CN106876542B - A kind of high LED lamp bead packaging method for falling Bin rate - Google Patents
A kind of high LED lamp bead packaging method for falling Bin rate Download PDFInfo
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- CN106876542B CN106876542B CN201710183650.8A CN201710183650A CN106876542B CN 106876542 B CN106876542 B CN 106876542B CN 201710183650 A CN201710183650 A CN 201710183650A CN 106876542 B CN106876542 B CN 106876542B
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- 239000011324 bead Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000012216 screening Methods 0.000 claims abstract description 199
- 239000000843 powder Substances 0.000 claims abstract description 180
- 230000007246 mechanism Effects 0.000 claims abstract description 53
- 239000003292 glue Substances 0.000 claims abstract description 41
- 238000009527 percussion Methods 0.000 claims abstract description 25
- 239000011148 porous material Substances 0.000 claims abstract description 25
- 238000005538 encapsulation Methods 0.000 claims abstract description 16
- 238000003756 stirring Methods 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000010792 warming Methods 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000007873 sieving Methods 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract description 2
- 238000009776 industrial production Methods 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 229910052761 rare earth metal Inorganic materials 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- IBIRZFNPWYRWOG-UHFFFAOYSA-N phosphane;phosphoric acid Chemical compound P.OP(O)(O)=O IBIRZFNPWYRWOG-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cultivation Of Plants (AREA)
- Luminescent Compositions (AREA)
Abstract
The invention discloses a kind of high LED lamp bead packaging methods for falling Bin rate, fluorescent powder is sieved using drum-type fluorescent powder screening plant first, device includes at least two layers screening bucket being successively arranged outward from center, the bucket wall of every layer of screening bucket is provided with sieve pore, and the screen-aperture of every layer of screening bucket is sequentially reduced from inside to outside, the percussion mechanism that screening bucket is connected with the rotary drive mechanism for driving it to rotate and shakes it.And the device can automatic sieving fluorescent powder, improve the consistency of fluorescent powder partial size, work efficiency is high, cost of labor is low, be suitble to large-scale industrial production.Fluorescent powder after screening is easier to encapsulation glue and is uniformly mixed, reduce requirement and the operation difficulty to glue stirring technique and equipment, and effective control can be obtained in fluorescent powder amount in the encapsulation glue injected in bracket, improve LED lamp bead product brightness, the consistency of color obtained by encapsulation, fraction defective is reduced, encapsulation Business Economic Benefit can be obviously improved.
Description
Technical field
The invention belongs to LED encapsulation technology fields, relate in particular to a kind of high LED lamp bead packaging method for falling Bin rate.
Background technique
With the development of semiconductor illumination technique and wideling popularize for application, the light efficiency of LED is constantly being improved, novel optical
Design is also constantly being broken through, and new lamp kind emerges in multitude, and the single situation of product is further being reversed, while controlling software
These huge progress but also LED illumination is more convenient are improved, LED has all been embodied in illumination applications and has and is wide
Application prospect.LED as forth generation light source, have energy-saving and environmental protection, safety, the service life is long, low in energy consumption, brightness is high, waterproof, it is shockproof,
Easily light modulation, the advantages that, be gradually widely used in various fields, such as display, decoration, backlight, general lighting, stage illumination, lighting
Etc..
In the industrial chain of entire LED production, LED encapsulation is one of vital link.In the prior art, LED is sealed
Filling technique mainly includes the techniques such as die bond, bonding wire, dispensing, light splitting, packaging.Wherein, gluing process refers to fluorescent powder and encapsulation
Fluorescent glue is injected into LED support by glue again after being mixed to form fluorescent glue, with chip, the bonding line in protective cradle.In addition to
Except protection, another important function of fluorescent glue gluing process is: the fluorescent powder in encapsulation glue can be sent out under the excitation of chip
Visible light out, the light that the light that the fluorescent powder in fluorescent glue issues can be issued with chip is mutually compound, thus realize different colours,
The light emitting of brightness.
