CN106952995A - A kind of manufacture method of LED lamp bead - Google Patents
A kind of manufacture method of LED lamp bead Download PDFInfo
- Publication number
- CN106952995A CN106952995A CN201710183189.6A CN201710183189A CN106952995A CN 106952995 A CN106952995 A CN 106952995A CN 201710183189 A CN201710183189 A CN 201710183189A CN 106952995 A CN106952995 A CN 106952995A
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- fluorescent material
- fluorescent
- lamp bead
- led lamp
- glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention discloses a kind of manufacture method of LED lamp bead, use airflow screening device that the first larger fluorescent material of particle size range and the second fluorescent material are sieved to the fluorescence powder heap for 3 10 heap different-grain diameters first；Mixed after the first fluorescent material in same particle size range, the second fluorescent material are well mixed with encapsulation glue, fluorescent glue is made after stirring in deaeration, and fluorescent glue is instilled and is provided with the support of LED chip, baking-curing obtains LED lamp bead.The uniformity of fluorescent powder grain particle diameter has been obviously improved after being sieved using airflow screening device to fluorescent material, so that mixed fluorescent powder particle size range is small, it is more easy to be well mixed with encapsulation glue, reduce the requirement in fluorescent glue whipping process to equipment and operation difficulty, and the light intensity of LED lamp bead and photochromic uniformity are high, it is high with a batch of product concentration degree, improve the acceptance rate of encapsulating products, and it is this fluorescent material screening plant and screening mode high degree of automation, simple to operate, suitable for mass industrialized production.
Description
Technical field
The invention belongs to LED encapsulation technologies field, a kind of manufacture method of LED lamp bead is related in particular to.
Background technology
LED (Light Emitting Diode) is light emitting diode, is a kind of semiconducting solid luminescent device, and it is profit
With solid semiconductor chip as luminescent material, when two ends add forward voltage, minority carrier inside semiconductor and many
Number carrier occurs to be combined, and releases superfluous energy and causes photon to be launched, directly sends white light.LED light source have high efficiency,
Long-life, without the harmful substances such as Hg, impact resistance vibrations, real-time color is controllable the advantages of, with the fast development of LED technology,
The performances such as LED brightness, life-span have great lifting so that LED application field is more and more wider.
In the manufacturing process of LED component, encapsulation is a vital link, at present, and LED packaging technologies include solid
Crystalline substance, bonding wire, dispensing, light splitting, packaging and other steps.In above-mentioned steps, gluing process is specially：First fluorescent material is mixed with encapsulation glue
Conjunction forms fluorescent glue, then fluorescent glue is injected into LED support, chip, bonding line in protective cradle.In addition to protection, point
Another important function of adhesive process is：Fluorescent material in encapsulation glue can send visible ray, fluorescent material hair under the exciting of chip
The light that the light gone out can be sent with chip is mutually combined, and realizes different colours, the light transmitting of brightness, so as to realize device color
It is controllable in real time.
During dispensing, the fluorescent material amount and fluorescent material injected in every LEDs device are uniform in the coating of chip surface
Property, determine actual color, the brightness output of same batch LED product.Currently, LED encapsulates enterprise when carrying out gluing process,
Next fluorescent material (being usually two or more) will be purchased first directly to mix with encapsulation glue, then carries out dispensing.But
Caused because variety classes fluorescent material particle diameter is not of uniform size, and fluorescent material even of the same race, its particle diameter distribution also is difficult to uniformly (grain
Footpath distribution is big, and fluorescent powder grain is not of uniform size to be caused).And fluorescent material particle diameter is inconsistent or particle size scope extensively cause very much it is glimmering
Light powder is with packaging plastic shipwreck to be well mixed, so that fluorescent material skewness in encapsulation glue, this fluorescent material is uneven
Distribution causes in dispensing, and the fluorescent glue volume injected in each LED support is identical, but the fluorescent material amount in actual fluorescent glue
Difference occurs, meanwhile, thickness distribution of the fluorescent material in support is difficult to uniform effect.Finally, in batch production,
Because difference occurs in the amount of fluorescent material, it may result in the intrinsic brilliance of encapsulation gained LED product, color and change, with a collection of
Secondary product illumination effect homogeneity is poor, reduces the output concentration degree of batch production.
