CN205231060U - Testing arrangement of camera module - Google Patents
Testing arrangement of camera module Download PDFInfo
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- CN205231060U CN205231060U CN201520913183.6U CN201520913183U CN205231060U CN 205231060 U CN205231060 U CN 205231060U CN 201520913183 U CN201520913183 U CN 201520913183U CN 205231060 U CN205231060 U CN 205231060U
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- camera module
- testing apparatus
- plain conductor
- image sensor
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Abstract
The utility model provides a testing arrangement of camera module. Wherein, the camera module includes image sensor chip and a plurality of plain conductor, plain conductor's first end with the image sensor chip links to each other, plain conductor's second end unsettled in the image sensor chip, testing arrangement includes a plurality of test points, the test point be suitable for with plain conductor's second termination touches and carries out electrical test. The utility model discloses a testing arrangement of camera module is applicable to the camera module that has unsettled plain conductor, utilizes unsettled plain conductor's elasticity, forms certain contact force between plain conductor's free end and testing arrangement's test point, reduces contact resistance, realizes image sensor chip and the electric connection who surveys test panel to carry out electrical test to the module.
Description
Technical field
The utility model relates to field of semiconductor manufacture, particularly relates to a kind of testing apparatus of camera module.
Background technology
At present, the method for packing of the imageing sensor (CIS:CMOSImageSensor) of main flow comprises: integration packaging (ChipOnBoard, COB) and Flip-Chip Using (FlipChip, FC) on wafer-level package (ChipScalePackage, CSP), plate.
CISCSP is a kind of encapsulation technology being generally applied in low and middle-end, low pixel (2M pixel or following) imageing sensor at present, can adopt Dielevel(chip-scale) or Waferlevel(wafer scale) encapsulation technology.This encapsulation technology usually uses wafer scale glass and wafer bonding and uses cofferdam to separate between the image sensor chip of wafer, then the welding disking area of wafer is after grinding by the T-shaped Metal Contact chip size packages technology of pad side after the silicon puncturing technique (TSV:ThroughSiliconVia) that makes bond pad surface or endoporus side, pad face ring metal and connect or cutting, and after wafer rear extended link, make solder ball grid array (BGA:BallGridArray), then form the image sensor cell of single sealed cavity after cutting.Rear end forms module assembled structure by the method for SMT.But CSP encapsulation has following significantly problem: 1 affects properties of product: thick support glass has a great impact the absorption of light, refraction, reflection and the performance tool of scattering to imageing sensor especially small pixel size product; 2 integrity problems: in the thermal expansion coefficient difference between the component in encapsulating structure and cavity the SMT technique of sealing gas below or product environment for use change in there is integrity problem; 3 scales of investment are large, environment pollution control requires large, and the production cycle is longer, and unit chip cost is higher especially for high pixel large-size images product sensor.
CISCOB encapsulation is a kind of DieLevel(chip-scale being generally applied in high-end, high pixel product (5M pixel or more) imageing sensor at present) encapsulation technology.This encapsulation technology uses bond wire wire the chip back bonding after grinding and cutting on the pad of pcb board, loads onto the support and camera lens with IR sheet glass, forms Knockdown block structure.But, the following significantly problem of COB encapsulation: 1, micronic dust controls very difficult, needs the proper clean room grade of superelevation, manufactures carrying cost high; 2, product design customizes, the cycle is long, flexibility ratio is inadequate; 3 are not easy large-scale production;
The DieLevel(chip-scale of high-end, high pixel (the 5M pixel or more) imageing sensor that CISFC encapsulation is risen recently) encapsulation technology.This encapsulation technology is directly connected with pad by the disposable all contact tabs of effect that heat is ultrasonic with the pad of PCB carrying out the chip bonding pad of golden plain projection through grinding and cutting at pad, forms encapsulating structure.Rear end adopts the method for SMT to form module assembled structure by the pad outside PCB or tin ball.But, the following significantly problem of FC encapsulation: 1 this encapsulation requires very high to PCB substrate, and have close thermal coefficient of expansion with Si, cost is very high; 2 fabrication reliability difficulty are very large, and the coherence request that the ultrasonic all projections of heat are connected with pad is very high, projection and pad Hard link, and ductility is bad; 3 micronic dusts control difficulty are large, process environments requires high, and cost is very high.
