CN107210263A - 在集成电路或印刷电路板中形成导电及电阻电路结构的方法 - Google Patents

在集成电路或印刷电路板中形成导电及电阻电路结构的方法 Download PDF

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Publication number
CN107210263A
CN107210263A CN201680009910.3A CN201680009910A CN107210263A CN 107210263 A CN107210263 A CN 107210263A CN 201680009910 A CN201680009910 A CN 201680009910A CN 107210263 A CN107210263 A CN 107210263A
Authority
CN
China
Prior art keywords
metal nanoparticle
deposited
nanoparticle material
conductive
deposited metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680009910.3A
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English (en)
Chinese (zh)
Inventor
本杰明·S·库克
胡安·亚力杭德罗·赫布佐默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CN107210263A publication Critical patent/CN107210263A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/209—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/498—Resistive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN201680009910.3A 2015-03-31 2016-03-31 在集成电路或印刷电路板中形成导电及电阻电路结构的方法 Pending CN107210263A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/674,809 2015-03-31
US14/674,809 US10390433B2 (en) 2015-03-31 2015-03-31 Methods of forming conductive and resistive circuit structures in an integrated circuit or printed circuit board
PCT/US2016/025442 WO2016161212A1 (en) 2015-03-31 2016-03-31 Methods of forming conductive and resistive circuit structures in an integrated circuit or printed circuit board

Publications (1)

Publication Number Publication Date
CN107210263A true CN107210263A (zh) 2017-09-26

Family

ID=57007343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680009910.3A Pending CN107210263A (zh) 2015-03-31 2016-03-31 在集成电路或印刷电路板中形成导电及电阻电路结构的方法

Country Status (5)

Country Link
US (1) US10390433B2 (https=)
EP (1) EP3278359A4 (https=)
JP (1) JP6820136B2 (https=)
CN (1) CN107210263A (https=)
WO (1) WO2016161212A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111584483A (zh) * 2019-02-19 2020-08-25 半导体组件工业公司 形成半导体器件的方法及其结构
CN111683770A (zh) * 2018-01-31 2020-09-18 荷兰应用科学研究会(Tno) 用于产生和烧结细微线条和图案的方法和装置

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* Cited by examiner, † Cited by third party
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US10643944B2 (en) * 2018-07-30 2020-05-05 Texas Instruments Incorporated Additively manufactured programmable resistive jumpers
CN114142246B (zh) * 2021-11-24 2023-06-23 中国人民解放军空军工程大学 一种基于渐变阻抗的宽频大角度超材料吸波体及制备方法

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DE3741916A1 (de) * 1987-12-10 1989-06-22 Heino Pachschwoell Verfahren zum aushaerten von klebstoffen auf kunststoffbasis
JPH08250303A (ja) * 1995-03-15 1996-09-27 Mitsubishi Electric Corp 厚膜抵抗素子とその製造方法
US20040214452A1 (en) * 2002-10-18 2004-10-28 William Freeman Method for optically trimming electronic components
CN103500701A (zh) * 2013-10-18 2014-01-08 中国科学院微电子研究所 一种制备纳米器件的方法
CN104160457A (zh) * 2012-03-09 2014-11-19 昭和电工株式会社 透明导电图案的制造方法
US20150053662A1 (en) * 2013-08-21 2015-02-26 Goodrich Corporation Heating elements for aircraft heated floor panels

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US5236857A (en) 1991-10-30 1993-08-17 Texas Instruments Incorporated Resistor structure and process
US5855755A (en) 1995-06-19 1999-01-05 Lynntech, Inc. Method of manufacturing passive elements using conductive polypyrrole formulations
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CN104160457A (zh) * 2012-03-09 2014-11-19 昭和电工株式会社 透明导电图案的制造方法
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CN103500701A (zh) * 2013-10-18 2014-01-08 中国科学院微电子研究所 一种制备纳米器件的方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111683770A (zh) * 2018-01-31 2020-09-18 荷兰应用科学研究会(Tno) 用于产生和烧结细微线条和图案的方法和装置
CN111683770B (zh) * 2018-01-31 2023-10-27 荷兰应用科学研究会(Tno) 用于产生和烧结细微线条和图案的方法和装置
CN111584483A (zh) * 2019-02-19 2020-08-25 半导体组件工业公司 形成半导体器件的方法及其结构

Also Published As

Publication number Publication date
EP3278359A1 (en) 2018-02-07
WO2016161212A1 (en) 2016-10-06
JP2018511947A (ja) 2018-04-26
EP3278359A4 (en) 2018-10-03
US10390433B2 (en) 2019-08-20
JP6820136B2 (ja) 2021-01-27
US20160295696A1 (en) 2016-10-06

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Application publication date: 20170926