CN107068425A - The pin electrode package locator of capacitor four - Google Patents
The pin electrode package locator of capacitor four Download PDFInfo
- Publication number
- CN107068425A CN107068425A CN201710388753.8A CN201710388753A CN107068425A CN 107068425 A CN107068425 A CN 107068425A CN 201710388753 A CN201710388753 A CN 201710388753A CN 107068425 A CN107068425 A CN 107068425A
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- encapsulation
- retention
- short side
- capacitor
- frame body
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
Abstract
The invention discloses a kind of pin electrode package locator of capacitor four, encapsulation positioning frame body including encapsulating porch on capacitor package shell for buckle closure, encapsulation positioning frame body inwall mutually coats spacing contact with capacitor case outer wall to be packaged, encapsulation positioning frame body upper port sets encapsulation retention Hp, four encapsulation positioning holes spacing with the pin extraction electrode phase accurate contraposition of capacitor four are set in encapsulation retention Hp, if the envelope lip height dimension encapsulated between the encapsulation retention Hp upper surface of positioning hole and capacitor package shell upper port is more than or equal to the extraction length dimension that the pin extraction electrode of capacitor four draws capacitor package shell upper port；Encapsulation positioning frame body, encapsulation retention Hp and encapsulation positioning hole are that structure is made in integral type.Just precise positioning can be carried out before epoxy packages are produced to the pin electrode of power capacitor four, four pin electrodes after encapsulation is not glanced off layout pitch distance between skew, each pin and do not occur deviation, positioning accurate accuracy is high.
Description
Technical field
The present invention relates to a kind of electrode for capacitors pin location structure, use and draw to capacitor four more particularly, to one kind
The encapsulation locator that pin electrode is packaged.
Background technology
The electrode pin and capacitor battery core of capacitor are before being encapsulated into capacitor case, it usually needs carry out to electric capacity
Device battery core and pin can just carry out follow-up encapsulation production after being positioned, can both improve the neat quality of the outward appearance of capacitor in itself
Effect, electrode for capacitors pin can be improved again, and to enter the production install convenient that uses of various circuit electricals in the later stage reliable and stable
Property, if alignment quality control cloth is in place, easily to follow-up using a series of problems is brought, even directly resulting in can not
Form qualified product export；And for the relatively high power capacitor such as the automobile with four electrode pins 61, steamer or electric power,
If when its application is used into installation on circuit boards, then to the inner core of capacitor 60 of four pin electrodes 61（See Fig. 6）
Positioning before each pin package just seems more strict requirements, is installed because the pin of capacitor four on circuit board is electrically connected
Hole is, when PCB pulls making sheet, drilling to be automatically positioned with regard to system, and the arrangement pitch distance between pin has been entirely accurate
Constant, this requires the pin electrode 61 of four pin electrode capacitors on circuit boards to be installed to accurately correspond to electricity
The welding hole being made on the plate of road, could in process of production can quickly in the insertion circuit board without damage, if
The pin electrode 61 of four pin electrode capacitors occurs encapsulation deflection in encapsulation and either offset, then directly resulting in install
Carry out being welded to form effective control circuit of correlation on circuit board.
The content of the invention
The present invention is existed to installing and using four electricity before circuit board to solve existing four pins electrode power capacitor
Pole pin easily produces distribution distance fusion between pin deflection or skew, pin when encapsulating production and, with there is relatively large deviation, led
Causing can not to be effectively mounted directly the one kind provided using the present situation such as on circuit boards can be to the pin electrode of power capacitor four
With regard to carrying out precise positioning before epoxy packages production is entered, the pin electrode of the power capacitor after epoxy packages four is set not occur partially
Deviation does not occur for layout pitch distance between tiltedly skew, each pin, improves the pin electrode package precise positioning degree of power capacitor four
The pin electrode package locator of capacitor four.
