WO2017166870A1 - Method for manufacturing high color gamut white light led lamp bead based on red light quantum dot - Google Patents

Method for manufacturing high color gamut white light led lamp bead based on red light quantum dot Download PDF

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WO2017166870A1
WO2017166870A1 PCT/CN2016/110960 CN2016110960W WO2017166870A1 WO 2017166870 A1 WO2017166870 A1 WO 2017166870A1 CN 2016110960 W CN2016110960 W CN 2016110960W WO 2017166870 A1 WO2017166870 A1 WO 2017166870A1
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quantum dot
red light
glue
light quantum
phosphor
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PCT/CN2016/110960
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French (fr)
Chinese (zh)
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高丹鹏
邢其彬
苏宏波
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深圳市聚飞光电股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • the invention belongs to the field of LED backlight processing, and particularly relates to a method for manufacturing a high color gamut white LED lamp bead based on red light quantum dots.
  • LED backlights have become the mainstream in the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color control, etc. Especially the high color gamut LED backlight enables the application of its TV, mobile phone, Electronic products such as tablets have more vivid colors and higher color reproduction. At present, the commonly used LED backlight uses a blue chip to excite the YAG yellow phosphor. Due to the lack of red light in the backlight, the color gamut value can only reach NTSC 65% to 72%.
  • the technician In order to further improve the color gamut value, the technician generally adopts a method in which the blue light chip simultaneously excites the red phosphor and the green phosphor, but since the half-wave width of the phosphor is wider, even if this method is used, only Can increase the color gamut value of the backlight to about 80% NTSC.
  • the excitation efficiency of the existing phosphor is low, and a large amount of phosphor is required for realizing high color gamut white light, which leads to a high concentration of phosphor powder (a ratio of phosphor to package glue) in the LED packaging process, thereby greatly increasing the packaging operation. Difficulty and poor product rate.
  • quantum dot materials have been paid more and more attention.
  • quantum dot phosphors have a series of unique optical properties such as adjustable spectrum with size, narrow half-wave width of emission peak, large Stokes shift, and high excitation efficiency. Wide attention.
  • quantum dot phosphors achieve high color gamut white light mainly in the following ways: (1) The quantum dot phosphor is made into an optical film, filled in a light guide plate or attached to a liquid crystal screen, and excited by a blue or ultraviolet backlight lamp bead. (2) The quantum dot phosphor powder is made into a glass tube, placed on the side of the screen, and excited by blue or ultraviolet backlight beads to obtain high color gamut white light.
  • the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art complicated process, low light conversion efficiency, high cost, and difficult to realize large-scale industrialization, thereby proposing a high color gamut value and avoiding quantum dots.
  • a method for producing a high color gamut white LED lamp bead based on red light quantum dots which can be agglomerated by phosphors, has high yield, and can be mass-produced industrially.
  • the present invention discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot, and the process steps are as follows:
  • step 3 weigh 5 to 1000 parts by weight of the encapsulating glue, pour into the red light quantum dot clear solution obtained in step 2); magnetically stir the quantum dot solution mixed with the encapsulating glue;
  • step 5 vacuum defoaming the fluorescent glue mixed with the green phosphor in step 5), mixing the green phosphor with the red quantum dot fluorescent gel, and completely defoaming the fluorescent gel to obtain red and green fluorescent glue. ;
  • the red and green fluorescent glue obtained in the step 6) is dropped into the LED holder fixed with the blue chip, and baked to cure the fluorescent glue, thereby obtaining a high color gamut white LED lamp bead.
  • the peak wavelength of the emitted light of the red light quantum dot phosphor is 600-660 nm; and the peak wavelength of the emitted light of the blue chip is 430-470 nm.
  • the red light quantum dot phosphor has a particle diameter of 1 to 10 nm.
  • the red light quantum dot phosphor is BaS, AgInS 2 , NaCl, Fe 2 O 3 , In 2 O 3 , InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe.
  • the organic solvent is at least one of n-hexane, cyclohexane, n-octane, toluene, dichlorotoluene, dichloromethane, chloroform, and pyridine.
  • the encapsulant is one of an epoxy encapsulant, a silicone encapsulant, and a polyurethane encapsulant.
  • the green light fluorescent powder has a peak light wavelength of 520 to 555 nm.
  • the green phosphor is at least one of a rare earth element doped silicate, an aluminate, a phosphate, a nitride, and a fluoride phosphor.
