CN109390454B - Fluorescent thin film structure for LED (light-emitting diode), preparation method thereof and light-emitting source - Google Patents
Fluorescent thin film structure for LED (light-emitting diode), preparation method thereof and light-emitting source Download PDFInfo
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- CN109390454B CN109390454B CN201811197113.XA CN201811197113A CN109390454B CN 109390454 B CN109390454 B CN 109390454B CN 201811197113 A CN201811197113 A CN 201811197113A CN 109390454 B CN109390454 B CN 109390454B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
The invention relates to a fluorescent film structure for an LED (light emitting diode), a preparation method thereof and a light emitting source. The method for preparing the fluorescent film structure for the LED comprises the steps of obtaining a first transparent film, obtaining a second transparent film, coating fluorescent powder on the upper surface of the first transparent film, and adhering the second transparent film to the upper surface of the first transparent film coated with the fluorescent powder. And the LED luminous light source comprises the fluorescent film structure for the LED. The invention solves the problems of phosphor powder precipitation and poor light color consistency in the packaging process, shortens the packaging process and reduces the production cost.
Description
Technical Field
The invention relates to the field of LED packaging, in particular to a fluorescent film structure for an LED, a preparation method thereof and a light-emitting source.
Background
Under the increasingly serious background of global energy crisis, white light LED as a novel solid light source draws wide attention by virtue of its advantages of small volume, long service life, energy saving, environmental protection, high luminous efficiency and the like, is considered as a third generation lighting technology, and is widely applied to the fields of large screen display, landscape lighting, street lamp lighting, indoor lighting, traffic signal lamps and the like. LED packages are an important ring of the LED industry.
At present, the dispensing method is a commonly used choice in the process of packaging the industrialized white light LED, namely, the adhesive and the fluorescent powder are fully and uniformly mixed together, the mixture is placed in a vacuum defoaming machine for vacuumizing and defoaming treatment, then the fluorescent glue mixture is placed in a dispensing cylinder to be dripped on the surface of a chip, and a hemispherical uniform fluorescent powder coating is obtained under ideal conditions.
However, in the process of implementing the technical scheme, the inventor of the present application finds that the phosphor precipitation phenomenon exists in the dispensing process.
Disclosure of Invention
The invention aims to provide a fluorescent film structure for an LED, a preparation method thereof and a light-emitting source.
In order to solve the problems, the technical scheme of the invention is as follows:
the embodiment of the application discloses fluorescent film structure for LED includes:
a first transparent film;
the fluorescent powder is coated on the upper surface of the first transparent film; and
and the second transparent film is attached to the upper surface of the first transparent film coated with the fluorescent powder.
Preferably, the fluorescent powder is uniformly coated on the upper surface of the first transparent film.
Preferably, the materials of the first transparent film and the second transparent film are selected from one or more of silicone materials, epoxy resins, acrylic resins and silica gels.
Preferably, the first transparent film and the second transparent film are both solidified adhesive mixtures, each adhesive mixture comprises an A-type adhesive and a B-type adhesive, and the mass ratio of the A-type adhesive to the B-type adhesive is 1: 1-5.
Preferably, the thicknesses of the first transparent film and the second transparent film are both 0.1 +/-0.05 mm-0.5 +/-0.05 mm.
Preferably, the phosphor includes a red phosphor and/or a yellow phosphor and/or a green phosphor.
A method for preparing a fluorescent thin film structure for an LED is characterized by comprising the following steps:
s1: obtaining a first transparent film;
s2: obtaining a second transparent film;
s3: coating fluorescent powder on the upper surface of the first transparent film;
s4: attaching the second transparent film to the first transparent film in the step S3
A surface on which the fluorescent thin film structure for the LED is formed;
the step S1 and the step S2 may be performed simultaneously, and the steps S2 and the step S3 may be exchanged in order.
