature, reduces air current flow inside and outside cavity, so as to reduce contamination of the extraneous foreign matter to chip in assembling process.
Specifically, then passing through the second end 122 and the weldering on circuit board 300 using the pressing way of contact in the first embodiment
The good contact of disk 310, subregion of the packaging part 200 with circuit board 300 by way of buckle or bonding is fixed.
In a second embodiment, using welding manner, concrete mode is：In the second end 122 of plain conductor or circuit
One layer of gold-tin alloy weld layer is plated on the pad 310 of plate 300, by local rapid welding, the heat of control welding region conducts,
Not influence the performance of lens assembly；
（One）Pad plates gold-tin alloy mode：S201 provides camera module, and the camera module includes temperature sensitive
Camera lens, the camera module also includes the hanging plain conductor being electrically connected with image sensor chip in one end；
S203 provides the circuit board with some pads；The advance attached solder layer of pad of circuit board described in S205, it is outstanding to plain conductor
The pad of dead end and circuit board carries out rapid welding.Plain conductor is gold thread, and the diameter of gold thread is more than or equal to 10 microns, solder layer
For tin layers, by the thickness for controlling tin layers so that in follow-up quick local welding, gold thread can form stabilization with tin layers
The higher gold-tin alloy weld layer of gold content.In an other embodiment：The step of pad of circuit board advance attached solder layer
Also include：S206 forms solder layer using attached solder on the pad of typography and circuit board, Reflow Soldering.In another embodiment
In, also include the step of the pad of circuit board advance attached solder layer：S206 ' is using solder wave process on the pad of circuit board
Attached solder layer.In one embodiment, the method for the thickness of control tin layers includes：Control the parameter of solder wave process so that tin
Thickness degree is less than gold thread diameter.In another embodiment, the method for the thickness of control tin layers includes：Using typography in circuit
Adhere to tin cream on the pad of plate, Reflow Soldering forms tin layers, mode is drawn using air knife mode, suction gun or soldering tip adherent fashion causes
Tin thickness, which is less than, carries out thickness.Tin thickness is less than gold wire thickness, and gold-tin alloy is in welding process, with good material
Advantage, can reduce brilliant crisp, and with good fluidity, resistivity is low, the characteristics of thermal conductivity is good.Rapid welding includes：Pulse thermocompression bonding
Technique, laser welding process, ultrasonic thermocompression Welding, and rapid welding is local welding mode, and heated perimeter is less than described
The 1/2 of camera module bottom area.
（Two）Gold-tin alloy mode is plated at the second end of plain conductor 122, and S101 provides camera module, the camera module
Include thermally sensitive camera lens, the camera module also includes that one end is hanging to be connected with image sensor chip electricity
The plain conductor connect；S103 provides the circuit board with some pads；The free end of plain conductor described in S105 adheres to weldering in advance
The bed of material, rapid welding is carried out to the pad of plain conductor free end and circuit board.Plain conductor is gold thread, and the diameter of gold thread is more than
Equal to 10 microns, solder layer is tin layers, by the thickness for controlling tin layers so that in follow-up quick local welding, gold thread with
It is higher that tin layers can form stable gold content（Fu Jin）Gold-tin alloy weld layer, wherein tin thickness be less than gold wire thickness,
Gold-tin alloy is in welding process, with good material advantage, can reduce brilliant crisp, and with good fluidity, resistivity is low, heat conduction
The characteristics of property is good.Rapid welding includes：Pulse heat bond technology, laser welding process, ultrasonic thermocompression Welding, and fast welding
Local welding mode is connected in, heated perimeter is less than the 1/2 of the camera module bottom area.
