CN102891129A - Pre-plastic-package lead frame and package process thereof - Google Patents
Pre-plastic-package lead frame and package process thereof Download PDFInfo
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- CN102891129A CN102891129A CN2012103147579A CN201210314757A CN102891129A CN 102891129 A CN102891129 A CN 102891129A CN 2012103147579 A CN2012103147579 A CN 2012103147579A CN 201210314757 A CN201210314757 A CN 201210314757A CN 102891129 A CN102891129 A CN 102891129A
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- lead frame
- plastic
- capsule body
- plastic packaging
- pin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention relates to a pre-plastic-package lead frame for a sensing chip and an integrated circuit chip of a pressure sensor, and a package process for the pre-plastic-package lead frame. The pre-plastic-package lead frame comprises a lead frame body and a pre-plastic-package shell, wherein the pre-plastic-package shell is a rectangular box body with an inner cavity; the upper end of the pre-plastic-package shell is provided with an opening; and the pre-plastic-package shell is combined with the lead frame through injection molding. The pre-plastic-package shell with the inner cavity is formed on the lead frame body in an injection molding manner; the chips are mounted, and metal wires are bonded in the inner cavity of the pre-plastic-package shell; silica gel is filled in the inner cavity to protect the chips and the metal wires, so that the stability and the yield of a product are improved; each pin of the lead frame is provided with two semicircular locking holes and is locked in the solidified pre-plastic-package shell, so that wet air can be effectively stopped from entering the shell during use, and the product can be prevented from being out of work; and the silica gel is filled to protect the metal wires, so that the wet air can be isolated, ineffectiveness of a circuit is avoided, the whole inner circuit is effectively protected, and the stability of the product is improved.
Description
Technical field
The present invention relates to a kind of lead frame and packaging technology thereof, especially relate to a kind of sensing chip of pressure sensor and pre-plastic packaging lead frame and the packaging technology thereof of integrated circuit (IC) chip.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection that realizes chip internal circuit exit and outer pin by means of bonding material, and the key structure spare of formation electric loop, it has played the function served as bridge that is connected with outer lead, all needing to use lead frame in the semiconductor integrated block of the overwhelming majority, is basic material important in the electronics and information industry.
Plastic package process after the lead frame of existing sensor chip adopts usually, its technical process is: use first epoxy organic conductive glue with chip attachment on lead frame, by Bonding the pad of chip and the pin of lead frame are coupled together with spun gold again, then seal moulding with epoxy resin through injection mould, last outer lead is electroplated one deck terne metal, scale off from the band upper punch again, according to needed shape moulding.Its inside chip and spun gold are only sealed protection by the injection mould plastic packaging, and in the situations such as thermal shock and overstress, internal circuit is easy to lose efficacy, and this also is the low major reason of sensor chip yields.Simultaneously, the inefficacy that the absorption of the moisture of plastic packaging material produces in the prior art is main failure mode, and bonding main dependence plastic packaging material can't prevent the moisture infiltration to the adhesiveness of lead frame between lead frame and the plastic packaging material.
Integrated circuit (IC) chip and pressure sensing chip all are to be mounted on the lead frame in the prior art, and the thermal coefficient of expansion of epoxy molding compound is 60ppm/ ℃, and the thermal coefficient of expansion of lead frame is 17ppm/ ℃, and the thermal coefficient of expansion of chip is 2.6ppm/ ℃.Because the difference of material thermal expansion coefficient under thermal shock, can produce strain, for pressure sensing chip, the strain meeting of its generation directly has influence on the stability of product.
Summary of the invention
The applicant is studied improvement for above-mentioned problem, and a kind of lead frame and packaging technology thereof are provided; isolation moisture reduces thermal shock and overstress to the impact of inside chip, avoids circuit malfunction; effectively protect whole internal circuit, improve product stability and yields.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of pre-plastic packaging lead frame comprises lead frame and preformed capsule body, and described preformed capsule body is upper end open and the rectangular box with inner chamber, and described preformed capsule body is combined with described lead frame by injection moulding; Described lead frame comprises 2 edge strips, several pins and chip support platform, described chip support platform is arranged on the bottom center of preformed capsule body, pin is symmetricly set on the both sides of described chip support platform, the both sides of the edge of described each pin are provided with symmetrically arranged lock hole, described lock hole plastic packaging is in the frame of described preformed capsule body, described each pin extends described preformed capsule body, 2 edge strips are parallel to described pin and are arranged on the both sides of described preformed capsule body, and it is external and connect described pin and described edge strip that the pin brace rod is arranged on described preformed capsule.