Preferably, the step S1 includes:
s101: weighing a first adhesive, and performing vacuum defoaming treatment on the first adhesive;
s102: preparing a first transparent film-like adhesive on a substrate by using the first adhesive subjected to vacuum degassing in the step S101 through a spin coating method;
s103: curing the first transparent film-like adhesive prepared in the step S102 to obtain the first transparent film;
preferably, the step S2 includes:
s201: weighing a second adhesive, and performing vacuum defoaming treatment on the second adhesive;
s202: preparing a second transparent film-like adhesive on the substrate by using the second adhesive subjected to vacuum degassing in the step S201 through a spin coating method;
s203: the second transparent film-like paste prepared in the step S202 is subjected to a curing process,
obtaining the second transparent film;
preferably, the step S3 includes:
s301: weighing fluorescent powder, wherein the mass ratio of the fluorescent powder to the first adhesive and/or the second adhesive is 0.5-1.5: 1;
s302: coating the fluorescent powder on the upper surface of the first transparent film;
the step S301 may be performed simultaneously with the step S101/the step S201.
Preferably, the performing of the curing process in the step S103 and/or the step S203 includes:
a1, a first curing stage, wherein the first curing stage is curing at 50-100 ℃ for 10-60 min;
a2, and a second curing stage, wherein the second curing stage is curing at 120-160 ℃ for 10-60 min.
Preferably, the step S4 includes:
s401: bonding the second transparent film to the upper surface of the first transparent film in the step S3 to form two transparent films;
s402: bonding the two layers of transparent films in the step S401 together by adopting a hot pressing technology to obtain the fluorescent film structure for the LED;
preferably, the phosphor in step S302 is uniformly coated on the upper surface of the first transparent film.
Preferably, the substrate is made of one material selected from glass and plastic, the thickness of the substrate is 0.5-1 cm, and the substrate is resistant to the temperature of above 160 ℃.
Preferably, the first curing stage is curing at 80 ℃ for 20min and the second curing stage is curing at 150 ℃ for 20 min.
An LED light source comprising the fluorescent thin film structure for LED as set forth in any one of claims 1 to 6.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
(1) the fluorescent film structure for the LED disclosed by the invention has the advantages that the fluorescent powder is coated on the upper surface of the first transparent film, the second transparent film is attached to the upper surface of the first transparent film coated with the fluorescent powder, and the fluorescent powder is prevented from being directly mixed with an adhesive for preparing the transparent film, so that the precipitation of fluorescent powder particles is reduced, and the good optical performance of the fluorescent powder can be kept.
(2) The preparation method of the fluorescent film structure for the LED is simple, the thickness, the shape, the size and the like of the film are convenient to control, when the fluorescent film structure is prepared, the first transparent film and the second transparent film are prepared firstly, then, fluorescent powder is coated on the upper surface of the first transparent film, the second transparent film is attached to the upper surface of the first transparent film coated with the fluorescent powder, two layers of transparent films are obtained, the two layers of transparent films are bonded together by adopting a hot pressing technology, and the whole preparation method avoids the direct mixing of the fluorescent powder and an adhesive for preparing the transparent films, so that the problem of the precipitation of the fluorescent powder in the adhesive can be reduced, and the good optical performance of the fluorescent powder can be kept.
(3) The fluorescent film structure for the LED prepared by the invention is a film, and the fluorescent film can be directly placed on a chip, so that the fluorescent film is uniformly covered on the chip and is packaged in an LED lamp source. The problem of inconsistent dispensing uniformity of fluorescent glue on a single chip in the traditional dispensing process is solved, so that the LED light color consistency is improved.
(4) The fluorescent film for the LED prepared by the invention is formed in one step, so that the light chromaticity of the LED packaged in the same batch or even different batches is basically completely consistent. The fluorescent film packaging mode is adopted, so that the process of dispensing in the traditional dispensing method is omitted, the packaging process steps are reduced, the cost is reduced, and the fluorescent film packaging method has certain application value.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
FIG. 1 is a top view of a fluorescent thin film structure for LEDs of the present invention;
FIG. 2 is a side view of a fluorescent thin film structure for LEDs of the present invention;
FIG. 3 is a flow chart of the preparation of the fluorescent thin film structure for LED of the present invention;
FIG. 4 is a PL spectrum measured with a fluorescent thin film for an LED according to embodiment 1 of the present invention;
FIG. 5 shows PL spectrum measured by a fluorescent thin film for LED according to embodiment 1 of the present invention.
Description of reference numerals: 1-a first transparent film; 2-fluorescent powder; 3-a second transparent film.
Detailed Description
The following describes in detail a fluorescent thin film structure for LED, a method for manufacturing the same, and a light source according to the present invention with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more fully apparent from the following description and appended claims
Example 1
Referring to fig. 1 and 2, the present invention discloses a fluorescent thin film structure for an LED, including a first transparent thin film 1; fluorescent powder 2 coated on the upper surface of the first transparent film 1; and a second transparent film 3 attached to the upper surface of the first transparent film 1 coated with the phosphor 2.