  • the magnetic stirring is specifically: placing the quantum dot solution mixed with the sealing glue in a magnetic stirrer, controlling the rotational speed of the magnetic rotor to be 120-350 rpm, and stirring for 5-30 min.
  • the specific step of the vacuum degassing agitation in the step 4) is: placing the mixed liquid obtained in the step 3) in a vacuum defoaming machine, and vacuuming until the pressure in the defoaming machine is 0 to 0.2 Kpa, and controlling off
  • the stirring speed of the bubble machine is 300-1200 rpm/min
  • the defoaming temperature is 40-55 ° C
  • the mixture is vacuum defoamed and stirred for 15 to 90 min
  • the baking temperature in the step 7) is 120-180 ° C
  • baking The time is 0.5-6h.
  • the high color gamut white LED lamp bead obtained by the red light quantum dot of the invention greatly improves the color gamut value of the backlight bead, and is up to 92% of NTSC.
  • the light powder has high excitation efficiency, and the phosphor concentration is low during the packaging operation, which reduces the difficulty of packaging operation and product defect rate, and is suitable for mass industrial production.
  • the high color gamut white LED lamp bead obtained by the red light quantum dot adopts the organic solvent as a connecting bridge to uniformly mix the quantum dot and the package glue, and avoids the agglomeration failure phenomenon of the quantum dot phosphor powder, which is remarkable Improve the quality of high color gamut white LED lamp beads.
  • the high color gamut white LED lamp bead obtained by using the red light quantum dot of the invention removes the organic solvent from the sealing glue by vacuum defoaming, thereby avoiding poisoning and hardening of the encapsulating glue by the influence of the organic solvent. Thereby solving the technical bottleneck of the quantum dot phosphor packaging, and greatly improving the reliability of the high color gamut white LED lamp bead.
  • FIG. 1 is a schematic view showing a manufacturing process of a high color gamut white LED lamp bead according to Embodiment 1-3;
  • Embodiment 2 is a structural diagram of the high color gamut white LED lamp bead described in Embodiment 1;
  • Embodiment 1 This embodiment discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot. The specific process steps are as shown in FIG. 1 :
  • red light quantum dot phosphor with a peak wavelength of 630 nm (red light quantum dot phosphor is commercially available and its particle size is 5 nm). According to the mass ratio of the red light quantum dot to the organic solvent is 1:1000, an appropriate amount of the organic solvent C 7 H 8 (toluene) is added to the red light quantum dot phosphor.
  • the mixed solution obtained in the step 1) is placed in an ultrasonic cleaner for ultrasonic treatment.
  • the ultrasonic bath temperature of the ultrasonic cleaning machine was controlled at 35 ° C, the ultrasonic frequency was 70 KHz, and the ultrasonic treatment time was 40 min, so that the red light quantum dot phosphor was completely dissolved in the organic solvent to obtain a clear solution.
  • package glue A package glue B mass ratio of 1:10 (package A, package B is silicone package), red light quantum dot and package glue (including package glue A and package glue B) quality A ratio of 1:500, weigh a certain amount of encapsulating glue A and encapsulating glue B, and pour into the red light quantum dot clear solution obtained in step 2).
  • the quantum dot solution mixed with the encapsulating glue was placed in a magnetic stirrer to control the rotation speed of the magnetic rotor to 250 rpm, and stirred for 20 min to uniformly mix the red light quantum dot solution with the encapsulating glue A and the sealing glue B.
  • the mixture obtained in the step 3) is placed in a vacuum defoaming machine, vacuum is applied until the pressure in the deaerator is 0.1 Kpa, the stirring speed of the defoaming machine is controlled at 800 rpm/min, and the defoaming temperature is 48 ° C.
  • the organic solvent in the mixture obtained in the step 3) can be extracted by vacuum defoaming and stirring for 50 minutes to obtain a uniformly mixed red light quantum dot fluorescent glue.
  • green fluorescent powder with a peak wavelength of 540 nm (green phosphor can be rare earth doped silicate, aluminate, phosphate, nitride, fluoride, etc.)
  • the mass ratio of the green phosphor to the red quantum dot phosphor is 25:1), added to the red quantum dot fluorescent glue obtained in the step 4), and the fluorescent glue is manually stirred by the glass rod in the same direction Stir for 8 min at a constant speed to mix the green phosphor into the red quantum dot fluorescent gel.