In the image sensor chip packaging technology of traditional employing plain conductor bonding, usually first by image sensor chip die bond (such as adhering to) on keyset (flexible PCB), then bonding bonding wire is carried out, the first end of plain conductor is connected on the pad of image sensor chip, second end is connected on keyset, realize the electrical connection of image sensor chip and keyset thus, and then the image sensor chip after encapsulation is connected on circuit board by the lead-in wire on keyset or tin ball.Existing wire bonding method easily causes the configuration flexibility after encapsulation poor, and the follow-up assembly precision of camera module requires high, and the relative position of camera lens and image sensor chip is difficult to the performance of control effect camera module; And because now methodical flow process is longer, packaging efficiency is lower, causes the image sensor chip long period to be exposed in air, need detection repeatedly and cleaning, reduce yields, increase the cost of camera module.
Especially, other techniques are adopted to carry out the image sensor chip connected for some plain conductor second ends, need to adopt new bonding method and bonding apparatus to form a kind of camera module with unsettled plain conductor, this camera module comprises image sensor chip and some plain conductors, the first end of plain conductor is connected with image sensor chip, and the second end of plain conductor is suspended on image sensor chip.Before this camera module and circuit board are assembled, usually need to carry out testing electrical property to this camera module, to ensure module product quality.Therefore need a kind of testing apparatus being applicable to have the camera module of unsettled plain conductor badly, to reduce contact resistance, realize the electric connection of image sensor chip and test board, thus testing electrical property is carried out to module.
Utility model content
The purpose of this utility model is the testing apparatus providing a kind of camera module, is applicable to the camera module with unsettled plain conductor, reduces contact resistance, realizes the electric connection of image sensor chip and test board, thus carry out testing electrical property to module.
Based on above consideration, the utility model provides a kind of testing apparatus of camera module, described camera module comprises image sensor chip and some plain conductors, the first end of described plain conductor is connected with described image sensor chip, and the second end of described plain conductor is suspended on described image sensor chip; Described testing apparatus comprises some test points, and described test point is suitable for carrying out testing electrical property with the second end in contact of described plain conductor.
Preferably, described testing apparatus comprises test board and is arranged at the some pads on described test board, and described test point is positioned on described pad.
Preferably, described pad is fixedly connected on described test board.
Preferably, on described test board, corresponding position peripheral with the installation frame of described camera module is provided with bulge-structure.
Preferably, described testing apparatus comprises test board and is arranged at the some probes on described test board, and described test point is positioned on described probe.
Preferably, described probe elasticity is connected on described test board.
Preferably, on described test board, corresponding position peripheral with the installation frame of described camera module is provided with bulge-structure.
Preferably, described test board is provided with groove, described probe is arranged in described groove.
The testing apparatus of camera module of the present utility model, be applicable to the camera module with unsettled plain conductor, utilize the elasticity of unsettled plain conductor, certain contact is formed between the free end and the test point of testing apparatus of plain conductor, reduce contact resistance, realize the electric connection of image sensor chip and test board, thus testing electrical property is carried out to module.
Accompanying drawing explanation
Read the following detailed description to non-limiting example by referring to accompanying drawing, other features, objects and advantages of the present utility model will become more obvious.
Fig. 1 uses the testing apparatus of camera module of the present utility model to carry out the method flow diagram tested;
Fig. 2-Fig. 5 is the process schematic that use is carried out according to the testing apparatus of the utility model embodiment 1 testing;
Fig. 6-Fig. 9 is the process schematic that use is carried out according to the testing apparatus of the utility model embodiment 2 testing.
In the drawings, run through different diagrams, same or similar Reference numeral represents same or analogous device (module) or step.
Embodiment
In the specific descriptions of following preferred embodiment, with reference to the accompanying drawing formed appended by the utility model part.Appended accompanying drawing shows by way of example and can realize specific embodiment of the present utility model.The embodiment of example is not intended to limit according to all embodiments of the present utility model.Be appreciated that under the prerequisite not departing from scope of the present utility model, other embodiments can be utilized, also can carry out amendment that is structural or logicality.Therefore, following specific descriptions are also nonrestrictive, and scope of the present utility model limited by appended claim.
As shown in Figure 1, the method using the testing apparatus of camera module of the present utility model to carry out testing comprises the steps:
S1: camera module is provided, described camera module comprises image sensor chip and some plain conductors, and the first end of described plain conductor is connected with described image sensor chip, and the second end of described plain conductor is suspended on described image sensor chip;
S2: testing apparatus is provided, described testing apparatus comprises some test points;
S3: make the test point of testing apparatus described in the second end in contact of described plain conductor carry out testing electrical property.