The content of the invention
Therefore, the technical problems to be solved by the invention be in existing LED packaging technologies fluorescent material particle size range it is wide, with
Homogeneity is poor after encapsulation glue mixing, and LED product illumination effect uniformity is not good obtained by encapsulation, so as to propose a kind of by fluorescence
Dressing sieve is divided into the fluorescent material airflow screening device being packaged after different-grain diameter and the side that LED lamp bead manufacture is carried out using the device
Method.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of manufacture method of LED lamp bead, first using fluorescent material airflow screening device screening fluorescent material,
The screening plant includes screening casing, and the screening casing top offers dog-house, and the screening casing side is provided with
Blast mechanism, the Blast mechanism is connected with the screening box house, and Blast mechanism produces the air-flow of horizontal direction.
Preferably, the Blast mechanism is disposed in proximity to the side of the dog-house.
Preferably, the wind speed of the Blast mechanism air blast is 0.001-5.5m/s.
Preferably, the manufacture method of the LED lamp bead comprises the following steps：
S1, by particle diameter for 0.1-100 μm the first fluorescent material by screening casing dog-house put into, start Blast mechanism,
The flow direction of the Blast mechanism formation air-flow is vertical with the direction that fluorescent material falls, and is 3-10 kinds by first fluorescent material screening
The fluorescence powder heap of particle size range, a length of 480-550nm of the first phosphor emission light wave；
S2, particle diameter put into for 0.3-200 μm of the second fluorescent material by the dog-house, start the Blast mechanism by institute
State the fluorescence powder heap that the screening of the second fluorescent material is particle size range in 3-10, a length of 575- of the second phosphor emission light wave
680nm；
S3, the first fluorescent material in same particle size scope, the second fluorescent material are taken, it is well mixed to obtain mixed fluorescent powder；
S4, the mixed fluorescent powder for obtaining the step S3 are well mixed with encapsulation glue, obtain fluorescent glue, the fluorescence
In glue, the mass percent of mixed fluorescent powder is 1-85%；
S5, by the fluorescent glue instill be provided with the support of LED chip, baking make fluorescence adhesive curing, produce LED
Pearl.
Preferably, in the step S3, the first fluorescent material described in the mixed fluorescent powder and second fluorescent material
Mass ratio be 0.1-100:1.
Preferably, in the step S4, mixed fluorescent powder is uniformly mixed with encapsulation glue by deaeration, it is described de-
It is 20-53 DEG C to steep whipping temp in whipping process, and vacuum is 0-2.5KPa during stirring, and mixing speed is 200-1800rpm/
Min, mixing time 60-1800s.
Preferably, in the step S5, the baking process is：The LED support for having fluorescent glue will be dripped first with 1-15
DEG C/min heating rate rises to 35-120 DEG C by room temperature, prebake conditions 0.5-4h, then be warming up to 1-8 DEG C/min heating rate
130-240 DEG C, 0.5-12h is toasted, makes fluorescence adhesive curing.
Preferably, first fluorescent material, the second fluorescent material be the silicate doped with rare earth element, aluminate,
One kind in phosphate, nitride, fluoride.
Preferably, the encapsulation glue is one in epoxies packaging plastic, organic silicon packaging plastic, polyurethane packaging plastic
Kind.
Preferably, the wavelength of transmitted light of the LED chip is 230-480nm, the viscosity of the fluorescent glue is not less than
850mPa·S。
The above-mentioned technical proposal of the present invention has advantages below compared with prior art：
(1) manufacture method of LED lamp bead of the present invention, first using fluorescent material airflow screening device screening fluorescence
Powder, described device includes screening casing, and the screening casing top offers dog-house, and the screening casing side is provided with drum
Wind mechanism, the Blast mechanism is connected with the screening box house, and Blast mechanism produces the air-flow of horizontal direction.Air blower
The direction that the air-flow that structure is produced falls with fluorescent material is mutually perpendicular to, by the fluorescent material that particle diameter distribution is uneven or particle size range is larger
Sieve as 3-10 kind fluorescence powder heaps, because the fluorescent material of different-grain diameter varies in weight, in the presence of air-flow, bigger glimmering of particle diameter
The backward position apart from air-blast device air port is nearer under light powder, falls behind under the smaller fluorescent material of particle diameter apart from air-blast device air port
Position is more remote, so that the fluorescent material of different-grain diameter be distinguished, and screening plant is simple in construction and can be automatically by fluorescent material according to grain
Footpath is distinguished, and high degree of automation reduces cost of labor, it is adaptable to mass industrial production.
