CN103258936A - LED packaging substrate and method for coating in shape-preserving mode - Google Patents
LED packaging substrate and method for coating in shape-preserving mode Download PDFInfo
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- CN103258936A CN103258936A CN2013101395761A CN201310139576A CN103258936A CN 103258936 A CN103258936 A CN 103258936A CN 2013101395761 A CN2013101395761 A CN 2013101395761A CN 201310139576 A CN201310139576 A CN 201310139576A CN 103258936 A CN103258936 A CN 103258936A
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Abstract
The invention discloses an LED packaging substrate and a method for coating in a shape-preserving mode. The surface of the substrate is a light reflecting layer, a boss is arranged at the position where a chip is fixed on the substrate, the upper surface of the boss is provided with a groove which is used for being aligned to the substrate when crystals of an LED chip are fixed in LED packaging, a zone, except the position where the crystals are fixed on the chip, on the boss is coated with a chemical coating layer with pro-fluorescent powder glue so that the fluorescent powder glue can be spread out on the boss quickly. The method includes the steps: the fluorescent powder glue is coated along the center of the boss of the substrate and the fluorescent powder glue is reserved on the upper top face of the boss; the fluorescent powder glue is put into an environment with temperature higher than the room temperature and lower than the solidification temperature to enable organic solvent to be evaporated; at the same time, due to the fact that viscosity of the fluorescent powder glue becomes low, fluorescent powder particles are subsided on the fluorescent powder glue quickly till the fluorescent powder particles are distributed around the chip to form a thin fluorescent powder layer. Therefore, the coating of the fluorescent powder in the shape-preserving mode is achieved. The coating of the fluorescent powder in the shape-preserving mode can be compatible with a device with a fluorescent powder free glue dispensing coating technology. The LED packaging substrate and the method for coating in the shape-preserving mode have the advantage of being simple in technology.
Description
Technical field
The invention belongs to the LED encapsulation technology, relate to a kind of LED base plate for packaging and reach the method that is used for the conformal coating, can realize that the LED fluorescent material conformal specular quality and colour temperature stability applies, be specially adapted in the extensive LED encapsulation production.
Background technology
LEDs (Light Emitting Diodes) is a kind of light emitting semiconductor device of making based on P-N junction electroluminescence principle, have advantages such as electro-optical efficiency height, long service life, environmental protection and energy saving and volume are little, be described as the 21 century green illumination light source, if can be applied to the traditional lighting field and will obtain very obvious energy-saving effect, this is significant now what be becoming tight global energy day.Along with the breakthrough that with the nitride is the third generation semi-conducting material technology of representative, semiconductor lighting industry based on high-power and high-luminance light-emitting diode (LED) is risen rapidly in the whole world, just become semi-conductor photoelectronic industry new growth engines, and causing a revolution in the traditional lighting field.Because the LED unique advantages, begun to be used widely in a lot of fields, as Landscape Lighting, headlight for vehicles, street lamp and backlight etc., thought the main developing direction of following lighting technology to have huge market potential by industry.
Current LED color quality more and more is subjected to everybody attention, specifically can comprise the photochromic consistency of LED and LED spatial color uniformity two aspects, for example USDOE will improve the photochromic consistency of LED, reduce and divide one of Bin quantity main five big challenges as LED illumination development, and the star (Energy Star) of american energy was classified the spatial color uniformity of LED encapsulation and light fixture one of as LED lighting quality evaluation index in 2008 simultaneously.Along with the rapid popularization (as commercial lighting, lighting of home, office lighting etc.) of LED in the room lighting field, people are progressively changed " according to comfortable " into to the requirement of LED illumination from " illuminating ", packaging technology by accurately controlling when therefore LED encapsulates, improve the photochromic consistency of LED and spatial color uniformity, become and widened the LED lighting field, accelerated the important techniques target that LED replaces traditional lighting.
