CN106558645A - A kind of method for packing of cladded type quantum dot LED lamp bead - Google Patents
A kind of method for packing of cladded type quantum dot LED lamp bead Download PDFInfo
- Publication number
- CN106558645A CN106558645A CN201611081715.XA CN201611081715A CN106558645A CN 106558645 A CN106558645 A CN 106558645A CN 201611081715 A CN201611081715 A CN 201611081715A CN 106558645 A CN106558645 A CN 106558645A
- Authority
- CN
- China
- Prior art keywords
- quantum dot
- glue
- packing
- powder
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention belongs to LED-backlit manufacture field, and in particular to a kind of method for packing of cladded type quantum dot LED lamp bead.The half-wave width of the quanta point material used by the present invention is narrower, the color gamut value of energy significant increase LED lamp bead, and gained LED lamp bead color gamut value is up to NTSC more than 93%；Pre-coat is carried out to quanta point material using epoxy resin, the extraneous erosion of dampness, oxygen to quanta point material is intercepted, is improve the reliability of lamp bead；White light LEDs lamp bead is obtained using quantum dot fluorescence powder, as quantum dot fluorescence powder launching efficiency is high, phosphor concentration is relatively low during packaging operation, reduces the difficulty and product fraction defective of packaging operation, is adapted to mass industrialized production；With great market prospect and economic worth.
Description
Technical field
The invention belongs to LED-backlit manufacture field, and in particular to a kind of method for packing of cladded type quantum dot LED lamp bead.
Background technology
Into 21st century since, back light source technique quickly grows, and constantly has new technique, new product to release, LED-backlit
The market mainstream is become.Compared with traditional CCFL backlight, LED-backlit has high colour gamut, high brightness, long-life, energy-saving ring
Protect, many advantages, such as real-time color is controllable, the LED backlight of particularly high colour gamut makes TV using which, mobile phone, panel computer
There is more chromatic colour, color rendition Du Genggao Deng electronic product screen.Conventional LED backlight adopts blue light core at present
Piece excites the form of YAG yellow fluorescent powders, because lacking red color light component in backlight, color gamut value can only achieve NTSC65%～
72%.In order to further improve color gamut value, technical staff generally employs blue chip while exciting red light fluorescent powder, green glow glimmering
The mode of light powder, but due to the half-wave width of existing use fluorescent material it is wider, even if therefore adopt in this way, also can only be by the color of backlight
Thresholding is promoted to NTSC 80% or so.Meanwhile, the launching efficiency of existing fluorescent material is low, is to realize that high colour gamut white light needs in a large number
Fluorescent material, causes the concentration (fluorescent material accounts for the ratio of encapsulation glue) of fluorescent material in LED encapsulation process very high, so as to greatly increase
The fraction defective of the difficulty and product of packaging operation is added.
In recent years, quanta point material is gradually taken seriously, and particularly quantum dot fluorescence powder has spectrum with size adjustable, sends out
A series of unique optical properties such as peak half-wave width, Stokes shift are big, launching efficiency is high are penetrated, by LED-backlit industry
Extensive concern.At present, quantum dot fluorescence powder realizes that the mode of high colour gamut white light mainly has：(1) quantum dot fluorescence powder is made
Optical film material, is filled in light guide plate or is affixed in LCD screen, is excited by blue light or ultraviolet light backlight lamp bead, obtains high color
Domain white light；(2) quantum dot fluorescence powder is made into glass tubing, is placed in screen side, excited by blue light or ultraviolet light backlight lamp bead,
Obtain high colour gamut white light.The existing Related product of both implementations is released, the quantum dot film TV of such as TCL.But, this two
Complex process, the phototranstormation efficiency for planting implementation is low, relatively costly, is difficult to realize extensive industrialization.
The content of the invention
For this purpose, the technical problem to be solved be overcome that prior art processes are complicated, phototranstormation efficiency is low, into
This is higher, is difficult to realize the technical bottleneck of extensive industrialization, so as to proposing that a kind of color gamut value is high, avoiding quantum dot fluorescence powder
Affected by extraneous dampness, oxygen and chip high temperature, yield is high, can mass industrialized production cladded type quantum dot LED
The method for packing of lamp bead.