Further:
Described lock hole is semicircle.
Described chip support platform is provided with the platform brace rod, and described platform brace rod is L-shaped.
The two ends of described edge strip are provided with location hole.
The material of described preformed capsule body is engineering plastics.
Described lead frame adopts acid bronze alloy to make.
A kind of packaging technology comprises that the following step poly-:
A, make lead frame by etching or Sheet Metal Forming Technology;
B, lead frame electronickelling bottom and partially plating gold;
C, lead frame is put into the mould injection moulding form the preformed capsule body with inner chamber, make pre-plastic packaging lead frame;
D, in preformed capsule intracoelomic cavity, carry out chip attachment, gold wire bonding;
E, fill preformed capsule intracoelomic cavity and loam cake is installed with silica gel.
Technique effect of the present invention is:
The invention discloses a kind of pre-plastic packaging lead frame and packaging technology thereof, injection moulding forms the preformed capsule body with inner chamber on lead frame, carry out chip attachment, gold wire bonding at preformed capsule intracoelomic cavity, and with the inner cavity filled protection chip of silica gel and spun gold, improve product stability and yields; Simultaneously, each pin of lead frame is provided with two semicircle lock holes, and pin is locked in the preformed capsule body of curing, effectively stops moisture in use to enter in the housing, to prevent product failure; In addition, filling gel protection spun gold can not broken under pressure and cause open failure, and can isolate moisture, avoids circuit malfunction, effectively protects whole internal circuit, has improved the stability of product.
Description of drawings
Fig. 1 is the front view of pre-plastic packaging lead frame.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is the three-dimensional structure schematic diagram of pre-plastic packaging lead frame.
Fig. 4 is the structural representation of lead frame.
Fig. 5 is pin and preformed capsule attachment structure schematic diagram.
Fig. 6 is the structural representation behind the chip package.
Fig. 7 is the cutaway view of Fig. 6.
Fig. 8 is the packaging technology flow chart.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail.
Shown in Fig. 1 ~ 5, pre-plastic packaging lead frame comprises lead frame 2 and preformed capsule body 1, preformed capsule body 1 is upper end open and the rectangular box with inner chamber, preformed capsule body 1 is by injection moulding and lead frame 2 combinations, lead frame 2 is as the skeleton of pre-plastic packaging, through forming one with preformed capsule body 1 after the injection moulding.Lead frame 2 comprises 2 edge strips 203,8 pins 202 and chip support platform 201, chip support platform 201 is arranged on the bottom center of preformed capsule body 1, chip support platform 201 is provided with platform brace rod 205, platform brace rod 205 is L-shaped, the stability of chip support platform 201 when platform brace rod 205 guarantees injection moulding.Pin 202 is symmetricly set on the both sides of chip support platform 201, the both sides of the edge of each pin 202 are provided with symmetrically arranged lock hole 207(such as Fig. 4), lock hole 207 is semicircle, lock hole 207 plastic packagings are in the frame of preformed capsule body 1 (such as Fig. 5), each pin 202 extends preformed capsule body 1,2 edge strips 203 are parallel to pin 202 and are arranged on the both sides of preformed capsule body 1, pin brace rod 204 is arranged on outside the preformed capsule body 1 and connects pin 202 and edge strip 203, and the two ends of edge strip 203 are provided with location hole 206.
The location hole 206 of lead frame 2 must with the packing producing line system matches, location hole 206 is positioned at the edge of lead frame 2, location hole can just mate with transmission mechanical part pilot pin, these pilot pins are the parts of producing built-in unit, and equipment comprises loader, bonding equipment, closes to former and printing device.Pin brace rod 204 is as the company's muscle between the pin 202, in pre-plastic packaging process, can prevent that plastic packaging material from gushing out suddenly between pin 202.Chip support platform 201 is used for mounting integrated circuit (IC) chip as the carrier of chip.