Large power white light LED is normally mixed by two wavelength light (blue light+sodium yellow) or three-wavelength light (blue light+green light+red light).The white light LEDs that extensively adopts is to form by blue led chip (GaN) and yellow fluorescent powder (YAG or TAG) at present.The phosphor powder layer parameter has a strong impact on the important optical properties such as light extraction efficiency, colour temperature, spatial color uniformity of LED in LED encapsulation.Current, a kind of fluorescent material coating method that the most generally adopts in LED encapsulation is that fluorescent material free point glue applies, and this kind fluorescent material coating method has advantages such as the simple and low cost of technology; Yet this kind fluorescent material coating method usually causes final LED encapsulating products colour temperature spatial distribution to have bigger difference, is having a strong impact on the lighting quality of LED product.Domestic and international research person has carried out many research work, finds the method that the conformal of LED fluorescent material applies, and namely the phosphor powder layer uniform thickness is coated on the led chip surface.The conformal coating method requires to control parameters such as fluorescent material geometry and thickness, thereby improves photochromic consistency and the spatial color uniformity of LED encapsulating products; Fluorescent material conformal simultaneously applies the ultra-thin phosphor powder layer of realizing can effectively solve colour temperature temperature and the integrity problem that the fluorescent material heating brings.For the conformal that realizes fluorescent material applies, global famous LED encapsulates electrophoresis (U.S.patent6,576 that enterprise successively develops, 488), solution evaporation (U.S.patent7,217,583), wafer level packaging (B.Braune et al., Proc.SPIE6486,64860X, process (H.T.Huang et al., OPTICS EXPRESS, 18 of the pulse spraying described of pertinent literature 2007) and at present, A201,2010).Wherein electrophoresis and solution evaporation realize that conformal applies comparatively complexity, and cost is higher; The process of wafer level packaging and pulse spraying is had relatively high expectations to sealed in unit, and technology is control accurately, and can not realize that the conformal of LED horizontal chip applies.To develop a kind of technology simple, low-cost and be applicable to that the fluorescent material conformal of all led chip types applies the LED optical articles of encapsulation high optical quality most important for this reason.
Summary of the invention
The invention provides a kind of LED base plate for packaging and be used for the method that conformal applies, be intended to have good operability, can effectively promote the encapsulation performance of LED product simultaneously.
A kind of LED base plate for packaging provided by the invention, it is characterized in that, substrate surface is that reflector layer is provided with boss in substrate fixed chip position, the boss upper surface is provided with for realizing that LED encapsulation led chip is solid when brilliant and the groove of base plate alignment, remove zone outside the solid brilliant position of chip on the boss, scribble the immersion coating of one deck parent phosphor gel, phosphor gel can be sprawled on this boss fast.
Above-mentioned LED base plate for packaging carries out the method that conformal applies, and comprises the steps:
(1) after finishing fixed L ED chip and circuit be connected operation, the center in the zone of phosphor gel in the substrate boss is applied, make phosphor gel rest on the last end face of boss;
(2) led module that step (1) is obtained is placed into and makes the organic solvent volatilization in the ring that is higher than room temperature and is lower than curing temperature, the viscosity of phosphor gel diminishes simultaneously, thereby fluorescent powder grain is rapid precipitation in phosphor gel, until the fluorescent powder grain tight distribution around chip, and form the thin phosphor powder layer of one deck, thereby realize that the fluorescent material conformal applies.
The fluorescent material conformal paint-on technique principle that the present invention adopts is: by the board structure design, a glue is applied how much patterns of back chip phosphor gel on every side control, make that how much patterns of fluorescent material are very compact; Utilize the precipitation effect of fluorescent powder grain then, obtain to be distributed in chip fluorescent material thin layer on every side; The final fluorescent material conformal coating that realizes having good optical and reliability.The fluorescent material method of conformal coating of LED of the present invention encapsulation, can with the fluorescent material free point coating device compatibility of current extensive employing, have good operability and the advantage of extensive use rapidly.Can effectively promote simultaneously the encapsulation performance of LED product, as optical property and reliability etc.