To solve above-mentioned technical problem, the invention discloses a kind of method for packing of cladded type quantum dot LED lamp bead, described
The step of method for packing, is as follows：
1) at least two fluorescent material are weighed, is mixed by any ratio and is obtained luminescent material, wherein at least one in the fluorescent material
It is quantum dot fluorescence powder to plant fluorescent material；
2) encapsulation glue is weighed for the first time, pour into step 1) in weighed luminescent material, the luminescent material and described
The mass ratio of encapsulation glue is 1：1-300, is then stirred, and obtains quantum dot fluorescence glue；
3) by step 2) obtained by the baking of quantum dot fluorescent glue process, make quantum dot fluorescence adhesive curing；
4) by step 3) obtained by gone out to bake the fluorescent glue of solidification and be ground, until quantum dot fluorescence glue grinds to form granule
Shape；
5) by step 4) grinding gained particulate matter carry out wet ball grinding process；Then drying and processing is carried out, until being had
There is the powder of the single quantum dot or multi layered quantum dots or other luminescent materials of epoxy resin cladding；
6) weigh encapsulation glue for the second time, pour step 5 into) obtained by powder in, be stirred, obtain with epoxy
The quantum dot fluorescence glue of class wrapper glue cladding；The luminescent material and with it is described weigh for the second time encapsulation glue mass ratio be
1：0.1-200；
7) take step 6) obtained by have epoxy resin cladding quantum dot fluorescence glue instill be fixed with ultraviolet light or indigo plant
In the LED support of optical chip；
8) by step 7) obtained by drip have quantum dot fluorescence glue LED support carry out baking process, until epoxy resin coat
Quantum dot fluorescence adhesive curing, that is, obtain LED lamp bead.
Preferably, the quantum dot fluorescence powder is consisted of：BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、
InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbS、
PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3In at least one.
Preferably, in the luminescent material, the fluorescent material in addition to quantum dot fluorescence powder is the nothing of rare earth doped element
Machine fluorescent material；
The inorganic fluorescent powder is silicate, aluminate, phosphate, nitride, at least one being fluorinated in matter fluorescent powder.
Preferably, the transmitting peak wavelength of the luminescent material is 450-660nm.
Preferably, the encapsulation glue be epoxiess packaging plastic, silicone packaging plastic, in polyurethane packaging plastic at least
It is a kind of.
Preferably, the step 5) in, wet ball grinding process uses planetary ball mill, and rotating speed is 240-2000rpm.
Preferably, the UV chip wavelength is 230-400nm；The blue chip wavelength is 420-480nm.
Preferably, the step 3) in, the temperature of the baking is 100-150 DEG C, and the time is 0.5-2h.
Preferably, the step 3) in, the temperature of drying and processing is 40-60 DEG C.
It is more highly preferred to, the step 8) in, the temperature that the baking is processed is 80-160 DEG C, and the time is 0.5-8h.
The above-mentioned technical proposal of the present invention has advantages below compared to existing technology：
(1) compared with prior art, the half-wave width of quanta point material is narrower, the colour gamut of energy significant increase LED lamp bead
Value, present invention gained LED lamp bead color gamut value is up to NTSC more than 93%.
(2) compared with existing method for packing, pre-coat is carried out to quanta point material using epoxy resin, is intercepted extraneous wet
The erosion of gas, oxygen to quanta point material, improves the reliability of lamp bead.
(3) compared with existing packaging technology, the present invention obtains white light LEDs lamp bead using quantum dot fluorescence powder, due to quantum
Dot fluorescent powder launching efficiency is high, and during packaging operation, phosphor concentration is relatively low, reduces the difficulty and product of packaging operation not
Yield, is adapted to mass industrialized production.
Description of the drawings
In order that present disclosure is more likely to be clearly understood, the specific embodiment below according to the present invention is simultaneously combined
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the schematic diagram of the LED lamp bead described in embodiment obtained by method powder.
In figure, reference is expressed as：1- supports；The 2- coats of metal；3- chips；4- bonding lines；5- cladded type luminescent materials
A；6- cladded type luminescent material B；7 encapsulation glue.
Specific embodiment
Embodiment
Embodiment 1：
1) the phosphate red light fluorescent powder that 0.75g wavelength of transmitted light is 635nm is weighed, weighing 0.04g wavelength of transmitted light is
The GaSe green quantum dot fluorescent powders of 537nm, are collectively disposed in container.
