CN206877847U - The pin electrode package locator of capacitor four - Google Patents
The pin electrode package locator of capacitor four Download PDFInfo
- Publication number
- CN206877847U CN206877847U CN201720605915.4U CN201720605915U CN206877847U CN 206877847 U CN206877847 U CN 206877847U CN 201720605915 U CN201720605915 U CN 201720605915U CN 206877847 U CN206877847 U CN 206877847U
- Authority
- CN
- China
- Prior art keywords
- encapsulation
- retention
- short side
- capacitor
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of pin electrode package locator of capacitor four, encapsulation positioning frame body including encapsulating porch on capacitor package shell for buckle closure, encapsulation positioning frame body inwall mutually coats spacing contact with capacitor case outer wall to be packaged, encapsulation positioning frame body upper port sets encapsulation retention Hp, four encapsulation positioning holes spacing with the pin extraction electrode phase accurate contraposition of capacitor four are set in encapsulation retention Hp, if the envelope lip height dimension encapsulated between the encapsulation retention Hp upper surface of positioning hole and capacitor package shell upper port is more than or equal to the extraction length dimension that the pin extraction electrode of capacitor four draws capacitor package shell upper port；Encapsulation positioning frame body, encapsulation retention Hp and encapsulation positioning hole are that structure is made in integral type.Just precise positioning can be carried out before epoxy packages produce to the pin electrode of power capacitor four, four pin electrodes after encapsulation is not glanced off skew, deviation does not occur for layout pitch distance between each pin, and positioning accurate accuracy is high.
Description
Technical field
A kind of electrode for capacitors pin location structure is the utility model is related to, more particularly, to a kind of use to capacitor
The encapsulation locator that four pin electrodes are packaged.
Background technology
The electrode pin and capacitor battery core of capacitor are before being encapsulated into capacitor case, it usually needs carry out to electric capacity
Device battery core and pin can just carry out follow-up encapsulation production after being positioned, can both improve the neat quality of the outward appearance of capacitor in itself
Effect, it is reliable and stable that the production install convenient that electrode for capacitors pin uses in the later stage into various circuit electricals can be improved again
Property, if alignment quality control cloth is in place, easily bring a series of problems to follow-up use, even directly resulting in can not
Form qualified product export；And for the relatively high power capacitor such as the automobile with four electrode pins, steamer or electric power, such as
Fruit be by its using installation on circuit boards when, then to the positioning before each pin package of capacitor of four pin electrodes
Just seem more strict requirements, due on circuit board the pin of capacitor four electrical connection mounting hole be when PCB pulls making sheet,
System is automatically positioned what drilling formed, the arrangement pitch distance between pin has been that entirely accurate is constant, and this requires to treat
The electrode pin of the four pin electrode capacitors of installation on circuit boards can accurately correspond to manufactured weldering on circuit board
Hole, could in process of production can be quickly in the insertion circuit board without damage, if four pin electrode capacitors
Electrode pin occurs encapsulation deflection in encapsulation and either offset, then directly resulting in can not be welded to form in mounting circuit boards
Related effective control circuit.
Utility model content
There is to installing and using before circuit board to solve existing four pins electrode power capacitor for the utility model
Four electrode pins easily produce pin deflection or skew when encapsulation produces, and distribution distance is merged and occurred larger inclined between pin
Difference, the one kind for leading to not effectively to be mounted directly using the present situation such as on circuit boards and providing can be to the pin of power capacitor four
Electrode, with regard to carrying out precise positioning, makes the pin electrode of the power capacitor after epoxy packages four not send out before epoxy packages production is entered
Raw deflection is offset, and deviation does not occur for layout pitch distance between each pin, and it is precisely fixed to improve the pin electrode package of power capacitor four
The pin electrode package locator of capacitor four of position degree.