(2) manufacture method of LED lamp bead of the present invention, will be in same particle size range (in airflow screen packing
Put interior same position) the first fluorescent material, the second fluorescent material it is well mixed after mixed with encapsulation glue, deaeration stir after system
Fluorescent glue is obtained, finally fluorescent glue is instilled and is provided with the support of LED chip, baking-curing obtains LED lamp bead.Using airflow screen
Separating device has been obviously improved the uniformity of fluorescent powder grain particle diameter after being sieved to fluorescent material so that mixed fluorescent powder particle diameter model
Enclose small, be more easy to be well mixed with encapsulation glue, reduce the requirement in fluorescent glue whipping process to equipment and operation difficulty, and
By this screening process, the amount controllability of fluorescent material is strong in the fluorescent glue being added dropwise into support, and fluorescent material in fluorescent glue
Distribution uniformity is high, so that the light intensity of LED lamp bead and photochromic uniformity are high, it is high with a batch of product concentration degree, improve envelope
The acceptance rate of product is filled, production cost is reduce further, the economic benefit of encapsulation enterprise is improved.
Brief description of the drawings
In order that present disclosure is more likely to be clearly understood, specific embodiment and combination below according to the present invention
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the fluorescent material airflow screening apparatus structure schematic diagram described in the embodiment of the present invention；
Fig. 2 is the fluorescent material airflow screening device operation principle schematic diagram described in the embodiment of the present invention；
Fig. 3 be the LED lamp bead described in the embodiment of the present invention 1 manufacture method in the first fluorescent material screening after particle diameter distribution
Figure；
Fig. 4 be the LED lamp bead described in the embodiment of the present invention 2 manufacture method in the second fluorescent material screening after particle diameter distribution
Figure；
Fig. 5 is the launching light spectrogram of lamp bead made from the manufacture method of the LED lamp bead described in the embodiment of the present invention 1；
Fig. 6 is the launching light spectrogram of lamp bead made from the manufacture method of the LED lamp bead described in the embodiment of the present invention 2.
Reference is expressed as in figure：1- sieves casing；2- dog-houses；3- Blast mechanisms.
Embodiment
Embodiment 1
The present embodiment provides a kind of manufacture method of LED lamp bead, first using fluorescent material airflow screening device screening fluorescence
Powder, the structural representation of the airflow screening device is as shown in figure 1, it includes sieving casing 1, the top of the screening casing 1
The dog-house 2 for putting into fluorescent material is offered, the side of the screening casing 1 is provided with blast structure 3, the Blast mechanism
3 be conventional drum blower fan, and Blast mechanism 3 may be provided at the inside of screening casing 1 or be connected with the inside of screening casing 1, air-flow is roused
Enter to sieve in casing 1, it is disposed in proximity to the side of dog-house 2, and can produce the air-flow of horizontal direction.