2) epoxy resin of 1.50g is weighed, is poured into step 1) in the luminescent material that weighed, carry out vacuum defoamation and stir
Mix, obtain quantum dot fluorescence glue.
3) by step 2) obtained by quantum dot fluorescent glue be placed in baking oven 0.5h toasted at 150 DEG C, make quantum dot fluorescence glue
Solidification.
4) by step 3) obtained by gone out bake solidification fluorescent glue be placed in agate mortar, be ground, by quantum dot fluorescence
Glue grinds to form graininess.
5) by step 4) grinding gained particulate matter is placed in planetary ball mill, adds appropriate ethanol to carry out wet ball grinding,
Drum's speed of rotation is controlled for 240rpm.Ball milling terminates to be dried at 60 DEG C, is uniformly dispersed and has epoxy resin
The quantum dot fluorescence powder powder of cladding.
6) weigh 3.25g silica type encapsulation glue, pour step 5 into) obtained by have epoxy resin cladding quantum dot it is glimmering
In light powder powder, vacuum stirring is carried out, obtain the quantum dot fluorescence glue that glue cladding is encapsulated with epoxiess.
7) take a certain amount of step 6) obtained by have epoxy resin cladding quantum dot fluorescence glue instill be fixed with indigo plant
In the LED support of optical chip (a length of 445nm of chip emission light wave).
8) by step 7) obtained by drip have quantum dot fluorescence glue LED support be placed in baking oven, toast 8h at 120 DEG C, make
The quantum dot fluorescence adhesive curing of epoxy resin cladding, that is, obtain LED lamp bead.
Embodiment 2：
1) the MgS red quantum dot fluorescent powders that 0.17g wavelength of transmitted light is 644nm are weighed, 0.10g wavelength of transmitted light is
The GaAs green quantum dot fluorescent powders of 541nm, and the aluminate blue light fluorescent powder that 0.58g wavelength of transmitted light is 458nm, jointly
It is placed in container.
2) epoxy resin of 2.00g is weighed, is poured into step 1) in the luminescent material that weighed, carry out vacuum defoamation and stir
Mix, obtain quantum dot fluorescence glue.
3) by step 2) obtained by quantum dot fluorescent glue be placed in baking oven 1h toasted at 120 DEG C, make quantum dot fluorescence glue solid
Change.
4) by step 3) obtained by gone out bake solidification fluorescent glue be placed in stainless steel mortar, be ground, quantum dot is glimmering
Optical cement grinds to form graininess.
5) by step 4) grinding gained particulate matter is placed in planetary ball mill, adds appropriate ethanol to carry out wet ball grinding,
Drum's speed of rotation is controlled for 1300rpm.Ball milling terminates to be dried at 50 DEG C, is uniformly dispersed and has epoxy resin
The quantum dot fluorescence powder powder of cladding.
6) weigh 4.05g polyurethaness encapsulation glue, pour step 5 into) obtained by have epoxy resin cladding quantum dot
In phosphor powder, vacuum stirring is carried out, obtain the quantum dot fluorescence glue that glue cladding is encapsulated with epoxiess.
7) take a certain amount of step 6) obtained by have epoxy resin cladding quantum dot fluorescence glue instill be fixed with purple
In the LED support of outer optical chip (a length of 280nm of chip emission light wave).
8) by step 7) obtained by drip have quantum dot fluorescence glue LED support be placed in baking oven, toast 3h at 80 DEG C, make ring
The quantum dot fluorescence adhesive curing of oxygen resin-coating, that is, obtain LED lamp bead.
Embodiment 3：
1) the fluoride red light fluorescent powder that 3.45g wavelength of transmitted light is 620nm is weighed, weighing 0.12g wavelength of transmitted light is
The MgTe green quantum dot fluorescent powders of 537nm, are collectively disposed in container.
2) epoxy resin of 2.75g is weighed, is poured into step 1) in the luminescent material that weighed, carry out vacuum defoamation and stir
Mix, obtain quantum dot fluorescence glue.
3) by step 2) obtained by quantum dot fluorescent glue be placed in baking oven 1h toasted at 100 DEG C, make quantum dot fluorescence glue solid
Change.
4) by step 3) obtained by gone out bake solidification fluorescent glue be placed in agate mortar, be ground, by quantum dot fluorescence
Glue grinds to form graininess.