  • the fluorescent glue mixed with the green phosphor in step 5) is placed in a vacuum defoaming machine to control the defoaming temperature to 40 ° C, the pressure of the pressure deaerator is 1 Kpa, and the defoaming stirring speed is 1500 rpm / Min, vacuum defoaming and stirring for 8 min, the green fluorescent powder and the red light quantum dot fluorescent glue are thoroughly mixed, and the fluorescent rubber is completely defoamed to obtain red and green fluorescent glue.
  • the obtained red and green fluorescent glue is dropped into a blue chip (the peak wavelength of the chip emission light is 450 nm), and the bonding wire is connected (the bonding wire material may be gold, silver, copper and other conductive alloy)
  • the LED holder cup case the LED holder is placed in an oven and baked at 160 ° C for 4 hours. After the red and green fluorescent glue in the cup is cured, a high color gamut white LED lamp bead is obtained.
  • the obtained LED lamp bead is composed of 1 bracket, 2 blue chip, 3 bonding wire, 4 red light quantum dot phosphor, 5 green light rare earth phosphor and 6 package glue (see FIG. 2 for details).
  • Embodiment 2 This embodiment discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot. The specific process steps are as shown in FIG. 1 :
  • GaN red light quantum dot phosphor with a peak wavelength of 600 nm (red light quantum dot phosphor is commercially available and its particle size is 10 nm). According to the mass ratio of the red light quantum dot to the organic solvent is 1:50, an appropriate amount of the organic solvent CHCl 3 (trichloromethane) is added to the red light quantum dot phosphor.
  • the mixed solution obtained in the step 1) is placed in an ultrasonic cleaner for ultrasonic treatment.
  • the ultrasonic bath temperature of the ultrasonic cleaning machine is controlled to 45 ° C, the ultrasonic frequency is 15 KHz, and the ultrasonic treatment time is 90 min, so that the red light quantum dot phosphor is completely dissolved in the organic solvent to obtain a clear solution.
  • the package glue B mass ratio is 1:20 (package glue A, package glue B is polyurethane package glue), the mass ratio of red light quantum dot and package glue (including package glue A and package glue B) is 1:5, weigh a certain amount of package glue A and package glue B, and pour into the red light quantum dot clear solution obtained in step 2).
  • the quantum dot solution mixed with the sealing glue was placed in a magnetic stirrer, and the magnetic rotor speed was controlled to be 350 rpm, and the mixture was stirred for 5 minutes to uniformly mix the red light quantum dot solution with the sealing glue A and the sealing glue B.
  • the mixture obtained in the step 3) is placed in a vacuum defoaming machine, and the vacuum is evacuated to a pressure of 0.1 Kpa in the defoaming machine, the stirring speed of the defoaming machine is controlled to be 1200 rpm/min, and the defoaming temperature is 40 to 55 ° C.
  • the mixed solution was subjected to vacuum defoaming and stirring for 15 minutes, and the organic solvent in the mixed liquid obtained in the step 3) was extracted to obtain a uniformly mixed red light quantum dot fluorescent gel.
  • green fluorescent powder with a peak wavelength of 555 nm (green phosphor can be rare earth doped silicate, aluminate, phosphate, nitride, fluoride, etc.) At least one of the above, the mass ratio of the green phosphor to the red quantum dot phosphor is 1:1,), added to the red quantum dot fluorescent gel obtained in the step 4), and artificially stirred by a glass to the fluorescent glue. Stir in the same direction for 5 min at a constant speed to mix the green phosphor into the red quantum dot fluorescent gel.
  • the fluorescent glue mixed with the green fluorescent powder obtained in the step 5) is placed in a vacuum defoaming machine to control the defoaming temperature to be 55 ° C, the defoaming machine pressure is 0.1 Kpa, and the defoaming agent stirring speed is 2000 rpm / Min, vacuum defoaming and stirring for 3 min, the green phosphor and the red light quantum dot fluorescent glue are thoroughly mixed, and the fluorescent rubber is completely defoamed to obtain red and green fluorescent glue.
  • the LED bracket is connected to the bonding wire (the bonding wire material can be gold, silver, copper and other conductive alloy).
  • the LED bracket is placed in an oven and baked at 120 ° C for 6 hours. After the red and green fluorescent glue in the cup is cured, the high color gamut white LED lamp bead is obtained.
