CN107109140A - 在电子装置中替换油墨阶挡板的粘合剂 - Google Patents

在电子装置中替换油墨阶挡板的粘合剂 Download PDF

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Publication number
CN107109140A
CN107109140A CN201580069426.5A CN201580069426A CN107109140A CN 107109140 A CN107109140 A CN 107109140A CN 201580069426 A CN201580069426 A CN 201580069426A CN 107109140 A CN107109140 A CN 107109140A
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China
Prior art keywords
adhesive composition
adhesive layer
laminate
substrate
adhesive
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Pending
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CN201580069426.5A
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English (en)
Chinese (zh)
Inventor
奥德蕾·A·舍曼
罗伯特·R·齐斯切克
斯科特·M·塔皮奥
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN107109140A publication Critical patent/CN107109140A/zh
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    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • G—PHYSICS
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CN201580069426.5A 2014-12-19 2015-12-16 在电子装置中替换油墨阶挡板的粘合剂 Pending CN107109140A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462094203P 2014-12-19 2014-12-19
US62/094,203 2014-12-19
PCT/US2015/066060 WO2016100493A1 (en) 2014-12-19 2015-12-16 Adhesives to replace ink step bezels in electronic devices

Publications (1)

Publication Number Publication Date
CN107109140A true CN107109140A (zh) 2017-08-29

Family

ID=56127532

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580069426.5A Pending CN107109140A (zh) 2014-12-19 2015-12-16 在电子装置中替换油墨阶挡板的粘合剂

Country Status (7)

Country Link
US (1) US10307985B2 (enExample)
EP (1) EP3234744A4 (enExample)
JP (1) JP2018500677A (enExample)
KR (1) KR20170100561A (enExample)
CN (1) CN107109140A (enExample)
TW (1) TW201700679A (enExample)
WO (1) WO2016100493A1 (enExample)

Cited By (2)

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WO2022036854A1 (zh) * 2020-08-19 2022-02-24 太仓展新胶粘材料股份有限公司 一种边缘遮光的oca光学胶的制备方法
CN114206998A (zh) * 2019-07-31 2022-03-18 洛德公司 用于降低粘合强度和相关拉脱应力的方法和系统

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CN106517830A (zh) * 2016-10-18 2017-03-22 广东小天才科技有限公司 显示装置、电子设备及显示装置的制备方法
US11203182B2 (en) * 2017-01-17 2021-12-21 Sekisui Chemical Co., Ltd. Filling-bonding material, protective sheet-equipped filling-bonding material, laminated body, optical device, and protective panel for optical device
JP2019082523A (ja) * 2017-10-30 2019-05-30 株式会社ジャパンディスプレイ 液晶表示装置
DE102019130343A1 (de) * 2018-12-21 2020-06-25 Rogers Corporation Einseitiges drucksensibles Klebeband
EP3693163A1 (en) * 2019-02-06 2020-08-12 Koninklijke Philips N.V. Method and apparatus for manufacturing a device
US20230002571A1 (en) * 2021-01-19 2023-01-05 Mary Lawren Epstein Disposable film wrap system for use with handheld devices

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JP5116268B2 (ja) 2005-08-31 2013-01-09 キヤノン株式会社 積層型半導体装置およびその製造方法
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KR101816330B1 (ko) * 2010-03-09 2018-01-08 쓰리엠 이노베이티브 프로퍼티즈 컴파니 디스플레이 패널을 접합하기 위한 열 활성화 광학 투명 접착제
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