CN107054739B - Resin material transfer device of integrated circuit plastic packaging equipment - Google Patents
Resin material transfer device of integrated circuit plastic packaging equipment Download PDFInfo
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- CN107054739B CN107054739B CN201710397562.8A CN201710397562A CN107054739B CN 107054739 B CN107054739 B CN 107054739B CN 201710397562 A CN201710397562 A CN 201710397562A CN 107054739 B CN107054739 B CN 107054739B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/56—Orientating, i.e. changing the attitude of, articles, e.g. of non-uniform cross-section
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/30—Arranging and feeding articles in groups
- B65B35/36—Arranging and feeding articles in groups by grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/30—Arranging and feeding articles in groups
- B65B35/40—Arranging and feeding articles in groups by reciprocating or oscillatory pushers
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- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model provides an integrated circuit plastic envelope equipment's resin material transfer device, including resin material feeding unit, resin material centre gripping transfer mechanism, resin material upset feeding mechanism, ejecting device is collected to resin material horizontal transfer mechanism and resin material, the clamping part in the centre gripping transfer mechanism is located feeding unit's discharge gate department, upset feeding mechanism is located the discharge gate department at centre gripping transfer mechanism rear portion, horizontal transfer mechanism is located upset feeding mechanism's rear portion, horizontal transfer mechanism is last to have a plurality of equidistant chambeies of depositing, 90 backs when upset feeding mechanism overturns, the resin material can both fall into the corresponding intracavity of depositing in proper order, it has a plurality of storage chambeies to collect ejecting device is last, when horizontal transfer mechanism moved the top of collecting ejecting device, it all falls into the storage intracavity to deposit all resin materials of intracavity. The invention can automatically arrange the resin materials and automatically convey the arranged resin materials to the manipulator, thereby greatly reducing the labor intensity of workers, improving the production efficiency and avoiding personal injury.
Description
Technical Field
The invention relates to integrated circuit plastic packaging equipment, in particular to a resin material transfer device of the integrated circuit plastic packaging equipment.
Background
With the rapid development of electronic industry, people have higher and higher requirements on the plastic packaging process of integrated circuits, and the intelligent degree of the integrated circuits is gradually improved as plastic packaging equipment for plastic packaging. However, most manufacturers still manually place resin materials in the mold when plastic-packaging the integrated circuit, and this placement method is not only inefficient but also unsafe. Although the production efficiency can be greatly improved by adopting the automatic discharging of the manipulator, how to arrange and orderly put the resin materials into the manipulator is an important technical key point, and many manufacturers urgently need to solve the technical problem.
Disclosure of Invention
The invention aims to solve the technical problem of providing a resin material transfer device of integrated circuit plastic package equipment, which can automatically arrange resin materials and automatically convey the arranged resin materials to a mechanical arm, thereby greatly reducing the labor intensity of workers, improving the production efficiency and avoiding personal injury.
The technical scheme of the invention is that the resin material transfer device of the integrated circuit plastic package equipment comprises a resin material feeding device, a resin material clamping and transferring mechanism, a resin material overturning and feeding mechanism, a resin material horizontal transfer mechanism and a resin material collecting and pushing device, wherein the resin material feeding device, the resin material clamping and transferring mechanism, the resin material overturning and transferring mechanism and the resin material collecting and pushing device are arranged on a bracket, the resin material clamping and transferring mechanism is positioned at the rear part of the resin material feeding device, a clamping part in the resin material clamping and transferring mechanism is positioned at a discharging port of the resin material feeding device, the resin material overturning and feeding mechanism is positioned at a discharging port at the rear part of the resin material clamping and transferring mechanism, the resin material horizontal transfer mechanism is positioned at the rear part of the resin material overturning and feeding mechanism, a plurality of storage cavities which are arranged at equal intervals and are used for placing resin materials are arranged on the resin material horizontal transfer mechanism, after the resin material overturning and feeding mechanism is overturned for 90 degrees each time, the resin material can both fall into the corresponding intracavity of depositing in proper order, the ejecting device is located one side of resin material horizontal migration mechanism to resin material collection, set up a plurality ofly on the ejecting device and deposit the diameter in chamber and the equal storage chamber of interval, when resin material horizontal migration mechanism removed the top that ejecting device was collected to resin material, all resin materials of depositing the intracavity fall into the storage intracavity, resin material feeding unit, resin material centre gripping transfer mechanism, resin material upset feeding mechanism, resin material horizontal migration mechanism and resin material collection ejecting device all are connected with the control system electricity.