  • the obtained LED lamp bead is composed of a bracket, a blue chip, a bonding wire, a red light quantum dot phosphor, a green rare earth phosphor, and a package glue.
  • Embodiment 3 This embodiment discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot. The specific process steps are as shown in FIG. 1 :
  • the mixed solution obtained in the step 1) is placed in an ultrasonic cleaner for ultrasonic treatment.
  • the ultrasonic bath temperature of the ultrasonic cleaning machine is controlled to 25 ° C, the ultrasonic frequency is 120 KHz, and the ultrasonic treatment time is 10 min, so that the red light quantum dot phosphor is completely dissolved in the organic solvent to obtain a clear solution.
  • the package glue B mass ratio is 1:20 (package A, package B is silicone package), red light quantum dot and package glue (including package glue A and package glue B) quality A ratio of 1:5, weigh a certain amount of encapsulating glue A and encapsulating glue B, and pour into the red light quantum dot clear solution obtained in step 2).
  • the quantum dot solution mixed with the sealing glue was placed in a magnetic stirrer, and the magnetic rotor speed was controlled to be 350 rpm, and the mixture was stirred for 5 minutes to uniformly mix the red light quantum dot solution with the sealing glue A and the sealing glue B.
  • the mixture obtained in the step 3) is placed in a vacuum defoaming machine, vacuumed to a pressure of 0.2 Kpa in the defoaming machine, the stirring speed of the defoaming machine is controlled at 300 rpm/min, and the defoaming temperature is 55 ° C.
  • the organic solvent in the mixture obtained in the step 3) can be extracted by vacuum defoaming and stirring for 15 minutes to obtain a uniformly mixed red light quantum dot fluorescent gel.
  • green fluorescent powder with a peak wavelength of 555 nm (green phosphor can be rare earth doped silicate, aluminate, phosphate, nitride, fluoride, etc.)
  • At least one of the mass ratio of the green phosphor to the red quantum dot phosphor is 50: 1), added to the red light quantum dot fluorescent glue obtained in the step 4), artificially stirred the fluorescent glue with glass, and uniformly stirred in the same direction for 5 min, so that the green fluorescent powder is mixed into the red light quantum dot fluorescent glue.
  • the fluorescent glue mixed with the green fluorescent powder obtained in the step 5) is placed in a vacuum defoaming machine to control the defoaming temperature to 25 ° C, the defoaming machine pressure is 1.5 Kpa, and the defoaming agent stirring speed is 1100 rpm / Min, vacuum defoaming and stirring for 10 min, the green fluorescent powder and the red light quantum dot fluorescent glue are thoroughly mixed, and the fluorescent rubber is completely defoamed to obtain red and green fluorescent glue.
  • the obtained red and green fluorescent glue is dropped into the blue chip (the peak wavelength of the chip emission light is 470 nm), and the bonding wire (the bonding wire material can be gold, silver, copper and other conductive alloy) is connected.
  • the LED holder is placed in an oven and baked at 180 ° C for 0.5 h. After the red and green fluorescent glue in the cup is cured, a high color gamut white LED lamp bead is obtained.
  • the obtained LED lamp bead is composed of a bracket, a blue chip, a bonding wire, a red light quantum dot phosphor, a green rare earth phosphor, and a package glue.
  • Example 1 Example 2
  • Example 3 Color coordinates (0.30, 0.28) (0.28, 0.26) (0.29, 0.27) NTSC gamut value 93.2% 94.2% 92.5%
  • the high color gamut white LED lamp bead obtained by the method described in the embodiment 1 is subjected to luminescence test, and the obtained emission spectrum is shown in FIG. 3. It can be seen from the figure that the lamp bead obtained by the method of the embodiment is emitted under the excitation of the blue chip. Red and green light are combined with blue light chips to form high color gamut white light.
  • the half-wave width of the red light emission peak of the lamp bead (about 640 nm) is narrower, indicating that the emitted red light color has higher purity and the color gamut value of the lamp bead is high.

Abstract

The invention belongs to the field of LED backlight processing, and specifically relates to a method for manufacturing a high color gamut white light LED lamp bead based on a red light quantum dot. The present invention uses a red light quantum dot fluorescent powder, and encapsulates the red light right quantum dot fluorescent powder within a backlight LED lamp bead utilizing an organic solvent by way of first dissolving and then extracting same, where a blue light chip is used for excitation, to obtain a high color gamut white light. By means of related technical means, the invention greatly reduces the difficulty of encapsulation work, and solves the technical problems that it is difficult to mix the quantum dot fluorescent powder with encapsulation glue, that the quantum dot fluorescent powder easily agglomerates and loses effect, and that the encapsulation glue can hardly solidify due to the influence of organic matters, having a bright market prospect and high economic value.

