CN1070933C - 含元素周期表第ivb族中金属、氮和氧的化合物材料及其制备方法 - Google Patents
含元素周期表第ivb族中金属、氮和氧的化合物材料及其制备方法 Download PDFInfo
- Publication number
- CN1070933C CN1070933C CN94194592A CN94194592A CN1070933C CN 1070933 C CN1070933 C CN 1070933C CN 94194592 A CN94194592 A CN 94194592A CN 94194592 A CN94194592 A CN 94194592A CN 1070933 C CN1070933 C CN 1070933C
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- metal
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- thin layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
- F24S70/00—Details of absorbing elements
- F24S70/20—Details of absorbing elements characterised by absorbing coatings; characterised by surface treatment for increasing absorption
- F24S70/225—Details of absorbing elements characterised by absorbing coatings; characterised by surface treatment for increasing absorption for spectrally selective absorption
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/082—Compounds containing nitrogen and non-metals and optionally metals
- C01B21/0821—Oxynitrides of metals, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0676—Oxynitrides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24S—SOLAR HEAT COLLECTORS; SOLAR HEAT SYSTEMS
- F24S70/00—Details of absorbing elements
- F24S70/20—Details of absorbing elements characterised by absorbing coatings; characterised by surface treatment for increasing absorption
- F24S70/25—Coatings made of metallic material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02181—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing hafnium, e.g. HfO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02189—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing zirconium, e.g. ZrO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02192—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing at least one rare earth metal element, e.g. oxides of lanthanides, scandium or yttrium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/40—Solar thermal energy, e.g. solar towers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Vapour Deposition (AREA)
- Catalysts (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4344258A DE4344258C1 (de) | 1993-12-23 | 1993-12-23 | Material aus chemischen Verbindungen mit einem Metall der Gruppe IV A des Periodensystems, Stickstoff und Sauerstoff, dessen Verwendung und Verfahren zur Herstellung |
DEP4344258.7 | 1993-12-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1138353A CN1138353A (zh) | 1996-12-18 |
CN1070933C true CN1070933C (zh) | 2001-09-12 |
Family
ID=6506067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN94194592A Expired - Fee Related CN1070933C (zh) | 1993-12-23 | 1994-12-19 | 含元素周期表第ivb族中金属、氮和氧的化合物材料及其制备方法 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP0736109B1 (zh) |
JP (1) | JP3524552B2 (zh) |
CN (1) | CN1070933C (zh) |
AT (1) | ATE194395T1 (zh) |
AU (1) | AU1383795A (zh) |
DE (1) | DE4344258C1 (zh) |
DK (1) | DK0736109T3 (zh) |
ES (1) | ES2149342T3 (zh) |
GR (1) | GR3034501T3 (zh) |
WO (1) | WO1995017533A1 (zh) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19506188C2 (de) * | 1995-02-22 | 2003-03-06 | Miladin Lazarov | Implantat und dessen Verwendung |
DE19601238C2 (de) | 1996-01-15 | 2001-09-06 | Miladin Lazarov | Farbiger Strahlungsenergie-Wandler |
DE19730884A1 (de) * | 1997-07-18 | 1999-01-21 | Leybold Ag | Verfahren zum Beschichten eines Substrates mit Chromoxinitrid |
DE19950386A1 (de) * | 1999-10-19 | 2001-05-10 | Miladin Lazarov | Biokompatibler Gegenstand |
DE10058931A1 (de) * | 2000-11-28 | 2002-06-20 | Tinox Ges Fuer Energieforschun | Gemusterter Strahlungsenergie-Wandler |
DE10122329B4 (de) * | 2001-05-08 | 2004-06-03 | Tinox Gmbh | Wärmetauscher-Vorrichtung mit einer oberflächenbeschichteten Wand, die Medium 1 von Medium 2 trennt |
ITRM20010349A1 (it) * | 2001-06-18 | 2002-12-18 | Enea Ente Nuove Tec | Rivestimento superficiale del tubo collettore di un concentratore solare parabolico lineare. |
DE10149397A1 (de) * | 2001-10-01 | 2003-04-24 | Siemens Ag | Hartstoffschicht |
DE102004019061B4 (de) * | 2004-04-20 | 2008-11-27 | Peter Lazarov | Selektiver Absorber zur Umwandlung von Sonnenlicht in Wärme, ein Verfahren und eine Vorrichtung zu dessen Herstellung |
