CN107110602B - 具有对流和辐射加热的熔炉 - Google Patents

具有对流和辐射加热的熔炉 Download PDF

Info

Publication number
CN107110602B
CN107110602B CN201480065142.4A CN201480065142A CN107110602B CN 107110602 B CN107110602 B CN 107110602B CN 201480065142 A CN201480065142 A CN 201480065142A CN 107110602 B CN107110602 B CN 107110602B
Authority
CN
China
Prior art keywords
temperature control
carrier element
another
substrate
smelting furnace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480065142.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN107110602A (zh
Inventor
R.埃布纳
B.琼斯
A.施皮岑贝尔格
U.凯姆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebner Industrieofenbau GmbH
Original Assignee
Ebner Industrieofenbau GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebner Industrieofenbau GmbH filed Critical Ebner Industrieofenbau GmbH
Publication of CN107110602A publication Critical patent/CN107110602A/zh
Application granted granted Critical
Publication of CN107110602B publication Critical patent/CN107110602B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories or equipment specially adapted for furnaces of these types
    • F27B9/40—Arrangements of controlling or monitoring devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/06—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated
    • F27B9/062—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity heated without contact between combustion gases and charge; electrically heated electrically heated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path
    • F27B9/24—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path being carried by a conveyor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/28—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity for treating continuous lengths of work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D19/00—Arrangements of controlling devices
    • F27D2019/0028—Regulation
    • F27D2019/0071—Regulation using position sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Tunnel Furnaces (AREA)
  • Furnace Details (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
CN201480065142.4A 2013-09-27 2014-09-25 具有对流和辐射加热的熔炉 Expired - Fee Related CN107110602B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1317170.7A GB201317170D0 (en) 2013-09-27 2013-09-27 Furnace with a convection and radiation heating
GB1317170.7 2013-09-27
PCT/EP2014/070580 WO2015044320A1 (en) 2013-09-27 2014-09-25 Furnace with a convection and radiation heating

Publications (2)

Publication Number Publication Date
CN107110602A CN107110602A (zh) 2017-08-29
CN107110602B true CN107110602B (zh) 2019-11-15

Family

ID=49553514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480065142.4A Expired - Fee Related CN107110602B (zh) 2013-09-27 2014-09-25 具有对流和辐射加热的熔炉

Country Status (7)

Country Link
US (1) US9970709B2 (cg-RX-API-DMAC7.html)
EP (1) EP3049744B1 (cg-RX-API-DMAC7.html)
JP (1) JP6491216B2 (cg-RX-API-DMAC7.html)
KR (1) KR20160068820A (cg-RX-API-DMAC7.html)
CN (1) CN107110602B (cg-RX-API-DMAC7.html)
GB (1) GB201317170D0 (cg-RX-API-DMAC7.html)
WO (1) WO2015044320A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201317194D0 (cg-RX-API-DMAC7.html) * 2013-09-27 2013-11-13 Ebner Ind Ofenbau
JP7477754B2 (ja) * 2020-03-30 2024-05-02 日本製鉄株式会社 加熱炉および加熱方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1251419A (zh) * 1998-08-20 2000-04-26 松下电器产业株式会社 气体漂浮装置、气体漂浮运送装置及热处理装置
CN1309758A (zh) * 1998-06-18 2001-08-22 罗斯空气设备公司 用于材料热处理的可转换设备
US6336755B1 (en) * 1999-02-16 2002-01-08 Fuji Photo Film Co., Ltd. Image forming apparatus
CN101257060A (zh) * 2008-03-05 2008-09-03 荀建华 太阳能电池烧结炉温区隔断装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61149781A (ja) * 1984-12-24 1986-07-08 日立金属株式会社 雰囲気焼結用連続炉
FR2579501B1 (fr) * 1985-03-30 1990-03-02 Neitz Heinrich Verwaltung Procede et dispositif pour le brasage de pieces en aluminium
US4767324A (en) * 1987-05-26 1988-08-30 General Electric Company Transition section for muffle furnace
JPH01167582A (ja) * 1987-12-23 1989-07-03 Shinagawa Refract Co Ltd 被熱物の浮上・輸送焼成炉およびその焼成法
JP2910061B2 (ja) * 1989-06-30 1999-06-23 松下電器産業株式会社 焼成炉
MY117325A (en) * 1997-08-04 2004-06-30 Matsushita Electric Industrial Co Ltd Method of heat treating object and apparatus for the same.
JP4090585B2 (ja) * 1997-08-04 2008-05-28 松下電器産業株式会社 対象物体の加熱処理方法およびそのための装置
JPH11281259A (ja) * 1998-03-27 1999-10-15 Tokai Konetsu Kogyo Co Ltd 連続式雰囲気炉
JP2000128346A (ja) * 1998-08-20 2000-05-09 Matsushita Electric Ind Co Ltd 浮揚装置、浮揚搬送装置および熱処理装置
JP3547724B2 (ja) * 2001-09-25 2004-07-28 沖電気工業株式会社 レジストパターンのベーク装置及びレジストパターンの形成方法
JP2003329372A (ja) * 2002-05-14 2003-11-19 Nittetsu Elex Co Ltd 連続処理設備
JP4741307B2 (ja) * 2005-05-20 2011-08-03 富士フイルム株式会社 加熱装置及び加熱方法
JP2008020112A (ja) * 2006-07-12 2008-01-31 Fujitsu Hitachi Plasma Display Ltd 加熱処理方法および装置
US20100127418A1 (en) * 2008-11-25 2010-05-27 Ronald Alan Davidson Methods For Continuous Firing Of Shaped Bodies And Roller Hearth Furnaces Therefor
CN201331256Y (zh) * 2008-12-15 2009-10-21 合肥恒力电子技术开发公司 一种高温炉管气隔断装置
DE102009037299A1 (de) * 2009-08-14 2011-08-04 Leybold Optics GmbH, 63755 Vorrichtung und Behandlungskammer zur thermischen Behandlung von Substraten
US9163877B2 (en) * 2011-06-07 2015-10-20 Berndorf Band Gmbh Conveyor oven