The present invention be solve the concrete technical scheme that is used of above-mentioned technical problem for：A kind of pin electrode of capacitor four envelope
Fill locator, it is characterised in that：Encapsulation positioning frame body including encapsulating porch on capacitor package shell for buckle closure, envelope
Dress positioning frame body inwall and capacitor case outer wall to be packaged mutually coat it is spacing contact, encapsulation positioning frame body upper port is provided with encapsulating
Injecting glue window, encapsulation positioning frame body upper port is provided with the encapsulation retention Hp of the extension on the inside of termination, and encapsulation retention Hp is provided with four
The individual encapsulation positioning hole spacing with the packaged pin extraction electrode phase accurate contraposition of capacitor four, is set at encapsulation positioning hole
Envelope lip height dimension between encapsulation retention Hp upper surface and capacitor package shell upper port draws more than or equal to capacitor four
Pin extraction electrode draws the extraction length dimension of capacitor package shell upper port；Encapsulate positioning frame body, encapsulation retention Hp and envelope
Dress positioning hole is that structure is made in integral type.The pin electrode of power capacitor four can entered before epoxy packages production with regard to carrying out
Precise positioning, make the pin electrode of the power capacitor after epoxy packages four do not glance off between skew, each pin layout pitch away from
From not occurring deviation, the pin electrode package precise positioning degree of power capacitor four is improved.Encapsulate locator reusable, structure
Simple cost is low, improves product first-time qualification rate and lifting product quality, it is to avoid the appearance of substandard product, reduction manufacture control
Cost.Encapsulation positioning frame body has the shape deformation phenomenon for preventing capacitor after epoxy packages.
Positioning frame body is encapsulated preferably, described encapsulation positioning frame body is rectangle, encapsulation retention Hp is located at rectangle
Encapsulate at the inner side of positioning frame body short side termination, form the short side encapsulation retention Hp of rectangle encapsulation positioning frame body, encapsulation is fixed
Position hole is located in short side encapsulation retention Hp；The long side end head medial surface of rectangle encapsulation positioning frame body is plane walled structure.Improve
To the encapsulation positioning stablity reliability of the pin extraction electrode of capacitor four, reduction encapsulation retention Hp is when being packaged injecting glue operation
The adverse effect caused, improves the reliable validity of operation.
Preferably, described short side encapsulation retention Hp, which includes the first short side, encapsulates retention Hp and the encapsulation positioning of the second short side
Lip, the unilateral short side encapsulation retention Hp of each short side of encapsulation positioning frame body is equipped with the first short side encapsulation retention Hp and two
Second short side encapsulates retention Hp, and each first short side encapsulation retention Hp is provided with two encapsulation positioning holes, two the second short side envelopes
Spaced-apart slots gap structure, spaced-apart slots gap slot bottom and encapsulation posting are respectively provided between dress retention Hp and the first short side encapsulation retention Hp
Internal wall is flush；Second short side encapsulation retention Hp is located at encapsulation positioning frame body upper port short side and long side binding site, the
One short side encapsulation retention Hp bottom face position forms encapsulation positioning frame body button higher than the second short side encapsulation retention Hp bottom face position
When covering at capacitor case upper port to be packaged, the second short side encapsulation retention Hp bottom face connects with capacitor case upper port
Touch and there is the encapsulation positioning of height separated by a distance to tie between the first short side encapsulation retention Hp bottom face and capacitor case upper port
Structure.The encapsulation positioning stablity reliability to the pin extraction electrode of capacitor four is improved, reduction encapsulation retention Hp is being packaged note
The adverse effect caused during adhesive curing, spaced-apart slots gap structure improves injecting glue operation observability, and height is more effective separated by a distance
Control avoid injecting glue solidification from producing to climb glue phenomenon, improve the reliable validity of operation, raising encapsulation positioning product quality.
Preferably, described short side encapsulation retention Hp, which includes the first short side, encapsulates retention Hp and the encapsulation positioning of the second short side
Lip, the unilateral short side encapsulation retention Hp of each short side of encapsulation positioning frame body is equipped with two the first short side encapsulation retention Hps and two
Second short side encapsulates retention Hp, and two the first short side encapsulation retention Hps mutually have the first spaced-apart slots gap structure, the first short side
Encapsulate retention Hp and the second short side encapsulation retention Hp has the second spaced-apart slots gap structure, the first spaced-apart slots breach and each other
Two spaced-apart slots gap slot bottoms are flush with encapsulation positioning frame body inwall；An envelope is equipped with each first short side encapsulation retention Hp
Positioning hole is filled, the second short side encapsulation retention Hp is located at encapsulation positioning frame body upper port short side and at long side binding site, first is short
Banding dress retention Hp bottom face position forms encapsulation positioning frame body buckle closure and existed higher than the second short side encapsulation retention Hp bottom face position
When at capacitor case upper port to be packaged, the second short side encapsulation retention Hp bottom face be in contact with capacitor case upper port and
First short side, which is encapsulated between retention Hp bottom face and capacitor case upper port, has the encapsulation locating structure of height separated by a distance.Carry
The high encapsulation positioning stablity reliability to the pin extraction electrode of capacitor four, reduction encapsulation retention Hp is being packaged injecting glue solidification
Shi Zaocheng adverse effect, spaced-apart slots gap structure improves injecting glue operation observability, and more effective control is kept away height separated by a distance
That exempts from injecting glue solidification generation climbs glue phenomenon, improves the reliable validity of operation, improves encapsulation positioning product quality.