Because the density of the fluorescent powder 2 is greater than that of the adhesive, the fluorescent powder 2 is precipitated under the action of gravity and is not uniformly distributed in the adhesive, so that the concentration distribution of the fluorescent powder glue is changed. In addition, in the dispensing process, the concentration of the fluorescent powder 2 is difficult to keep consistent from beginning to end, the fluorescent powder 2 is mixed in the adhesive and has a certain granularity, in the dispensing process, the dispensing cylinder is vertically placed, although the adhesive has a certain viscosity, the density of the fluorescent powder 2 is greater than that of the adhesive, the fluorescent powder 2 is inevitably slowly precipitated along with the lapse of dispensing time, the concentration of the fluorescent powder is higher when dispensing is started, and the later, the lower the concentration of the fluorescent powder 2 is, so that the light chromaticity of the LEDs packaged in different batches or even the same batch is not completely consistent, and finally, the light emitting of the LEDs is changed, and the consistency is influenced. However, the fluorescent film structure for the LED disclosed by the invention is characterized in that the fluorescent powder 2 is coated on the upper surface of the first transparent film 1, the second transparent film 3 is attached to the upper surface of the first transparent film 1 coated with the fluorescent powder 2, and the fluorescent powder 2 is prevented from being directly mixed with an adhesive for preparing the transparent film, so that the precipitation of the fluorescent powder 2 is reduced, the light-color consistency of the LED is further improved, and the good optical performance of the fluorescent powder 2 can be kept by the same worker.
In addition, in the dispensing process, the fluorescent glue in the dispensing cylinder is dripped on the surface of the chip by virtue of gravity, the dripped fluorescent glue is similar to the spherical shape of water drops, and the fluorescent glue is inevitably in a convex shape after natural leveling and curing, namely the fluorescent glue is thick in the middle and thin at the periphery, so that the dispensing uniformity on a single chip is inconsistent. The fluorescent film structure for the LED disclosed by the invention is a film, and the fluorescent film can be directly placed on a chip, so that the fluorescent film is uniformly covered on the chip and is packaged in the LED. The problem of inconsistent dispensing uniformity of fluorescent glue on a single chip in the traditional dispensing process is solved, so that the LED light color consistency is improved.
Further, the phosphor 2 is uniformly coated on the upper surface of the first transparent film 1.
Further, the materials of the first transparent film 1 and the second transparent film 3 are selected from one or more of silicone materials, epoxy resins, acrylic resins, and silica gels.
Further, the first transparent film 1 and the second transparent film 3 are both solidified adhesive mixtures, each adhesive mixture comprises an A-type adhesive and a B-type adhesive, and the mass ratio of the A-type adhesive to the B-type adhesive is 1: 1-5.
Further, the thicknesses of the first transparent film 1 and the second transparent film 3 are both 0.1 +/-0.05 mm-0.5 +/-0.05 mm.
Further, the phosphor 2 includes a red phosphor and/or a yellow phosphor and/or a green phosphor.
Example 2
Referring to fig. 3, the present invention also discloses a method for preparing a fluorescent thin film structure for an LED, comprising:
s1: obtaining a first transparent film 1;
s2: obtaining a second transparent film 3;
s3: coating the fluorescent powder 2 on the upper surface of the first transparent film 1;
s4: bonding the second transparent film 3 to the upper surface of the first transparent film 1 in step S3 to form a fluorescent film structure for LED;
step S1 and step S2 may be performed simultaneously, and step S2 and step S3 may exchange the order.
Specifically, step S1 includes:
s101: weighing the first adhesive, and performing vacuum defoaming treatment on the first adhesive;
s102: preparing a first transparent film-like adhesive on the substrate by using the first adhesive subjected to vacuum degassing in the step S101 through a spin coating method;
s103: the first transparent film-like adhesive prepared in step S102 is subjected to curing treatment to obtain a first transparent film 1.
Specifically, step S2 includes:
s201: weighing a second adhesive, and performing vacuum defoaming treatment on the second adhesive;
s202: preparing a second transparent film-like adhesive on the substrate by using the second adhesive subjected to vacuum degassing in the step S201 through a spin coating method;
s203: curing the second transparent film-like adhesive prepared in step S202 to obtain a second transparent film-like adhesive
A transparent film 3.