In the prior art, the bonding main support plastic packaging material of pin and plastic packaging material is to the adhesiveness of pin, because the difference of storeroom thermal coefficient of expansion, under thermal shock, plastic packaging material and pin are prone to lamination, and moisture easily enters interiors of products by this layering, cause internal circuit to lose efficacy.In the present invention, such as Fig. 4,5, the pin 202 of lead frame all is provided with two semicircle lock holes 207, pin 202 is locked in the plastic packaging material, the structure of lock hole 207 has been improved the adhesiving effect of plastic packaging material to pin greatly, and pin lock hole 207 is as pin locking and moisture structure, and its pin with lead frame is locked in the preformed capsule body 1 of curing, can stop well moisture in use to enter in the housing, to prevent product failure.Simultaneously, among the present invention, replace epoxy resin as plastic packaging material with engineering plastics, the matched coefficients of thermal expansion of engineering plastics and lead frame is better, effectively prevents the lamination of plastic packaging material and lead frame.
Such as Fig. 8, adopt the packaging technology of the pressure sensor of aforementioned lead frame 2 to comprise that the following step poly-:
A, make lead frame 2(such as Fig. 4 by etching or Sheet Metal Forming Technology).
B, lead frame 2 electronickelling bottom and partially plating golds.The thickness of coating of electronickelling bottom is not less than 1.27 millimeters, then carry out partially plating gold, interior pin and chip support platform upper surface thickness of coating should be controlled at more than 0.10 micron, below 1.27 microns, outer pin thickness of coating should be controlled at more than 0.10 micron, below 0.30 micron.
C, lead frame 2 put into the mould injection moulding form preformed capsule body 1(such as the Fig. 1,2,3 with inner chamber), preformed capsule body 1 is combined as a whole with lead frame 2, makes pre-plastic packaging lead frame.
D, carry out the mounting of integrated circuit (IC) chip 3, pressure sensing chip 4, gold wire bonding (Fig. 6) in preformed capsule body 1 inner chamber, integrated circuit (IC) chip 3 is mounted on the chip support platform 201, and pressure sensing chip 4 is mounted on the intracavity bottom of preformed capsule body 1.
E, fill the inner chamber (Fig. 7) of preformed capsule bodies 1 and loam cake (not drawing in the drawings) is installed with silica gel 5.
The production of lead frame 2 can be with chemical etching method or mechanical punching out method, and blank is the band that is rolled into a bundle.Typical beam thickness value is 0.25 millimeter, and the technique of chemical etching is to adopt the chemicals of photoetching and dissolving metal to etch a figure (such as Fig. 4) from metal band.Stamp out location hole at band before the processing, then coat photoresist on the two sides; Photoresist exposes, develops and solidify by lay photoetching mask plate under ultraviolet ray; Photoresist behind the exposure curing carves a profile and prepares to carry out etching at framework at this moment; The chemical substance of similar ferric trichloride or ammonium persulfate is sprayed at the two sides of band, the corrosion of metals of expose portion is fallen and is made framework injury-free.Although the equipment cost that chemical etching method is relevant is lower, its framework production cost is higher than the punching out method.This kind process be suitable for being in the development phase the encapsulation new product, with short production cycle or for the punching out method the too large product of difficulty.When the punching out method was produced lead frame, the band blank that uses the leapfrog mould will be rolled into a bundle was undertaken die-cut by mechanical force, and the required power of die-cut metal is directly proportional with the die-cut metal length of want.