Description

一种基于红光量子点的高色域白光LED灯珠的制作方法High color gamut white LED lamp bead based on red light quantum dot 技术领域Technical field
本发明属于LED背光加工领域,具体涉及一种基于红光量子点的高色域白光LED灯珠的制作方法。The invention belongs to the field of LED backlight processing, and particularly relates to a method for manufacturing a high color gamut white LED lamp bead based on red light quantum dots.
背景技术Background technique
进入二十一世纪以来,背光源技术发展迅速,不断有新技术、新产品推出,LED背光已成为市场主流。与传统的CCFL背光源相比,LED背光具有高色域、高亮度、长寿命、节能环保、实时色彩可控等诸多优点,特别是高色域的LED背光源使应用其的电视、手机、平板电脑等电子产品屏幕具有更加鲜艳的颜色,色彩还原度更高。目前常用的LED背光源采用蓝光芯片激发YAG黄光荧光粉的形式,因背光源中缺少红光成分,色域值只能达到NTSC 65%~72%。为了进一步提高色域值,技术人员普遍采用了蓝光芯片同时激发红光荧光粉、绿光荧光粉的方式,但由于现用荧光粉的半波宽较宽,故即使采用这种方式,也只能将背光源的色域值提升至NTSC 80%左右。同时,现有荧光粉的激发效率低,为实现高色域白光需要大量荧光粉,导致LED封装过程中荧光粉的浓度(荧光粉占封装胶水的比例)很高,从而极大地增加了封装作业的难度以及产品的不良率。Since the beginning of the 21st century, backlight technology has developed rapidly, and new technologies and new products have been introduced. LED backlights have become the mainstream in the market. Compared with the traditional CCFL backlight, LED backlight has many advantages such as high color gamut, high brightness, long life, energy saving and environmental protection, real-time color control, etc. Especially the high color gamut LED backlight enables the application of its TV, mobile phone, Electronic products such as tablets have more vivid colors and higher color reproduction. At present, the commonly used LED backlight uses a blue chip to excite the YAG yellow phosphor. Due to the lack of red light in the backlight, the color gamut value can only reach NTSC 65% to 72%. In order to further improve the color gamut value, the technician generally adopts a method in which the blue light chip simultaneously excites the red phosphor and the green phosphor, but since the half-wave width of the phosphor is wider, even if this method is used, only Can increase the color gamut value of the backlight to about 80% NTSC. At the same time, the excitation efficiency of the existing phosphor is low, and a large amount of phosphor is required for realizing high color gamut white light, which leads to a high concentration of phosphor powder (a ratio of phosphor to package glue) in the LED packaging process, thereby greatly increasing the packaging operation. Difficulty and poor product rate.
近年来,量子点材料逐渐受到重视,特别是量子点荧光粉具有光谱随尺寸可调、发射峰半波宽窄、斯托克斯位移大、激发效率高等一系列独特的光学性能,受到LED背光行业的广泛关注。目前,量子点荧光粉实现高色域白光的方式主要有:(1)将量子点荧光粉制成光学膜材,填充于导光板或者贴于液晶屏幕内,通过蓝光或紫外光背光灯珠激发,获得高色域白光;(2)将量子点荧光粉制成玻璃管,置于屏幕侧面,通过蓝光或紫外光背光灯珠激发,获得高色域白光。这两种实现方式已有相关产品推出,例如TCL的量子点膜 电视。但是,这两种实现方式的工艺复杂、光转化效率低、成本较高,很难实现大规模产业化。为此,有研究人员尝试,将量子点荧光粉封装与LED灯珠内来获得高色域白光,但由于存在量子点荧光粉难以与封装胶水混合,并且很容易团聚失效,且混入杂质会破坏封装胶水,使封装胶水难以固化等技术难题,故相关研究难以取得实质的进展。In recent years, quantum dot materials have been paid more and more attention. In particular, quantum dot phosphors have a series of unique optical properties such as adjustable spectrum with size, narrow half-wave width of emission peak, large Stokes shift, and high excitation efficiency. Wide attention. At present, quantum dot phosphors achieve high color gamut white light mainly in the following ways: (1) The quantum dot phosphor is made into an optical film, filled in a light guide plate or attached to a liquid crystal screen, and excited by a blue or ultraviolet backlight lamp bead. (2) The quantum dot phosphor powder is made into a glass tube, placed on the side of the screen, and excited by blue or ultraviolet backlight beads to obtain high color gamut white light. These two implementations have been introduced with related products, such as the quantum dot film of TCL. TV. However, the two implementations are complicated in process, low in light conversion efficiency, and high in cost, and it is difficult to achieve large-scale industrialization. To this end, some researchers have tried to enclose quantum dot phosphors and LED lamp beads to obtain high color gamut white light, but due to the existence of quantum dot phosphors, it is difficult to mix with the package glue, and it is easy to agglomerate failure, and the impurities will be destroyed. It is difficult to make substantial progress in related research, such as encapsulation of glue, which makes the encapsulation glue difficult to cure.