Preferably, described the second short side encapsulation retention Hp is horizontally extended into the second envelope lip in capacitor package shell
Stretch size and horizontally extended into less than the first short side encapsulation retention Hp in the first envelope lip in capacitor package shell and stretch size.Reduction envelope
The adverse effect that dress retention Hp is caused when being packaged injecting glue solidification.
Preferably, described encapsulation positioning frame body, encapsulation retention Hp and encapsulation positioning hole are aluminum alloy material wire cutting
The one-piece integrated structure for forming or pouring into a mould.The validity easy to use of encapsulation locator is improved, structure is more firmly steady
It is fixed reliable, prevent shape deformation phenomenon of the capacitor after epoxy packages from occurring.
Preferably, the pin of capacitor four that the aperture diameter size of described encapsulation positioning hole is more than packaged positioning draws
Go out 0.3~0.6mm of electrode external diameter diameter dimension.Encapsulation positioning precision degree is improved, raising is connected contraposition with pcb board erecting and welding
Precision.
Preferably, described encapsulation positioning frame body height dimension is 10~20mm.Packaged capacitor is prevented in raising
Cost is controlled on the basis of generation shape deformation phenomenon after epoxy packages.
Preferably, described encapsulation positioning frame body encapsulates four framework corners of positioning frame body provided with circle in rectangle
Arc switching groove, center of arc's line of circular arc switching groove encapsulates four framework corners of positioning frame body for rectangle
Vertical connecting line, the arc of circular arc switching groove, which is faced out, concaves towards encapsulation positioning frame body outer face, and circular arc switching groove is set
In the encapsulation retention Hp lower position of encapsulation positioning frame body.Encapsulation positioning frame body is improved to fit with the positioning between capacitor case
Degree, more effective control prevents the shape deformation phenomenon after epoxy packages from occurring.
Positioning frame body is encapsulated preferably, described encapsulation positioning frame body is rectangle, encapsulation retention Hp includes being located at length
Long banding dress retention Hp on the inside of the long side end head of square package positioning frame body encapsulates positioning frame body short side termination with rectangle is located at
The short side encapsulation retention Hp of inner side, encapsulation positioning hole is located in short side encapsulation retention Hp.Improve the envelope to capacitor long side direction
Fill dimensional stability effect.
The beneficial effects of the invention are as follows：The pin electrode of power capacitor four can just be entered before epoxy packages production is entered
Row precise positioning, makes the pin electrode of the power capacitor after epoxy packages four not glance off layout pitch between skew, each pin
Deviation does not occur for distance, improves the pin electrode package precise positioning degree of power capacitor four.Encapsulate locator reusable, knot
The simple cost of structure is low, improves product first-time qualification rate and lifting product quality, it is to avoid the appearance of substandard product, reduction manufacture control
This is made.It is not likely to produce and climbs glue phenomenon, encapsulation positioning uses reliable and stable.Encapsulation positioning frame body prevents capacitor from being sealed in epoxy
Shape deformation phenomenon after dress occurs, and the capacitor profile after package curing is more reliable and more stable to be deformed.
Brief description of the drawings：
The present invention is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is a kind of dimensional structure diagram of the pin electrode package locator of capacitor four of the present invention.
Fig. 2 is another dimensional structure diagram of the pin electrode package locator of capacitor four of the present invention.
Fig. 3 is the main structure diagram of the pin electrode package locator of Fig. 1 capacitors four.
Fig. 4 is Fig. 3 backsight structural representation.
Fig. 5 be in Fig. 3 A-A to structural representation.
Fig. 6 is the four pin capacitor inner core knots that the pin electrode package locator of capacitor four of the present invention to be encapsulated positioning
Structure schematic diagram.
