CN205621732U - Many cameras module - Google Patents
Many cameras module Download PDFInfo
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- CN205621732U CN205621732U CN201521026904.8U CN201521026904U CN205621732U CN 205621732 U CN205621732 U CN 205621732U CN 201521026904 U CN201521026904 U CN 201521026904U CN 205621732 U CN205621732 U CN 205621732U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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Abstract
The utility model provides a many cameras module, include: a plurality of image sensor chips, image sensor chip electrical connection has unsettled plain conductor, plain conductor's first end link fits the pad of image sensor chip, second end unsettled in the image sensor chip, lens cone frame, lens cone frame are whole being suitable for and assemble multiunit camera lens module and a plurality of image sensor chip, the lens cone frame with the assembly of image sensor chip forms the standard component, wherein the photosurface of a plurality of image sensor chips is parallel respectively, no inclination, the circuit board, the circuit board with the standard component passes through plain conductor's second end electrical connection.
Description
Technical field
This utility model relates to field of semiconductor manufacture, particularly relates to a kind of multi-cam module.
Background technology
At present, the method for packing of the imageing sensor (CIS:CMOS Image Sensor) of main flow includes: wafer-level package (Chip Scale Package, CSP), integration packaging (Chip On Board on plate, and Flip-Chip Using (Flip Chip, FC) COB).
CISCSP is that one is commonly utilized in low and middle-end, the encapsulation technology of low pixel (2M pixel or following) imageing sensor at present, can use Die level (chip-scale) or Wafer level (wafer scale) encapsulation technology.This encapsulation technology generally uses wafer scale glass and wafer bonding and uses cofferdam to separate between the image sensor chip of wafer, the welding disking area of wafer the most after grinding is by the T-shaped metal contact chip scale packaging techniques of pad side after making bond pad surface or the silicon puncturing technique (TSV:Through Silicon Via) of endoporus side, pad face ring metal connection or cutting, and after wafer rear extended link, make solder ball grid array (BGA:Ball Grid Array), then form the image sensor cell of single sealing cavity after cutting.Rear end forms module assembled structure by the method for SMT.But, CSP encapsulation has a problem will be apparent below: 1 affect properties of product: the support glass of thickness to the absorption of light, reflect, reflect and scatter the performance to imageing sensor especially small pixel size product and have a very big impact；2 integrity problems: seal the gas SMT technique below in the thermal expansion coefficient difference between component in encapsulating structure and cavity or product uses in the change of environment and integrity problem occurs；3 scales of investment are big, environment pollution control requires big, and the production cycle is longer, and unit chip is relatively costly particularly with high pixel large-size images product sensor.
CIS COB encapsulation is Die Level (chip-scale) encapsulation technology that one is commonly utilized in pixel product high-end, high (5M pixel or more than) imageing sensor at present.This encapsulation technology uses bond wire wire the chip back bonding after ground cutting on the pad of pcb board, loads onto support and the camera lens with IR sheet glass, is formed and assembles modular structure.But, COB encapsulates problem will be apparent below: 1, micronic dust controls extremely difficult, needs the proper clean room grade of superelevation, manufactures and maintains cost high；2, product design customization, cycle length, flexibility ratio are inadequate；3 are not easy large-scale production；
Die Level (chip-scale) encapsulation technology of pixel high-end, high that CIS FC encapsulation is risen recently (5M pixel or more than) imageing sensor.This encapsulation technology is directly attached the chip bonding pad carrying out the gold element ground cutting of projection at pad by the disposable all contact tabs of effect that heat is ultrasonic with the pad of PCB with pad, forms encapsulating structure.Rear end uses the method for SMT to form module assembled structure by the pad outside PCB or stannum ball.But, FC encapsulates problem will be apparent below: PCB substrate is required the highest by 1 this encapsulation, has close thermal coefficient of expansion with Si, and cost is the highest；2 manufacture reliability difficulty very greatly, and the coherence request that the ultrasonic all projections of heat are connected with pad is the highest, and projection and pad Hard link, ductility is bad；3 micronic dusts control difficulty are big, process environments requires height, and cost is the highest；
Additionally, the assembly method of conventional CIS module is:
Step 1, is welded to image sensor chip on circuit board, forms first parts；
Step 2, by camera lens module and sleeve module assembled, forms second parts；
First parts and second parts are assembled, thus form a complete photographic head module by step 3.