The utility model is that concrete technical scheme is used by solving above-mentioned technical problem：A kind of pin of capacitor four electricity
Pole encapsulates locator, it is characterised in that：Encapsulation posting including encapsulating porch on capacitor package shell for buckle closure
Body, encapsulation positioning frame body inwall and capacitor case outer wall to be packaged mutually coat it is spacing contact, encapsulate positioning frame body upper port and set
There is encapsulation injecting glue window, encapsulation positioning frame body upper port is provided with the encapsulation retention Hp to extension on the inside of termination, encapsulated in retention Hp
Provided with four encapsulation positioning holes spacing with the packaged pin extraction electrode phase accurate contraposition of capacitor four, encapsulation positioning is set
The envelope lip height dimension between encapsulation retention Hp upper surface and capacitor package shell upper port at hole is more than or equal to electric capacity
The pin extraction electrode of device four draws the extraction length dimension of capacitor package shell upper port；Encapsulate positioning frame body, encapsulation positioning
Lip and encapsulation positioning hole are that structure is made in integral type.Can be to the pin electrode of power capacitor four before epoxy packages production is entered
With regard to carrying out precise positioning, the pin electrode of the power capacitor after epoxy packages four is not glanced off skew, be distributed between each pin
Deviation does not occur for spacing distance, improves the pin electrode package precise positioning degree of power capacitor four.Encapsulation locator is repeatable to be made
With cost simple in construction is low, improves product first-time qualification rate and lifting product quality, avoids the appearance of substandard product, reduce
Manufacture control cost.Encapsulation positioning frame body has the shape deformation phenomenon for preventing capacitor after epoxy packages.
Positioning frame body is encapsulated preferably, described encapsulation positioning frame body is rectangle, encapsulation retention Hp is located at rectangle
Encapsulate at the inner side of positioning frame body short side termination, form the short side encapsulation retention Hp of rectangle encapsulation positioning frame body, encapsulation is fixed
Position hole is located in short side encapsulation retention Hp；Rectangle encapsulation positioning frame body long side termination medial surface is plane walled structure.Improve
To the encapsulation positioning stablity reliability of the pin extraction electrode of capacitor four, encapsulation retention Hp is reduced when being packaged injecting glue operation
Caused by adverse effect, improve and operate reliable validity.
Preferably, described short side encapsulation retention Hp includes the first short side encapsulation retention Hp and the encapsulation positioning of the second short side
Lip, the unilateral short side encapsulation retention Hp of each short side of encapsulation positioning frame body are equipped with the first short side encapsulation retention Hp and two
Second short side encapsulates retention Hp, and each first short side encapsulation retention Hp is provided with two encapsulation positioning holes, two the second short side envelopes
Spaced-apart slots gap structure, spaced-apart slots gap slot bottom and encapsulation posting are respectively provided between dress retention Hp and the first short side encapsulation retention Hp
Internal wall is flush；Second short side encapsulation retention Hp is located at encapsulation positioning frame body upper port short side and long side binding site, the
One short side encapsulation retention Hp bottom face position forms encapsulation positioning frame body button higher than the second short side encapsulation retention Hp bottom face position
When covering at capacitor case upper port to be packaged, the second short side encapsulation retention Hp bottom face connects with capacitor case upper port
Touch and there is the encapsulation positioning of height separated by a distance to tie between the first short side encapsulation retention Hp bottom face and capacitor case upper port
Structure.The encapsulation positioning stablity reliability to the pin extraction electrode of capacitor four is improved, encapsulation retention Hp is reduced and is being packaged note
Adverse effect caused by during adhesive curing, spaced-apart slots gap structure improve injecting glue operation observability, and height is more effective separated by a distance
Control avoids climbing glue phenomenon caused by injecting glue solidification, improves and operates reliable validity, improves encapsulation positioning product quality.