Embodiment
Embodiment 1：
In embodiment shown in Fig. 1, Fig. 3, Fig. 4, Fig. 5, a kind of pin electrode package locator of capacitor four, including for buckle closure
Encapsulated on capacitor package shell outside the encapsulation positioning frame body 10 of porch, encapsulation positioning frame body inwall and capacitor to be packaged
Shell outer wall mutually coats spacing contact, and encapsulation positioning frame body upper port is provided with encapsulation injecting glue window 20, encapsulates positioning frame body upper port
Provided with the encapsulation retention Hp to extension on the inside of termination, four are provided with encapsulation retention Hp and is drawn with the packaged pin of capacitor four
The spacing encapsulation positioning hole 40 of electrode phase accurate contraposition, sets the encapsulation retention Hp upper surface at encapsulation positioning hole to be sealed with capacitor
Envelope lip height dimension between casing upper port is more than or equal to the pin extraction electrode of capacitor four and drawn outside capacitor package
The extraction length dimension of shell upper port；Encapsulation positioning frame body 10, encapsulation retention Hp and encapsulation positioning hole 40 are that knot is made in integral type
Structure.It is that rectangle encapsulates positioning frame body to encapsulate positioning frame body 10, and encapsulation retention Hp is located at rectangle encapsulation positioning frame body short end
At first 30 inner side, the short side encapsulation retention Hp of rectangle encapsulation positioning frame body is formed, encapsulation positioning hole 40 is opened in short side envelope
Fill in retention Hp；First 50 medial surface of the rectangle encapsulation long side end of positioning frame body is plane walled structure.Short side encapsulates retention Hp bag
Include the first short side encapsulation retention Hp 31 and second short side encapsulation retention Hp 32, the unilateral short side envelope of each short side of encapsulation positioning frame body
Dress retention Hp is equipped with two the first short side encapsulation retention Hps 31 and two the second short side encapsulation retention Hps 32, two the first short sides
Encapsulating retention Hp 31 mutually has the first spaced-apart slots breach 33（See Fig. 3）Structure, the first short side encapsulation retention Hp 31 and second is short
Banding dress retention Hp 32 has the structure of the second spaced-apart slots breach 34, the first spaced-apart slots breach 33 and the second spaced-apart slots breach each other
34 bottom lands are flush with the encapsulation inwall of positioning frame body 10；An encapsulation positioning is provided with each first short side encapsulation retention Hp 31
Hole 40（See Fig. 3）, the second short side encapsulation retention Hp 32, which is connected to, to be encapsulated at positioning frame body upper port short side and long side binding site,
First short side encapsulation retention Hp 31 bottom face position forms encapsulation positioning higher than the second short side encapsulation retention Hp 32 bottom face position
When the buckle closure of framework 10 is at capacitor case upper port to be packaged, the second short side encapsulation bottom face of retention Hp 32 and capacitor case
Upper port is in contact and has height separated by a distance between the end face of the first short side encapsulation retention Hp bottom 31 and capacitor case upper port
Encapsulation locating structure.Second short side encapsulates the second short side envelope that retention Hp 32 is extended downwardly from encapsulation positioning frame body 10 upper surface
Set a lip thickness dimension D and encapsulate retention Hp 31 is extended downwardly from encapsulation positioning frame body 10 upper surface first more than the first short side
Short side encapsulation retention Hp thickness E（See Fig. 5）.Second short side encapsulation retention Hp 32 is horizontally extended into capacitor package shell
Size B is stretched in second envelope lip and is horizontally extended into less than the first short side encapsulation retention Hp and is stretched in the first envelope lip in capacitor package shell
Size C (see Fig. 4).Encapsulation positioning frame body 10, encapsulation retention Hp and encapsulation positioning hole 40 be aluminum alloy material wire cutting form or
The one-piece integrated structure of cast.The capacitor four that the aperture diameter size of encapsulation positioning hole 40 is more than packaged positioning draws
0.3~0.6mm of pin extraction electrode external diameter diameter dimension.It is 10~20mm to encapsulate the height dimension of positioning frame body 10.Encapsulation positioning
Framework 10 is provided with circular arc switching groove 35, circular arc switching groove in four framework corners that rectangle encapsulates positioning frame body
35 center of arc's line is the vertical connecting line for four framework corners that rectangle encapsulates positioning frame body, circular arc switching groove
Arc face out and concave towards encapsulation positioning frame body outer face, circular arc switching groove is located at the encapsulation retention Hp of encapsulation positioning frame body
Lower position.