The assembly method of this kind of photographic head module has the disadvantage that for photographic head module, need the accurate installation using high-accuracy installation equipment just can carry out above-mentioned steps 3, otherwise will have influence on the imaging effect of photographic head module, and then the product qualified rate of the photographic head module being assembled is the highest；Photographic head module especially for high pixel, common installation equipment is used to be difficult to preferably complete the accurate installation of above-mentioned steps 3, the imaging effect making the photographic head module of high pixel is a greater impact, the image quality of become image is poor, and the especially image quality of image surrounding is the most bad.
And, in the image sensor chip packaging technology using plain conductor bonding, the most first by image sensor chip die bond (such as adhering to) to keyset (flexible PCB), then carry out being bonded bonding wire, first end of plain conductor is connected on the pad of image sensor chip, second end is connected on keyset, it is achieved in the electrical connection of image sensor chip and keyset, the most again the image sensor chip after encapsulation is connected on circuit board by the lead-in wire on keyset or stannum ball.
The configuration flexibility that existing wire bonding method easily causes after encapsulation is poor, and the follow-up assembly precision of photographic head module requires height, and camera lens is difficult to control to affect the performance of photographic head module with the relative position of image sensor chip；And owing to the most methodical flow process is longer, packaging efficiency is relatively low, cause the image sensor chip long period to be exposed in air, need detection repeatedly and cleaning, reduce yields, increase the cost of photographic head module.Especially, the image sensor chip that other techniques are attached is used for some plain conductor second ends, needing a kind of new bonding method and device, so that the first end of wire is connected to the pad of image sensor chip, the second end is suspended on outside image sensor chip.
Additionally, making rapid progress along with consumption electronic product, it is adaptable to the single camera of portable electron device is existing defects on part segments market, and focusing ability, dynamic equilibrium have been difficult in adapt to demand the most.Portable electron device has occurred in that multi-cam module, multi-cam module has been supplied in the main photographic head of smart mobile phone, but the photosurface that can there is image sensor chip in the assembling of multi-cam module does not lines up, there are height and the problem of misalignment angle, an insurmountable difficult problem can be brought in follow-up imaging process.
In sum, the assembly method of new multi-cam module is to need in the industry the problem of searching badly.
Utility model content
Based on considerations above,
This utility model provides a kind of multi-cam module, it is characterised in that including:
Multiple image sensor chips, described image sensor chip is electrically connected unsettled plain conductor, and the first terminal link of described plain conductor is suspended on described image sensor chip together in the pad of described image sensor chip, the second end；
Lens barrel framework, lens barrel framework is that an entirety is suitable to assemble many group camera lens modules and multiple image sensor chip, and described lens barrel framework and described image sensor chip are assembled to form standard component；The photosurface of wherein said multiple image sensor chip is the most parallel, without angle of inclination；
Circuit board, described circuit board is electrically connected by the second end of described plain conductor with described standard component.
Preferably, the plurality of image sensor chip photosurface alignment.
Preferably, described plain conductor forms the second end of elastic construction and described plain conductor less than described image sensor chip lower surface 5 microns to 300 microns.
Preferably, the second end of described plain conductor is connected by the pressing way of contact, rapid welding mode, conducting resinl bonding mode or non-conductive adhesive bonding mode with described circuit board.
The assembly method of multi-cam module of the present utility model uses common installation equipment just accurately can assemble multi-cam module, overcome the assembly method of multi-cam module in prior art and need to use the deficiency of high-precision installation equipment, assembly method of the present utility model is simple, it is prone to adjust image sensor chip to the focal plane of camera lens, it is prone to correct camera lens and the gradient of image sensor chip, optical property after having assembled with guarantee multi-cam module, installation step of the present utility model makes described proud photographic head module have high-quality imaging effect, photographic head module especially for high pixel, the image quality that can make its image surrounding significantly improves.