During dispensing, the coating uniformity of the fluorescent powder amount and fluorescent powder injected in every LED is determined same
The actual color of batch LED product, brightness output.Currently, LED encapsulates enterprise when carrying out gluing process, first carrys out buying
Fluorescent powder (usually two or more) directly with encapsulation glue mix, then carry out dispensing.But due to variety classes
Fluorescent powder partial size it is not of uniform size, fluorescent powder even of the same race, particle diameter distribution is also uneven, and (particle size distribution range is big, glimmering
Light powder particles big one are inconsistent).And fluorescent powder partial size is inconsistent or particle size range is too wide, leads to fluorescent powder and packaging plastic
Shipwreck is to be uniformly mixed.Finally make in dispensing, it is practical glimmering although the fluorescent glue volume injected in every LED is identical
Fluorescent powder amount in optical cement will appear difference, meanwhile, fluorescent powder is difficult to realize uniformly coat in bracket.Finally, raw in batch
When production, since difference occurs in the amount of fluorescent powder, intrinsic brilliance, the color that will lead to encapsulation gained LED product change, from
And LED lamp bead falls Bin rate when can reduce batch production, product falls bin rate in same photochromic area and does not concentrate, affected product
Quality.
Summary of the invention
For this purpose, technical problem to be solved by the present invention lies in fluorescent powder partial sizes in existing LED packaging technology to be unevenly distributed
Even, particle size range is wide, mixes not uniform enough with encapsulation glue, the fluorescent powder amount in each package support is difficult to control accurately
One, cause LED product brightness, colour consistency bad, thus propose that one kind makes lamp bead fall bin rate and more concentrates, brightness, color
The good fluorescent powder screening plant of consistency and the method for utilizing the device manufacturing LED lamp bead.
In order to solve the above technical problems, the technical solution of the present invention is as follows:
The present invention provides a kind of high LED lamp bead packaging method for falling Bin rate, uses drum-type fluorescent powder screening plant first
Fluorescent powder is sieved, described device includes at least two layers screening bucket being successively arranged outward from center, the bucket of every layer of screening bucket
Wall is provided with sieve pore, and the screen-aperture of every layer of screening bucket is sequentially reduced from inside to outside, and the screening bucket is connected with for driving
Its rotary drive mechanism rotated and the percussion mechanism for shaking it.
Preferably, the screening bucket is connected to mounting bracket by rotary shaft, described in the rotary drive mechanism driving
Rotary shaft drives the screening bucket to rotate in turn.
Preferably, the rotary shaft is arranged through the screening bucket bottom surface, and the rotary shaft is horizontal by 5-85 °
The axial direction at angle, the screening bucket is parallel with the rotary shaft to make the screening bucket opening upwards horizontal by 5-85 ° of angle
It is obliquely installed.
Preferably, the rotary drive mechanism drives the screening bucket to rotate with the speed of 3~360rpm/min, it is described
Percussion mechanism drives the screening bucket to shake with the frequency of 5-200Hz.
Preferably, the screening bucket is four layers, it is followed successively by the first screening bucket, the second screening bucket, third sieve from inside to outside
Divide bucket and the 4th screening bucket, the screen-aperture of the first screening bucket is 50-99 μm, and the screen-aperture of the second screening bucket is 25-
40 μm, the screen-aperture that third sieves bucket is 10-20 μm, and the screen-aperture of the 4th screening bucket is 1-5 μm.
Preferably, the rotary drive mechanism is driving motor, the percussion mechanism is vibration motor.
Preferably, the LED lamp bead packaging method that the height falls Bin rate includes the following steps:
S1, it takes the first fluorescent powder to be placed in the screening bucket in innermost layer, starts rotary drive mechanism and percussion mechanism, grain
The first fluorescent powder that diameter is less than innermost layer screening bucket screen-aperture enters external screening bucket, and collection cut size is greater than innermost layer and sieves bucket
First fluorescent powder of screen-aperture, until the first fluorescent powder is sifted out by the sieve pore of outermost layer screening bucket；First phosphor particles
Diameter is 0.1-100 μm, wavelength of transmitted light 480-550nm；
S2, it takes the second fluorescent powder to be placed in the screening bucket in innermost layer, starts rotary drive mechanism and percussion mechanism, grain
The second fluorescent powder that diameter is less than innermost layer screening bucket screen-aperture enters external screening bucket, and collection cut size is greater than innermost layer and sieves bucket
Second fluorescent powder of screen-aperture, until the second fluorescent powder is sifted out by the sieve pore of outermost layer screening bucket；First phosphor particles
Diameter is 0.3-120 μm, wavelength of transmitted light 575-680nm；
S3, it is taken respectively in the first fluorescent powder and the second fluorescent powder screened out by same layer screening bucket, is mixed to get mixed
It closes fluorescent powder to be placed in encapsulation glue, formation rubber powder mixture, in the rubber powder mixture, the quality percentage of mixed fluorescent powder
Than for 1-80%；
The rubber powder mixture is stirred in S4, deaeration, obtains fluorescent glue；
S5, fluorescent glue instillation is provided in the bracket of LED chip, the wavelength of transmitted light of the LED chip is
230-480nm, then baking drop has the bracket of fluorescent glue to fluorescence adhesive curing to get LED lamp bead.
