CN107254264B - 电路连接材料、电路部件的连接结构及其制造方法 - Google Patents
电路连接材料、电路部件的连接结构及其制造方法 Download PDFInfo
- Publication number
- CN107254264B CN107254264B CN201710459575.3A CN201710459575A CN107254264B CN 107254264 B CN107254264 B CN 107254264B CN 201710459575 A CN201710459575 A CN 201710459575A CN 107254264 B CN107254264 B CN 107254264B
- Authority
- CN
- China
- Prior art keywords
- circuit
- application according
- resin
- conducting particles
- connection material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011111831 | 2011-05-18 | ||
JP2011-111831 | 2011-05-18 | ||
CN201280023903.0A CN103548207B (zh) | 2011-05-18 | 2012-04-10 | 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280023903.0A Division CN103548207B (zh) | 2011-05-18 | 2012-04-10 | 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107254264A CN107254264A (zh) | 2017-10-17 |
CN107254264B true CN107254264B (zh) | 2019-07-09 |
Family
ID=47176716
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280023903.0A Active CN103548207B (zh) | 2011-05-18 | 2012-04-10 | 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法 |
CN201710459575.3A Active CN107254264B (zh) | 2011-05-18 | 2012-04-10 | 电路连接材料、电路部件的连接结构及其制造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280023903.0A Active CN103548207B (zh) | 2011-05-18 | 2012-04-10 | 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6146302B2 (pt) |
KR (1) | KR101899185B1 (pt) |
CN (2) | CN103548207B (pt) |
BR (1) | BR112013029413B1 (pt) |
WO (1) | WO2012157375A1 (pt) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6330346B2 (ja) * | 2014-01-29 | 2018-05-30 | 日立化成株式会社 | 接着剤組成物、接着剤組成物を用いた電子部材、及び半導体装置の製造方法 |
WO2018042701A1 (ja) | 2016-08-30 | 2018-03-08 | 日立化成株式会社 | 接着剤組成物 |
JP2018145418A (ja) * | 2017-03-06 | 2018-09-20 | デクセリアルズ株式会社 | 樹脂組成物、樹脂組成物の製造方法、及び構造体 |
US11355469B2 (en) | 2017-12-28 | 2022-06-07 | Showa Denko Materials Co., Ltd. | Connection structure and method for producing same |
WO2019131668A1 (ja) * | 2017-12-28 | 2019-07-04 | 日立化成株式会社 | 希土類メタルボンド磁石の製造方法及び希土類メタルボンド磁石 |
WO2019142791A1 (ja) * | 2018-01-17 | 2019-07-25 | 日立化成株式会社 | 接着剤組成物、接続構造体及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63308880A (ja) * | 1987-06-11 | 1988-12-16 | Sony Chem Corp | 異方性導電接着体 |
JP2610900B2 (ja) | 1987-10-27 | 1997-05-14 | ソニーケミカル 株式会社 | 熱硬化型異方性導電接着シート及びその製造方法 |
JP4289319B2 (ja) | 1997-03-31 | 2009-07-01 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JPH10273626A (ja) * | 1997-03-31 | 1998-10-13 | Hitachi Chem Co Ltd | 回路接続材料及び回路板の製造法 |
JP3587859B2 (ja) | 1997-03-31 | 2004-11-10 | 日立化成工業株式会社 | 回路接続材料並びに回路端子の接続構造及び接続方法 |
JP2000182691A (ja) * | 1998-12-17 | 2000-06-30 | Hitachi Chem Co Ltd | 回路の接続部材及びこれを用いた接続方法 |
JP4590732B2 (ja) | 2000-12-28 | 2010-12-01 | 日立化成工業株式会社 | 回路接続材料及びそれを用いた回路板の製造方法、回路板 |
US6548175B2 (en) * | 2001-01-11 | 2003-04-15 | International Business Machines Corporation | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
JP4860163B2 (ja) * | 2005-02-15 | 2012-01-25 | 積水化学工業株式会社 | 導電性微粒子の製造方法 |
JP2006245453A (ja) * | 2005-03-07 | 2006-09-14 | Three M Innovative Properties Co | フレキシブルプリント回路基板の他の回路基板への接続方法 |
CN101529574A (zh) * | 2006-10-31 | 2009-09-09 | 日立化成工业株式会社 | 电路连接结构体 |
WO2008105355A1 (ja) * | 2007-02-26 | 2008-09-04 | Sekisui Chemical Co., Ltd. | 導電性微粒子及び異方性導電材料 |
JP4872949B2 (ja) * | 2007-10-12 | 2012-02-08 | 日立化成工業株式会社 | 回路接続材料及びそれを用いた回路部材の接続構造 |
CN101836265B (zh) * | 2007-10-22 | 2012-07-25 | 日本化学工业株式会社 | 包覆导电性粉体和使用该粉体的导电性粘合剂 |
WO2009057612A1 (ja) * | 2007-10-31 | 2009-05-07 | Hitachi Chemical Company, Ltd. | 回路接続材料及び回路部材の接続構造 |
KR20090054198A (ko) * | 2007-11-26 | 2009-05-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 점착 시트의 제조방법 및 이에 의한 점착 시트 |
JP2009277769A (ja) * | 2008-05-13 | 2009-11-26 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた回路部材の接続構造 |
JP2009277776A (ja) | 2008-05-13 | 2009-11-26 | Sharp Corp | 半導体装置及びその製造方法 |
WO2010125966A1 (ja) * | 2009-04-28 | 2010-11-04 | 日立化成工業株式会社 | 異方導電粒子 |
-
2012
- 2012-04-10 JP JP2013515048A patent/JP6146302B2/ja active Active
- 2012-04-10 CN CN201280023903.0A patent/CN103548207B/zh active Active
- 2012-04-10 CN CN201710459575.3A patent/CN107254264B/zh active Active
- 2012-04-10 BR BR112013029413-2A patent/BR112013029413B1/pt active IP Right Grant
- 2012-04-10 KR KR1020137027238A patent/KR101899185B1/ko active IP Right Grant
- 2012-04-10 WO PCT/JP2012/059804 patent/WO2012157375A1/ja active Application Filing
-
2016
- 2016-09-21 JP JP2016184337A patent/JP2017073386A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
BR112013029413B1 (pt) | 2021-08-10 |
CN103548207A (zh) | 2014-01-29 |
BR112013029413A2 (pt) | 2017-01-31 |
CN107254264A (zh) | 2017-10-17 |
KR20140019380A (ko) | 2014-02-14 |
WO2012157375A1 (ja) | 2012-11-22 |
JP2017073386A (ja) | 2017-04-13 |
JP6146302B2 (ja) | 2017-06-14 |
CN103548207B (zh) | 2017-10-27 |
KR101899185B1 (ko) | 2018-09-14 |
JPWO2012157375A1 (ja) | 2014-07-31 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Patentee before: HITACHI CHEMICAL Co.,Ltd. |