The present embodiment also provides a kind of manufacture method of LED lamp bead, and it comprises the following steps：
S1, particle diameter sieved for 0.1-100 μm of the first fluorescent material by airflow screening device according to particle size, by first
Fluorescent material is put into by the dog-house 2 of screening casing 1, and the wind speed of the air blast of Blast mechanism 3 is 2m/s, and forms the flow direction of air-flow
It is vertical with the direction that fluorescent material falls, after the first fluorescent material is fallen by dog-house 2, the air blower configuration in the side of dog-house 2
Into air-flow first fluorescent material is sieved, the first fluorescent material particle diameter distribution after screening is as shown in figure 3, to the first fluorescent material
Carry out categorised collection, obtain as the fluorescence powder heap of 3-10 kind particle size ranges, in the present embodiment, first fluorescent material be doped with
Tm3+Silicate, its wavelength of transmitted light be 550nm；
S2, particle diameter put into for 0.3-200 μm of the second fluorescent material by the dog-house 2, starting the Blast mechanism 3 will
The second fluorescent material screening is the fluorescence powder heap of 3-10 kind particle size ranges, and second fluorescent material is doped with Ho3+Aluminic acid
Salt, its wavelength of transmitted light is 575nm；
S3, the first fluorescent material and the second fluorescent material (the in same particle size range for taking particle size range to be in 25-30 μm
One fluorescent material and the second fluorescent material are located at the same position of screening casing, cause weight not because fluorescent material particle diameter is of different sizes
Together, under the airflow function of the formation of Blast mechanism 3, the bigger fluorescent material of particle diameter falls in the position close to the air port of Blast mechanism 3, grain
The smaller fluorescent material in footpath falls in the position away from air port, and the particle diameter of final fluorescent material is in normal distribution, the airflow screening device
Operation principle it is as shown in Figure 2), the first fluorescent material of selection is well mixed with the second fluorescent material, mixed fluorescent powder is obtained, its
In the first fluorescent material and the second fluorescent material mass ratio be 0.1：1；
S4, by the obtained mixed fluorescent powders of step S3 and epoxies encapsulation glue be uniformly mixed by deaeration, obtain
Fluorescent glue, deaeration stirring is carried out using automatic agitator, in agitator, and whipping temp is 20 DEG C, and vacuum is
0KPa, mixing speed is 200rpm/min, mixing time 1800s, in the obtained fluorescent glue of stirring, the quality of mixed fluorescent powder
Percentage is 1%, and fluorescence adhesiveness is 860mPaS；
S5, by obtained fluorescent glue instill be fixed with the support of LED chip, the volume of fluorescent glue accounts for support volume
65%, the wavelength of transmitted light of the LED chip is 230nm, and baking drop has the LED support of fluorescent glue so that fluorescence in an oven
Adhesive curing, the process of baking is：Rise to 35 DEG C by room temperature first with 1 DEG C/min heating rate, prebake conditions 4h, then with 1 DEG C/
Min heating rate is warming up to 130 DEG C, toasts 12h, makes fluorescence adhesive curing, is taken out after cooling from baking oven, produces LED lamp bead,
The emission spectrum of lamp bead is as shown in Figure 5.
Embodiment 2
The present embodiment provides a kind of manufacture method of LED lamp bead, and it comprises the following steps：
S1, particle diameter sieved for 0.1-100 μm of the first fluorescent material by airflow screening device according to particle size, by first
Fluorescent material is put into by the dog-house 2 of screening casing 1, and the wind speed of the air blast of Blast mechanism 3 is 5.5m/s, and formed the flow direction of air-flow with
The direction that fluorescent material falls is vertical, and after the first fluorescent material is fallen by dog-house 2, the Blast mechanism in the side of dog-house 2 is formed
Air-flow first fluorescent material is sieved, to the first fluorescent material carry out categorised collection, obtain as the glimmering of 3-10 kind particle size ranges
In light powder heap, the present embodiment, first fluorescent material is the phosphate phosphor doped with rare earth element, and its wavelength of transmitted light is
520nm；
S2, particle diameter put into for 0.3-200 μm of the second fluorescent material by the dog-house, starting the Blast mechanism 3 will
The second fluorescent material screening is the fluorescence powder heap of 3-10 kind particle size ranges, and second fluorescent material is doped with rare earth element
Matter fluorescent powder is fluorinated, its wavelength of transmitted light is 625nm, the second fluorescent material particle diameter distribution such as Fig. 4 institutes after screening in the present embodiment
Show；
S3, take the first fluorescent material and the second fluorescent material that particle size range is in 15-20 μm well mixed, obtain mixing fluorescence
Powder, wherein the mass ratio of the first fluorescent material and the second fluorescent material is 20：1；
S4, by the obtained mixed fluorescent powders of step S3 and epoxies encapsulation glue be uniformly mixed by deaeration, obtain
Fluorescent glue, deaeration stirring is carried out using automatic agitator, in agitator, and whipping temp is 30 DEG C, and vacuum is
1.2KPa, mixing speed is 800rpm/min, mixing time 700s, in the obtained fluorescent glue of stirring, the matter of mixed fluorescent powder
It is 45% to measure percentage, and fluorescence adhesiveness is 900mPaS；
S5, by obtained fluorescent glue instill be fixed with the support of LED chip, the volume of fluorescent glue accounts for support volume
90%, the wavelength of transmitted light of the LED chip is 370nm, and baking drop has the LED support of fluorescent glue so that fluorescence in an oven
Adhesive curing, the process of baking is：Rise to 90 DEG C by room temperature first with 8 DEG C/min heating rate, prebake conditions 2.5h, then with 5 DEG C/
Min heating rate is warming up to 190 DEG C, toasts 8h, makes fluorescence adhesive curing, is taken out after cooling from baking oven, produces LED lamp bead,
The emission spectrum of lamp bead is as shown in Figure 6.