Preferably, the mass ratio of the first fluorescent powder and the second fluorescent powder is 0.01-100:1 in the mixed fluorescent powder.
Preferably, temperature is 20-55 DEG C, vacuum degree 0-2KPa in deaeration whipping process described in the step S4,
Mixing speed is 300-1500rpm/min, mixing time 90-1800s.
Preferably, the process of baking described in the step S5 specifically: first with the heating rate of 1-10 DEG C/min
It is warming up to 40-100 DEG C, prebake conditions 0.5-3h, is then warming up to 110-220 DEG C with the heating rate of 1-10 DEG C/min, toasts 1-
15h。
The above technical solution of the present invention has the following advantages over the prior art:
(1) height of the present invention falls the LED lamp bead packaging method of Bin rate, first using drum-type fluorescent powder screening dress
Set screening fluorescent powder, described device includes at least two layers screening bucket being successively arranged outward from center, every layer of screening bucket
Bucket wall is provided with sieve pore, and the screen-aperture of every layer of screening bucket is sequentially reduced from inside to outside, and the screening bucket is connected with for driving
The percussion mechanism for moving the rotary drive mechanism of its rotation and shaking it.When sieving fluorescent powder, fluorescent powder is placed in innermost layer screening
Bucket, the fluorescent powder that partial size is greater than innermost layer screening bucket screen-aperture are sized out, and partial size is less than innermost layer and sieves bucket screen-aperture
Fluorescent powder fall into next layer of screening bucket, and so on, until fluorescent powder by outermost layer screening bucket sieve pore sift out, thus by glimmering
Light powder is distinguished according to particle size range, improves the consistency of fluorescent powder partial size, reduces the particle size range of fluorescent powder, rotation
Driving mechanism and percussion mechanism make screening efficiency high, and the device can automatic sieving fluorescent powder, work efficiency is high, manually at
This is low, is suitble to large-scale industrial production.
(2) the LED lamp bead packaging method of the present invention that Bin rate is fallen using the height, first by the first fluorescent powder,
Second fluorescent powder is sieved respectively with the screening plant, is chosen glimmering by same level-one the first fluorescent powder for screening out of screening bucket and second
It after the mixing of light powder, is uniformly mixed with packaging plastic and fluorescent glue is made, then fluorescent glue instillation is provided in the bracket of LED chip,
Fluorescence adhesive curing is baked to up to LED lamp bead.The first fluorescent powder, the second fluorescent powder partial size consistency after screening is high, it is easier to
It encapsulates glue to be uniformly mixed, reduces requirement and the operation difficulty to glue stirring technique and equipment, and in encapsulation glue
Fluorescent powder is evenly distributed, and effective control can be obtained in fluorescent powder amount in the encapsulation glue injected in bracket, improves obtained by encapsulation
LED lamp bead falls the concentration ratio of bin and the consistency with a collection of LED product brightness, color, reduces fraction defective, can be obviously improved
Encapsulate Business Economic Benefit.
Detailed description of the invention
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the structural schematic diagram of fluorescent powder screening plant described in the embodiment of the present invention 1；
Fig. 2 is the grain size distribution for the first fluorescent powder that screening plant described in the embodiment of the present invention 1 screens out；
Fig. 3 is the launching light spectrogram of LED lamp bead described in the embodiment of the present invention 1；
Fig. 4 is the grain size distribution for the first fluorescent powder that screening plant described in the embodiment of the present invention 2 screens out；
Fig. 5 is the grain size distribution for the first fluorescent powder that screening plant described in the embodiment of the present invention 3 screens out；
Fig. 6 is the launching light spectrogram of LED lamp bead described in the embodiment of the present invention 3.