The resin material conveying device of the integrated circuit plastic packaging equipment comprises a vibration disc and a sensor, wherein the vibration disc is arranged on the top surface of a support, the sensor is arranged at a discharge port of the vibration disc, and a vibration motor and the sensor in the vibration disc are electrically connected with a control system.
The invention relates to a resin material transfer device of integrated circuit plastic package equipment, wherein the resin material clamping and transfer mechanism comprises a support plate, a front vertical plate, a magnetic couple type rodless cylinder, a rear vertical plate, a clamping cylinder, clamping jaws, a feeding track and a push block for pushing resin materials clamped by the clamping jaws backwards along the feeding track, the front vertical plate and the rear vertical plate are all arranged on the top surface of a support, the magnetic couple type rodless cylinder is arranged between the front vertical plate and the rear vertical plate, the clamping cylinder is fixed on the support plate, the support plate is arranged on a cylinder body of the magnetic couple type rodless cylinder, the clamping jaws are two and are respectively positioned at two sides of a discharge port of a vibration disc, the two clamping jaws are arranged on cylinder rods of the clamping cylinder, the push blocks are respectively arranged at the lower parts of the back surfaces of the two clamping jaws, the push block and the clamping jaws are both positioned above the feeding track, and the magnetic couple type rodless cylinder and the clamping cylinder are both controlled by a pneumatic solenoid valve, the pneumatic electromagnetic valve is electrically connected with the control system.
The invention relates to a resin material transfer device of integrated circuit plastic packaging equipment, wherein a resin material overturning and feeding mechanism comprises a charging barrel, a shift lever and a swinging power source for driving the shift lever to overturn for 90 degrees, the swinging power source is arranged on the top surface of a support, one end of the shift lever is connected with a rotating shaft of the swinging power source, the other end of the shift lever is connected with the charging barrel, the front end of an inner cavity of the charging barrel is positioned at a discharge port of a feeding track, a first opening and closing mechanism for opening the inner cavity of the charging barrel to enable resin materials stored in the inner cavity of the charging barrel to fall is arranged at the rear end of the inner cavity of the charging barrel, and the swinging power source is electrically connected with a control system.
The resin material transfer device of the integrated circuit plastic package equipment comprises a first opening and closing mechanism, a first baffle, a top pin and a first spring, wherein the rear end of a charging barrel is provided with a chute, the first baffle is positioned in the chute, the first baffle is provided with a first blanking hole, the first spring is positioned at one end of the first baffle, two ends of the first spring are abutted between the first baffle and the side wall of the chute, a guide pin penetrates through the first spring, the first blanking hole and the inner cavity of the charging barrel are mutually staggered under the action of the jacking force of the first spring, the top pin is arranged at the other end of the first baffle, and the top pin extends out of a through hole formed in the side wall of the chute.
The invention relates to a resin material transfer device of integrated circuit plastic packaging equipment, wherein a resin material horizontal transfer mechanism comprises a resin material storage barrel, a connecting plate and an electric cylinder, the electric cylinder is arranged on the top surface of a support, the connecting plate is arranged on the electric cylinder, the resin material storage barrel is arranged on the connecting plate, a plurality of storage cavities for storing resin materials are formed in the top surface of the resin material storage barrel, a convex plate for pressing down a top pin is arranged behind the storage cavities, the convex plate is positioned on the top surface of the resin material storage barrel, a second opening and closing mechanism for opening the storage cavities to enable all resin materials stored in the resin material storage barrel to fall is arranged at the bottom of the resin material storage barrel, and the electric cylinder is electrically connected with a control system.
The invention relates to a resin material transfer device of integrated circuit plastic package equipment, wherein a second opening and closing mechanism comprises a second baffle plate, a second spring and a guide rod, the second baffle plate is positioned at the bottom of a resin material storage barrel, the second spring is positioned at one end of the second baffle plate, two ends of the second spring are propped between the second baffle plate and the outer wall of the resin material storage barrel, a plurality of second blanking holes are formed in the second baffle plate, the second blanking holes and a storage cavity are mutually staggered under the action of the jacking force of the second spring, the guide rod is arranged at the other end of the second baffle plate, and the guide rod is positioned in a through hole formed in the side wall of the resin material storage barrel.