5) by step 4) grinding gained particulate matter is placed in planetary ball mill, adds appropriate ethanol to carry out wet ball grinding,
Drum's speed of rotation is controlled for 2000rpm.Ball milling terminates to be dried at 40 DEG C, is uniformly dispersed and has epoxy resin
The quantum dot fluorescence powder powder of cladding.
6) weigh 3.50g silica type encapsulation glue, pour step 5 into) obtained by have epoxy resin cladding quantum dot it is glimmering
In light powder powder, vacuum stirring is carried out, obtain the quantum dot fluorescence glue that glue cladding is encapsulated with epoxiess.
7) take a certain amount of step 6) obtained by have epoxy resin cladding quantum dot fluorescence glue instill be fixed with indigo plant
In the LED support of optical chip (a length of 480nm of chip emission light wave).
8) by step 7) obtained by drip have quantum dot fluorescence glue LED support be placed in baking oven, toast 0.5h at 160 DEG C,
The quantum dot fluorescence adhesive curing for coating epoxy resin, that is, obtain LED lamp bead.
Experimental example
The chromaticity coordinates and color gamut value of the quantum dot LED lamp bead described in testing example 1-3, as a result as shown in table 1.
Table 1
The above results show, the quantum dot LED lamp bead obtained using the method for embodiment 1-3 it is photochromic all in white light area,
And there is high color gamut value, color gamut value is up to more than 93%.
Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description other multi-forms change or
Change.There is no need to be exhaustive to all of embodiment.And thus it is extended obvious change or
Among changing still in the protection domain of the invention.
Claims (10)
1. a kind of method for packing of cladded type quantum dot LED lamp bead, it is characterised in that as follows the step of the method for packing：
1) at least two fluorescent material are weighed, is mixed by any ratio and is obtained luminescent material, wherein at least one of described fluorescent material is glimmering
Light powder is quantum dot fluorescence powder；
2) encapsulation glue is weighed for the first time, pour into step 1) in weighed luminescent material, the luminescent material and the encapsulation
The mass ratio of glue is 1：1-300, is then stirred, and obtains quantum dot fluorescence glue；
3) by step 2) obtained by the baking of quantum dot fluorescent glue process, make quantum dot fluorescence adhesive curing；
4) by step 3) obtained by gone out to bake the fluorescent glue of solidification and be ground, until quantum dot fluorescence glue grinds to form graininess；
5) by step 4) grinding gained particulate matter carry out wet ball grinding process；Then drying and processing is carried out, until obtaining with ring
The single quantum dot or multi layered quantum dots or the powder of other luminescent materials of oxygen resin-coating；
6) weigh encapsulation glue for the second time, pour step 5 into) obtained by powder in, be stirred, obtain with epoxiess envelope
The quantum dot fluorescence glue of dress glue cladding；The luminescent material and with it is described weigh for the second time encapsulation glue mass ratio be 1：
0.1-200；
7) take step 6) obtained by have epoxy resin cladding quantum dot fluorescence glue instill be fixed with ultraviolet light or blue light core
In the LED support of piece；
8) by step 7) obtained by drip have quantum dot fluorescence glue LED support carry out baking process, until epoxy resin cladding amount
Son point fluorescence adhesive curing, that is, obtain LED lamp bead.
2. method for packing as claimed in claim 1, it is characterised in that the quantum dot fluorescence powder is consisted of：BaS、
AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、
GaSe、InGaAs、MgS、MgSe、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、
CsPbBr3、CsPbI3In at least one.
3. method for packing as claimed in claim 2, it is characterised in that in the luminescent material, except quantum dot fluorescence powder with
Outer fluorescent material is the inorganic fluorescent powder of rare earth doped element；
The inorganic fluorescent powder is silicate, aluminate, phosphate, nitride, at least one being fluorinated in matter fluorescent powder.
4. method for packing as claimed in claim 3, it is characterised in that the transmitting peak wavelength of the luminescent material is 450-
660nm。
5. method for packing as claimed in claim 4, it is characterised in that the encapsulation glue is epoxiess packaging plastic, organosilicon
At least one in class wrapper glue, polyurethane packaging plastic.
6. method for packing as claimed in claim 5, it is characterised in that the step 5) in, wet ball grinding process is used
Planetary ball mill, rotating speed are 240-2000rpm.