发明内容Summary of the invention
为此,本发明所要解决的技术问题在于克服现有技术工艺复杂、光转化效率低、成本较高,很难实现大规模产业化的技术瓶颈,从而提出一种色域值高、避免量子点荧光粉的团聚失效现象、良率高、可大批量工业化生产的基于红光量子点的高色域白光LED灯珠的制作方法。Therefore, the technical problem to be solved by the present invention is to overcome the technical bottleneck of the prior art complicated process, low light conversion efficiency, high cost, and difficult to realize large-scale industrialization, thereby proposing a high color gamut value and avoiding quantum dots. A method for producing a high color gamut white LED lamp bead based on red light quantum dots which can be agglomerated by phosphors, has high yield, and can be mass-produced industrially.
为解决上述技术问题,本发明公开了一种基于红光量子点的高色域白光LED灯珠的制作方法,所述工艺步骤如下:In order to solve the above technical problem, the present invention discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot, and the process steps are as follows:
1)称取1重量份的红光量子点荧光粉与50~2000重量份的有机溶剂,向红光量子点荧光粉中加入相应量的有机溶剂,得到混合溶液;1) weigh 1 part by weight of red light quantum dot phosphor and 50 to 2000 parts by weight of an organic solvent, and add a corresponding amount of organic solvent to the red light quantum dot phosphor to obtain a mixed solution;
2)将步骤1)所得混合溶液进行超声处理,直至红光量子点荧光粉完全溶解于有机溶剂中,获得澄清溶液;2) ultrasonically treating the mixed solution obtained in the step 1) until the red light quantum dot phosphor is completely dissolved in the organic solvent to obtain a clear solution;
3)称取5~1000重量份的封装胶水,倒入步骤2)所得红光量子点澄清溶液中;将混有封装胶水的量子点溶液进行磁力搅拌;3) weigh 5 to 1000 parts by weight of the encapsulating glue, pour into the red light quantum dot clear solution obtained in step 2); magnetically stir the quantum dot solution mixed with the encapsulating glue;
4)将步骤3)所得混合液进行真空脱泡搅拌;将步骤3)所得混合液中的有机溶剂抽出,得到混合均匀的红光量子点荧光胶;4) The mixture obtained in the step 3) is subjected to vacuum defoaming and stirring; the organic solvent in the mixture obtained in the step 3) is extracted to obtain a uniformly mixed red light quantum dot fluorescent gel;
5)称取1-50重量份绿光荧光粉,加入到步骤4)所得红光量子点荧光胶中,对荧光胶进行搅拌,使绿光荧光粉混入红光量子点荧光胶中;5) Weigh 1-50 parts by weight of the green fluorescent powder, add to the red light quantum dot fluorescent glue obtained in step 4), stir the fluorescent glue, and mix the green fluorescent powder into the red light quantum dot fluorescent glue;
6)再将步骤5)所得混有绿光荧光粉的荧光胶进行真空脱泡,使绿光荧光粉与红光量子点荧光胶充分混合,使荧光胶彻底脱泡,得到红、绿光荧光胶;6) vacuum defoaming the fluorescent glue mixed with the green phosphor in step 5), mixing the green phosphor with the red quantum dot fluorescent gel, and completely defoaming the fluorescent gel to obtain red and green fluorescent glue. ;
7)将步骤6)中得到的红、绿光荧光胶滴入固定有蓝光芯片的LED支架中,并烘烤使荧光胶固化,即得到高色域白光LED灯珠。 7) The red and green fluorescent glue obtained in the step 6) is dropped into the LED holder fixed with the blue chip, and baked to cure the fluorescent glue, thereby obtaining a high color gamut white LED lamp bead.