Appended drawing reference indicates in figure are as follows: 1- first sieves bucket；2- second sieves bucket；3- third sieves bucket；4- the 4th is sieved
Bucket；5- rotary shaft；6- mounting bracket.
Specific embodiment
Embodiment 1
The present embodiment provides a kind of high LED lamp bead packaging methods for falling Bin rate, first using drum-type fluorescent powder screening dress
Set screening fluorescent powder, drum-type fluorescent powder screening plant as shown in Figure 1, described device include successively be arranged outward from center to
Few two layers of screening bucket, every layer of bucket wall for sieving bucket are provided with sieve pore, and from inside to outside the screen-aperture of every layer of screening bucket according to
Secondary reduction, the percussion mechanism that the screening bucket is also connected with the rotary drive mechanism for driving it to rotate and shakes it, institute
Stating rotary drive mechanism is conventional drive motor, and the percussion mechanism is vibration motor.
In the present embodiment, the screening bucket is 4 layers, is successively arranged from inside to outside, and bung hole is towards consistent, from the inside to the outside according to
Secondary is the first screening bucket 1, second screening bucket 2, third screening bucket 3 and the 4th screening bucket 4, and the first screening bucket 1 to the 4th sieves bucket 4
Screen-aperture be sequentially reduced, in the present embodiment first screening bucket 1 screen-aperture be 99 μm, it is described second screening bucket 2 sieve
Hole aperture is 40 μm, and the screen-aperture of the third screening bucket 3 is 20 μm, and the screen-aperture of the 4th screening bucket 4 is 5 μm.
Further, the first screening bucket 1, second sieves bucket 2, third screening bucket the 3, the 4th sieves bucket 4 and passes through a rotation
Shaft 5 is connected to a mounting bracket 6, and the driving mechanism driving rotary shaft 5 rotates and then drives screening bucket rotation, as schemed institute
To show, the rotary shaft 5 is arranged through the bottom center of each screening bucket, and connect with the crossbeam being set at screening bucket bung hole,
Be connected in mounting bracket 6 to will sieve bucket, the rotary shaft 5 is arranged horizontal by 45° angle, and sieve bucket axial direction and
Rotary shaft 5 in parallel to sieving barrel opening upwards and be obliquely installed horizontal by 45° angle, rotary drive motor driving first to
4th screening bucket is rotated with the speed of 3rpm/min, while the vibration motor drives the screening bucket to shake with the frequency of 5Hz,
So that fluorescent powder is more efficiently sieved.
The course of work of the fluorescent powder screening plant are as follows:
By fluorescent powder to be sieved investment the first screening bucket 1, start rotary drive motor and vibration motor, partial size is greater than first
The fluorescent powder of screening 1 sieve pore of bucket, which stays in the first screening bucket 1, to be recovered, fluorescent powder quilt of the partial size less than the first screening 1 sieve pore of bucket
It falls into the second screening bucket 2, the fluorescent powder that partial size is greater than the second screening 2 sieve pore of bucket, which stays in the second screening bucket 2, to be recovered, with this
Analogize, until fluorescent powder is sifted out by the sieve pore of the 4th screening bucket 4, completes the screening to fluorescent powder.