7. method for packing as claimed in claim 6, it is characterised in that the UV chip wavelength is 230-400nm；It is described
Blue chip wavelength is 420-480nm.
8. method for packing as claimed in claim 7, it is characterised in that the step 3) in, the temperature of the baking is 100-
150 DEG C, the time is 0.5-2h.
9. method for packing as claimed in claim 8, it is characterised in that the step 3) in, the temperature of drying and processing is 40-60
℃。
10. method for packing as claimed in claim 9, it is characterised in that the step 8) in, the temperature that the baking is processed is
80-160 DEG C, the time is 0.5-8h.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611081715.XA CN106558645A (en) | 2016-11-30 | 2016-11-30 | A kind of method for packing of cladded type quantum dot LED lamp bead |
| PCT/CN2017/091997 WO2018099082A1 (en) | 2016-11-30 | 2017-07-06 | Method for packaging coated quantum-dot led lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611081715.XA CN106558645A (en) | 2016-11-30 | 2016-11-30 | A kind of method for packing of cladded type quantum dot LED lamp bead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106558645A true CN106558645A (en) | 2017-04-05 |
Family
ID=58445751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611081715.XA Pending CN106558645A (en) | 2016-11-30 | 2016-11-30 | A kind of method for packing of cladded type quantum dot LED lamp bead |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106558645A (en) |
| WO (1) | WO2018099082A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018099082A1 (en) * | 2016-11-30 | 2018-06-07 | 深圳市聚飞光电股份有限公司 | Method for packaging coated quantum-dot led lamp bead |
| WO2019000783A1 (en) * | 2017-06-27 | 2019-01-03 | 深圳Tcl新技术有限公司 | Led, backlight module, and liquid crystal display device |
| CN109233804A (en) * | 2018-09-05 | 2019-01-18 | 纳晶科技股份有限公司 | Quantum dot powder and preparation method thereof, luminescent device, quantum dot composition, quantum dot film and preparation method thereof |
| CN110137334A (en) * | 2019-05-28 | 2019-08-16 | 深圳扑浪创新科技有限公司 | A kind of infrared LED device of quantum dot fluorescence conversion |
| CN113480713A (en) * | 2021-06-30 | 2021-10-08 | 上海交通大学 | Preparation method of polyurea quantum dot fluorescent microspheres |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006321966A (en) * | 2004-09-28 | 2006-11-30 | Kyocera Corp | Fluorescent structural body, superfine particle structural body and composite, and light emitting device and light emitting device assembly |
| CN101137738A (en) * | 2005-03-08 | 2008-03-05 | 皇家飞利浦电子股份有限公司 | Illumination system comprising a radiation source and a luminescent material |
| CN102321479A (en) * | 2011-09-30 | 2012-01-18 | 钟瑜 | Dual core-shell fluorescent material and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103030822B (en) * | 2012-12-20 | 2014-09-24 | 纳晶科技股份有限公司 | Quantum dots powder and preparation method thereof, silicone lens and manufacture method thereof and LED lamp |
| CN103456865B (en) * | 2013-09-03 | 2016-08-17 | 易美芯光（北京）科技有限公司 | A kind of LED encapsulation |
| CN104633551A (en) * | 2015-03-03 | 2015-05-20 | 深圳市华星光电技术有限公司 | White LED, backlight module and liquid crystal display device |
| CN106558645A (en) * | 2016-11-30 | 2017-04-05 | 深圳市聚飞光电股份有限公司 | A kind of method for packing of cladded type quantum dot LED lamp bead |
-
2016
- 2016-11-30 CN CN201611081715.XA patent/CN106558645A/en active Pending
-
2017
- 2017-07-06 WO PCT/CN2017/091997 patent/WO2018099082A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006321966A (en) * | 2004-09-28 | 2006-11-30 | Kyocera Corp | Fluorescent structural body, superfine particle structural body and composite, and light emitting device and light emitting device assembly |
| CN101137738A (en) * | 2005-03-08 | 2008-03-05 | 皇家飞利浦电子股份有限公司 | Illumination system comprising a radiation source and a luminescent material |
| CN102321479A (en) * | 2011-09-30 | 2012-01-18 | 钟瑜 | Dual core-shell fluorescent material and preparation method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018099082A1 (en) * | 2016-11-30 | 2018-06-07 | 深圳市聚飞光电股份有限公司 | Method for packaging coated quantum-dot led lamp bead |
| WO2019000783A1 (en) * | 2017-06-27 | 2019-01-03 | 深圳Tcl新技术有限公司 | Led, backlight module, and liquid crystal display device |