Embodiment 3
The present embodiment provides a kind of manufacture method of LED lamp bead, and it comprises the following steps：
S1, particle diameter sieved for 0.1-100 μm of the first fluorescent material by airflow screening device according to particle size, by first
Fluorescent material is put into by the dog-house 2 of screening casing 1, and the wind speed of the air blast of Blast mechanism 3 is 0.001m/s, and forms the flow direction of air-flow
It is vertical with the direction that fluorescent material falls, after the first fluorescent material is fallen by dog-house 2, the air blower configuration in the side of dog-house 2
Into air-flow first fluorescent material is sieved, to the first fluorescent material carry out categorised collection, obtain as 3-10 kind particle size ranges
In fluorescence powder heap, the present embodiment, first fluorescent material is the Nitride phosphor doped with rare earth element, its wavelength of transmitted light
For 480nm；
S2, particle diameter put into for 0.3-200 μm of the second fluorescent material by the dog-house, starting the Blast mechanism 3 will
The second fluorescent material screening is the fluorescence powder heap of 3-10 kind particle size ranges, and second fluorescent material is doped with rare earth element
Matter fluorescent powder is fluorinated, its wavelength of transmitted light is 680nm；
S3, take the first fluorescent material and the second fluorescent material that particle size range is in 50-60 μm well mixed, obtain mixing fluorescence
Powder, wherein the mass ratio of the first fluorescent material and the second fluorescent material is 100：1；
S4, by the obtained mixed fluorescent powders of step S3 and epoxies encapsulation glue be uniformly mixed by deaeration, obtain
Fluorescent glue, deaeration stirring is carried out using automatic agitator, in agitator, and whipping temp is 53 DEG C, and vacuum is
2.5KPa, mixing speed is 1800rpm/min, mixing time 60s, in the obtained fluorescent glue of stirring, the matter of mixed fluorescent powder
It is 85% to measure percentage, and fluorescence adhesiveness is 950mPaS；
S5, by obtained fluorescent glue instill be fixed with the support of LED chip, the volume of fluorescent glue accounts for support volume
100%, the wavelength of transmitted light of the LED chip is 480nm, and baking drop has the LED support of fluorescent glue so that glimmering in an oven
Optical cement solidifies, and the process of baking is：First 120 DEG C are risen to 15 DEG C/min heating rate by room temperature, prebake conditions 0.5h, then with
8 DEG C/min heating rate is warming up to 240 DEG C, toasts 0.5h, makes fluorescence adhesive curing, is taken out after cooling from baking oven, produces LED
Lamp bead.
Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (10)
1. a kind of manufacture method of LED lamp bead, it is characterised in that first using fluorescent material airflow screening device screening fluorescent material,
The screening plant includes screening casing, and the screening casing top offers dog-house, and the screening casing side is provided with
Blast mechanism, the Blast mechanism is connected with the screening box house, and Blast mechanism produces the air-flow of horizontal direction.
2. the manufacture method of LED lamp bead according to claim 1, it is characterised in that the Blast mechanism is disposed in proximity to
The side of the dog-house.
3. the manufacture method of LED lamp bead according to claim 2, it is characterised in that the wind speed of the Blast mechanism air blast
For 0.001-5.5m/s.
4. the manufacture method of LED lamp bead according to claim 3, it is characterised in that comprise the following steps：
S1, by particle diameter for 0.1-100 μm the first fluorescent material by screening casing dog-house put into, start Blast mechanism, it is described
The flow direction of Blast mechanism formation air-flow is vertical with the direction that fluorescent material falls, and is 3-10 kind particle diameters by first fluorescent material screening
The fluorescence powder heap of scope, a length of 480-550nm of the first phosphor emission light wave；
S2, particle diameter put into for 0.3-200 μm of the second fluorescent material by the dog-house, start the Blast mechanism by described the
The screening of two fluorescent material is the fluorescence powder heap of particle size range in 3-10, a length of 575-680nm of the second phosphor emission light wave；
S3, the first fluorescent material in same particle size scope, the second fluorescent material are taken, it is well mixed to obtain mixed fluorescent powder；
S4, the mixed fluorescent powder for obtaining the step S3 are well mixed with encapsulation glue, obtain fluorescent glue, the fluorescent glue
In, the mass percent of mixed fluorescent powder is 1-85%；
S5, by the fluorescent glue instill be provided with the support of LED chip, baking make fluorescence adhesive curing, produce LED lamp bead.
