CN107275465B - Led封装及其制作方法 - Google Patents
Led封装及其制作方法 Download PDFInfo
- Publication number
- CN107275465B CN107275465B CN201710514855.XA CN201710514855A CN107275465B CN 107275465 B CN107275465 B CN 107275465B CN 201710514855 A CN201710514855 A CN 201710514855A CN 107275465 B CN107275465 B CN 107275465B
- Authority
- CN
- China
- Prior art keywords
- graphene oxide
- fluororesin
- sealant
- led
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Abstract
Description
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710514855.XA CN107275465B (zh) | 2017-06-29 | 2017-06-29 | Led封装及其制作方法 |
PCT/CN2017/112235 WO2019000815A1 (zh) | 2017-06-29 | 2017-11-22 | Led封装及其制作方法 |
US16/145,222 US10636949B2 (en) | 2017-06-29 | 2018-09-28 | LED package and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710514855.XA CN107275465B (zh) | 2017-06-29 | 2017-06-29 | Led封装及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107275465A CN107275465A (zh) | 2017-10-20 |
CN107275465B true CN107275465B (zh) | 2019-01-04 |
Family
ID=60070512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710514855.XA Active CN107275465B (zh) | 2017-06-29 | 2017-06-29 | Led封装及其制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10636949B2 (zh) |
CN (1) | CN107275465B (zh) |
WO (1) | WO2019000815A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107275465B (zh) * | 2017-06-29 | 2019-01-04 | 华中科技大学鄂州工业技术研究院 | Led封装及其制作方法 |
CN109037404B (zh) * | 2018-08-01 | 2019-06-18 | 广东旭宇光电有限公司 | 植物萌芽照射二极管及其制备方法和植物萌芽照射灯 |
CN111029452B (zh) * | 2019-12-10 | 2022-04-19 | 宁波安芯美半导体有限公司 | 一种紫外发光二极管封装结构及其封装方法、和紫外灯 |
CN113659059A (zh) * | 2021-07-09 | 2021-11-16 | 深圳市佑明光电有限公司 | Led灯珠、照明灯及led灯珠的制造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007311707A (ja) * | 2006-05-22 | 2007-11-29 | Ushio Inc | 紫外線発光素子パッケージ |
US20120074434A1 (en) * | 2010-09-24 | 2012-03-29 | Jun Seok Park | Light emitting device package and lighting apparatus using the same |
CN102504451B (zh) * | 2011-12-11 | 2014-02-26 | 浙江大学 | 氟树脂/纳米复合材料的制备方法 |
CN103756325B (zh) * | 2014-01-16 | 2016-06-22 | 广东工业大学 | 一种低填充量高导热石墨烯/硅脂复合材料及其制备方法 |
EP3170875B1 (en) * | 2014-07-15 | 2020-11-04 | AGC Inc. | Adhesive for ultraviolet-light-emitting device, and ultraviolet-light-emitting device |
EP3172771B1 (en) * | 2014-07-23 | 2019-03-20 | Crystal Is, Inc. | Illumination device with improved photon extraction, and assembling method therefor |
CN104829990A (zh) * | 2015-04-11 | 2015-08-12 | 安徽中威光电材料有限公司 | 一种led光源用聚四氟乙烯基掺杂铁磷粉的散热材料及其制备方法 |
CN104910829B (zh) * | 2015-05-05 | 2017-05-17 | 深圳新宙邦科技股份有限公司 | 一种led封装胶用增粘剂及其制备方法 |
CN104867450B (zh) * | 2015-06-05 | 2017-09-19 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法、显示装置 |
CN106854330B (zh) * | 2016-11-25 | 2018-03-23 | 常州中英科技股份有限公司 | 一种含氟树脂混合物及其制备的半固化片和覆铜板 |
CN107337881B (zh) * | 2017-06-29 | 2020-05-08 | 华中科技大学鄂州工业技术研究院 | 用于led封装的氟树脂界面剂、制备及使用方法 |
CN107275465B (zh) * | 2017-06-29 | 2019-01-04 | 华中科技大学鄂州工业技术研究院 | Led封装及其制作方法 |
-
2017
- 2017-06-29 CN CN201710514855.XA patent/CN107275465B/zh active Active
- 2017-11-22 WO PCT/CN2017/112235 patent/WO2019000815A1/zh active Application Filing
-
2018
- 2018-09-28 US US16/145,222 patent/US10636949B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10636949B2 (en) | 2020-04-28 |
WO2019000815A1 (zh) | 2019-01-03 |
US20190035991A1 (en) | 2019-01-31 |
CN107275465A (zh) | 2017-10-20 |
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GR01 | Patent grant | ||
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CB03 | Change of inventor or designer information |
Inventor after: Liang Renli Inventor after: Xu Linlin Inventor after: Chen Jingwen Inventor after: Wang Shuai Inventor after: Zhang Jun Inventor after: Du Shida Inventor after: Chen Changqing Inventor after: Dai Jiangnan Inventor before: Liang Renli Inventor before: Xu Linlin Inventor before: Chen Jingwen Inventor before: Wang Shuai Inventor before: Zhang Jun Inventor before: Du Shida |
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CB03 | Change of inventor or designer information |