This utility model is by forming unsettled plain conductor by the chip of imageing sensor by bond wire wire, and further holistic lens barrel framework is assembled with multiple image sensor chips, it is electrically connected with circuit board by the free end of plain conductor again, and plain conductor is elastic construction, elastic deformation can occur, can preferably improve electric property, pad, BGA and scolding tin three SMT connection than traditional C/S P have more process advantage；And lens barrel framework is that an entirety can assemble multiple image sensor chip, the photosurface alignment of multiple image sensor chips, improves assembly precision and the performance of module of multi-cam module.
This utility model uses gold thread to be directly connected to chip and PCB substrate pad, and gold thread ductility is good, and environmental suitability is strong, of good reliability.Lens barrel framework of the present utility model can form open architecture, effective minimizing light veiling glare in photographic head module, it is provided that module performance with image sensor chip..
By the forming method of this multiple image sensor module, can guarantee that the location between imageing sensor and assembly precision, it is to avoid not the lining up of imageing sensor photosurface, angular deviation, it is to avoid multiple image sensor module causes imaging performance to decline because of assembly precision.
Explanation by embodiment in detail below is become apparent from by various aspects of the present utility model.
Accompanying drawing explanation
Reading the following detailed description to non-limiting example by referring to accompanying drawing, other features, objects and advantages of the present utility model will become more apparent upon.
Fig. 1 is the schematic diagram of the image sensor chip with unsettled plain conductor according to this utility model embodiment；
Fig. 2 is the schematic diagram of the standard component according to this utility model embodiment；
Fig. 3 is the schematic diagram of the photographic head module according to this utility model embodiment；
Fig. 4 is the flow chart of the assembly method according to photographic head module of the present utility model.
In the drawings, running through different diagrams, same or similar reference represents same or analogous device (module) or step.
Detailed description of the invention
In the specific descriptions of following preferred embodiment, by with reference to constituting the accompanying drawing appended by this utility model part.Appended accompanying drawing has been illustrated by way of example and has been capable of specific embodiment of the present utility model.The embodiment of example is not intended as limit according to all embodiments of the present utility model.It is appreciated that on the premise of without departing from scope of the present utility model, it is possible to use other embodiments, it is also possible to carry out the structural or amendment of logicality.Therefore, following specific descriptions are the most nonrestrictive, and scope of the present utility model is defined by the claims appended hereto.
In order to more clearly illustrate method for packing of the present utility model, in the following embodiments, use glass as substrate.It will be appreciated to those of skill in the art that substrate can also be made up of other transparent material.
Fig. 1 is the schematic diagram of the image sensor chip with unsettled plain conductor according to this utility model embodiment；Fig. 2 is the schematic diagram of the standard component according to this utility model embodiment；Fig. 3 is the schematic diagram of the photographic head module according to this utility model embodiment；Fig. 4 is the flow chart of the assembly method of the photographic head module according to this utility model embodiment.
As shown in Figure 4, and please also refer to this method for packing of Fig. 1 to Fig. 3 and comprise the following steps:
S10: providing multiple image sensor chips 110 with unsettled plain conductor 120, the first end 121 of described plain conductor 120 is bonded to the pad 111 of described image sensor chip 110, and the second end 122 is suspended on described image sensor chip 110；
In this step, there are image sensing district 112, and the welding disking area 113 around image sensing district 112 in the front of image sensor chip 110, and welding disking area 113 includes some pads 111.In this step, the second end of plain conductor 120 is unsettled is not bonded mutually with any medium, and plain conductor is that gold thread, silver wire, copper cash etc. have good wire performance, and is elastic construction, and elastic deformation can occur when active force is in the second end 122；
Please also refer to Fig. 2, step S20: provide lens barrel framework 131, described lens barrel framework 131 is that an entirety is suitable to assemble many group camera lens modules 132 and multiple image sensor chip 110；
Step S30: the plurality of image sensor chip 110 and lens barrel framework 131, camera lens module 132 are assembled to form standard component 200, then by the second end of described plain conductor 120, described standard component 200 are assembled to form photographic head module 400 with circuit board 300.