Preferably, described short side encapsulation retention Hp includes the first short side encapsulation retention Hp and the encapsulation positioning of the second short side
Lip, the unilateral short side encapsulation retention Hp of each short side of encapsulation positioning frame body are equipped with two the first short side encapsulation retention Hps and two
Second short side encapsulates retention Hp, and two the first short side encapsulation retention Hps mutually have the first spaced-apart slots gap structure, the first short side
Encapsulation retention Hp and the second short side encapsulation retention Hp have the second spaced-apart slots gap structure each other, the first spaced-apart slots breach and the
Two spaced-apart slots gap slot bottoms are flush with encapsulation positioning frame body inwall；An envelope is equipped with each first short side encapsulation retention Hp
Positioning hole is filled, the second short side encapsulation retention Hp is located at encapsulation positioning frame body upper port short side and at long side binding site, first is short
Banding dress retention Hp bottom face position forms encapsulation positioning frame body buckle closure and existed higher than the second short side encapsulation retention Hp bottom face position
When at capacitor case upper port to be packaged, the second short side encapsulation retention Hp bottom face be in contact with capacitor case upper port and
First short side, which is encapsulated between retention Hp bottom face and capacitor case upper port, has the encapsulation locating structure of height separated by a distance.Carry
The high encapsulation positioning stablity reliability to the pin extraction electrode of capacitor four, reduce encapsulation retention Hp and be packaged injecting glue solidification
When caused by adverse effect, spaced-apart slots gap structure improves injecting glue operation observability, and more effective control is kept away height separated by a distance
Exempt to climb glue phenomenon caused by injecting glue solidification, improve and operate reliable validity, improve encapsulation positioning product quality.
Preferably, described the second short side encapsulation retention Hp is horizontally extended into the second envelope lip in capacitor package shell
Stretch size and horizontally extended into less than the first short side encapsulation retention Hp in the first envelope lip in capacitor package shell and stretch size.Reduce envelope
Dress retention Hp adverse effect caused by when being packaged injecting glue solidification.
Preferably, described encapsulation positioning frame body, encapsulation retention Hp and encapsulation positioning hole are aluminum alloy material wire cutting
Form or pour into a mould the one-piece integrated structure formed.The validity easy to use of encapsulation locator is improved, structure is more firmly steady
It is fixed reliable, prevent shape deformation phenomenon of the capacitor after epoxy packages from occurring.
Preferably, the pin of capacitor four that the aperture diameter size of described encapsulation positioning hole is more than packaged positioning draws
Go out 0.3~0.6mm of electrode external diameter diameter dimension.Encapsulation positioning precision degree is improved, improves and is connected contraposition with pcb board erecting and welding
Precision.
Preferably, described encapsulation positioning frame body height dimension is 10~20mm.Packaged capacitor is prevented in raising
Control cost on the basis of generation shape deformation phenomenon after epoxy packages.
Preferably, described encapsulation positioning frame body is provided with circle in four framework corners of rectangle encapsulation positioning frame body
Arc switching groove, center of arc's line of circular arc switching groove encapsulate four framework corners of positioning frame body for rectangle
Vertical connecting line, the arc of circular arc switching groove, which faces out, concaves towards encapsulation positioning frame body outer face, and circular arc switching groove is set
In the encapsulation retention Hp lower position of encapsulation positioning frame body.Encapsulation positioning frame body is improved to be bonded with the positioning between capacitor case
Degree, more effective control prevent the shape deformation phenomenon after epoxy packages from occurring.
Positioning frame body is encapsulated preferably, described encapsulation positioning frame body is rectangle, encapsulation retention Hp includes being located at length
Long side encapsulation retention Hp on the inside of square package positioning frame body long side termination encapsulates positioning frame body short side termination with rectangle is located at
The short side encapsulation retention Hp of inner side, encapsulation positioning hole are located in short side encapsulation retention Hp.Improve the envelope to capacitor long side direction
Fill dimensional stability effect.
The beneficial effects of the utility model are：Can be to the pin electrode of power capacitor four before epoxy packages production is entered
With regard to carrying out precise positioning, the pin electrode of the power capacitor after epoxy packages four is not glanced off skew, be distributed between each pin
Deviation does not occur for spacing distance, improves the pin electrode package precise positioning degree of power capacitor four.Encapsulation locator is repeatable to be made
With cost simple in construction is low, improves product first-time qualification rate and lifting product quality, avoids the appearance of substandard product, reduce
Manufacture control cost.It is not likely to produce and climbs glue phenomenon, encapsulation positioning uses reliable and stable.Encapsulation positioning frame body prevents capacitor from existing
Shape deformation phenomenon after epoxy packages occurs, and the capacitor profile after package curing is more reliable and more stable to be deformed.
Brief description of the drawings：
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is a kind of dimensional structure diagram of the pin electrode package locator of the utility model capacitor four.
Fig. 2 is another dimensional structure diagram of the pin electrode package locator of the utility model capacitor four.