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1309758A (zh) * 1998-06-18 2001-08-22 罗斯空气设备公司 用于材料热处理的可转换设备
CN1251419A (zh) * 1998-08-20 2000-04-26 松下电器产业株式会社 气体漂浮装置、气体漂浮运送装置及热处理装置
US6336755B1 (en) * 1999-02-16 2002-01-08 Fuji Photo Film Co., Ltd. Image forming apparatus
CN101257060A (zh) * 2008-03-05 2008-09-03 荀建华 太阳能电池烧结炉温区隔断装置

Also Published As

Publication number Publication date
KR20160068820A (ko) 2016-06-15
GB201317170D0 (en) 2013-11-06
WO2015044320A1 (en) 2015-04-02
US9970709B2 (en) 2018-05-15
JP6491216B2 (ja) 2019-03-27
CN107110602A (zh) 2017-08-29
US20160290719A1 (en) 2016-10-06
JP2016536557A (ja) 2016-11-24
EP3049744A1 (en) 2016-08-03
EP3049744B1 (en) 2018-10-24

Similar Documents

Publication Publication Date Title
CN102686965B (zh) 用于对连续运动的钢带进行预热的装置和方法
FI86055C (fi) Anordning foer vaermehaerdning av glasskivor.
CA2912922C (en) Transporting device for hot and thin-walled steel parts
CN102356458A (zh) 利用极低质量运送系统的扩散炉及晶圆快速扩散加工处理的方法
JP6723350B2 (ja) コンベヤローラ端部の冷却を有するガラス板処理システム
TW201139942A (en) Method for reclaiming energy in smelting systems and smelting system based on thermocouples
CN107108311A (zh) 用于成型或成形加热的玻璃片的设备和方法
CN107110602B (zh) 具有对流和辐射加热的熔炉
US8865058B2 (en) Heat treatment furnace
CN103765143B (zh) 具有外壳集成冷却系统的炉系统
CN108779959A (zh) 工业炉及其热利用方法
KR101358285B1 (ko) 연속식 소성로
WO2001092800A1 (en) Heat treatment apparatus
JP2009014227A (ja) 熱処理炉
CN105899902A (zh) 包括密封温度控制部的熔炉
FI115834B (fi) Menetelmä ja laite lasilevyjen lämmittämiseksi
HK1241453B (zh) 具有对流和辐射加热的熔炉
HK1241453A1 (en) Furnace with a convection and radiation heating
JP4661766B2 (ja) ハニカム構造体の焼成方法及び焼成装置
CN112050628B (zh) 一种利用余热排蜡的窑炉
JP2017083123A (ja) 炉内搬送装置、炉内搬送方法、及び連続焼成炉
JP2023080567A (ja) 熱処理炉
JPS6020665B2 (ja) 高熱物体の保有熱回収装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1241453

Country of ref document: HK

GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191115

Termination date: 20200925

CF01 Termination of patent right due to non-payment of annual fee