The resin material conveying device of the integrated circuit plastic package equipment comprises a feeding clamp and a resin lifting mechanism, wherein the resin material collecting and pushing device comprises a plurality of storage cavities, the diameter and the distance of the storage cavities are equal to those of the storage cavities, a stop block is arranged at one end of the feeding clamp and used for pushing a second baffle plate to retract, an ejecting mechanism is arranged on the feeding clamp and used for ejecting the resin material in the storage cavities, and the resin lifting mechanism is electrically connected with a control system.
The resin material transfer device of the integrated circuit plastic packaging equipment comprises a resin lifting mechanism, wherein the resin lifting mechanism comprises a mounting frame, a lifting block, a guide shaft and a driving motor, the mounting frame is fixed on a support, the guide shaft and the driving motor are both arranged on the mounting frame, the lifting block is slidably arranged on the guide shaft, the driving motor drives the lifting block to lift through a belt and a belt pulley, a feeding clamp is arranged at the top of the lifting block, and the driving motor is electrically connected with a control system.
The resin material transfer device of the integrated circuit plastic package equipment comprises a transmitting plate, a guide rod and a return spring, wherein two ends of the guide rod are respectively arranged on a feeding clamp and a lifting block, the return spring is sleeved on the guide rod, two ends of the return spring are pressed between the feeding clamp and the lifting block, the feeding clamp is provided with a long through hole penetrating through all storage cavities, the transmitting plate is positioned in the long through hole, the bottom of the transmitting plate is fixedly connected with the lifting block, the top of the feeding clamp is provided with a limiting groove, and the top of a mounting rack is provided with a limiting pin inserted into the limiting groove.
After adopting the structure, compared with the prior art, the resin material transfer device of the integrated circuit plastic package equipment has the following advantages: the resin material feeding device arranges resin materials in order and continuously conveys the resin materials to a discharge port, the resin material clamping and transferring mechanism clamps the conveyed resin materials and then conveys the resin materials to the resin material overturning and feeding mechanism, the resin material overturning and feeding mechanism receiving the resin materials overturns for 90 degrees in a reciprocating way, after the resin material overturning and feeding mechanism overturns once, the resin material horizontal transferring mechanism performs linear equal-step-pitch displacement once, all the storage cavities are filled with the resin materials finally, then the resin material horizontal transferring mechanism starts to move to the resin material collecting and pushing device and moves all the resin materials in the storage cavities into the storage cavities, finally the resin material collecting and pushing device conveys all the received resin materials to a manipulator, then the resin material collecting and pushing device and the resin material horizontal transferring mechanism reset and receive the resin materials again, and the process is repeated in a reciprocating way, the automatic conveying of the resin material to the manipulator is realized. Therefore, the structure for automatically arranging the resin materials and conveying the arranged resin materials to the mechanical arm in a reciprocating manner greatly lightens the labor intensity of workers, improves the production efficiency and avoids personal injury of the workers.
Drawings
FIG. 1 is a schematic perspective view of a resin material transfer device of an IC molding apparatus according to the present invention;
fig. 2 is a schematic perspective view of the feeding rail hidden by the resin material clamping and transferring mechanism in fig. 1;
FIG. 3 is a schematic perspective view of the resin material turnover feeding mechanism in FIG. 1;
FIG. 4 is an enlarged schematic top view of the loading clamp of the resin material horizontal transfer mechanism and the resin material collection and ejection device in FIG. 1;
fig. 5 is a schematic perspective view of the resin material collecting and pushing device of fig. 1.