Fig. 3 is the main structure diagram of the pin electrode package locator of Fig. 1 capacitors four.
Fig. 4 is Fig. 3 backsight structural representation.
Fig. 5 be in Fig. 3 A-A to structural representation.
Embodiment
Embodiment 1：
In embodiment shown in Fig. 1, Fig. 3, Fig. 4, Fig. 5, a kind of pin electrode package locator of capacitor four, including for
Buckle closure encapsulates the encapsulation positioning frame body 10 of porch, encapsulation positioning frame body inwall and electric capacity to be packaged on capacitor package shell
Device outer shell outer wall mutually coats spacing contact, and encapsulation positioning frame body upper port is provided with encapsulation injecting glue window 20, encapsulated in positioning frame body
Port is provided with the encapsulation retention Hp to extension on the inside of termination, encapsulates and is provided with four and the packaged pin of capacitor four in retention Hp
The spacing encapsulation positioning hole 40 of extraction electrode phase accurate contraposition, the encapsulation retention Hp upper surface at encapsulation positioning hole and electric capacity are set
Envelope lip height dimension between device package casing upper port is more than or equal to the pin extraction electrode of capacitor four and draws capacitor envelope
The extraction length dimension of casing upper port；It is integral type system to encapsulate positioning frame body 10, encapsulation retention Hp and encapsulation positioning hole 40
Into structure.It is that rectangle encapsulates positioning frame body to encapsulate positioning frame body 10, and it is short that encapsulation retention Hp is located at rectangle encapsulation positioning frame body
At first 30 inner side of side end, the short side encapsulation retention Hp of rectangle encapsulation positioning frame body is formed, encapsulation positioning hole 40 is opened in short
In banding dress retention Hp；The medial surface of rectangle encapsulation positioning frame body long side termination 50 is plane walled structure.Short side encapsulation positioning
Lip includes the first short side encapsulation retention Hp 31 and second short side encapsulation retention Hp 32, encapsulates the short of each short side one side of positioning frame body
Banding dress retention Hp is equipped with two the first short sides encapsulation retention Hps 31 and two the second short sides encapsulation retention Hps 32, two first
Short side encapsulation retention Hp 31 mutually has the first spaced-apart slots breach 33（See Fig. 3）Structure, the first short side encapsulation retention Hp 31 and the
Two short sides encapsulation retention Hp 32 has the structure of the second spaced-apart slots breach 34, the first spaced-apart slots breach 33 and the second spaced-apart slots each other
The bottom land of breach 34 is flush with the encapsulation inwall of positioning frame body 10；An encapsulation is provided with each first short side encapsulation retention Hp 31
Positioning hole 40（See Fig. 3）, the second short side encapsulation retention Hp 32, which is connected to, encapsulates positioning frame body upper port short side and long side bound site
Place is put, the first short side encapsulation retention Hp 31 bottom face position forms envelope higher than the second short side encapsulation retention Hp 32 bottom face position
When filling the buckle closure of positioning frame body 10 at capacitor case upper port to be packaged, the second short side encapsulation bottom face of retention Hp 32 and electric capacity
Device shell upper port be in contact and have between the end face of the first short side encapsulation retention Hp bottom 31 and capacitor case upper port height every
Open the encapsulation locating structure of distance.Second short side encapsulates second that retention Hp 32 extends downwardly from encapsulation positioning frame body 10 upper surface
Short side encapsulation retention Hp thickness D is more than the first short side encapsulation retention Hp 31 and extended downwardly from encapsulation positioning frame body 10 upper surface
The first short side encapsulation retention Hp thickness E（See Fig. 5）.Second short side encapsulation retention Hp 32 is horizontally extended into outside capacitor package
Size B is stretched in the second envelope lip in shell and horizontally extends into the first envelope in capacitor package shell less than the first short side encapsulation retention Hp
Size C is stretched in lip (see Fig. 4).It is aluminum alloy material wire cutting to encapsulate positioning frame body 10, encapsulation retention Hp and encapsulation positioning hole 40
Form or pour into a mould the one-piece integrated structure formed.The aperture diameter size for encapsulating positioning hole 40 is more than the electric capacity of packaged positioning
0.3~0.6mm of the pin extraction electrode external diameter diameter dimension of device four.It is 10~20mm to encapsulate the height dimension of positioning frame body 10.Envelope
Dress positioning frame body 10 is provided with circular arc switching groove 35 in four framework corners of rectangle encapsulation positioning frame body, and circular arc turns
The center of arc's line for connecing groove 35 is the vertical connecting line of four framework corners of rectangle encapsulation positioning frame body, and circular arc turns
The arc for connecing groove faces out and concaves towards encapsulation positioning frame body outer face, and circular arc switching groove is located at the encapsulation of encapsulation positioning frame body
Retention Hp lower position.