Specifically, step S3 includes:
s301: weighing fluorescent powder 2, wherein the mass ratio of the fluorescent powder 2 to the first adhesive and/or the second adhesive is 0.5-1.5: 1;
s302: coating the fluorescent powder 2 on the upper surface of the first transparent film 1;
step S301 may be performed simultaneously with step S101/step 201.
Further, the performing of the curing process in step S103 and/or step S203 includes:
a1, a first curing stage, wherein the first curing stage is curing at 50-100 ℃ for 10-60 min;
a2, and a second curing stage, wherein the second curing stage is curing at 120-160 ℃ for 10-60 min.
Specifically, step S4 includes:
s401: bonding a second transparent film 3 to the upper surface of the first transparent film 1 in step S3 to form two transparent films;
s402: and (3) bonding the two layers of transparent films in the step S401 together by adopting a hot pressing technology to obtain the fluorescent film structure for the LED.
Further, the phosphor 2 in step S302 is uniformly coated on the upper surface of the first transparent film 1.
Further, the materials of the first adhesive and the second adhesive are selected from one or more of silicone materials, epoxy resins, acrylic resins and silica gels.
Further, the first adhesive and the second adhesive comprise an A-type adhesive and a B-type adhesive, and the mass ratio of the A-type adhesive to the B-type adhesive is 1: 1-5.
Further, the mass ratio of the fluorescent powder 2 to the A-type adhesive is 1.5-2.5: 1.
Furthermore, the substrate is made of one of glass and plastic, the thickness of the substrate is 0.5-1 cm, and the substrate can resist the temperature of more than 160 ℃.
Further, the first curing stage was curing at 80 ℃ for 20min, and the second curing stage was curing at 150 ℃ for 20 min.
Further, the thicknesses of the first transparent film 1 and the second transparent film 3 are both 0.1 +/-0.05 mm-0.5 +/-0.05 mm.
Further, the phosphor 2 includes a red phosphor and/or a yellow phosphor and/or a green phosphor.
The preparation method of the fluorescent film structure for the LED is simple, the thickness, the shape, the size and the like of the film are convenient to control, when in preparation, the first transparent film 1 and the second transparent film 2 are firstly prepared, then the fluorescent powder 2 is coated on the upper surface of the first transparent film 1, the second transparent film 3 is attached to the upper surface of the first transparent film 1 coated with the fluorescent powder 2, two layers of transparent films are obtained, the two layers of transparent films are bonded together by adopting a hot-pressing technology, and the whole preparation method avoids the direct mixing of the fluorescent powder 2 and an adhesive for preparing the transparent films, so that the problem of the fluorescent powder precipitating in the adhesive can be reduced, and the good optical performance of the fluorescent powder can be kept.
In the traditional dispensing process, the concentration of the fluorescent powder 2 is difficult to keep consistent from beginning to end, the fluorescent powder 2 is mixed in the adhesive and keeps a certain granularity, in the dispensing process, the dispensing cylinder is vertically placed, although the silica gel has a certain viscosity, the density of the fluorescent powder 2 is greater than that of the adhesive, the fluorescent powder 2 is inevitably slowly precipitated along with the lapse of dispensing time, the concentration of the fluorescent powder is higher when dispensing is started, and the later, the lower the concentration of the fluorescent powder 2 is, so that the light chromaticity of LEDs packaged in different batches or even the same batch is not completely consistent, and finally, the light emitting of the LEDs is changed, and the consistency is influenced. The fluorescent film structure obtained by the method for preparing the fluorescent film structure for the LED is formed in one step, and if a fluorescent film packaging mode is adopted, the light chromaticity of the LED packaged in the same batch or even different batches is basically completely consistent, and meanwhile, the process of dispensing in the traditional dispensing method is omitted, so that the packaging process steps are reduced, the cost is reduced, and the method has a certain application value.
This example is further illustrated by the following two specific preparative procedures.