Engineering plastics are as the plastic packaging material of preformed capsule body 1, in the present embodiment, the thermal coefficient of expansion of plastic packaging material is 7ppm/ ℃, the thermal coefficient of expansion of lead frame is 17ppm/ ℃, the thermal coefficient of expansion of chip is 2.6ppm/ ℃, the matched coefficients of thermal expansion of plastic packaging material and pressure sensing chip 4 is good, under thermal shock, the strain that produces is very little, directly be mounted on the structure of lead frame with respect to pressure sensing chip, this structural design of lead frame 2 has improved the precision and stability of pressure sensing chip 4 greatly.Silica gel 5 is filled in the inner chamber of preformed capsule body 1; Protective IC chip 3, pressure sensing chip 4 and spun gold; silica gel has good thermal insulation, insulating properties, moisture resistance, shock resistance, and especially the shock resistance under high frequency is good, has effectively protected chip and spun gold.
Pre-plastic packaging lead frame of the present invention and packaging technology thereof are compared with prior art, integrated circuit (IC) chip is mounted on the lead frame, and pressure sensing chip directly is mounted in the preformed capsule body, adopt simultaneously engineering plastics to substitute traditional epoxide resin material as plastic packaging material, directly being mounted on lead frame with pressure sensing chip compares, the matched coefficients of thermal expansion of chip and plastic packaging material is better, has greatly improved the stability of product.
Claims (7)
1. pre-plastic packaging lead frame, it is characterized in that: comprise lead frame and preformed capsule body, described preformed capsule body is upper end open and the rectangular box with inner chamber, and described preformed capsule body is combined with described lead frame by injection moulding; Described lead frame comprises 2 edge strips, several pins and chip support platform, described chip support platform is arranged on the bottom center of preformed capsule body, pin is symmetricly set on the both sides of described chip support platform, the both sides of the edge of described each pin are provided with symmetrically arranged lock hole, described lock hole plastic packaging is in the frame of described preformed capsule body, described each pin extends described preformed capsule body, 2 edge strips are parallel to described pin and are arranged on the both sides of described preformed capsule body, and it is external and connect described pin and described edge strip that the pin brace rod is arranged on described preformed capsule.
2. according to pre-plastic packaging lead frame claimed in claim 1, it is characterized in that: described lock hole is for semicircle.
3. according to pre-plastic packaging lead frame claimed in claim 1, it is characterized in that: described chip support platform is provided with the platform brace rod, and described platform brace rod is L-shaped.
4. according to pre-plastic packaging lead frame claimed in claim 1, it is characterized in that: the two ends of described edge strip are provided with location hole.
5. according to pre-plastic packaging lead frame claimed in claim 1, it is characterized in that: the material of described preformed capsule body is engineering plastics.
6. according to pre-plastic packaging lead frame claimed in claim 1, it is characterized in that: described lead frame adopts acid bronze alloy to make.
7. packaging technology is characterized in that comprising that the following step poly-:
A, make lead frame by etching or Sheet Metal Forming Technology;
B, lead frame electronickelling bottom and partially plating gold;
C, lead frame is put into the mould injection moulding form the preformed capsule body with inner chamber, make pre-plastic packaging lead frame;
D, in preformed capsule intracoelomic cavity, carry out chip attachment, gold wire bonding;