Detailed Description
The resin material transfer device of the integrated circuit plastic packaging equipment of the invention is further described in detail with reference to the accompanying drawings and the detailed description:
as shown in fig. 1, in the present embodiment, the resin material transfer device of the ic molding apparatus according to the present invention includes a resin material feeding device 10 mounted on a support 14, a resin material clamping and transferring mechanism 15, a resin material turning and feeding mechanism 13, a resin material horizontal transfer mechanism 12, and a resin material collecting and pushing device 11 for feeding the resin material to a robot. The resin material clamping and transferring mechanism 15 is positioned at the rear part of the resin material feeding device 10, a clamping part in the resin material clamping and transferring mechanism 15 is positioned at a discharge port of the resin material feeding device 10, the resin material overturning and feeding mechanism 13 is positioned at a discharge port at the rear part of the resin material clamping and transferring mechanism 15, the resin material horizontal transferring mechanism 12 is positioned at the rear part of the resin material overturning and feeding mechanism 13, a plurality of storage cavities which are arranged at equal intervals and used for storing resin materials are arranged on the resin material horizontal transferring mechanism 12, after the resin material overturning and feeding mechanism 13 overturns for 90 degrees, the resin materials can fall into the corresponding storage cavities in sequence, the resin material collecting and pushing device 11 is positioned at one side of the resin material horizontal transferring mechanism 12, a plurality of storage cavities which are equal to the storage cavities in diameter and interval are arranged on the resin material collecting and pushing device 11, when the resin material horizontal transferring mechanism 12 moves to the upper part of the resin material collecting and pushing device 11, all resin materials in the storage cavity fall into the storage cavity, and the resin material feeding device 10, the resin material clamping and transferring mechanism 15, the resin material overturning and feeding mechanism 13, the resin material horizontal transferring mechanism 12 and the resin material collecting and pushing device 11 are all electrically connected with the control system. The resin material feeding device 10 arranges resin materials in order and continuously conveys the resin materials to a discharge port, the resin material clamping and transferring mechanism 15 clamps the conveyed resin materials and then conveys the resin materials to the resin material overturning and feeding mechanism 13, the resin material overturning and feeding mechanism 13 receiving the resin materials performs 90-degree overturning in a reciprocating manner, after the resin material overturning and feeding mechanism 13 overturns once, the resin material horizontal transferring mechanism 12 performs linear equal-step displacement once, all storage cavities are filled with the resin materials finally, then, the resin material horizontal transferring mechanism 12 starts to move to the resin material collecting and pushing device 11 and transfers all the resin materials in the storage cavities to the storage cavities, and finally, the resin material collecting and pushing device 11 conveys all the received resin materials to a manipulator (not shown in the figure). And then, the resin material collecting and pushing device 11 and the resin material horizontal transfer mechanism 12 are reset, and the resin material is received again, and the reciprocating circulation is carried out, so that the automatic conveying of the resin material to the manipulator is realized.
The resin material feeding device 10 comprises a vibration disc 101 and a sensor 102, wherein the vibration disc 101 and the sensor 102 are commercially available products. The vibrating disk 101 is arranged on the top surface of the bracket 14, the sensor 102 is arranged at the discharge port of the vibrating disk 101, and the vibrating motor and the sensor 102 in the vibrating disk 101 are electrically connected with the control system. The vibration disc 101 vibrates at high frequency, so that cylindrical resin materials move forward along the track in order under the vibration effect, the sensor 102 is used for detecting whether the resin materials exist at the tail end (the discharge port) of the track, and the control system controls the starting and stopping of the vibration motor in the vibration disc 101 through received detection signals.
Referring to fig. 2, the resin material clamping and transferring mechanism 15 includes a supporting plate 151, a front vertical plate 152, a magnetic coupling type rodless cylinder 153, a rear vertical plate 150, a clamping cylinder 156, a clamping jaw 154, a feeding rail 157, and a pushing block 155 for pushing the resin material clamped by the clamping jaw 154 backward along the feeding rail 157. The feeding rail 157, the front vertical plate 152 and the rear vertical plate 150 are all installed on the top surface of the support 14, the magnetic couple type rodless cylinder 153 is installed between the front vertical plate 152 and the rear vertical plate 150, the clamping cylinder 156 is fixed on the supporting plate 151, the supporting plate 151 is installed on the cylinder body of the magnetic couple type rodless cylinder 153, two clamping jaws 154 are respectively located on two sides of the discharge port of the vibrating disc 101, the two clamping jaws 154 form a clamping portion, the two clamping jaws 154 are installed on the cylinder rod of the clamping cylinder 156, two push blocks 155 are installed on the lower portions of the back sides of the two clamping jaws 154, the push block 155 and the clamping jaws 154 are both located above the feeding rail 157, the magnetic couple type rodless cylinder 153 and the clamping cylinder 156 are controlled by a pneumatic solenoid valve, the pneumatic solenoid valve is electrically connected with a control system, the magnetic couple type rodless cylinder 153 is a commercially available product, and the specific structure thereof is not described herein. . When the resin material is grabbed, the clamping cylinder 156 clamps and drives the two clamping jaws 154 to clamp two sides of the resin material, after clamping of the resin material is completed, the magnetic couple type rodless cylinder 153 drives the clamping cylinder 156 to linearly retreat to convey the resin material to a preset position of the feeding rail 157, and meanwhile, the pushing blocks 155 at the rear portions of the two clamping jaws 154 push the resin material conveyed last time in the feeding rail 157 into the resin material overturning and feeding mechanism 13.