The specific preparation process is as follows:
5g, 5g and 9g of the adhesive A, the adhesive B and the aluminate fluorescent powder 2 are respectively weighed, namely the ratio of the adhesive to the fluorescent powder 2 is 1:0.9, the ratio of the adhesive A to the adhesive B is 1:1, and the ratio of the fluorescent powder 2 to the adhesive A is 1.8: 1. Placing the glue A and the glue B in a glue preparation cup, fully and uniformly mixing the glue A and the glue B by using a glass rod, placing the uniformly mixed glue AB in a vacuum defoaming machine for defoaming and vacuumizing, then placing the glue AB mixture in a feeding cylinder, and spin-coating the mixed glue AB on a glass substrate in a glue homogenizing machine by adopting a rotary coating method, wherein the acceleration of the first stage of the glue homogenizing machine is as follows: 350rpm/s, and the second stage constant speed stage speed is as follows: 400rpm/s, the third stage is a stop stage, the speed and acceleration are both 0rpm/s, and the spin coating time is 160 s. And then curing the mixture in an oven at 80 ℃ for 20min, and curing the mixture at 150 ℃ for 20min to obtain a first transparent film 1. And then spin-coating the mixed AB glue on a glass substrate in a glue homogenizing machine again, wherein the acceleration of the first stage of the glue homogenizing machine is as follows: 350rpm/s, and the second stage constant speed stage speed is as follows: 400rpm/s, the third stage is a stop stage, the speed and acceleration are both 0rpm/s, and the spin coating time is 160 s. And then curing the mixture in an oven at 80 ℃ for 20min, and curing the mixture at 150 ℃ for 20min to obtain a second transparent film 3. Then, the weighed phosphor 2 is uniformly coated on the upper surface of the first transparent film 1, and the second transparent film 3 is attached to the upper surface of the first transparent film 1 coated with the phosphor 2. And bonding the two transparent films together by adopting a hot pressing technology, and cooling to obtain the fluorescent film structure shown in figures 1 and 2. The obtained fluorescent film is placed in a fluorescence spectrometer to detect a PL spectrum, a spectrogram shown in figure 4 is obtained, and the fluorescent film can keep good optical performance of the fluorescent powder from the spectrogram.
The specific preparation process II comprises the following steps:
5g, 9g and 2.25g of the adhesive A, the adhesive B, the aluminate fluorescent powder and the nitride fluorescent powder are respectively weighed, namely the ratio of the adhesive to the fluorescent powder 2 is 1:1.125, the ratio of the adhesive A to the adhesive B is 1:1, and the ratio of the fluorescent powder 2 to the adhesive A is 2.25: 1. Placing the glue A and the glue B in a glue preparation cup, fully and uniformly mixing the glue A and the glue B by using a glass rod, placing the uniformly mixed glue AB in a vacuum defoaming machine for defoaming and vacuumizing, placing a glue AB mixture in a feeding cylinder, and spin-coating the mixed glue AB on a glass substrate in a glue homogenizing machine by adopting a rotary coating method, wherein the acceleration of the first stage of the glue homogenizing machine is as follows: 350rpm/s, and the second stage constant speed stage speed is as follows: 400rpm/s, the third stage is a stop stage, the speed and acceleration are both 0rpm/s, and the spin coating time is 160 s. And then curing the mixture in an oven at 80 ℃ for 20min, and curing the mixture at 150 ℃ for 20min to obtain a first transparent film 1. Spin-coating the mixed AB glue on the glass substrate in the spin coater again, wherein the acceleration of the first stage of the spin coater is as follows: 350rpm/s, and the second stage constant speed stage speed is as follows: 400rpm/s, the third stage is a stop stage, the speed and acceleration are both 0rpm/s, and the spin coating time is 160 s. And then curing the mixture in an oven at 80 ℃ for 20min, and curing the mixture at 150 ℃ for 20min to obtain a second transparent film 3. The weighed and uniformly mixed phosphor 2 is uniformly coated on the upper surface of the first transparent film 1, and the second transparent film 3 is attached to the upper surface of the first transparent film 1 coated with the phosphor 2. And bonding the two transparent films together by adopting a hot pressing technology, and cooling to obtain the fluorescent film structure shown in figures 1 and 2. The obtained fluorescent film is put into a fluorescence spectrometer to detect a PL spectrum, a spectrogram shown in figure 5 is obtained, and the fluorescent film can keep good optical performance of the fluorescent powder from the spectrogram.