Embodiment 2：
In embodiment illustrated in fig. 2, short side encapsulation retention Hp includes the first short side encapsulation retention Hp and the encapsulation of the second short side is fixed
Position lip, the unilateral short side encapsulation retention Hp of each short side of encapsulation positioning frame body are respectively connected with the first short side encapsulation retention Hp 31
Retention Hp 32 is encapsulated with two the second short sides, each first short side encapsulates and two encapsulation positioning holes 40 are provided with retention Hp, two
Second short side encapsulates and is respectively provided with spaced-apart slots gap structure between retention Hp and the first short side encapsulation retention Hp, spaced-apart slots gap slot bottom with
Encapsulation positioning frame body inwall is flush；Second short side encapsulation retention Hp is located at encapsulation positioning frame body upper port short side and combined with long side
Opening position, the first short side encapsulation retention Hp bottom face position form encapsulation higher than the second short side encapsulation retention Hp bottom face position
When positioning frame body buckle closure is at capacitor case upper port to be packaged, the second short side encapsulation retention Hp bottom face and capacitor case
Upper port is in contact and has height separated by a distance between the first short side encapsulation retention Hp bottom face and capacitor case upper port
Encapsulation locating structure.Other are identical with embodiment 1.
Embodiment 3：
It is that rectangle encapsulates positioning frame body to encapsulate positioning frame body, and encapsulation retention Hp includes being located at rectangle encapsulation positioning frame body
Long side encapsulation retention Hp on the inside of long side termination is determined with the short side encapsulation being located on the inside of rectangle encapsulation positioning frame body short side termination
Position lip, encapsulation positioning hole are located in short side encapsulation retention Hp.Other are identical with embodiment 1.
In use, the rectangle that the utility model is encapsulated to locator encapsulates positioning frame body from capacitor openings end to be packaged
Under place's lid, and four pin extraction electrode accurate contrapositions of capacitor are made to pass the encapsulation retention Hp of rectangle encapsulation positioning frame body
On encapsulation positioning hole 41 after, rectangle is encapsulated into the downward gland of positioning frame body at capacitor openings end to be packaged, it is precisely fixed
Four pin extraction electrodes of the good capacitor to be packaged in position, then inject epoxy packaging plastic at encapsulation injecting glue window 20 again.Epoxy
Rectangle encapsulation positioning frame body is easily removed after package curing, obtains the capacitor of four pin extraction electrode precise positionings, encapsulation
Locator can be repeated several times use.
Above content and structure describes the general principle of the utility model product, principal character and of the present utility model excellent
Point, it should be understood by those skilled in the art that.Simply illustrate principle of the present utility model described in examples detailed above and specification,
On the premise of the spirit and scope of the utility model is not departed from, the utility model also has various changes and modifications, these changes
Belonged to improving within claimed the scope of the utility model.The utility model requires protection scope will by appended right
Ask book and its equivalent thereof.
Claims (10)
- A kind of 1. pin electrode package locator of capacitor four, it is characterised in that：Including for buckle closure in capacitor package shell The encapsulation positioning frame body of upper encapsulation porch, encapsulation positioning frame body inwall mutually coat spacing connect with capacitor case outer wall to be packaged Touch, encapsulation positioning frame body upper port is provided with encapsulation injecting glue window, and encapsulation positioning frame body upper port is provided with to extension on the inside of termination Retention Hp is encapsulated, encapsulation retention Hp is spacing with the packaged pin extraction electrode phase accurate contraposition of capacitor four provided with four Positioning hole is encapsulated, the envelope lip between encapsulation retention Hp upper surface and the capacitor package shell upper port at encapsulation positioning hole is set Height dimension is more than or equal to the extraction length dimension that the pin extraction electrode of capacitor four draws capacitor package shell upper port； Encapsulation positioning frame body, encapsulation retention Hp and encapsulation positioning hole are that structure is made in integral type.