Embodiment 2：
In embodiment illustrated in fig. 2, short side encapsulation retention Hp includes the first short side and encapsulates retention Hp and the second short side encapsulation retention Hp,
The unilateral short side encapsulation retention Hp of each short side of encapsulation positioning frame body is respectively connected with the first short side encapsulation retention Hp 31 and two
Individual second short side encapsulates and is provided with two encapsulation positioning holes 40, two second in retention Hp 32, each first short side encapsulation retention Hp
Short side, which is encapsulated, is respectively provided with spaced-apart slots gap structure, spaced-apart slots gap slot bottom and encapsulation between retention Hp and the first short side encapsulation retention Hp
Positioning frame body inwall is flush；Second short side encapsulation retention Hp is located at encapsulation positioning frame body upper port short side and long side binding site
Place, the first short side encapsulation retention Hp bottom face position forms encapsulation positioning higher than the second short side encapsulation retention Hp bottom face position
When framework buckle closure is at capacitor case upper port to be packaged, the second short side encapsulation retention Hp bottom face and capacitor case upper end
Mouth is in contact and has the encapsulation of height separated by a distance between the first short side encapsulation retention Hp bottom face and capacitor case upper port
Location structure.Other be the same as Examples 1 are identical.
Embodiment 3：
It is that rectangle encapsulates positioning frame body to encapsulate positioning frame body, and encapsulation retention Hp includes being located at the long side of rectangle encapsulation positioning frame body
Long banding dress retention Hp and the short side encapsulation retention Hp being located on the inside of rectangle encapsulation positioning frame body short side termination on the inside of termination,
Encapsulation positioning hole is located in short side encapsulation retention Hp.Other be the same as Examples 1 are identical.
In use, the rectangle that the present invention is encapsulated into locator encapsulates positioning frame body from lid at capacitor openings end to be packaged
Under, and four pin electrodes 61 extraction accurate contraposition of capacitor is passed in the encapsulation retention Hp of rectangle encapsulation positioning frame body
Encapsulation positioning hole 41 after, by rectangle encapsulate the downward gland of positioning frame body at capacitor openings end to be packaged, precise positioning
Four pin extraction electrodes of good capacitor to be packaged, then inject epoxy packaging plastic at encapsulation injecting glue window 20 again.Epoxy is sealed
Rectangle encapsulation positioning frame body is easily removed after dress solidification, the capacitor of four pin extraction electrode precise positionings is obtained, encapsulation is fixed
Position device, which can be repeated several times, to be used.
Above content and structure describes the general principle, principal character and advantages of the present invention of product of the present invention, one's own profession
The technical staff of industry should be recognized that.Merely illustrating the principles of the invention described in examples detailed above and specification, is not departing from this
On the premise of spirit and scope, various changes and modifications of the present invention are possible, and these changes and improvements belong to requirement and protected
Within the scope of the invention of shield.The scope of the present invention is defined by the appended claims and its equivalents.
Claims (10)
1. a kind of pin electrode package locator of capacitor four, it is characterised in that：Including for buckle closure in capacitor package shell
The encapsulation positioning frame body of upper encapsulation porch, encapsulation positioning frame body inwall mutually coats spacing connect with capacitor case outer wall to be packaged
Touch, encapsulation positioning frame body upper port is provided with the extension on the inside of termination provided with encapsulation injecting glue window, encapsulation positioning frame body upper port
Retention Hp is encapsulated, encapsulation retention Hp is spacing with the packaged pin extraction electrode phase accurate contraposition of capacitor four provided with four
Positioning hole is encapsulated, the envelope lip between encapsulation retention Hp upper surface and the capacitor package shell upper port at encapsulation positioning hole is set
Height dimension is more than or equal to the extraction length dimension that the pin extraction electrode of capacitor four draws capacitor package shell upper port；
Encapsulation positioning frame body, encapsulation retention Hp and encapsulation positioning hole are that structure is made in integral type.
2. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning
Framework is that rectangle encapsulates positioning frame body, and encapsulation retention Hp is located at the inner side of rectangle encapsulation positioning frame body short side termination,
The short side encapsulation retention Hp of rectangle encapsulation positioning frame body is formed, encapsulation positioning hole is located in short side encapsulation retention Hp；Rectangle
It is plane walled structure to encapsulate the long side end head medial surface of positioning frame body.