Height described in the present embodiment falls the LED lamp bead packaging method of Bin rate comprising following steps:
S1, it takes the first fluorescent powder to be placed in the first screening bucket 1, starts rotary drive mechanism and percussion mechanism, partial size
The first fluorescent powder less than the first screening 1 screen-aperture of bucket enters external screening bucket, and collection cut size is greater than the first screening 1 sieve pore of bucket
First fluorescent powder in aperture, until the first fluorescent powder is sifted out by the sieve pore of the 4th screening bucket；The first fluorescent powder partial size is
0.1-100 μm, wavelength of transmitted light 480nm, for the silicate fluorescent powder doped with rare earth element, test the fluorescence being sized out
Powder diameter, fluorescent powder grain size distribution are as shown in Figure 2；
S2, it takes the second fluorescent powder to be placed in the first screening bucket 1, starts rotary drive mechanism and percussion mechanism, partial size
The second fluorescent powder less than the first screening 1 screen-aperture of bucket enters the screening bucket being located at outside the first screening bucket 1, and collection cut size is big
In the second fluorescent powder of the first screening 1 screen-aperture of bucket, until the second fluorescent powder is sifted out by the sieve pore of the 4th screening bucket 4；It is described
Second fluorescent powder partial size is 0.3-120 μm, wavelength of transmitted light 575nm, and second fluorescent powder is doped with rare earth element
Aluminate fluorescent powder；
S3, it is taken respectively in the first fluorescent powder and the second fluorescent powder screened out by same layer screening bucket, is mixed to get mixed
Fluorescent powder is closed, in mixed fluorescent powder, the mass ratio of the first fluorescent powder and the second fluorescent powder is 0.01:1, and mixed fluorescent powder is placed in
It encapsulates in glue, formation rubber powder mixture, in the rubber powder mixture, the mass percent of mixed fluorescent powder is 1%；
The rubber powder mixture is stirred in S4, deaeration, obtains fluorescent glue, rubber powder mixture is placed in automatic agitator
In, control blender temperature is 20 DEG C, and vacuum degree 0KPa, blender centrifugal rotational speed is set as 300rpm/min, mixing time
For 1800s；
S5, fluorescent glue instillation is provided in the bracket of LED chip, the fluorescent glue volume accounts for the bracket volume
75%, the wavelength of transmitted light of the LED chip is 230nm, and then baking drop has the bracket of fluorescent glue to fluorescence adhesive curing, is dried
Roasted journey specifically: 40 DEG C, prebake conditions 3h are warming up to first with the heating rate of 1 DEG C/min, then with the heating speed of 1 DEG C/min
Rate is warming up to 110 DEG C, toasts 15h to get LED lamp bead, the emission spectrum of the LED lamp bead is as shown in Figure 3.
Embodiment 2
The present embodiment provides a kind of drum-type fluorescent powder screening plant, described device includes successively being arranged outward from center
The bucket wall of at least two layers screening bucket, every layer of screening bucket is provided with sieve pore, and the screen-aperture of every layer of screening bucket from inside to outside
It is sequentially reduced, the percussion mechanism that the screening bucket is also connected with the rotary drive mechanism for driving it to rotate and shakes it,
The rotary drive mechanism is conventional drive motor, and the percussion mechanism is vibration motor.
In the present embodiment, the screening bucket is 6 layers, is successively arranged from inside to outside, and bung hole is towards consistent, from the inside to the outside according to
Secondary is the first screening bucket to the 6th screening bucket, and the screen-aperture of the first screening bucket to the 6th screening bucket is sequentially reduced, the present embodiment
In the screen-aperture of the first screening bucket be 60 μm, the screen-aperture of the second screening bucket is 55 μm, the sieve pore of third screening bucket
Aperture is 50 μm, and the screen-aperture of the 4th screening bucket is 45 μm, and the screen-aperture of the 5th screening bucket is 35 μm, the 6th screening bucket
Screen-aperture is 30 μm.
Further, screening bucket is connected to a mounting bracket by a rotary shaft, and the driving mechanism driving rotary shaft turns
It is dynamic and then drive screening bucket rotation, the rotary shaft through each screening bucket bottom center's setting, and be set to screening bucket
Crossbeam connection at bung hole, so that screening bucket is connected in mounting bracket, the rotary shaft is arranged horizontal by 5 ° of angles, and
The axial direction for sieving bucket is parallel with rotary shaft to sieve barrel opening upwards and be arranged horizontal by 5 ° of overturning angles, rotation driving electricity
First to fourth screening bucket of machine driving is rotated with the speed of 360rpm/min, at the same the vibration motor drive the screening bucket with
The frequency of 200Hz shakes, so that fluorescent powder is more efficiently sieved.