In the third embodiment, using conducting resinl bonding mode, the free end of specific plain conductor adheres to conduction in advance
Glue, conducting resinl is tin glue in the present embodiment, and the pad progress solidification to plain conductor free end and circuit board is electrically connected
Connect.Because there is tin glue good cohesive, electric conductivity can be used for doing point electrode slurry, still had according to controllable after hardening
There is good performance.Plain conductor is gold thread, and the diameter of gold thread is more than or equal to 5 microns, and the thickness of tin glue is micro- for 2 microns to 100
Rice.Curing mode is carried out by the way of heat cure or UV solidifications.The composition of tin glue is in the present embodiment：Epoxide-resin glue or
UV glue, and small silver strip mixture, the thickness of tin glue is：2 microns to 100 microns.It can additionally use：The pad of circuit board
Attachment tin glue, is solidified and is electrically connected to the pad of plain conductor free end and circuit board in advance.Due to tin glue have it is good
Cohesive well, electric conductivity can be used for doing point electrode slurry, still have good performance according to controllable after hardening.Metal
Wire is gold thread, and the diameter of gold thread is more than or equal to 5 microns, and the thickness of tin glue is 2 microns to 100 microns.Curing mode is using warm
The mode of solidification or UV solidifications is carried out.The composition of tin glue is in the present embodiment：Epoxide-resin glue or UV glue, and small silver strip
Mixture, the thickness of tin glue is：2 microns to 100 microns.Conducting resinl can also use other of conductive energy in the present embodiment
Metal material.
After packaging part 200 is formed, packaging part 200 can also be tested, in the electrical testing of the packaging part 200
During, elastic deformation occurs for the elastic construction of the plain conductor 120 to provide contact, due to the second of plain conductor
End 122 is less than 5 microns to 300 microns of 110 lower surface of described image sensor chip（Fig. 1 is referred to, distance is h）, improve gold
Belong to wire 120 and test device（Do not mark）Switching performance；And it is the assembling of the packaging part 200 and circuit board 300
During, elastic deformation occurs for the elastic construction of the plain conductor 120 to provide contact, due to the second of plain conductor
End 122 is less than 5 microns to 300 microns of 110 lower surface of described image sensor chip（Fig. 1 is referred to, distance is h）, can improve
The switching performance of plain conductor and circuit board.Refer to that dotted line 120 ' in Fig. 4, Fig. 4 shows for packaging part 200 not with circuit board
During 300 assembling, the first shape state of plain conductor 120；Solid line 120 ' ' display assembled for packaging part 200 with circuit board 300
After the completion of, the second shape state generation elastic deformation of the second shape state of plain conductor, now plain conductor, plain conductor
Contact of second end with pad it is more good, be conducive to the transmission of signal, now the second end and contact pads area be more than
Equal to 0.01 square millimeter.
The present invention also provides a kind of camera module, it is characterised in that including：Image sensor chip, described image is passed
Sensor chip is electrically connected hanging plain conductor, and the first end of the plain conductor is bonded to described image sensor chip
Pad, the second end is suspended on described image sensor chip；Support frame, is provided with optical transmission window, is suitable to and image sensing
Device chip is assembled into a packaging part；Camera lens module, suitable for being assemblied in the support frame in packaging part and being assembled into circuit board
Camera module；Circuit board, the circuit board is electrically connected with the packaging part by the second end of the plain conductor.Metal
Second end of wire formation elastic construction and the plain conductor is less than described image sensor chip lower surface 5 microns to 300
Micron.Second end of plain conductor is with the circuit board by pressing the way of contact, rapid welding mode, conducting resinl bonding mode
Or the mode of non-conductive adhesive bonding mode is connected.It is obvious to a person skilled in the art that the invention is not restricted to above-mentioned demonstration
Property embodiment details, and without departing from the spirit or essential characteristics of the present invention, can be with other specific shapes
Formula realizes the present invention.Therefore, from the point of view of anyway, embodiment all should be regarded as exemplary, and be nonrestrictive.This
Outside, it will be apparent that, the word of " comprising " one is not excluded for other elements and step, and wording " one " is not excluded for plural number.Device right will
Seeking the multiple element of middle statement can also be realized by an element.The first, the second grade word is used for representing title, and not table
Show any specific order.