In this step, there is the image sensor chip 110 of unsettled plain conductor and lens barrel framework 131 (installation frame) and the camera lens module 132 being positioned at lens barrel lower portion, the inner surface of lens barrel framework 131 also has step 1311 in one embodiment, step 1311 is arranged towards one end of image sensor chip 110 corresponding to camera lens 132, be suitable to assemble a base plate for packaging 140, base plate for packaging 140 is glass material, plastic material, and the surface of base plate for packaging 140 is coated with IR film or AR film；It is not provided with step 1311 and base plate for packaging 140 in another embodiment, directly covers IR film or AR film at camera lens 132 near the surface in image sensing district 112.
After the assembling completing standard component 200, by the second end 122 pressing way of contact, rapid welding mode, conducting resinl bonding mode or the non-conductive adhesive bonding mode of plain conductor, standard component 200 and circuit board 300 are assembled to form photographic head module 400.
Concrete, use the pressing way of contact then by the second end 122 and pad 310 good contact on circuit board 300 in the first embodiment, standard component 200 by buckle or bonding by the way of fix with the subregion of circuit board 300.
In a second embodiment, using rapid welding mode, concrete mode is: plate one layer of gold-tin alloy weld layer on the second end 122 of plain conductor or the pad 310 of circuit board 300, by local rapid welding, control the heat conduction of welding region, not affect the performance of lens assembly；
(1) pad gold-plated ashbury metal mode: S201 provides photographic head module, and described photographic head module includes thermally sensitive camera lens, and described photographic head module also includes the plain conductor being electrically connected with image sensor chip that one end is unsettled；S203 provides the circuit board with some pads；The pad of circuit board described in S205 attached solder layer in advance, carries out rapid welding to the pad of plain conductor free end Yu circuit board.Plain conductor is gold thread, and the diameter of gold thread is more than or equal to 10 microns, and solder layer is tin layers, and by controlling the thickness of tin layers so that in follow-up quick local welding, gold thread and tin layers can form the gold-tin alloy weld layer that stable gold content is higher.In an other embodiment: the step of the pad of circuit board attached solder layer in advance also includes: S206 uses typography to form solder layer with attached solder on the pad of circuit board, Reflow Soldering.In another embodiment, the step of the pad of circuit board attached solder layer in advance also includes: S206 ' uses solder wave process attached solder layer on the pad of circuit board.In one embodiment, the method for the thickness controlling tin layers includes: control the parameter of solder wave process so that tin thickness is less than gold thread diameter.In another embodiment, the method for the thickness controlling tin layers includes: using typography to adhere to tin cream on the pad of circuit board, Reflow Soldering forms tin layers, uses air knife mode, suction gun absorption mode or soldering tip adherent fashion that tin thickness is less than and carries out thickness.Tin thickness is less than gold wire thickness, and gold-tin alloy, in welding process, has good material advantage, can reduce brilliant crisp, have good fluidity, and resistivity is low, the feature that heat conductivity is good.Rapid welding includes: pulse heat bond technology, laser welding process, ultrasonic thermocompression Welding, and rapid welding is local welding mode, and heated perimeter is less than the 1/2 of described photographic head module bottom area.
(2) the gold-plated ashbury metal mode of plain conductor the second end 122, S101 provides photographic head module, described photographic head module includes thermally sensitive camera lens, and described photographic head module also includes the plain conductor being electrically connected with image sensor chip that one end is unsettled；S103 provides the circuit board with some pads；The free end of plain conductor described in S105 attached solder layer in advance, carries out rapid welding to the pad of plain conductor free end Yu circuit board.Plain conductor is gold thread, and the diameter of gold thread is more than or equal to 10 microns, and solder layer is tin layers, by controlling the thickness of tin layers, making in follow-up quick local welding, gold thread and tin layers can form the gold-tin alloy weld layer of stable gold content higher (Fu Jin), and wherein tin thickness is less than gold wire thickness, gold-tin alloy is in welding process, there is good material advantage, can reduce brilliant crisp, there is good fluidity, resistivity is low, the feature that heat conductivity is good.Rapid welding includes: pulse heat bond technology, laser welding process, ultrasonic thermocompression Welding, and rapid welding is local welding mode, and heated perimeter is less than the 1/2 of described photographic head module bottom area.