Below in conjunction with specific embodiment, the utility model is described in detail.
embodiment 1
The present embodiment provides a kind of testing apparatus 120 of camera module, as shown in Figure 3.Some pads 122 that this testing apparatus 120 comprises test board 121 and is arranged on described test board 121, described pad 122 has test point.Preferably, described pad 122 is fixedly connected on described test board 121.In addition, on test board 121, corresponding position peripheral with the installation frame 114 of camera module 110 is provided with bulge-structure 125, for limiting the position of camera module 110.
Fig. 2-Fig. 5 is the process schematic that use is carried out according to the testing apparatus of the present embodiment testing, and specifically comprises the steps:
S1: provide camera module 110, as shown in Figure 2.This camera module 110 comprises image sensor chip 112 and some plain conductors 111, the first end of described plain conductor 111 is connected with described image sensor chip 112, second end of described plain conductor 111 is suspended on described image sensor chip 112, not with any medium phase bonding, plain conductor 111 can be gold thread, silver-colored line, copper cash etc., there is good electric conductivity, and be elastic construction, active force in the second end time can there is elastic deformation.In addition, camera module 110 also comprises installation frame 114 and the camera lens 115 be arranged in installation frame 114 and sheet glass 113.
S2: provide testing apparatus 120, as shown in Figure 3.Some pads 122 that this testing apparatus 120 comprises test board 121 and is arranged on described test board 121, described pad 122 has test point.Preferably, described pad 122 is fixedly connected on described test board 121.In addition, on test board 121, corresponding position peripheral with the installation frame 114 of camera module 110 is provided with bulge-structure 125, for limiting the position of camera module 110.
S3: make the test point of testing apparatus 120 described in the second end in contact of described plain conductor 111 to form electric connection, as shown in Figure 4, Figure 5.When camera module 110 and testing apparatus 120 close to each other time, by the bulge-structure 125 making installation frame 114 periphery of camera module 110 be contained in testing apparatus 120, the second end of plain conductor 111 is made to correspond to the pad 122 of testing apparatus 120, as shown in Figure 4.When applying pressure force close to each other further to camera module 110 and testing apparatus 120, because plain conductor 111 is elastic construction, elastic deformation can be there is under pressure force effect, as shown in Figure 5, thus certain contact is formed between second end and the test point of pad 122 of plain conductor 111, reduce contact resistance (being usually less than 1 ohm), realize the electric connection of image sensor chip and test board, thus testing electrical property is carried out to module.
embodiment 2
The present embodiment provides a kind of testing apparatus 220 of camera module, as shown in Figure 7.Some probes 222 that this testing apparatus 220 comprises test board 221 and is arranged on described test board 221, described probe 222 has test point.Preferably, test board 221 is provided with groove 224, probe 222 is arranged in groove 224 and is connected to test board 221 by flexible member 223 elasticity.In addition, on test board 221, corresponding position peripheral with the installation frame 214 of camera module 210 is provided with bulge-structure 225, for limiting the position of camera module 210.
Fig. 6-Fig. 9 is the process schematic that use is carried out according to the testing apparatus of the present embodiment testing, and specifically comprises the steps:
S1: provide camera module 210, as shown in Figure 6.This camera module 210 comprises image sensor chip 212 and some plain conductors 211, the first end of described plain conductor 211 is connected with described image sensor chip 212, second end of described plain conductor 211 is suspended on described image sensor chip 212, not with any medium phase bonding, plain conductor 211 can be gold thread, silver-colored line, copper cash etc., there is good electric conductivity, and be elastic construction, active force in the second end time can there is elastic deformation.In addition, camera module 210 also comprises installation frame 214 and the camera lens 215 be arranged in installation frame 214 and sheet glass 213.
S2: provide testing apparatus 220, as shown in Figure 7.Some probes 222 that this testing apparatus 220 comprises test board 221 and is arranged on described test board 221, described probe 222 has test point.Preferably, test board 221 is provided with groove 224, probe 222 is arranged in groove 224 and is connected to test board 221 by flexible member 223 elasticity.In addition, on test board 221, corresponding position peripheral with the installation frame 214 of camera module 210 is provided with bulge-structure 225, for limiting the position of camera module 210.
S3: make the test point of testing apparatus 220 described in the second end in contact of described plain conductor 211 to form electric connection, as shown in Figure 8, Figure 9.When camera module 210 and testing apparatus 220 close to each other time, by the bulge-structure 225 making installation frame 214 periphery of camera module 210 be contained in testing apparatus 220, the second end of plain conductor 211 is made to correspond to the pad 222 of testing apparatus 220, as shown in Figure 8.When applying pressure force close to each other further to camera module 210 and testing apparatus 220, under pressure force effect, flexible member 223 compresses, there is elastic deformation in plain conductor 211 simultaneously, as shown in Figure 9, thus form certain contact between second end and the test point of probe 222 of plain conductor 211, reduce contact resistance (being usually less than 1 ohm), realize the electric connection of image sensor chip and test board, thus testing electrical property is carried out to module.