CN100439092C (zh) * | 2006-06-08 | 2008-12-03 | 复旦大学 | 一种金属和非金属多层薄膜结构的光热能量转换器件 |
DE202009015334U1 (de) | 2009-11-11 | 2010-02-25 | Almeco-Tinox Gmbh | Optisch wirksames Mehrschichtsystem für solare Absorption |
EP2336811B2 (de) | 2009-12-21 | 2024-08-07 | ALANOD GmbH & Co. KG | Verbundmaterial |
CN102120373A (zh) * | 2010-01-26 | 2011-07-13 | 东莞理工学院 | 一种太阳能反射薄膜材料 |
CN102373431A (zh) * | 2010-08-26 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 铝合金表面防腐处理方法及其制品 |
CN102560392A (zh) * | 2010-12-24 | 2012-07-11 | 鸿富锦精密工业(深圳)有限公司 | 铝及铝合金表面防腐处理方法及其制品 |
EP2525162B1 (en) * | 2011-05-19 | 2013-07-17 | Sandvik Intellectual Property AB | A solar thermal absorber material |
DE102013110118B4 (de) | 2013-08-20 | 2016-02-18 | Von Ardenne Gmbh | Solarabsorber und Verfahren zu dessen Herstellung |
DE102013016316B4 (de) | 2013-10-04 | 2017-10-19 | Photon Energy Gmbh | Verfahren zur Herstellung eines Absorbers für einen Solarkollektor einer Solarthermieanlage |
JP6587170B2 (ja) * | 2014-12-26 | 2019-10-09 | 国立研究開発法人物質・材料研究機構 | 蒸発または蒸留用流体、蒸留方法及び蒸留装置 |
EP3246423B1 (en) * | 2015-01-16 | 2019-12-18 | Kyocera Corporation | Cermet decorative component |
WO2018138965A1 (ja) | 2017-01-24 | 2018-08-02 | ナノフロンティアテクノロジー株式会社 | 太陽熱発電用集熱膜およびその製造方法 |
CN111733383A (zh) * | 2019-03-25 | 2020-10-02 | 陈远达 | 一种无菌耐磨损类金刚石复合涂层医用手术刀的制作工艺 |
DK3988859T3 (da) | 2020-10-26 | 2023-02-06 | Almeco Gmbh | Deformerbart kompositmateriale til fritliggende solenergiabsorberende opsamlingspaneler med lavt tab af infrarød stråling |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3522427A1 (de) * | 1985-06-22 | 1986-02-20 | Helmut Dipl Ing Fischer | Titanoxinitridschicht fuer sensoranwendungen |
EP0488180A2 (en) * | 1990-11-28 | 1992-06-03 | Nippon Sheet Glass Co. Ltd. | Electrically responsive light controlling device |
EP0564709A1 (de) * | 1991-12-13 | 1993-10-13 | Balzers Aktiengesellschaft | Beschichtetes transparentes Substrat, Verwendung hiervon, Verfahren und Anlage zur Herstellung der Schichten, und Hafnium-Oxinitrid (HfOxNy) mit 1,5 x/y 3 und 2,6 n 2,8 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH664377A5 (de) * | 1986-01-16 | 1988-02-29 | Balzers Hochvakuum | Dekorative schwarze verschleissschutzschicht. |
US4861669A (en) * | 1987-03-26 | 1989-08-29 | Ppg Industries, Inc. | Sputtered titanium oxynitride films |
-
1993
- 1993-12-23 DE DE4344258A patent/DE4344258C1/de not_active Expired - Lifetime
-
1994
- 1994-12-19 AT AT95905080T patent/ATE194395T1/de active
- 1994-12-19 ES ES95905080T patent/ES2149342T3/es not_active Expired - Lifetime
- 1994-12-19 WO PCT/EP1994/004213 patent/WO1995017533A1/de active IP Right Grant
- 1994-12-19 CN CN94194592A patent/CN1070933C/zh not_active Expired - Fee Related
- 1994-12-19 DK DK95905080T patent/DK0736109T3/da active
- 1994-12-19 JP JP51717295A patent/JP3524552B2/ja not_active Expired - Fee Related
- 1994-12-19 AU AU13837/95A patent/AU1383795A/en not_active Abandoned
- 1994-12-19 EP EP95905080A patent/EP0736109B1/de not_active Expired - Lifetime
-
2000
- 2000-09-28 GR GR20000402191T patent/GR3034501T3/el unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3522427A1 (de) * | 1985-06-22 | 1986-02-20 | Helmut Dipl Ing Fischer | Titanoxinitridschicht fuer sensoranwendungen |
EP0488180A2 (en) * | 1990-11-28 | 1992-06-03 | Nippon Sheet Glass Co. Ltd. | Electrically responsive light controlling device |
EP0564709A1 (de) * | 1991-12-13 | 1993-10-13 | Balzers Aktiengesellschaft | Beschichtetes transparentes Substrat, Verwendung hiervon, Verfahren und Anlage zur Herstellung der Schichten, und Hafnium-Oxinitrid (HfOxNy) mit 1,5 x/y 3 und 2,6 n 2,8 |
Also Published As
Publication number | Publication date |
---|---|
JPH09507095A (ja) | 1997-07-15 |
AU1383795A (en) | 1995-07-10 |
JP3524552B2 (ja) | 2004-05-10 |
ES2149342T3 (es) | 2000-11-01 |
ATE194395T1 (de) | 2000-07-15 |
EP0736109A1 (de) | 1996-10-09 |
GR3034501T3 (en) | 2000-12-29 |
CN1138353A (zh) | 1996-12-18 |
DE4344258C1 (de) | 1995-08-31 |
DK0736109T3 (da) | 2000-10-23 |
EP0736109B1 (de) | 2000-07-05 |
WO1995017533A1 (de) | 1995-06-29 |
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