CN107075231B - 浸渍树脂、导体装置、电线圈和电机 - Google Patents

浸渍树脂、导体装置、电线圈和电机 Download PDF

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CN107075231B
CN107075231B CN201580062729.4A CN201580062729A CN107075231B CN 107075231 B CN107075231 B CN 107075231B CN 201580062729 A CN201580062729 A CN 201580062729A CN 107075231 B CN107075231 B CN 107075231B
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J.休伯
B.克劳斯纳
D.施尔姆
M.于布勒
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Abstract

用于电机导体的浸渍树脂、特别地催化可固化的浸渍树脂,其包含与至少一种反应性稀释剂和固化催化剂,特别地用于浸渍树脂的阳离子、阴离子或配位聚合的固化催化剂混合的至少一种反应性树脂,其中为改善所述浸渍树脂在其使用时的性能,所述反应性稀释剂包含杂环四元环。所述浸渍树脂是导体装置(2)的主绝缘(12)的一部分,所述导体装置继而被安装在电线圈或一般地被安装在电机中。

Description

浸渍树脂、导体装置、电线圈和电机
本发明涉及浸渍树脂、特别地用于电机的绝缘结构的催化可固化的浸渍树脂,其包含与至少一种反应性稀释剂和固化催化剂,特别地用于浸渍树脂的阳离子、阴离子或配位聚合的固化催化剂混合的至少一种反应性树脂。本发明还涉及导体装置(或布线、配线)以及具有这种导体装置的电线圈和电机。
电机、特别地旋转电机包括叠片铁芯(Blechpaket)内的电绕组。所述绕组由电导体(其任选地已设有初级绝缘
Figure GDA0002126080770000011
)和作为主绝缘的固体绝缘材料组成。在没有进一步的措施的情况下,在叠片铁芯、导体和主绝缘之间没有紧密的接合(连接),从而产生裂纹和空隙。在大气条件下运行时,这些区域会被空气填充。特别地,对于高电压范围内的应用,这是不允许的,因为局部放电将在最短的时间内破坏绝缘。这导致电机的故障。
为了实现紧密的接合并由此排除空气,而用可固化的浸渍树脂或浸渍漆来浸渍绕组。在此,固体绝缘材料可被设计为多孔的,以提高浸渍树脂吸收
Figure GDA0002126080770000012
对此的实例为云母带、绝缘纸或无纺布。
对于高压设备的浸渍,现有技术是环氧树脂和液态的脂环族酸酐的混合物,例如参见US 4113791(A)。酸酐在此作为固化剂用于与环氧树脂的加聚并同时降低粘度,这有利于快速且充分的浸渍。
然而,酸酐通常为致敏作用的化合物,尤其是在经由呼吸道吸收时。出于这些原因,在处理酸酐时适当的安全措施是必须的。
本发明所要解决的技术问题在于提供用于电机的导体装置的具有改善的性能的浸渍树脂。
根据本发明,所述技术问题通过浸渍树脂、特别地用于电机导体的催化可固化的浸渍树脂来解决,所述浸渍树脂包含与至少一种反应性稀释剂和含至少一种咪唑或咪唑类化合物的固化催化剂混合的至少一种反应性树脂,其中所述反应性树脂具有至少一个环氧乙烷官能度。
根据本发明,所述技术问题进一步通过由数个导体构成的导体装置来解决,其中围绕所述数个导体设置用这种类型的浸渍树脂浸渍的主绝缘。在此,所述主绝缘特别地由固体多孔绝缘材料例如云母带、绝缘纸或无纺布构成。
此外,根据本发明,所述技术问题通过具有这种类型的导体装置的电线圈来解决。
根据本发明,该技术问题最终通过具有这种类型的导体装置的电机来解决。关于浸渍树脂的在下文给出的优点和优选的实施方式可比照转移至导体装置、电线圈和电机。
在此,固化催化剂应理解为如下的化合物:其容许浸渍树脂的阳离子、阴离子或配位聚合。可使用不同的固化催化剂,其中出于上述原因而保持尽可能低的挥发性酸酐的含量。
特别地,作为阳离子型固化催化剂可例如使用有机盐类。例如这种有机盐可包括如有机铵、锍、鏻或咪唑鎓盐的化合物。因此,例如2-亚丁基四亚甲基硫鎓六氟锑酸盐是一种可能的阳离子型固化催化剂。