The present embodiment also provides a kind of high LED lamp bead packaging method for falling Bin rate comprising following steps:
S1, it takes the first fluorescent powder to be placed in the first screening bucket, starts rotary drive mechanism and percussion mechanism, partial size are small
Enter external screening bucket in the first fluorescent powder of the first screening bucket screen-aperture, collection cut size is greater than the first screening bucket screen-aperture
The first fluorescent powder, until the first fluorescent powder by the 6th screening bucket sieve pore sift out；The first fluorescent powder partial size is 0.5-95 μ
M, wavelength of transmitted light 545nm test the fluorescent powder partial size being sized out for the nitride phosphor doped with rare earth element,
Fluorescent powder grain size distribution is as shown in Figure 4；
S2, it takes the second fluorescent powder to be placed in the first screening bucket 1, starts rotary drive mechanism and percussion mechanism, partial size
The second fluorescent powder less than the first screening bucket screen-aperture enters the screening bucket being located at outside the first screening bucket, and collection cut size is greater than
Second fluorescent powder of the first screening 1 screen-aperture of bucket, until the second fluorescent powder is sifted out by the sieve pore of the 6th screening bucket；Described second
Fluorescent powder partial size is 0.3-120 μm, wavelength of transmitted light 680nm, and second fluorescent powder is the phosphoric acid doped with rare earth element
Salt fluorescent powder；
S3, it is taken respectively in the first fluorescent powder and the second fluorescent powder screened out by same layer screening bucket, is mixed to get mixed
Fluorescent powder is closed, in mixed fluorescent powder, the mass ratio of the first fluorescent powder and the second fluorescent powder is 100:1, and mixed fluorescent powder is placed in
It encapsulates in glue, formation rubber powder mixture, in the rubber powder mixture, the mass percent of mixed fluorescent powder is 80%；
The rubber powder mixture is stirred in S4, deaeration, obtains fluorescent glue, rubber powder mixture is placed in automatic agitator
In, control blender temperature is 55 DEG C, and vacuum degree 2KPa, blender centrifugal rotational speed is set as 1500rpm/min, mixing time
For 90s；
S5, fluorescent glue instillation is provided in the bracket of LED chip, the fluorescent glue volume accounts for the bracket volume
90%, the wavelength of transmitted light of the LED chip is 480nm, and then baking drop has the bracket of fluorescent glue to fluorescence adhesive curing, is dried
Roasted journey specifically: 100 DEG C, prebake conditions 0.5h are warming up to first with the heating rate of 10 DEG C/min, then with 10 DEG C/min's
Heating rate is warming up to 220 DEG C, toasts 1h to get LED lamp bead.
Embodiment 3
The present embodiment provides a kind of drum-type fluorescent powder screening plant, described device includes successively being arranged outward from center
The bucket wall of at least two layers screening bucket, every layer of screening bucket is provided with sieve pore, and the screen-aperture of every layer of screening bucket from inside to outside
It is sequentially reduced, the percussion mechanism that the screening bucket is also connected with the rotary drive mechanism for driving it to rotate and shakes it,
The rotary drive mechanism is conventional drive motor, and the percussion mechanism is vibration motor.
In the present embodiment, the screening bucket is 8 layers, is successively arranged from inside to outside, and bung hole is towards consistent, from the inside to the outside according to
Secondary is the first screening bucket to the 8th screening bucket, and the screen-aperture of the first screening bucket to the 8th screening bucket is sequentially reduced, the present embodiment
In the screen-aperture of the first screening bucket be 99 μm, the screen-aperture of the second screening bucket is 65 μm, the sieve pore of third screening bucket
Aperture is 60 μm, and the screen-aperture of the 4th screening bucket is 50 μm, and the screen-aperture of the 5th screening bucket is 45 μm, the 6th screening bucket
Screen-aperture is 35 μm, and the screen-aperture of the 7th screening bucket is 25 μm, and the screen-aperture of the 8th screening bucket is 5 μm.
Further, screening bucket is connected to a mounting bracket by a rotary shaft, and the driving mechanism driving rotary shaft turns
It is dynamic and then drive screening bucket rotation, the rotary shaft through each screening bucket bottom center's setting, and be set to screening bucket
Crossbeam connection at bung hole, so that screening bucket is connected in mounting bracket, the rotary shaft is arranged horizontal by 85 ° of angles,
And the axial direction for sieving bucket is parallel with rotary shaft to sieve barrel opening upwards and be arranged horizontal by 85 ° of overturning angles, rotation is driven
Dynamic motor driven first to fourth is sieved bucket and is rotated with the speed of 100rpm/min, while the vibration motor drives the screening
Bucket is shaken with the frequency of 120Hz, so that fluorescent powder is more efficiently sieved.