Referring to fig. 3, the resin material turning and feeding mechanism 13 includes a material barrel 132, a shift lever 133, and a swinging power source 131 for driving the shift lever 133 to turn 90 °. The swing power source 131 is a commercially available product, and is installed on the top surface of the bracket 14 and electrically connected to the control system, and the driving lever 133 has one end connected to the rotating shaft of the swing power source 131 and the other end connected to the cartridge 132. The front end of the inner cavity of the charging barrel 132 is positioned at the discharge port of the feeding track 157, and the rear end of the inner cavity of the charging barrel 132 is provided with a first opening and closing mechanism for opening the inner cavity of the charging barrel 132 so as to enable the resin material stored in the inner cavity of the charging barrel to fall. The first opening and closing mechanism comprises a first baffle 135, an ejector pin 138 and a first spring 134, a sliding groove 136 is formed in the rear end of the charging barrel 132, the first baffle 135 is located in the sliding groove 136, a first blanking hole 137 is formed in the first baffle 135, the first spring 134 is located at one end of the first baffle 135, two ends of the first spring are ejected between the side walls of the first baffle 135 and the sliding groove 136, a guide pin penetrates through the first spring 134, the first blanking hole 137 and the inner cavity of the charging barrel 132 are staggered mutually under the action of ejecting force of the first spring 134, the ejector pin 138 is arranged at the other end of the first baffle 135, and the ejector pin 138 extends out of a through hole formed in the side wall of the sliding groove 136. After the resin material is pushed into the charging barrel 132 by the pushing block 155, the swinging power source 131 drives the shifting lever 133 to turn over for 90 °, and during the turning over, the first baffle 135 will block the resin material from falling under the action of the pushing force of the first spring 134.
Referring to fig. 4, the resin horizontal transfer mechanism 12 includes a resin storage cylinder 122, a connection plate 121, and an electric cylinder 123, the electric cylinder 123 is mounted on the top surface of the support 14 and electrically connected to the control system, the connection plate 121 is mounted on the electric cylinder 123, and the resin storage cylinder 122 is mounted on the connection plate 121. The top surface of the resin material storage barrel 122 is provided with a plurality of storage cavities 124 for storing resin materials, the rear part of the storage cavity 124 is provided with a convex plate 125 for pressing down the top pin 138, the convex plate 125 is positioned on the top surface of the resin material storage barrel 122, and the bottom of the resin material storage barrel 122 is provided with a second opening and closing mechanism for opening the storage cavities 124 so as to enable all the resin materials stored in the storage cavities to fall down. When the swing power source 131 is turned over by 90 °, that is, the cartridge 132 is located right above the resin material storage cartridge 122, the ejector pin 138 is pressed in and retracted by the protruding plate 125, the first blanking hole 137 is coaxial with the inner cavity of the cartridge 132, and the resin material falls into the storage cavity 124 under the action of its own gravity. Subsequently, the swing power source 131 is reset to continue to receive the next resin material, and the above-described turning operation is repeated again, and the electric cylinder 123 drives the resin material storage barrel 122 to linearly displace stepwise, so that all the storage chambers 124 can receive the resin materials conveyed from the feed barrel 132 one by one. The electric cylinder 123 is a commercially available product, and thus the detailed structure thereof is not described herein.
Referring to fig. 4, the second opening and closing mechanism includes a second baffle 126, a second spring 127 and a guide rod 128, the second baffle 126 is located at the bottom of the resin material storage cylinder 122, the second spring 127 is located at one end of the second baffle 126, two ends of the second spring 127 are abutted between the second baffle 126 and the outer wall of the resin material storage cylinder 122, a plurality of second blanking holes are formed in the second baffle 126, the second blanking holes and the storage cavity 124 are staggered with each other under the action of the jacking force of the second spring 127, the guide rod 128 is installed at the other end of the second baffle 126, and the guide rod 128 is located in a through hole formed in the side wall of the resin material storage cylinder 122.
Referring to fig. 4 and 5, the resin material collecting and pushing device 11 includes a feeding clamp 114 and a resin lifting mechanism for lifting the feeding clamp 114 to transfer the resin material stored therein to the robot, and the resin lifting mechanism is electrically connected to the control system. The feeding clamp 114 is provided with a plurality of storage cavities 113 with the same diameter and the same distance with the storage cavity 124, one end of the feeding clamp 114 is provided with a stop block 112 for pushing the second stop plate 126 to retract, and the feeding clamp 114 is provided with an ejection mechanism for ejecting all resin materials in the storage cavities 113. After all the storage cavities 124 in the resin material storage barrel 122 store resin materials, the electric cylinder 123 drives the resin material storage barrel 122 to move to the upper side of the feeding clamp 114, and after the second baffle plate 126 touches the stop 112, the second baffle plate 126 is reset under the action of the stopping force, at this time, the second blanking hole is coaxial with the storage cavities 124, and all the resin materials in all the storage cavities 124 fall into the storage cavity 113.