| CN109233804A (en) * | 2018-09-05 | 2019-01-18 | 纳晶科技股份有限公司 | Quantum dot powder and preparation method thereof, luminescent device, quantum dot composition, quantum dot film and preparation method thereof |
| CN109233804B (en) * | 2018-09-05 | 2021-07-20 | 纳晶科技股份有限公司 | Quantum dot powder and preparation method thereof, light-emitting device, quantum dot composition, quantum dot film and preparation method thereof |
| CN110137334A (en) * | 2019-05-28 | 2019-08-16 | 深圳扑浪创新科技有限公司 | A kind of infrared LED device of quantum dot fluorescence conversion |
| CN113480713A (en) * | 2021-06-30 | 2021-10-08 | 上海交通大学 | Preparation method of polyurea quantum dot fluorescent microspheres |
| CN113480713B (en) * | 2021-06-30 | 2023-01-24 | 上海交通大学 | Preparation method of polyurea quantum dot fluorescent microspheres |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018099082A1 (en) | 2018-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106558645A (en) | A kind of method for packing of cladded type quantum dot LED lamp bead | |
| CN106449908B (en) | A kind of packaging method of the LED lamp bead based on quantum dot fluorescence film | |
| CN105870302B (en) | A kind of packaging method of high colour gamut white light quanta point LED | |
| CN106449943A (en) | Method for molding and sealing inverted quantum dot LED lamp bead | |
| CN106558644A (en) | A kind of method for packing of laminated devices quantum dot LED lamp bead | |
| CN106384776B (en) | A kind of packaging method of sandwich type quantum dot LED lamp bead | |
| CN105679894B (en) | A kind of production method of the high colour gamut white light LEDs lamp bead based on red light quantum point | |
| CN106784260A (en) | A kind of preparation method of direct LED backlight | |
| CN108610023B (en) | Preparation method of ceramic composite material, ceramic composite material and wavelength converter | |
| CN103869391A (en) | Color reinforcing film, and utilization structure, utilization method and manufacturing method of the color reinforcing film | |
| CN105810674A (en) | Light emitting diode (LED) luminous device and backlight module employing same | |
| CN102800794A (en) | Optical wavelength conversion device and application thereof in white light emitting device | |
| CN106935693A (en) | Luminous quantum dot CSP backlights in a kind of five face and preparation method thereof | |
| CN105742462B (en) | A kind of high colour gamut white light implementation that ultraviolet light is combined with multi layered quantum dots | |
| CN105679921B (en) | A kind of production method of the high colour gamut white light LEDs lamp bead of multi layered quantum dots combination | |
| CN109742220B (en) | White light LED containing liquid quantum dots and preparation method thereof | |
| CN106784177A (en) | A kind of method for packing of quantum dot LED lamp bead | |
| CN207217528U (en) | A kind of LED light source | |
| CN106784238A (en) | The preparation method of quantum dot lens-type direct LED backlight | |
| CN105514251B (en) | A kind of high colour gamut white light LEDs implementation method using red light fluorescent powder | |
| CN105845810B (en) | A kind of production method of the high colour gamut white light LEDs lamp bead based on green light quantum point | |
| CN107298582A (en) | A kind of ceramic material and preparation method thereof and fluorescence ceramics device | |
| CN111276593A (en) | Wide color gamut backlight source for display | |
| CN106601890A (en) | Quantum dot lamp bead preparation method and QLED display | |
| CN105552198B (en) | One kind uses MxSr1‑xTiO3：Eu2+, Mn2+The high colour gamut white light LEDs implementation method of blue light fluorescent powder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190109 Address after: 516000 No. 6 Lujiao Road, Huinan High-tech Industrial Park, Huizhou City, Guangdong Province Applicant after: Huizhou flying photoelectric Co., Ltd. Address before: 518000 Building C, 1-3 and E, Building 4, Egongling Industrial Zone, Egongling Community, Pinghu Street, Longgang District, Shenzhen City, Guangdong Province Applicant before: Shenzhen City Jufei Optoelectronic Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170405 |
|
| RJ01 | Rejection of invention patent application after publication |