E, fill preformed capsule intracoelomic cavity and loam cake is installed with silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103147579A CN102891129A (en) | 2012-08-30 | 2012-08-30 | Pre-plastic-package lead frame and package process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103147579A CN102891129A (en) | 2012-08-30 | 2012-08-30 | Pre-plastic-package lead frame and package process thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN102891129A true CN102891129A (en) | 2013-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012103147579A Pending CN102891129A (en) | 2012-08-30 | 2012-08-30 | Pre-plastic-package lead frame and package process thereof |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103178041A (en) * | 2013-03-27 | 2013-06-26 | 日月光封装测试(上海)有限公司 | Lead frame strip and glue sealing method |
| CN104505377A (en) * | 2014-11-03 | 2015-04-08 | 南通富士通微电子股份有限公司 | Semiconductor encapsulation frame |
| CN104977121A (en) * | 2014-04-08 | 2015-10-14 | 阿尔卑斯电气株式会社 | Pressure detection device |
| CN106158809A (en) * | 2015-04-24 | 2016-11-23 | 特科芯有限公司 | TSOP-48L chip package increases the error-proof structure of identification point |
| CN107887359A (en) * | 2016-09-29 | 2018-04-06 | 德克萨斯仪器股份有限公司 | Lead frame |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN109616462A (en) * | 2018-12-04 | 2019-04-12 | 四川金湾电子有限责任公司 | A kind of totally-enclosed symmetric packages lead frame |
| CN111199942A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and plastic packaging method |
| CN112002683A (en) * | 2020-08-25 | 2020-11-27 | 湖南方彦半导体有限公司 | Semiconductor frame |
| CN112694060A (en) * | 2020-12-22 | 2021-04-23 | 青岛歌尔微电子研究院有限公司 | MEMS packaging structure and packaging method thereof |
| CN114557145A (en) * | 2019-09-30 | 2022-05-27 | 西门子股份公司 | Housing for an electronic module and production thereof |
| CN115377019A (en) * | 2022-07-13 | 2022-11-22 | 珠海格力电器股份有限公司 | Packaging structure of device |
| CN115799075A (en) * | 2023-01-31 | 2023-03-14 | 江苏长电科技股份有限公司 | Packaging frame, manufacturing method thereof and packaging structure |
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| CN1421910A (en) * | 2001-11-23 | 2003-06-04 | 深圳市宝安区西乡镇臣田唐锋电器厂 | Image pick-up sensor chip packing method and structure |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103178041A (en) * | 2013-03-27 | 2013-06-26 | 日月光封装测试(上海)有限公司 | Lead frame strip and glue sealing method |
| CN103178041B (en) * | 2013-03-27 | 2016-05-04 | 日月光封装测试(上海)有限公司 | Lead frame moulding and glue sealing method |
| CN104977121A (en) * | 2014-04-08 | 2015-10-14 | 阿尔卑斯电气株式会社 | Pressure detection device |
| CN104977121B (en) * | 2014-04-08 | 2017-10-24 | 阿尔卑斯电气株式会社 | Pressure-detecting device |
| CN104505377A (en) * | 2014-11-03 | 2015-04-08 | 南通富士通微电子股份有限公司 | Semiconductor encapsulation frame |
| CN106158809A (en) * | 2015-04-24 | 2016-11-23 | 特科芯有限公司 | TSOP-48L chip package increases the error-proof structure of identification point |
| CN107887359A (en) * | 2016-09-29 | 2018-04-06 | 德克萨斯仪器股份有限公司 | Lead frame |
| CN107887359B (en) * | 2016-09-29 | 2022-05-31 | 德克萨斯仪器股份有限公司 | Lead frame |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN111199942B (en) * | 2018-11-16 | 2022-05-06 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and plastic packaging method |
| CN111199942A (en) * | 2018-11-16 | 2020-05-26 | 泰州友润电子科技股份有限公司 | High-insulation lead frame and plastic packaging method |
| CN109616462A (en) * | 2018-12-04 | 2019-04-12 | 四川金湾电子有限责任公司 | A kind of totally-enclosed symmetric packages lead frame |
| CN114557145A (en) * | 2019-09-30 | 2022-05-27 | 西门子股份公司 | Housing for an electronic module and production thereof |
| CN114557145B (en) * | 2019-09-30 | 2024-03-15 | 西门子股份公司 | Housing for an electronic module and production thereof |
| CN112002683A (en) * | 2020-08-25 | 2020-11-27 | 湖南方彦半导体有限公司 | Semiconductor frame |
| CN112694060A (en) * | 2020-12-22 | 2021-04-23 | 青岛歌尔微电子研究院有限公司 | MEMS packaging structure and packaging method thereof |
| CN115377019A (en) * | 2022-07-13 | 2022-11-22 | 珠海格力电器股份有限公司 | Packaging structure of device |
| CN115799075A (en) * | 2023-01-31 | 2023-03-14 | 江苏长电科技股份有限公司 | Packaging frame, manufacturing method thereof and packaging structure |
| CN115799075B (en) * | 2023-01-31 | 2023-05-05 | 江苏长电科技股份有限公司 | Packaging frame, manufacturing method thereof and packaging structure |
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Application publication date: 20130123 |