Referring to fig. 5, the resin lifting mechanism includes a mounting frame 110, a lifting block 118, a guide shaft 117 and a driving motor 111, the driving motor 111 is electrically connected to the control system, the mounting frame 110 is fixed on the support 14, the guide shaft 117 and the driving motor 111 are both mounted on the mounting frame 110, the lifting block 118 is slidably mounted on the guide shaft 117, the driving motor 111 drives the lifting block 118 to lift through a belt 119 and a belt pulley, and the feeding clamp 114 is located at the top of the lifting block 118. The ejection mechanism comprises a transmitting plate 115, a guide rod 116 and a return spring 1161, two ends of the guide rod 116 are respectively arranged on the feeding clamp 114 and the lifting block 118, the return spring 1161 is sleeved on the guide rod 116, two ends of the return spring 1161 are ejected between the feeding clamp 114 and the lifting block 118, a long through hole penetrating through all the storage cavities 113 is formed in the feeding clamp 114, the transmitting plate 115 is located in the long through hole, the bottom of the transmitting plate 115 is fixedly connected with the lifting block 118, a limiting groove 1141 is formed in the top of the feeding clamp 114, and a limiting pin 1142 used for being inserted into the limiting groove 1141 is arranged at the top of the mounting frame 110. After the storage cavity 113 receives the resin material, the driving motor 111 drives the feeding clamp 114 to ascend along the guide rod 116 through the belt 119, after the limit pin 1142 is inserted into the limit groove 1141, the feeding clamp 114 stops ascending, at this time, the ascending and descending block 118 continues to ascend, the emitting plate 115 overcomes the elastic force of the return spring 1161 under the driving of the emitting plate to eject all the resin material in the storage cavity 113 into a manipulator (not shown in the figure), and thus, the automatic conveying of the resin material is realized.
The working principle of the invention is as follows: the resin material feeding device 10 makes the cylindrical resin material linearly move along the track through the high-frequency vibration of the vibration disc 101, the orderly arranged resin material continuously moves towards the discharge port, the resin material clamping and transferring mechanism 15 clamps the resin material through the two clamping jaws 154 to clamp the resin material, the magnetic couple type rodless cylinder 153 drives the clamping jaws 154 to linearly move to send the resin material to a preset position on the feeding track 157, and meanwhile, the two push blocks 155 push the resin material which is sent from the feeding track 157 at the previous time into the inner cavity of the charging barrel 132. Swing power source 131 drives feed cylinder 132 through driving lever 133 and makes 90 upsets, under the effect of flange 125, knock pin 138 is impressed the withdrawal, the resin material falls into and deposits the chamber 124, feed cylinder 132 resets afterwards, receive the resin material that is pushed away by ejector pad 155 again, and repeatedly do 90 upsets, after feed cylinder 132 overturns once, electric cylinder 123 all can drive resin material storage cylinder 122 and make the equal step displacement of straight line once, finally make all storage chambers 124 can receive the resin material that is carried by feed cylinder 132 one by one. After the resin storage cylinder 122 is full, the electric cylinder 123 drives the resin storage cylinder 122 to move to the upper part of the feeding clamp 114, and all the resin in the storage cavity 124 falls into the storage cavity 113 under the blocking effect of the stop block 112. The driving motor 111 drives the feeding clamp 114 to ascend along the guide rod 116, when the limit pin 1142 is inserted into the limit groove 1141, the feeding clamp 114 stops moving, the ascending and descending block 118 continues to ascend, and the emission plate 115 is pushed to push all the resin materials in the storage cavity 113 to the manipulator against the elastic force of the return spring 1161, so that the automatic conveying of the resin materials is realized. Next, the resin material collecting and pushing device 11 and the resin material horizontal transfer mechanism 12 are reset, and the above process is repeated again, so that the reciprocating cycle is realized, and the resin material is automatically conveyed to the manipulator.
The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solutions of the present invention by those skilled in the art should fall within the protection scope of the present invention without departing from the design spirit of the present invention.
Claims (10)
1. A resin material transfer device of an integrated circuit plastic packaging device is characterized in that: the manipulator resin material overturning and conveying device comprises a resin material feeding device (10), a resin material clamping and conveying mechanism (15), a resin material overturning and conveying mechanism (13), a resin material horizontal conveying mechanism (12) and a resin material collecting and pushing device (11) which is arranged on a support (14) and used for feeding to a manipulator, wherein the resin material clamping and conveying mechanism (15) is arranged at the rear part of the resin material feeding device (10), a clamping part in the resin material clamping and conveying mechanism (15) is arranged at a discharge hole of the resin material feeding device (10), the resin material overturning and conveying mechanism (13) is arranged at the discharge hole of the rear part of the resin material clamping and conveying mechanism (15), the resin material horizontal conveying mechanism (12) is arranged at the rear part of the resin material overturning and conveying mechanism (13), a plurality of storage cavities which are arranged at equal intervals and used for placing resin materials are arranged on the resin material horizontal conveying mechanism (12), and after the resin material overturning and conveying mechanism (13) overturns for 90 degrees at each time, the resin material can both fall into the corresponding intracavity of depositing in proper order, ejecting device (11) is collected to the resin material is located one side of resin material horizontal migration mechanism (12), sets up a plurality ofly on ejecting device (11) and deposits the storage chamber that the diameter and the interval in chamber equal, when resin material horizontal migration mechanism (12) removed the top that ejecting device (11) was collected to the resin material, deposits all resin materials of intracavity and all fall into and store the intracavity, resin material feeding unit (10), resin material centre gripping conveying mechanism (15), resin material upset feeding mechanism (13), resin material horizontal migration mechanism (12) and resin material collection ejecting device (11) all are connected with the control system electricity.
2. The resin material transfer device of an ic molding apparatus according to claim 1, wherein: resin material feeding unit (10) are including vibration dish (101) and sensor (102), vibration dish (101) dress is on the top surface of support (14), sensor (102) dress is in the discharge gate department of vibration dish (101), and vibrating motor and sensor (102) in the vibration dish (101) all are connected with control system electricity.
3. The resin material transfer device of an ic molding apparatus according to claim 2, wherein: the resin material clamping and transferring mechanism (15) comprises a supporting plate (151), a front vertical plate (152), a magnetic couple type rodless cylinder (153), a rear vertical plate (150), a clamping cylinder (156), clamping jaws (154), a feeding rail (157) and a push block (155) for pushing the resin material clamped by the clamping jaws (154) backwards along the feeding rail (157), the front vertical plate (152) and the rear vertical plate (150) are all arranged on the top surface of the bracket (14), the magnetic couple type rodless cylinder (153) is arranged between the front vertical plate (152) and the rear vertical plate (150), the clamping cylinder (156) is fixed on the supporting plate (151), the supporting plate (151) is arranged on a cylinder body of the magnetic couple type rodless cylinder (153), the clamping jaws (154) are provided with two parts and are respectively positioned on two sides of a discharge hole of the vibrating disc (101), and the two clamping jaws (154) are arranged on a cylinder rod of the clamping cylinder (156), the two push blocks (155) are respectively arranged at the lower parts of the back surfaces of the two clamping jaws (154), the push blocks (155) and the clamping jaws (154) are both positioned above the feeding track (157), the magnetic coupling type rodless cylinder (153) and the clamping cylinder (156) are both controlled by a pneumatic solenoid valve, and the pneumatic solenoid valve is electrically controlled by a control system.
4. The resin material transfer device of an ic molding apparatus according to claim 3, wherein: resin material upset feeding mechanism (13) include feed cylinder (132), driving lever (133) and be used for driving lever (133) and overturn 90 swing power supply (131), swing power supply (131) dress is on support (14) top surface, the one end of driving lever (133) is connected with the pivot of swing power supply (131), and the other end is connected with feed cylinder (132), and the front end of feed cylinder (132) inner chamber is located the discharge gate department of pay-off track (157), and the rear end of feed cylinder (132) inner chamber is equipped with and is used for opening the first on-off mechanism of feed cylinder (132) inner chamber so that the resin material whereabouts of its inside deposit, swing power supply (131) are connected with the control system electricity.
5. The resin material transfer device of the ic plastic packaging equipment according to claim 4, wherein: the first opening and closing mechanism comprises a first baffle (135), an ejector pin (138) and a first spring (134), a sliding groove (136) is formed in the rear end of the charging barrel (132), the first baffle (135) is located in the sliding groove (136), a first blanking hole (137) is formed in the first baffle (135), the first spring (134) is located at one end of the first baffle (135), two ends of the first spring are ejected between the first baffle (135) and the side wall of the sliding groove (136), a guide pin penetrates through the first spring (134), the first blanking hole (137) and the inner cavity of the charging barrel (132) are staggered mutually under the action of ejecting force of the first spring (134), the ejector pin (138) is arranged at the other end of the first baffle (135), and the ejector pin (138) extends out of a through hole formed in the side wall of the sliding groove (136).
6. The resin material transfer device of an ic molding apparatus according to claim 5, wherein: resin material horizontal migration mechanism (12) includes resin material storage cylinder (122), connecting plate (121) and electric cylinder (123), electric cylinder (123) dress is on support (14) top surface, connecting plate (121) dress is on electric cylinder (123), resin material storage cylinder (122) dress is on connecting plate (121), has seted up a plurality of storage chamber (124) that are used for depositing the resin material on the top surface of resin material storage cylinder (122), and the rear of storing chamber (124) is equipped with flange (125) that are used for pushing down knock-pin (138), flange (125) are located the top surface of resin material storage cylinder (122), resin material storage cylinder (122) bottom is equipped with and is used for opening a plurality of storage chamber (124) so that the whole second start-stop mechanism that fall of the resin material of its inside deposit, electric cylinder (123) are connected with control system electricity.
7. The resin material transfer device of an ic molding apparatus according to claim 6, wherein: the second opening and closing mechanism comprises a second baffle (126), a second spring (127) and a guide rod (128), the second baffle (126) is located at the bottom of the resin material storage barrel (122), the second spring (127) is located at one end of the second baffle (126), two ends of the second baffle (126) are propped between the second baffle (126) and the outer wall of the resin material storage barrel (122), a plurality of second blanking holes are formed in the second baffle (126), the second blanking holes and the storage cavity (124) are staggered mutually under the action of jacking force of the second spring (127), the guide rod (128) is installed at the other end of the second baffle (126), and the guide rod (128) is located in a through hole formed in the side wall of the resin material storage barrel (122).
8. The resin material transfer device of an ic molding apparatus according to claim 7, wherein: the resin material collecting and pushing device (11) comprises a feeding clamp (114) and a resin lifting mechanism used for lifting the feeding clamp (114) to transfer resin materials stored in the feeding clamp to the manipulator, a plurality of storage cavities (113) with the same diameter and the same distance as the storage cavities (124) are formed in the feeding clamp (114), a stop block (112) used for pushing a second stop plate (126) to retract is mounted at one end of the feeding clamp (114), an ejection mechanism used for ejecting the resin materials in the storage cavities (113) is arranged on the feeding clamp (114), and the resin lifting mechanism is electrically connected with a control system.
9. The resin material transfer device of an ic molding apparatus according to claim 8, wherein: resin elevating system includes mounting bracket (110), elevator (118), guiding axle (117) and driving motor (111), mounting bracket (110) are fixed on support (14), guiding axle (117) and driving motor (111) all adorn on mounting bracket (110), elevator (118) slidable is installed on guiding axle (117), driving motor (111) drive elevator (118) through belt (119) and belt pulley and go up and down, the material loading presss from both sides (114) and adorns at elevator (118) top, driving motor (111) are connected with the control system electricity.
10. The resin material transfer device of an ic molding apparatus according to claim 9, wherein: the ejection mechanism comprises a transmitting plate (115), a guide rod (116) and a reset spring (1161), wherein two ends of the guide rod (116) are respectively arranged on the feeding clamp (114) and the lifting block (118), the reset spring (1161) is sleeved on the guide rod (116), two ends of the reset spring are ejected between the feeding clamp (114) and the lifting block (118), a long through hole penetrating through all the storage cavities (113) is formed in the feeding clamp (114), the transmitting plate (115) is located in the long through hole, the bottom of the transmitting plate (115) is fixedly connected with the lifting block (118), a limiting groove (1141) is formed in the top of the feeding clamp (114), and a limiting pin (1142) used for being inserted into the limiting groove (1141) is mounted on the top of the mounting frame (110).
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| CN201710397562.8A CN107054739B (en) | 2017-05-31 | 2017-05-31 | Resin material transfer device of integrated circuit plastic packaging equipment |
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| CN107452662B (en) * | 2017-09-13 | 2024-01-30 | 安徽海思达机器人有限公司 | Robot integration platform for chip packaging |
| CN111206887B (en) * | 2020-01-15 | 2021-10-15 | 宝鸡石油机械有限责任公司 | Single-drive double-action holding forceps |
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