In the third embodiment, using conducting resinl bonding mode, the free end of concrete plain conductor adheres to conducting resinl in advance, and conducting resinl be that silver is starched in the present embodiment, the pad of plain conductor free end with circuit board is carried out solidification and is electrically connected.Due to silver slurry there is good cohesive, electric conductivity may be used for doing point electrode slurry, still has good performance according to controlled after hardening.Plain conductor is gold thread, and the diameter of gold thread is more than or equal to 5 microns, and the thickness of silver slurry is 2 microns to 100 microns.Curing mode uses the mode of heat cure or UV solidification to carry out.In the present embodiment, the composition of silver slurry is: epoxide-resin glue or UV glue, and the mixture of small silver strip, and the thickness of silver slurry is: 2 microns to 100 microns.Additionally can use: the pad of circuit board adheres to silver slurry in advance, solidifies the pad of plain conductor free end with circuit board and is electrically connected.Due to silver slurry there is good cohesive, electric conductivity may be used for doing point electrode slurry, still has good performance according to controlled after hardening.Plain conductor is gold thread, and the diameter of gold thread is more than or equal to 5 microns, and the thickness of silver slurry is 2 microns to 100 microns.Curing mode uses the mode of heat cure or UV solidification to carry out.In the present embodiment, the composition of silver slurry is: epoxide-resin glue or UV glue, and the mixture of small silver strip, and the thickness of silver slurry is: 2 microns to 100 microns.In the present embodiment, conducting resinl also can use other metal materials with electric conductivity.
In the fourth embodiment, non-conductive adhesive bonding mode can be used, but plain conductor the second end 122 need to have good electrical contact with the pad of circuit board.
After forming standard component 200, standard component 200 can also be tested, during the testing electrical property of described standard component 200, the elastic construction generation elastic deformation of described plain conductor 120 is to provide contact pressure, owing to the second end 122 of plain conductor (refers to Fig. 1 less than described image sensor chip 110 lower surface 5 microns to 300 microns, distance, for h), improves the switching performance of plain conductor 120 and test device (mark)；And during being the assembling of described standard component 200 and circuit board 300, the elastic construction generation elastic deformation of described plain conductor 120 is to provide contact pressure, owing to the second end 122 of plain conductor (refers to Fig. 1 less than described image sensor chip 110 lower surface 5 microns to 300 microns, distance, for h), can improve the switching performance of plain conductor and circuit board.Refer to Fig. 4, in Fig. 4 dotted line 120 ' show when not assembling with circuit board 300 for standard component 200, the first shape state of plain conductor 120；Solid line 120 " show assemble for standard component 200 and circuit board 300 after; the second shape state of plain conductor; now the second shape state generation elastic deformation of plain conductor; the second end of plain conductor is the best with contacting of pad; the beneficially transmission of signal, now the second end and contact pads area are more than or equal to 0.01 square millimeter.
This utility model also provides for a kind of multi-cam module, including: multiple image sensor chips, described image sensor chip is electrically connected unsettled plain conductor, first terminal link of described plain conductor is suspended on described image sensor chip together in the pad of described image sensor chip, the second end；Lens barrel framework, lens barrel framework is that an entirety is suitable to assemble many group camera lens modules and multiple image sensor chip, and described lens barrel framework and described image sensor chip are assembled to form standard component；The photosurface of wherein said multiple image sensor chip is the most parallel, without angle of inclination；Circuit board, described circuit board is electrically connected by the second end of described plain conductor with described standard component.