金属络合化合物,即具有与配体例如有机配体配位键合的一个或多个金属中心原子的化合物,还可额外地用作固化催化剂,用作配位型、阳离子型或阴离子型固化催化剂。所述金属络合化合物可以是带电或不带电的,并且可包含相应的反离子。
作为阴离子型固化催化剂,除咪唑类化合物之外,还可使用例如叔胺。实例在此可提及4,5-二羟甲基-2-苯基咪唑和/或2-苯基-4-甲基-5-羟甲基咪唑。
相对于已知的酸酐类固化催化剂,在此提及的固化催化剂具有如下有优点:它们具有较低的湿度敏感性和/或它们在毒理学上可以不予考虑。
根据有利的实施方式,在浸渍过程中,固化催化剂以范围在0.001至10重量%的量被包含在浸渍树脂中。
在此,固化催化剂既可以存储的方式被包含在可存储的浸渍树脂中,又可以存储的方式被包含在待浸渍的固体多孔绝缘材料中例如在云母带、绝缘纸或无纺布中。
其中特别有利的实施方式是,固化催化剂被包含在多孔绝缘材料中并且在没有固化催化剂的情况下存储浸渍树脂,因为由于在浸渍树脂中缺少(不含)固化催化剂而使保质期可大大地增加。此外,没有发现所述固化催化剂与多孔绝缘材料的特殊的相互作用。
作为反应性稀释剂,可使用已知的市售反应性稀释剂。例如,也可使用具有杂环四元环的反应性稀释剂,例如具有氧作为杂原子,即氧杂环丁烷。实例在此可提及3-乙基-3-羟甲基氧杂环丁烷(oxetan)、3-乙基-3-[(2-乙基己基氧基)甲基]氧杂环丁烷;和/或3-乙基-3-{[(3-乙基氧杂环丁烷-3-基)甲氧基]甲基}氧杂环丁烷。
反应性稀释剂可以例如0.01至50重量%、特别地0.01至10重量%的量被包含在浸渍树脂中。
例如可通过反应性稀释剂的量来调节浸渍树脂的流变行为,因为氧杂环丁烷导致浸渍树脂的低的粘度。在此提及的氧杂环丁烷例如甚至导致即便在较高的温度下浸渍树脂的良好的真空强度(Vakuumfestigkeit),因为氧杂环丁烷具有低的蒸气压。
此外,有利地,浸渍树脂包含至少一种有机和/或无机纳米级填料。纳米颗粒(其还可以不同的纳米级填料的混合物的形式存在)特别改善了经固化的浸渍树脂的冲击强度、分层特性、裂纹敏感性
Figure GDA0002126080770000031
和耐局部放电性。
例如,作为反应性稀释剂使用在缩水甘油基醚中、特别地在经蒸馏的双酚-F-二缩水甘油基醚(BFDGE)中的3-乙基-3-{[(3-乙基氧杂环丁烷-3-基)甲氧基]甲基}氧杂环丁烷。在此,有利地,在经蒸馏的BFDGE中的反应性稀释剂用量为最高达5%。
在测试中,在145℃下固化10小时的样品的玻璃化转变温度在此可达149℃,所述样品由96重量%的经蒸馏的BFDGE、2重量%的1,2-二甲基咪唑和2重量%的OXT-221。
此外,有利的是,浸渍树脂包含至少一种无机和/或有机微米尺度的填料(即具有在微米范围内的平均粒径的填料)或微米尺度的填料混合物。可设想的还有微米尺度的填料的混合物。这样的填料导致机械强度的提高。
根据优选的实施方式,浸渍树脂的完全固化温度
Figure GDA0002126080770000032
在120至190℃的范围内、优选地在130℃至170℃的范围内。为此,使相应的固化催化剂与合适的反应性树脂反应。
这样的浸渍树脂被设计用于电机中的应用、特别地用于旋转电机和高压应用。在此。反应性树脂为具有环氧乙烷官能度的任意的反应性树脂或具有环氧乙烷官能度的不同反应性树脂的混合物。
本发明的实施例依据附图被详细地说明。这里,唯一的附图示出了包括多个导体4的导体装置2,所述多个导体各自具有初级绝缘6(例如由云母带、漆包线漆、聚酰亚胺膜)。导体装置2被布置在叠片铁芯8的凹槽7中,其开口被槽盖(Nutverschluss)10封闭。
此外,凹槽7填充有主绝缘12。主绝缘13浸渍有包含与至少一种反应性稀释剂和固化催化剂混合的至少一种反应性树脂的浸渍树脂,其中所述反应性稀释剂包含杂环四元环。在此,通过浸渍树脂将凹槽7中的空气排出。主绝缘12具有多孔材料、特别地绝缘材料,并且用于浸渍树脂的固化催化剂被包含在所述多孔材料中。
导体装置2是此处未被详细示出的电线圈的一部分。电线圈继而被安装在电机中。备选地,导体装置2被安装在电机中而不是电线圈的一部分。
本发明涉及用于电机导体的浸渍树脂、特别地催化可固化的浸渍树脂,其包含与至少一种反应性稀释剂和固化催化剂,特别地用于浸渍树脂的阴离子聚合的固化催化剂混合的至少一种反应性树脂,其中为改善所述浸渍树脂在其使用时的性能,所述反应性稀释剂包含杂环四元环。所述浸渍树脂是导体装置(2)的主绝缘(12)的一部分,所述导体装置继而被安装在电线圈或一般地被安装在电机中。