The raw materials used by the fluorescent film structure and the preparation method thereof disclosed by the invention are the fluorescent powder 2 and the adhesive, and other substances are not added, so that the prepared fluorescent film can keep the good optical performance of the fluorescent powder 2. In addition, the fluorescent film avoids direct mixing of the fluorescent powder and the adhesive, so that the precipitation of the fluorescent powder in the adhesive under the action of gravity can be reduced, and the fluorescent film has a certain application value.
Example 3
The invention also discloses an LED light source, which comprises the fluorescent film structure for the LED. The fluorescent film structure is packaged in the LED light source, so that the light color consistency of the LED can be improved.
The above examples are only for illustrating the present invention and are not intended to limit the scope of the present invention. In practical application, the raw materials or equivalent substitutes thereof, the processing methods or equivalent substitutes thereof, and the upper and lower limit values and interval values of the parameters of the raw materials and the processing methods can all realize the invention, and still belong to the protection scope of the invention.
Claims (8)
1. A method for preparing a fluorescent thin film structure for an LED is characterized by comprising the following steps:
s1: obtaining a first transparent film;
s2: obtaining a second transparent film;
s3: coating fluorescent powder on the upper surface of the first transparent film;
s4: bonding the second transparent film to the upper surface of the first transparent film in the step S3 to form the LED fluorescent film structure;
the step S1 and the step S2 may be performed simultaneously, and the step S2 and the step S3 may be exchanged in order;
the step S1 includes:
s101: weighing a first adhesive, and performing vacuum defoaming treatment on the first adhesive;
s102: preparing a first transparent film-like adhesive on a substrate by using the first adhesive subjected to vacuum degassing in the step S101 through a spin coating method;
s103: and curing the first transparent film-like adhesive prepared in the step S102 to obtain the first transparent film.
2. The method of claim 1, wherein the step S2 includes:
s201: weighing a second adhesive, and performing vacuum defoaming treatment on the second adhesive;
s202: preparing a second transparent film-like adhesive on the substrate by using the second adhesive subjected to vacuum degassing in the step S201 through a spin coating method;
s203: and curing the second transparent film-like adhesive prepared in step S202 to obtain the second transparent film.
3. The method of claim 2, wherein the step S3 includes:
s301: weighing fluorescent powder, wherein the mass ratio of the fluorescent powder to the first adhesive and/or the second adhesive is 0.5-1.5: 1;
s302: coating the fluorescent powder on the upper surface of the first transparent film;
the step S301 may be performed simultaneously with the step S101 or the step S201.
4. The method of claim 2, wherein the performing of the curing process in step S103 and/or step S203 comprises:
a1, a first curing stage, wherein the first curing stage is curing at 50-100 ℃ for 10-60 min;
a2, and a second curing stage, wherein the second curing stage is curing at 120-160 ℃ for 10-60 min.
5. The method of claim 3, wherein the step S4 includes:
s401: bonding the second transparent film to the upper surface of the first transparent film in the step S3 to form two transparent films;
s402: and bonding the two layers of transparent films in the step S401 together by adopting a hot pressing technology to obtain the fluorescent film structure for the LED.
6. The method of claim 3, wherein the phosphor in step S302 is uniformly coated on the upper surface of the first transparent film.
7. The method for preparing a fluorescent thin film structure for LED according to claim 1 or 2, wherein the substrate is made of one material selected from glass and plastic, the thickness of the substrate is 0.5-1 cm, and the substrate is resistant to a temperature of 160 ℃ or higher.
8. The method of claim 4, wherein the first curing stage is 20min at 80 ℃ and the second curing stage is 20min at 150 ℃.
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| CN108198931A (en) * | 2018-02-01 | 2018-06-22 | 深圳市光科全息技术有限公司 | A kind of flourescent sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2016018960A (en) * | 2014-07-10 | 2016-02-01 | エムテックスマート株式会社 | Manufacturing method of led and led |
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| CN106243605A (en) * | 2011-07-05 | 2016-12-21 | 迪睿合电子材料有限公司 | Phosphor plates formation resin combination |
| CN202695537U (en) * | 2012-07-10 | 2013-01-23 | 东华大学 | Fluorescent patch applied to fluorescent conversion type LED lamp |
| CN106816521A (en) * | 2016-12-26 | 2017-06-09 | 温州大学 | A kind of interlayer fluorescent glass and its preparation method and application |
| CN108198931A (en) * | 2018-02-01 | 2018-06-22 | 深圳市光科全息技术有限公司 | A kind of flourescent sheet |
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