The plurality of image sensor chip photosurface aligns.Described plain conductor forms the second end of elastic construction and described plain conductor less than described image sensor chip lower surface 5 microns to 300 microns.Second end of plain conductor is connected by the pressing way of contact, rapid welding mode, conducting resinl bonding mode or non-conductive adhesive bonding mode with described circuit board.
It is obvious to a person skilled in the art that this utility model is not limited to the details of above-mentioned one exemplary embodiment, and in the case of without departing substantially from spirit or essential attributes of the present utility model, it is possible to realize this utility model in other specific forms.Therefore, in any case from the point of view of, embodiment all should be regarded as exemplary, and be nonrestrictive.Additionally, it will be evident that " an including " word is not excluded for other elements and step, and wording " one " is not excluded for plural number.In device claim, multiple elements of statement can also be realized by an element.The first, the second word such as grade is used for representing title, and is not offered as any specific order.
Claims (4)
1. a multi-cam module, it is characterised in that including:
Multiple image sensor chips, described image sensor chip is electrically connected unsettled plain conductor, and the first terminal link of described plain conductor is suspended on described image sensor chip together in the pad of described image sensor chip, the second end；
Lens barrel framework, lens barrel framework is that an entirety is suitable to assemble many group camera lens modules and multiple image sensor chip, and described lens barrel framework and described image sensor chip are assembled to form standard component；The photosurface of wherein said multiple image sensor chip is the most parallel, without angle of inclination；
Circuit board, described circuit board is electrically connected by the second end of described plain conductor with described standard component.
2. multi-cam module as claimed in claim 1, it is characterised in that the plurality of image sensor chip photosurface aligns.
3. multi-cam module as claimed in claim 1, it is characterised in that described plain conductor forms the second end of elastic construction and described plain conductor less than described image sensor chip lower surface 5 microns to 300 microns.
4. multi-cam module as claimed in claim 1, it is characterised in that the second end of described plain conductor is connected by the pressing way of contact, rapid welding mode, conducting resinl bonding mode or non-conductive adhesive bonding mode with described circuit board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521026904.8U CN205621732U (en) | 2015-12-10 | 2015-12-10 | Many cameras module |
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| CN201521026904.8U CN205621732U (en) | 2015-12-10 | 2015-12-10 | Many cameras module |
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| CN205621732U true CN205621732U (en) | 2016-10-05 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633108A (en) * | 2015-12-10 | 2016-06-01 | 格科微电子（上海）有限公司 | Multi-camera module and assembling method therefor |
| TWI768128B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI768103B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module、system and manufacturing method thereof |
| TWI768125B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI768105B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, system and manufacturing method thereof |
| TWI768127B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, optical image system and optical image capturing manufacture method |
| TWI768106B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module、system and manufacturing method thereof |
| TWI768102B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, system and manufacturing method thereof |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
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- 2015-12-10 CN CN201521026904.8U patent/CN205621732U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105633108A (en) * | 2015-12-10 | 2016-06-01 | 格科微电子（上海）有限公司 | Multi-camera module and assembling method therefor |
| CN105633108B (en) * | 2015-12-10 | 2024-04-12 | 格科微电子（上海）有限公司 | Multi-camera module and assembly method thereof |
| TWI768103B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module、system and manufacturing method thereof |
| TWI768105B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, system and manufacturing method thereof |
| TWI768106B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module、system and manufacturing method thereof |
| TWI768102B (en) * | 2018-08-16 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, system and manufacturing method thereof |
| TWI768128B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI768125B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI768127B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, optical image system and optical image capturing manufacture method |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
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Effective date of registration: 20170930 Address after: Jiaxing City, Zhejiang province 314000 Jiashan Huimin street 1 Building 2 Taisheng Road No. 111 building 201 room Patentee after: Galaxycore Microelectronics (Zhejiang) Co., Ltd. Address before: 201203 floor, building No. 560, Pudong New Area, Shanghai, summer road, No. 2, building 11 Patentee before: Galaxycore Microelectronics (Shanghai) Co., Ltd. |