Description of drawings
Fig. 1 contains the schematic diagram that control fluorescent material applies the lead frame substrate of the boss that flows;
Fig. 2 is the schematic diagram of spot printing phosphor gel on the substrate boss;
Fig. 3 finishes the fluorescent powder grain post precipitation, reaches the schematic diagram that the fluorescent material conformal applies effect;
Fig. 4 contains the schematic diagram that control fluorescent material applies the ceramic substrate of the boss that flows;
Fig. 5 is the schematic diagram of spot printing phosphor gel on the substrate boss;
Fig. 6 finishes the fluorescent powder grain post precipitation, reaches the schematic diagram that the fluorescent material conformal applies effect;
Symbol description among the figure: 1001 lead frame templates, 1002 is heat sink, 1003 moulding compounds, 1004 support pins, 1005LED chip, 1006 silica gel, 1007 phosphor gel, 1008 phosphor powder layers, 1009 fluorescent material point coating devices, 1010 lead frame boss, 1011 grooves, 1012 immersion coatings, 2001 ceramic substrates, 2002 wire bond, 2003 ceramic layers, 2004 ceramic substrate boss.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described further.Need to prove at this, understand the present invention for the explanation of these execution modes for helping, but do not constitute limitation of the invention.In addition, below in each execution mode of described the present invention involved technical characterictic just can not make up mutually as long as constitute conflict each other.
A kind of fluorescent material method of conformal coating that is applied to the LED encapsulation that the present invention proposes, this fluorescent material method of conformal coating need specifically to implement a kind of substrate that contains boss of realizing mobile control in the fluorescent material coating.
The surface of substrate is reflector layer, and the material of reflector layer can be silver or other reflectorized material.Increase by a boss in substrate fixed chip position, boss can be vertical or incline structure etc., and the boss height is between the 0.01mm-3mm.The geometry of boss can be cuboid, round platform, truncated rectangular pyramids or five terrace with edges etc.The upper surface of boss is fluted, be used for to realize that LED encapsulation led chip is solid when brilliant and base plate alignment.Remove zone outside the solid brilliant position of chip on the boss, scribble the immersion coating (as titanium dioxide, 16 mercaptan and gold layer etc., the thickness of immersion coating generally requires less than 1 micron) of one deck parent phosphor gel; Be that the contact angle of phosphor gel on boss is very little, thereby the realization phosphor gel is sprawled on boss fast.
The material of substrate can be metal substrate materials such as copper, aluminium, silicon, pottery and non-metal base plate materials such as pcb board, glass;
Board structure can pass through CNC milling machine, and processing technologys such as line cutting, forging and pressing, injection moulding and etching realize.
Concrete phosphor gel painting method:
(1) after finishing fixed L ED chip and circuit be connected operation, phosphor gel is applied along substrate boss center, because the stagnation effect at boss edge, phosphor gel rests on the last end face of boss;
Being used for the encapsulated LED chip and can being quaternary materials such as binary material such as GaN or AlGaNP forms and other chip.
The process for preparation of phosphor gel is: fluorescent material is added in the glue material, and mix, wherein the glue material comprises packaging plastic commonly used such as silica gel, epoxy resin, or adds the organic retarder thinner that is used for reducing packaging plastic viscosity again in packaging plastic commonly used such as silica gel, epoxy resin, as ethanol etc.; For preventing fluorescent powder grain at the deposited phenomenon of coating procedure, in the phosphor gel that mixes, add polymethyl methacrylate (PMMA) particle, particle diameter is the 10-50 micron; Regulate the ratio between fluorescent material and the glue material, matched proportion density is the phosphor gel of 0.01g/ml～5.0g/ml, the addition of organic retarder thinner is the 0-10% of phosphor gel cumulative volume, and preferred range is 2-10%, and poly methyl methacrylate particle concentration is 0.01g/ml～1.0g/ml.Fluorescent material in the phosphor gel can be the fluorescent material that all LED encapsulation such as YAG and TAG are adopted.It can be materials such as silica gel, epoxy resin and liquid glass that the configuration phosphor gel is used the glue material.
Phosphor gel is transferred to approach on the substrate and can be dripped by syringe and be coated with approach such as spraying.