- 2. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning Framework is that rectangle encapsulates positioning frame body, and encapsulation retention Hp is located at the inner side of rectangle encapsulation positioning frame body short side termination, The short side encapsulation retention Hp of rectangle encapsulation positioning frame body is formed, encapsulation positioning hole is located in short side encapsulation retention Hp；Rectangle It is plane walled structure to encapsulate positioning frame body long side termination medial surface.
- 3. according to the pin electrode package locator of capacitor four described in claim 2, it is characterised in that：Described short side encapsulation Retention Hp includes the first short side encapsulation retention Hp and the second short side encapsulation retention Hp, encapsulates the short of each short side one side of positioning frame body Banding dress retention Hp is equipped with the first short side encapsulation retention Hp and two the second short side encapsulation retention Hps, each first short side Encapsulate retention Hp and be provided with two encapsulation positioning holes, between two the second short side encapsulation retention Hps and the first short side encapsulation retention Hp With spaced-apart slots gap structure, spaced-apart slots gap slot bottom is flush with encapsulation positioning frame body inwall；Second short side encapsulates retention Hp It is located at encapsulation positioning frame body upper port short side and long side binding site, the first short side encapsulation retention Hp bottom face position is higher than the Two short sides encapsulation retention Hp bottom face position, when forming encapsulation positioning frame body buckle closure at capacitor case upper port to be packaged, Second short side encapsulation retention Hp bottom face be in contact with capacitor case upper port and the first short side encapsulation retention Hp bottom face and There is the encapsulation locating structure of height separated by a distance between capacitor case upper port.
- 4. according to the pin electrode package locator of capacitor four described in claim 2, it is characterised in that：Described short side encapsulation Retention Hp includes the first short side encapsulation retention Hp and the second short side encapsulation retention Hp, encapsulates the short of each short side one side of positioning frame body Banding dress retention Hp is equipped with two the first short side encapsulation retention Hps and two the second short side encapsulation retention Hps, two the first short sides Encapsulation retention Hp mutually has the first spaced-apart slots gap structure, the first short side encapsulation retention Hp and the second short side encapsulation retention Hp phase There is the second spaced-apart slots gap structure, the first spaced-apart slots breach and the second spaced-apart slots gap slot bottom with encapsulating in positioning frame body between mutually Wall is flush；An encapsulation positioning hole is equipped with each first short side encapsulation retention Hp, the second short side encapsulation retention Hp is located at Encapsulate positioning frame body upper port short side and at long side binding site, the first short side encapsulation retention Hp bottom face position is short higher than second Banding dress retention Hp bottom face position, when forming encapsulation positioning frame body buckle closure at capacitor case upper port to be packaged, second Short side encapsulation retention Hp bottom face is in contact and the first short side encapsulation retention Hp bottom face and electric capacity with capacitor case upper port There is the encapsulation locating structure of height separated by a distance between device shell upper port.
- 5. according to the pin electrode package locator of capacitor four described in claim 3 or 4, it is characterised in that：Described second Short side encapsulation retention Hp, which horizontally extends into, stretches size less than the encapsulation positioning of the first short side in the second envelope lip in capacitor package shell Lip, which is horizontally extended into the first envelope lip in capacitor package shell, stretches size.
- 6. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning Framework, encapsulation retention Hp and encapsulation positioning hole are that aluminum alloy material wire cutting forms or poured into a mould the one-piece integrated structure formed.
- 7. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning The aperture diameter size in hole is more than 0.3~0.6mm of the pin extraction electrode external diameter diameter dimension of capacitor four of packaged positioning.
- 8. according to the pin electrode package locator of capacitor four described in Claims 2 or 3 or 4, it is characterised in that：Described envelope It is 10~20mm to fill positioning frame body height dimension.