3. according to the pin electrode package locator of capacitor four described in claim 2, it is characterised in that：Described short side encapsulation
Retention Hp includes the first short side and encapsulates retention Hp and the second short side encapsulation retention Hp, encapsulates the short of each short side one side of positioning frame body
Banding dress retention Hp is equipped with the first short side encapsulation retention Hp and two the second short side encapsulation retention Hps, each first short side
Retention Hp is encapsulated provided with two encapsulation positioning holes, two the second short sides are encapsulated between retention Hps and the first short side encapsulation retention Hp
With spaced-apart slots gap structure, spaced-apart slots gap slot bottom is flush with encapsulation positioning frame body inwall；Second short side encapsulates retention Hp
It is located at encapsulation positioning frame body upper port short side and long side binding site, the first short side encapsulation retention Hp bottom face position is higher than the
Two short sides encapsulation retention Hp bottom face position, when forming encapsulation positioning frame body buckle closure at capacitor case upper port to be packaged,
Second short side encapsulation retention Hp bottom face be in contact with capacitor case upper port and the first short side encapsulation retention Hp bottom face and
There is the encapsulation locating structure of height separated by a distance between capacitor case upper port.
4. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described short side encapsulation
Retention Hp includes the first short side and encapsulates retention Hp and the second short side encapsulation retention Hp, encapsulates the short of each short side one side of positioning frame body
Banding dress retention Hp is equipped with two the first short side encapsulation retention Hps and two the second short side encapsulation retention Hps, two the first short sides
Encapsulating retention Hp mutually has the first spaced-apart slots gap structure, the first short side encapsulation retention Hp and the second short side encapsulation retention Hp phase
There is the second spaced-apart slots gap structure, the first spaced-apart slots breach and the second spaced-apart slots gap slot bottom are with encapsulating in positioning frame body between mutually
Wall is flush；An encapsulation positioning hole is equipped with each first short side encapsulation retention Hp, the second short side encapsulation retention Hp is located at
Encapsulate positioning frame body upper port short side and at long side binding site, the first short side encapsulation retention Hp bottom face position is short higher than second
Banding dress retention Hp bottom face position, when forming encapsulation positioning frame body buckle closure at capacitor case upper port to be packaged, second
Short side encapsulation retention Hp bottom face is in contact and the first short side encapsulation retention Hp bottom face and electric capacity with capacitor case upper port
There is the encapsulation locating structure of height separated by a distance between device shell upper port.
5. according to the pin electrode package locator of capacitor four described in claim 3 or 4, it is characterised in that：Described second
Short side encapsulation retention Hp, which is horizontally extended into, stretches size less than the encapsulation positioning of the first short side in the second envelope lip in capacitor package shell
Lip, which is horizontally extended into the first envelope lip in capacitor package shell, stretches size.
6. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning
Framework, encapsulation retention Hp and encapsulation positioning hole are the one-piece integrated structure that aluminum alloy material wire cutting is formed or poured into a mould.
7. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning
The aperture diameter size in hole is more than 0.3~0.6mm of the pin extraction electrode external diameter diameter dimension of capacitor four of packaged positioning.
8. according to the pin electrode package locator of capacitor four described in Claims 2 or 3 or 4, it is characterised in that：Described envelope
It is 10~20mm to fill positioning frame body height dimension.
9. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning
Framework encapsulates four framework corners of positioning frame body provided with circular arc switching groove, the circle of circular arc switching groove in rectangle
Arc center line is the vertical connecting line for four framework corners that rectangle encapsulates positioning frame body, the arc of circular arc switching groove
Face out and concave towards encapsulation positioning frame body outer face, circular arc switching groove is located at orientation under the encapsulation retention Hp of encapsulation positioning frame body
Put place.
10. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation is determined
Position framework is that rectangle encapsulates positioning frame body, and encapsulation retention Hp includes being located on the inside of the long side end head of rectangle encapsulation positioning frame body
Long banding dress retention Hp and the short side encapsulation retention Hp being located on the inside of rectangle encapsulation positioning frame body short side termination, encapsulate positioning hole
It is located in short side encapsulation retention Hp.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710388753.8A CN107068425B (en) | 2017-05-27 | 2017-05-27 | Capacitor four-pin electrode packaging positioner |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710388753.8A CN107068425B (en) | 2017-05-27 | 2017-05-27 | Capacitor four-pin electrode packaging positioner |
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| CN107068425A true CN107068425A (en) | 2017-08-18 |
| CN107068425B CN107068425B (en) | 2023-06-23 |
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