(2) led module that step (1) is obtained is placed into and makes organic solvent volatilization (normally placing 0.5 hour-2 hours in 45 ℃-65 ℃ environment) in the environment that is higher than room temperature and is lower than curing temperature in 45 ℃ of-65 ℃ of temperature ranges, the viscosity of phosphor gel diminishes simultaneously, thereby fluorescent powder grain is rapid precipitation in phosphor gel, until the fluorescent powder grain tight distribution around chip, and form the extremely thin phosphor powder layer of one deck, thereby realize that the fluorescent material conformal applies.
This method goes for LED packing forms such as stent-type, chip on board, array and system in package.
Embodiment 1
Referring to Fig. 1, for containing the lead frame structure 1001 that is used for the LED encapsulation of boss 1010 structures, boss 1010 is a rectangular configuration.As shown in Figure 2, after led chip 1005 is bonded in the positive center of boss 1010 end faces, finish after gold thread 1004 lead key closing process, concentration is 0.5g/cm
3Phosphor gel 1007 is coated in lead frame boss 1010 end faces by 1009 of fluorescent material point coating devices, and the phosphor gel volume is 0.2 μ L, and can coat led chip 1005.After applying phosphor gel, led module is placed in 45 ℃ the cavity 1 hour, realizes the precipitation of fluorescent powder grain.Represent the fluorescent material post precipitation as Fig. 3, the fluorescent powder grain tight distribution is around chip, and the upper strata is pure silicon glue.It is to carry out phosphor gel in 1 hour in 150 ℃ the baking box to solidify that the led module of finishing above-mentioned technology is transferred to temperature, realizes that the fluorescent material conformal in the LED encapsulation applies.
Fig. 1-3 has shown the application of fluorescent material conformal paint-on technique scheme of the present invention on lead frame structure.
Embodiment 2
Referring to Fig. 4, be the ceramic substrate 2001 that is used for the LED encapsulation of boss structure, boss 2004 is a circular configuration.As shown in Figure 5, after led chip 1005 is bonded in the positive center of boss 1010 end faces, finish after gold thread 1004 lead key closing process, proportioning fluorescent material concentration is 0.8g/cm
3Phosphor gel 1007, wherein contain diluent ethanol 1.8% in the phosphor gel, the PMMA granule density is 0.1g/cm
3; By fluorescent material point coating device 1009 the phosphor gel point is coated in boss 2004 end faces, volume is 0.16 μ l, and can coat led chip 1005.Represent the fluorescent material post precipitation as Fig. 6, the fluorescent powder grain tight distribution is around chip, and the upper strata is pure silicon glue.After applying phosphor gel, led module is placed in 55 ℃ the cavity 1 hour, and ethanol begins volatilization, the fluorescent powder grain precipitation.It is to carry out phosphor gel in 1 hour in 150 ℃ the baking box to solidify that the led module of finishing above-mentioned technology is transferred to temperature, realizes that the fluorescent material conformal in the LED encapsulation applies.
Fig. 4-6 has shown the application of fluorescent material conformal paint-on technique scheme of the present invention on ceramic substrate.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the disclosed content of this embodiment and accompanying drawing.So everyly do not break away from the equivalence of finishing under the spirit disclosed in this invention or revise, all fall into the scope of protection of the invention.
Claims (10)
1. LED base plate for packaging, it is characterized in that, substrate surface is that reflector layer is provided with boss in substrate fixed chip position, the boss upper surface is provided with for realizing that LED encapsulation led chip is solid when brilliant and the groove of base plate alignment, remove zone outside the solid brilliant position of chip on the boss, scribble the immersion coating of one deck parent phosphor gel, phosphor gel can be sprawled on this boss fast.
2. LED base plate for packaging according to claim 1 is characterized in that, described boss height is 0.01mm-3mm.
3. LED base plate for packaging according to claim 1 is characterized in that, described boss is cuboid, round platform, truncated rectangular pyramids or five terrace with edges.
4. according to arbitrary described LED base plate for packaging in the claim 1 to 3, it is characterized in that the material of described immersion coating is titanium dioxide, 16 mercaptan or gold.
5. according to arbitrary described LED base plate for packaging in the claim 1 to 3, it is characterized in that the thickness of described immersion coating is less than 1 micron.