The present embodiment also provides a kind of high LED lamp bead packaging method for falling Bin rate comprising following steps:
S1, it takes the first fluorescent powder to be placed in the first screening bucket, starts rotary drive mechanism and percussion mechanism, partial size are small
Enter external screening bucket in the first fluorescent powder of the first screening bucket screen-aperture, collection cut size is greater than the first screening bucket screen-aperture
The first fluorescent powder, until screening complete；The first fluorescent powder partial size is 0.1-100 μm, and wavelength of transmitted light 515nm is
Doped with the fluorination matter fluorescent powder of rare earth element, the fluorescent powder partial size being sized out, fluorescent powder grain size distribution such as Fig. 5 institute are tested
Show；
S2, it takes the second fluorescent powder to be placed in the first screening bucket 1, starts rotary drive mechanism and percussion mechanism, partial size
The second fluorescent powder less than the first screening bucket screen-aperture enters the screening bucket being located at outside the first screening bucket, and collection cut size is greater than
Second fluorescent powder of the first screening 1 screen-aperture of bucket, until screening is completed；The second fluorescent powder partial size is 1.5-120 μm, hair
The a length of 630nm of light wave is penetrated, second fluorescent powder is the phosphate phosphor doped with rare earth element；
S3, it is taken respectively in the first fluorescent powder and the second fluorescent powder screened out by same layer screening bucket, is mixed to get mixed
Fluorescent powder is closed, in mixed fluorescent powder, the mass ratio of the first fluorescent powder and the second fluorescent powder is 2:1, and mixed fluorescent powder is placed in envelope
It fills in glue, formation rubber powder mixture, in the rubber powder mixture, the mass percent of mixed fluorescent powder is 50%；
The rubber powder mixture is stirred in S4, deaeration, obtains fluorescent glue, rubber powder mixture is placed in automatic agitator
In, control blender temperature is 35 DEG C, and vacuum degree 1KPa, blender centrifugal rotational speed is set as 800rpm/min, mixing time
For 550s；
S5, fluorescent glue instillation is provided in the bracket of LED chip, the fluorescent glue volume accounts for the bracket volume
95%, the wavelength of transmitted light of the LED chip is 370nm, and then baking drop has the bracket of fluorescent glue to fluorescence adhesive curing, is dried
Roasted journey specifically: 80 DEG C, prebake conditions 2h are warming up to first with the heating rate of 5 DEG C/min, then with the heating speed of 6 DEG C/min
Rate is warming up to 170 DEG C, toasts 7h to get LED lamp bead, the emission spectrum of the LED lamp bead is as shown in Figure 6.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (9)
1. a kind of high LED lamp bead packaging method for falling Bin rate, which is characterized in that use drum-type fluorescent powder screening plant first
Fluorescent powder is sieved, described device includes at least two layers screening bucket being successively arranged outward from center, the bucket of every layer of screening bucket
Wall is provided with sieve pore, and the screen-aperture of every layer of screening bucket is sequentially reduced from inside to outside, and the screening bucket is connected with for driving
Its rotary drive mechanism rotated and the percussion mechanism for shaking it；
The packaging method includes the following steps:
S1, it takes the first fluorescent powder to be placed in the screening bucket in innermost layer, starts rotary drive mechanism and percussion mechanism, partial size are small
Enter external screening bucket in the first fluorescent powder of innermost layer screening bucket screen-aperture, collection cut size is greater than innermost layer and sieves bucket sieve pore
First fluorescent powder in aperture, until the first fluorescent powder is sifted out by the sieve pore of outermost layer screening bucket；The first fluorescent powder partial size is
0.1-100 μm, wavelength of transmitted light 480-550nm；
S2, it takes the second fluorescent powder to be placed in the screening bucket in innermost layer, starts rotary drive mechanism and percussion mechanism, partial size are small
Enter external screening bucket in the second fluorescent powder of innermost layer screening bucket screen-aperture, collection cut size is greater than innermost layer and sieves bucket sieve pore
Second fluorescent powder in aperture, until the second fluorescent powder is sifted out by the sieve pore of outermost layer screening bucket；The first fluorescent powder partial size is
0.3-120 μm, wavelength of transmitted light 575-680nm；
S3, it is taken respectively in the first fluorescent powder and the second fluorescent powder screened out by same layer screening bucket, it is glimmering to be mixed to get mixing
Light powder is placed in encapsulation glue, formation rubber powder mixture, and in the rubber powder mixture, the mass percent of mixed fluorescent powder is
1-80%；
The rubber powder mixture is stirred in S4, deaeration, obtains fluorescent glue；
S5, fluorescent glue instillation is provided in the bracket of LED chip, the wavelength of transmitted light of the LED chip is 230-
480nm, then baking drop has the bracket of fluorescent glue to fluorescence adhesive curing to get LED lamp bead.