5. the manufacture method of LED lamp bead according to claim 4, it is characterised in that in the step S3, the mixing is glimmering
First fluorescent material described in light powder is 0.1-100 with the mass ratio of second fluorescent material:1.
6. the manufacture method of LED lamp bead according to claim 5, it is characterised in that in the step S4, mixed fluorescent powder
It is uniformly mixed with encapsulation glue by deaeration, whipping temp is 20-53 DEG C, vacuum during stirring in the deaeration whipping process
Spend for 0-2.5KPa, mixing speed is 200-1800rpm/min, mixing time 60-1800s.
7. the manufacture method of LED lamp bead according to claim 6, it is characterised in that described to toast in the step S5
Cheng Wei：The LED support that drop has fluorescent glue is risen into 35-120 DEG C, prebake conditions with 1-15 DEG C/min heating rate by room temperature first
0.5-4h, then 130-240 DEG C is warming up to 1-8 DEG C/min heating rate, 0.5-12h is toasted, makes fluorescence adhesive curing.
8. the manufacture method of LED lamp bead according to claim 7, it is characterised in that first fluorescent material, the second fluorescence
Powder is one kind in the silicate doped with rare earth element, aluminate, phosphate, nitride, fluoride.
9. the manufacture method of LED lamp bead according to claim 8, it is characterised in that the encapsulation glue seals for epoxies
Fill one kind in glue, organic silicon packaging plastic, polyurethane packaging plastic.
10. the manufacture method of LED lamp bead according to claim 9, it is characterised in that the transmitting light wave of the LED chip
A length of 230-480nm, the viscosity of the fluorescent glue is not less than 850mPaS.
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| CN201710183189.6A CN106952995A (en) | 2017-03-24 | 2017-03-24 | A kind of manufacture method of LED lamp bead |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433218A (en) * | 2013-08-30 | 2013-12-11 | 四川柏狮光电技术有限公司 | Screening equipment for promoting output of color zone of white-light LED lamp bead and screening method thereof |
| CN204107835U (en) * | 2014-09-11 | 2015-01-21 | 宜兴银茂荧光材料有限公司 | Fluorescent material screening machine |
| CN204523503U (en) * | 2015-03-31 | 2015-08-05 | 江苏罗化新材料有限公司 | A kind of fluorescent powder grain vibration separation screen |
| CN105185588A (en) * | 2015-09-22 | 2015-12-23 | 广东风华高新科技股份有限公司 | Preparation method of multilayer ceramic capacitor |
| CN105529388A (en) * | 2016-01-25 | 2016-04-27 | 深圳市聚飞光电股份有限公司 | Implementation method for high-color-gamut white LED (Light Emitting Diode) using red phosphor |
-
2017
- 2017-03-24 CN CN201710183189.6A patent/CN106952995A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103433218A (en) * | 2013-08-30 | 2013-12-11 | 四川柏狮光电技术有限公司 | Screening equipment for promoting output of color zone of white-light LED lamp bead and screening method thereof |
| CN204107835U (en) * | 2014-09-11 | 2015-01-21 | 宜兴银茂荧光材料有限公司 | Fluorescent material screening machine |
| CN204523503U (en) * | 2015-03-31 | 2015-08-05 | 江苏罗化新材料有限公司 | A kind of fluorescent powder grain vibration separation screen |
| CN105185588A (en) * | 2015-09-22 | 2015-12-23 | 广东风华高新科技股份有限公司 | Preparation method of multilayer ceramic capacitor |
| CN105529388A (en) * | 2016-01-25 | 2016-04-27 | 深圳市聚飞光电股份有限公司 | Implementation method for high-color-gamut white LED (Light Emitting Diode) using red phosphor |
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Application publication date: 20170714 |