Claims (12)

1.用于电机的由数个导体构成的导体装置(2),其中围绕所述数个导体设置主绝缘(12),所述主绝缘通过浸渍树脂来浸渍,所述浸渍树脂包括:
至少一种反应性树脂,其与至少一种反应性稀释剂混合;和
固化催化剂,其包含咪唑类化合物,用于引发所述浸渍树脂的阴离子聚合,
其中,所述反应性稀释剂包含杂环四元环。
2.根据权利要求1所述的导体装置,其中所述杂环四元环为氧杂环丁烷。
3.根据权利要求2所述的导体装置,其中所述氧杂环丁烷为3-乙基-3-羟甲基氧杂环丁烷、3-乙基-3-[(2-乙基己基氧基)甲基]氧杂环丁烷;和/或3-乙基-3-{[(3-乙基氧杂环丁烷-3-基)甲氧基]甲基}氧杂环丁烷。
4.根据权利要求1至3之一所述的导体装置,其中,所述杂环四元环在所述浸渍树脂中的含量在0.01至50重量%之间。
5.根据权利要求1至3之一所述的导体装置,其中,所述杂环四元环在所述浸渍树脂中的含量在0.01至10重量%之间。
6.根据权利要求1至3之一所述的导体装置,其中,还包含叔胺作为阴离子固化催化剂存在。
7.根据权利要求1至3之一所述的导体装置,其中,在所述浸渍树脂中存在至少一种有机和/或无机纳米级填料。
8.根据权利要求1至3之一所述的导体装置,其中,在所述浸渍树脂中存在至少一种有机和/或无机微米级填料。
9.根据权利要求1至3之一所述的导体装置,其中,主绝缘(12)具有多孔材料,并且用于所述浸渍树脂的固化催化剂被包含在所述多孔材料中。
10.电线圈,具有根据权利要求1至9之一所述的导体装置(2)。
11.电机,具有根据权利要求1至9之一所述的导体装置(2)。
12.根据权利要求11所述的电机,其中,所述电机为旋转电机。
CN201580062729.4A 2014-10-24 2015-10-19 浸渍树脂、导体装置、电线圈和电机 Expired - Fee Related CN107075231B (zh)

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