2. the LED lamp bead packaging method that height according to claim 1 falls Bin rate, which is characterized in that the screen-aperture is
1-99 μm, the screening bucket is connected to mounting bracket by rotary shaft, and the rotary drive mechanism drives the rotary shaft in turn
The screening bucket is driven to rotate.
3. the LED lamp bead packaging method that height according to claim 2 falls Bin rate, which is characterized in that the rotary shaft runs through
The screening bucket bottom surface setting, and the rotary shaft is horizontal by 5-85 ° of angle, the axial direction and the rotary shaft of the screening bucket
In parallel to make the screening bucket opening upwards be arranged horizontal by 5-85 ° of overturning angle.
4. the LED lamp bead packaging method that height according to claim 3 falls Bin rate, which is characterized in that the rotary driving machine
Structure drives the screening bucket to rotate with the speed of 3~360rpm/min, and the percussion mechanism drives the screening bucket with 5-200Hz
Frequency vibration.
5. the LED lamp bead packaging method that height according to claim 4 falls Bin rate, which is characterized in that the screening bucket is four
Layer is followed successively by the first screening bucket, the second screening bucket, third screening bucket and the 4th screening bucket, the first screening bucket from inside to outside
Screen-aperture be 50-99 μm, second screening bucket screen-aperture be 25-40 μm, third sieve bucket screen-aperture be 10-20
μm, the screen-aperture of the 4th screening bucket is 1-5 μm.
6. the LED lamp bead packaging method that height according to claim 5 falls Bin rate, which is characterized in that the rotary driving machine
Structure is driving motor, and the percussion mechanism is vibration motor.
7. the LED lamp bead packaging method that height according to claim 6 falls Bin rate, which is characterized in that the mixed fluorescent powder
In the mass ratio of the first fluorescent powder and the second fluorescent powder be 0.01-100:1.
8. the LED lamp bead packaging method that height according to claim 7 falls Bin rate, which is characterized in that described in the step S4
Deaeration whipping process in, temperature be 20-55 DEG C, vacuum degree 0-2KPa, mixing speed 300-1500rpm/min, stirring
Time is 90-1800s.
9. the LED lamp bead packaging method that height according to claim 8 falls Bin rate, which is characterized in that institute in the step S5
State the process of baking specifically: be warming up to 40-100 DEG C, prebake conditions 0.5-3h first with the heating rate of 1-10 DEG C/min, then
It is warming up to 110-220 DEG C with the heating rate of 1-10 DEG C/min, toasts 1-15h.
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| CN204523503U (en) * | 2015-03-31 | 2015-08-05 | 江苏罗化新材料有限公司 | A kind of fluorescent powder grain vibration separation screen |
| CN204746551U (en) * | 2015-05-07 | 2015-11-11 | 广州珠江光电新材料有限公司 | Phosphor powder thick liquids vibration isolation device |
| CN205518528U (en) * | 2016-01-21 | 2016-08-31 | 南京英达公路养护车制造有限公司 | Multistage drum sieve extension of compact |
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| CN203470333U (en) * | 2013-08-30 | 2014-03-12 | 四川柏狮光电技术有限公司 | Screening equipment for improving output of color area of white-light LED (light emitting diode) bulb |
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| CN104707775A (en) * | 2015-02-28 | 2015-06-17 | 长安大学 | Drum-type convenient and fast aggregate screening device |
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