Claims (8)
1. a kind of assembly method of camera module, it is characterised in that comprise the following steps：
The image sensor chip with hanging plain conductor is provided, the first end of the plain conductor is bonded to described image biography
The pad of sensor chip, the second end is suspended on described image sensor chip；
Described image sensor chip and the support frame for being provided with optical transmission window are assembled into a packaging part, the packaging part
Image sensor chip, optical transmission window and support frame formation cavity, reduce pollution of the foreign to image sensor chip；
Then the packaging part and circuit board and camera lens module are assembled to form by camera module by the second end of the plain conductor.
2. the assembly method of camera module as claimed in claim 1, it is characterised in that the plain conductor forms elastic knot
Structure, and the second end of the plain conductor is less than 5 microns to 300 microns of described image sensor chip lower surface.
3. the assembly method of camera module as claimed in claim 2, it is characterised in that in the electrical testing of the packaging part
During, elastic deformation occurs for the elastic construction of the plain conductor to provide contact, improves plain conductor and is filled with test
That puts is electrically connected performance；In the assembling process of the packaging part and circuit board, the elastic construction of the plain conductor occurs
Elastic deformation is to provide contact, and that improves plain conductor and circuit board is electrically connected performance.
4. the assembly method of camera module as claimed in claim 1, it is characterised in that contacted by welding manner, pressing
Second end of the plain conductor and the circuit board are electrically connected by mode, ultrasonic bond mode, conducting resinl bonding mode.
5. the assembly method of camera module as claimed in claim 1, it is characterised in that
In the packaging part and board fabrication process,
When the cavity of the packaging part is sealing, by controlling P/ (273+t) value to change within a certain range so that described
Inside cavity, the draught head of containment portion are less than 20%, and wherein P is the external pressure of cavity, and t is the Celsius temperature of containment portion,
To reduce damage of the assembling process lumen inside and outside draught head to packaging part；
When the cavity of the packaging part is non-tight, by controlling P/ (273+t) value to change within a certain range so that institute
State inside cavity, the draught head of containment portion is less than 20%, wherein P is the external pressure of cavity, and t is the temperature Celsius of containment portion
Degree, reduces air current flow inside and outside cavity, so as to reduce contamination of the extraneous foreign matter to chip in assembling process.
6. a kind of camera module, it is characterised in that including：
Image sensor chip, described image sensor chip is electrically connected hanging plain conductor, the plain conductor
First end is bonded to the pad of described image sensor chip, and the second end is suspended on described image sensor chip；
Support frame, is provided with optical transmission window, suitable for being assembled into a packaging part with image sensor chip；
Camera lens module, suitable for being assemblied in the support frame in packaging part；
Circuit board, the circuit board is electrically connected with the packaging part by the second end of the plain conductor.
7. camera module as claimed in claim 6, it is characterised in that the plain conductor formation elastic construction and the gold
The second end for belonging to wire is less than 5 microns to 300 microns of described image sensor chip lower surface.
8. camera module as claimed in claim 6, it is characterised in that the second end of the plain conductor and the circuit board
It is electrically connected by welding manner, the pressing way of contact, ultrasonic bond mode, conducting resinl bonding mode.
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| CN201710388252.XA CN107301988B (en) | 2017-05-27 | 2017-05-27 | Camera module and assembly method thereof |
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| CN201710388252.XA CN107301988B (en) | 2017-05-27 | 2017-05-27 | Camera module and assembly method thereof |
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| CN109904699A (en) * | 2017-12-11 | 2019-06-18 | 格科微电子（上海）有限公司 | The electrical connection methods of camera module |
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| CN112930598A (en) * | 2018-08-27 | 2021-06-08 | 荣耀终端有限公司 | Photosensitive chip packaging structure, camera module and mobile terminal |
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