CN107110602B - 具有对流和辐射加热的熔炉 - Google Patents

具有对流和辐射加热的熔炉 Download PDF

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Publication number
CN107110602B
CN107110602B CN201480065142.4A CN201480065142A CN107110602B CN 107110602 B CN107110602 B CN 107110602B CN 201480065142 A CN201480065142 A CN 201480065142A CN 107110602 B CN107110602 B CN 107110602B
Authority
CN
China
Prior art keywords
temperature control
carrier element
furnace
substrate
control part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480065142.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN107110602A (zh
Inventor
R.埃布纳
B.琼斯
A.施皮岑贝尔格
U.凯姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebner Industrieofenbau GmbH
Original Assignee
Ebner Industrieofenbau GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebner Industrieofenbau GmbH filed Critical Ebner Industrieofenbau GmbH
Publication of CN107110602A publication Critical patent/CN107110602A/zh
Application granted granted Critical
Publication of CN107110602B publication Critical patent/CN107110602B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories or equipment specially adapted for furnaces of these types
    • F27B9/40—Arrangements of controlling or monitoring devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
    • F27B9/062—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated electrically heated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path
    • F27B9/24—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path being carried by a conveyor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/28—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity for treating continuous lengths of work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/36—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations using air tracks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0028—Regulation
    • F27D2019/0071—Regulation using position sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Tunnel Furnaces (AREA)
  • Furnace Details (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
CN201480065142.4A 2013-09-27 2014-09-25 具有对流和辐射加热的熔炉 Expired - Fee Related CN107110602B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1317170.7 2013-09-27
GBGB1317170.7A GB201317170D0 (en) 2013-09-27 2013-09-27 Furnace with a convection and radiation heating
PCT/EP2014/070580 WO2015044320A1 (en) 2013-09-27 2014-09-25 Furnace with a convection and radiation heating

Publications (2)

Publication Number Publication Date
CN107110602A CN107110602A (zh) 2017-08-29
CN107110602B true CN107110602B (zh) 2019-11-15

Family

ID=49553514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480065142.4A Expired - Fee Related CN107110602B (zh) 2013-09-27 2014-09-25 具有对流和辐射加热的熔炉

Country Status (7)

Country Link
US (1) US9970709B2 (enExample)
EP (1) EP3049744B1 (enExample)
JP (1) JP6491216B2 (enExample)
KR (1) KR20160068820A (enExample)
CN (1) CN107110602B (enExample)
GB (1) GB201317170D0 (enExample)
WO (1) WO2015044320A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201317194D0 (enExample) * 2013-09-27 2013-11-13 Ebner Ind Ofenbau
JP7477754B2 (ja) * 2020-03-30 2024-05-02 日本製鉄株式会社 加熱炉および加熱方法
CN117438332A (zh) * 2022-07-14 2024-01-23 长鑫存储技术有限公司 加热装置和方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1251419A (zh) * 1998-08-20 2000-04-26 松下电器产业株式会社 气体漂浮装置、气体漂浮运送装置及热处理装置
CN1309758A (zh) * 1998-06-18 2001-08-22 罗斯空气设备公司 用于材料热处理的可转换设备
US6336755B1 (en) * 1999-02-16 2002-01-08 Fuji Photo Film Co., Ltd. Image forming apparatus
CN101257060A (zh) * 2008-03-05 2008-09-03 荀建华 太阳能电池烧结炉温区隔断装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61149781A (ja) * 1984-12-24 1986-07-08 日立金属株式会社 雰囲気焼結用連続炉
FR2579501B1 (fr) * 1985-03-30 1990-03-02 Neitz Heinrich Verwaltung Procede et dispositif pour le brasage de pieces en aluminium
US4767324A (en) * 1987-05-26 1988-08-30 General Electric Company Transition section for muffle furnace
JPH01167582A (ja) * 1987-12-23 1989-07-03 Shinagawa Refract Co Ltd 被熱物の浮上・輸送焼成炉およびその焼成法
JP2910061B2 (ja) * 1989-06-30 1999-06-23 松下電器産業株式会社 焼成炉
US6091055A (en) * 1997-08-04 2000-07-18 Matsushita Electric Industrial Co., Ltd. Method of heat treating object and apparatus for the same
JP4090585B2 (ja) * 1997-08-04 2008-05-28 松下電器産業株式会社 対象物体の加熱処理方法およびそのための装置
JPH11281259A (ja) * 1998-03-27 1999-10-15 Tokai Konetsu Kogyo Co Ltd 連続式雰囲気炉
JP2000128346A (ja) * 1998-08-20 2000-05-09 Matsushita Electric Ind Co Ltd 浮揚装置、浮揚搬送装置および熱処理装置
JP3547724B2 (ja) * 2001-09-25 2004-07-28 沖電気工業株式会社 レジストパターンのベーク装置及びレジストパターンの形成方法
JP2003329372A (ja) * 2002-05-14 2003-11-19 Nittetsu Elex Co Ltd 連続処理設備
JP4741307B2 (ja) * 2005-05-20 2011-08-03 富士フイルム株式会社 加熱装置及び加熱方法
JP2008020112A (ja) * 2006-07-12 2008-01-31 Fujitsu Hitachi Plasma Display Ltd 加熱処理方法および装置
US20100127418A1 (en) * 2008-11-25 2010-05-27 Ronald Alan Davidson Methods For Continuous Firing Of Shaped Bodies And Roller Hearth Furnaces Therefor
CN201331256Y (zh) * 2008-12-15 2009-10-21 合肥恒力电子技术开发公司 一种高温炉管气隔断装置
DE102009037299A1 (de) * 2009-08-14 2011-08-04 Leybold Optics GmbH, 63755 Vorrichtung und Behandlungskammer zur thermischen Behandlung von Substraten
US9163877B2 (en) * 2011-06-07 2015-10-20 Berndorf Band Gmbh Conveyor oven

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1309758A (zh) * 1998-06-18 2001-08-22 罗斯空气设备公司 用于材料热处理的可转换设备
CN1251419A (zh) * 1998-08-20 2000-04-26 松下电器产业株式会社 气体漂浮装置、气体漂浮运送装置及热处理装置
US6336755B1 (en) * 1999-02-16 2002-01-08 Fuji Photo Film Co., Ltd. Image forming apparatus
CN101257060A (zh) * 2008-03-05 2008-09-03 荀建华 太阳能电池烧结炉温区隔断装置

Also Published As

Publication number Publication date
US9970709B2 (en) 2018-05-15
EP3049744A1 (en) 2016-08-03
KR20160068820A (ko) 2016-06-15
CN107110602A (zh) 2017-08-29
EP3049744B1 (en) 2018-10-24
US20160290719A1 (en) 2016-10-06
JP2016536557A (ja) 2016-11-24
JP6491216B2 (ja) 2019-03-27
WO2015044320A1 (en) 2015-04-02
GB201317170D0 (en) 2013-11-06

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