- 9. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation positioning Framework is provided with circular arc switching groove, the circle of circular arc switching groove in four framework corners of rectangle encapsulation positioning frame body Arc center line encapsulates the vertical connecting line of four framework corners of positioning frame body, the arc of circular arc switching groove for rectangle Face out and concave towards encapsulation positioning frame body outer face, circular arc switching groove is located at orientation under the encapsulation retention Hp of encapsulation positioning frame body Put place.
- 10. according to the pin electrode package locator of capacitor four described in claim 1, it is characterised in that：Described encapsulation is determined Position framework is that rectangle encapsulates positioning frame body, and encapsulation retention Hp includes being located on the inside of rectangle encapsulation positioning frame body long side termination The short side encapsulation retention Hp that long side encapsulates retention Hp and is located on the inside of rectangle encapsulation positioning frame body short side termination, encapsulates positioning hole It is located in short side encapsulation retention Hp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720605915.4U CN206877847U (en) | 2017-05-27 | 2017-05-27 | The pin electrode package locator of capacitor four |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720605915.4U CN206877847U (en) | 2017-05-27 | 2017-05-27 | The pin electrode package locator of capacitor four |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206877847U true CN206877847U (en) | 2018-01-12 |
Family
ID=61337565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720605915.4U Active CN206877847U (en) | 2017-05-27 | 2017-05-27 | The pin electrode package locator of capacitor four |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206877847U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068425A (en) * | 2017-05-27 | 2017-08-18 | 宁波新容电器科技有限公司 | The pin electrode package locator of capacitor four |
| CN108766763A (en) * | 2018-06-07 | 2018-11-06 | 芜湖市亿仑电子有限公司 | A kind of four pin electrode package positioning devices of capacitor |
-
2017
- 2017-05-27 CN CN201720605915.4U patent/CN206877847U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068425A (en) * | 2017-05-27 | 2017-08-18 | 宁波新容电器科技有限公司 | The pin electrode package locator of capacitor four |
| CN108766763A (en) * | 2018-06-07 | 2018-11-06 | 芜湖市亿仑电子有限公司 | A kind of four pin electrode package positioning devices of capacitor |
| CN108766763B (en) * | 2018-06-07 | 2020-06-09 | 芜湖市亿仑电子有限公司 | Four-pin electrode packaging and positioning device for capacitor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106129020A (en) | Semiconductor package | |
| CN206877847U (en) | The pin electrode package locator of capacitor four | |
| CN204991696U (en) | Sensing chip package subassembly and electronic equipment who has this sensing chip package subassembly | |
| CN103531551A (en) | Semiconductor packaging structure and forming method thereof | |
| JP6204088B2 (en) | Semiconductor device | |
| CN107324274A (en) | The package carrier three-dimensionally integrated for SIP | |
| CN107068425A (en) | The pin electrode package locator of capacitor four | |
| CN204350511U (en) | Power module with heat-radiating substrate and shell, assembling semi-finished product | |
| CN103531550B (en) | The encapsulating structure of the small-space plastic package improved and method for packing | |
| CN206584961U (en) | A kind of LED support, LED support array, LED component and LED display | |
| CN106299768B (en) | A kind of arrangements of electric connection and mobile terminal | |
| CN210628280U (en) | Integrated chip packaging structure | |
| CN207637774U (en) | A kind of novel semi-conductor encapsulating structure, SAW filter and terminal device | |
| CN205692697U (en) | A kind of mold pressing Surface Mount pulse power capacitor device | |
| CN113453476A (en) | Local encapsulation waterproof structure and method | |
| CN203721708U (en) | Radio frequency chip connection sheet assembly | |
| CN203536411U (en) | Semiconductor packaging structure | |
| CN201868250U (en) | Encapsulation lid of capacitor | |
| CN103943598A (en) | Universal pre-packaged substrate structure, packaging structure and packaging method | |
| CN205984976U (en) | Plastic type buries and holds metal crate structure | |
| CN205845710U (en) | Chip high voltage ceramic capacitor | |
| CN208796985U (en) | A kind of semiconductor package structure | |
| CN109449143A (en) | Big surge TVS device of a kind of novel encapsulated for base station and preparation method thereof | |
| CN206908967U (en) | For loading the packaging cartridge of electronic component | |
| CN107240631A (en) | Method for packing, packaging tool and the packaging body of LED flip chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |