CN107001872B - 粘合片 - Google Patents

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Publication number
CN107001872B
CN107001872B CN201580064807.4A CN201580064807A CN107001872B CN 107001872 B CN107001872 B CN 107001872B CN 201580064807 A CN201580064807 A CN 201580064807A CN 107001872 B CN107001872 B CN 107001872B
Authority
CN
China
Prior art keywords
adhesive sheet
intermediate layer
sheet according
meth
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580064807.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN107001872A (zh
Inventor
垣内康彦
藤本泰史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN107001872A publication Critical patent/CN107001872A/zh
Application granted granted Critical
Publication of CN107001872B publication Critical patent/CN107001872B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201580064807.4A 2014-12-24 2015-12-17 粘合片 Active CN107001872B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-260561 2014-12-24
JP2014260561 2014-12-24
PCT/JP2015/085354 WO2016104322A1 (ja) 2014-12-24 2015-12-17 粘着シート

Publications (2)

Publication Number Publication Date
CN107001872A CN107001872A (zh) 2017-08-01
CN107001872B true CN107001872B (zh) 2020-04-07

Family

ID=56150343

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580064807.4A Active CN107001872B (zh) 2014-12-24 2015-12-17 粘合片

Country Status (5)

Country Link
JP (1) JP6717484B2 (ja)
KR (1) KR102460037B1 (ja)
CN (1) CN107001872B (ja)
TW (1) TWI697537B (ja)
WO (1) WO2016104322A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7340323B2 (ja) * 2017-12-27 2023-09-07 株式会社レゾナック・パッケージング 蓄電デバイス用外装材及び蓄電デバイス
JP7422134B2 (ja) * 2019-03-22 2024-01-25 リンテック株式会社 ワーク加工用粘着シートおよびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1254743A (zh) * 1998-11-20 2000-05-31 琳得科株式会社 压敏粘合片及其使用方法
JP2013087131A (ja) * 2011-10-13 2013-05-13 Lintec Corp 粘着シートおよびその使用方法
CN103320033A (zh) * 2012-03-23 2013-09-25 古河电气工业株式会社 半导体晶片表面保护用粘合带

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369584B2 (ja) * 2000-01-21 2009-11-25 日東電工株式会社 半導体ウエハ保持保護用粘着シート
JP4413551B2 (ja) * 2003-07-28 2010-02-10 古河電気工業株式会社 半導体ウエハ面保護用粘着テープ
JP2006282794A (ja) * 2005-03-31 2006-10-19 Furukawa Electric Co Ltd:The ウエハダイシング用粘着テープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1254743A (zh) * 1998-11-20 2000-05-31 琳得科株式会社 压敏粘合片及其使用方法
JP2013087131A (ja) * 2011-10-13 2013-05-13 Lintec Corp 粘着シートおよびその使用方法
CN103320033A (zh) * 2012-03-23 2013-09-25 古河电气工业株式会社 半导体晶片表面保护用粘合带

Also Published As

Publication number Publication date
KR102460037B1 (ko) 2022-10-27
WO2016104322A1 (ja) 2016-06-30
JP6717484B2 (ja) 2020-07-01
KR20170101183A (ko) 2017-09-05
TWI697537B (zh) 2020-07-01
CN107001872A (zh) 2017-08-01
JPWO2016104322A1 (ja) 2017-10-05
TW201629174A (zh) 2016-08-16

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