The testing apparatus of camera module of the present utility model, be applicable to the camera module with unsettled plain conductor, utilize the elasticity of unsettled plain conductor, certain contact is formed between the free end and the test point of testing apparatus of plain conductor, reduce contact resistance, realize the electric connection of image sensor chip and test board, thus testing electrical property is carried out to module.
To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, in any case, all should embodiment be regarded as exemplary, and be nonrestrictive.In addition, significantly, " comprising " one word do not get rid of other elements and step, and wording " one " does not get rid of plural number.Multiple elements of stating in device claim also can be realized by an element.First, second word such as grade is used for representing title, and does not represent any specific order.
Claims (8)
1. a testing apparatus for camera module, is characterized in that,
Described camera module comprises image sensor chip and some plain conductors, and the first end of described plain conductor is connected with described image sensor chip, and the second end of described plain conductor is suspended on described image sensor chip;
Described testing apparatus comprises some test points, and described test point is suitable for carrying out testing electrical property with the second end in contact of described plain conductor.
2. the testing apparatus of camera module as claimed in claim 1, is characterized in that, described testing apparatus comprises test board and is arranged at the some pads on described test board, and described test point is positioned on described pad.
3. the testing apparatus of camera module as claimed in claim 2, it is characterized in that, described pad is fixedly connected on described test board.
4. the testing apparatus of camera module as claimed in claim 2, is characterized in that, on described test board, corresponding position peripheral with the installation frame of described camera module is provided with bulge-structure.
5. the testing apparatus of camera module as claimed in claim 1, is characterized in that, described testing apparatus comprises test board and is arranged at the some probes on described test board, and described test point is positioned on described probe.
6. the testing apparatus of camera module as claimed in claim 5, it is characterized in that, described probe elasticity is connected on described test board.
7. the testing apparatus of camera module as claimed in claim 5, is characterized in that, on described test board, corresponding position peripheral with the installation frame of described camera module is provided with bulge-structure.
8. the testing apparatus of camera module as claimed in claim 5, it is characterized in that, described test board is provided with groove, and described probe is arranged in described groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520913183.6U CN205231060U (en) | 2015-11-17 | 2015-11-17 | Testing arrangement of camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520913183.6U CN205231060U (en) | 2015-11-17 | 2015-11-17 | Testing arrangement of camera module |
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| Publication Number | Publication Date |
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| CN205231060U true CN205231060U (en) | 2016-05-11 |
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| CN201520913183.6U Active CN205231060U (en) | 2015-11-17 | 2015-11-17 | Testing arrangement of camera module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390517A (en) * | 2015-11-17 | 2016-03-09 | 格科微电子（上海）有限公司 | Camera module test method and test device |
| CN107359173A (en) * | 2017-06-12 | 2017-11-17 | 格科微电子（上海）有限公司 | The assembly method of imaging sensor module |
| CN109425475A (en) * | 2017-08-22 | 2019-03-05 | 宁波舜宇光电信息有限公司 | Camera module test equipment, system and method |
-
2015
- 2015-11-17 CN CN201520913183.6U patent/CN205231060U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105390517A (en) * | 2015-11-17 | 2016-03-09 | 格科微电子（上海）有限公司 | Camera module test method and test device |
| CN105390517B (en) * | 2015-11-17 | 2023-10-27 | 格科微电子（上海）有限公司 | Testing method and testing device for camera module |
| CN107359173A (en) * | 2017-06-12 | 2017-11-17 | 格科微电子（上海）有限公司 | The assembly method of imaging sensor module |
| CN107359173B (en) * | 2017-06-12 | 2023-01-03 | 格科微电子（上海）有限公司 | Assembling method of image sensor module |
| CN109425475A (en) * | 2017-08-22 | 2019-03-05 | 宁波舜宇光电信息有限公司 | Camera module test equipment, system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170929 Address after: Jiaxing City, Zhejiang province 314000 Jiashan Huimin street 1 Building 2 Taisheng Road No. 111 building 201 room Patentee after: Galaxycore Microelectronics (Zhejiang) Co., Ltd. Address before: 201203 floor, building No. 560, Pudong New Area, Shanghai, summer road, No. 2, building 11 Patentee before: Galaxycore Microelectronics (Shanghai) Co., Ltd. |
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| TR01 | Transfer of patent right |