6. one kind is utilized the described LED base plate for packaging of claim 1 to carry out the method that conformal applies, and comprises the steps:
(1) after finishing fixed L ED chip and circuit be connected operation, phosphor gel is applied along substrate boss center, phosphor gel is because the stagnation effect of boss rests on the last end face of boss;
(2) led module that step (1) is obtained is placed into and makes the organic solvent volatilization in the ring that is higher than room temperature and is lower than curing temperature, the viscosity of phosphor gel diminishes simultaneously, thereby fluorescent powder grain is rapid precipitation in phosphor gel, until the fluorescent powder grain tight distribution around chip, and form the thin phosphor powder layer of one deck, thereby realize that the fluorescent material conformal applies.
7. the method that applies of conformal according to claim 6, it is characterized in that: described phosphor gel is made of fluorescent material, poly methyl methacrylate particle and glue material, altogether, the poly methyl methacrylate particle diameter is 10 microns-50 microns, the content of poly methyl methacrylate particle is 0.01g/ml～1.0g/ml, and the content of fluorescent material is 0.01g/ml～5.0g/ml.
8. according to the method for claim 6 or 7 described conformals coatings, it is characterized in that: phosphor gel is dripped to be coated with or to spray by syringe and is transferred on the substrate.
9. according to the method for claim 6 or 7 described conformals coatings, it is characterized in that: described glue material comprises packaging plastic and organic retarder thinner, and the addition of described organic retarder thinner is the 0-10% of phosphor gel cumulative volume.
10. the method that applies of conformal according to claim 9, it is characterized in that: described packaging plastic is silica gel, epoxy resin or liquid glass, the addition of organic retarder thinner is the 2-10% of phosphor gel cumulative volume.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470371A (en) * | 2015-12-03 | 2016-04-06 | 华中科技大学 | Coating apparatus and coating method for phosphor powder |
| CN105914284A (en) * | 2016-05-31 | 2016-08-31 | 华中科技大学 | Solution method based phosphor glue film coating method, product and application |
| JP2017220530A (en) * | 2016-06-06 | 2017-12-14 | シチズン電子株式会社 | Manufacturing method of light-emitting device |
| CN113937203A (en) * | 2021-10-13 | 2022-01-14 | 厦门华联电子股份有限公司 | Packaging film covering method for LED chip |
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| CN102859648A (en) * | 2010-03-03 | 2013-01-02 | 克里公司 | Systems and methods for application of optical materials to optical elements |
| CN102931320A (en) * | 2012-11-13 | 2013-02-13 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | White light light-emitting diode (LED) approximate shape-preserving packaging structure and preparation method thereof |
| CN203205458U (en) * | 2013-04-22 | 2013-09-18 | 华中科技大学 | LED package substrate |
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| CN1966160A (en) * | 2005-11-15 | 2007-05-23 | 厦门华联电子有限公司 | Fluorescent glue coating process |
| US20110241023A1 (en) * | 2010-01-26 | 2011-10-06 | Cho Byoung Gu | Multichip light emitting diode (led) and method of manufacture |
| CN102859648A (en) * | 2010-03-03 | 2013-01-02 | 克里公司 | Systems and methods for application of optical materials to optical elements |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105470371A (en) * | 2015-12-03 | 2016-04-06 | 华中科技大学 | Coating apparatus and coating method for phosphor powder |
| CN105470371B (en) * | 2015-12-03 | 2017-11-17 | 华中科技大学 | A kind of device and its painting method for fluorescent material coating |
| CN105914284A (en) * | 2016-05-31 | 2016-08-31 | 华中科技大学 | Solution method based phosphor glue film coating method, product and application |
| JP2017220530A (en) * | 2016-06-06 | 2017-12-14 | シチズン電子株式会社 | Manufacturing method of light-emitting device |
| CN113937203A (en) * | 2021-10-13 | 2022-01-14 | 厦门华联电子股份有限公司 | Packaging film covering method for LED chip |
| CN113937203B (en) * | 2021-10-13 | 2023-07-18 | 厦门华联电子股份有限公司 | Packaging and film coating method of LED chip |
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