作为优选,所述步骤1)中,所述红光量子点荧光粉的发射光峰值波长为600~660nm;所述蓝光芯片的发射光峰值波长为430~470nm。Preferably, in the step 1), the peak wavelength of the emitted light of the red light quantum dot phosphor is 600-660 nm; and the peak wavelength of the emitted light of the blue chip is 430-470 nm.
作为优选,所述步骤1)中,所述红光量子点荧光粉的粒径为1~10nm。Preferably, in the step 1), the red light quantum dot phosphor has a particle diameter of 1 to 10 nm.
作为优选,所述步骤1)中,红光量子点荧光粉为BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3中的至少一种。Preferably, in the step 1), the red light quantum dot phosphor is BaS, AgInS 2 , NaCl, Fe 2 O 3 , In 2 O 3 , InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe. At least one of GaAs, GaN, GaS, GaSe, InGaAs, MgS, MgSe, MgTe, PbS, PbSe, PbTe, Cd(S x Se 1-x ), BaTiO 3 , PbZrO 3 , CsPbCl 3 , CsPbBr 3 , and CsPbI 3 One.
作为优选,所述步骤1)中,所述有机溶剂为正己烷、环己烷、正辛烷、甲苯、二氯甲苯、二氯甲烷、三氯甲烷、吡啶中的至少一种。Preferably, in the step 1), the organic solvent is at least one of n-hexane, cyclohexane, n-octane, toluene, dichlorotoluene, dichloromethane, chloroform, and pyridine.
作为优选,所述步骤1)中,所述封装胶为环氧类封装胶、有机硅类封装胶、聚氨酯封装胶中的一种。Preferably, in the step 1), the encapsulant is one of an epoxy encapsulant, a silicone encapsulant, and a polyurethane encapsulant.
作为优选,所述步骤5)中,所述绿光荧光粉的射光峰值波长为520~555nm。Preferably, in the step 5), the green light fluorescent powder has a peak light wavelength of 520 to 555 nm.
作为优选,所述步骤5)中,所述绿光荧光粉为稀土元素掺杂的硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种。Preferably, in the step 5), the green phosphor is at least one of a rare earth element doped silicate, an aluminate, a phosphate, a nitride, and a fluoride phosphor.
作为优选,所述步骤3)中,所述磁力搅拌具体为:将所述混有封装胶水的量子点溶液置于磁力搅拌机中,控制磁力转子转速为120~350rpm,搅拌5~30min。Preferably, in the step 3), the magnetic stirring is specifically: placing the quantum dot solution mixed with the sealing glue in a magnetic stirrer, controlling the rotational speed of the magnetic rotor to be 120-350 rpm, and stirring for 5-30 min.
作为优选,所述步骤4)中的真空脱泡搅拌的具体步骤为:将步骤3)所得混合液置于真空脱泡机中,抽真空至脱泡机内压强为0~0.2Kpa,控制脱泡机搅拌转速为300~1200rpm/min,脱泡温度为40~55℃,对混合液进行真空脱泡搅拌15~90min;所述步骤7)中烘烤的温度为120-180℃,烘烤时间为0.5-6h。Preferably, the specific step of the vacuum degassing agitation in the step 4) is: placing the mixed liquid obtained in the step 3) in a vacuum defoaming machine, and vacuuming until the pressure in the defoaming machine is 0 to 0.2 Kpa, and controlling off The stirring speed of the bubble machine is 300-1200 rpm/min, the defoaming temperature is 40-55 ° C, and the mixture is vacuum defoamed and stirred for 15 to 90 min; the baking temperature in the step 7) is 120-180 ° C, baking The time is 0.5-6h.
本发明的上述技术方案相比现有技术具有以下优点:The above technical solution of the present invention has the following advantages over the prior art:
(1)本发明采用红光量子点获得的高色域白光LED灯珠,极大的提高了背光灯珠的色域值,可达NTSC 92%以上。(1) The high color gamut white LED lamp bead obtained by the red light quantum dot of the invention greatly improves the color gamut value of the backlight bead, and is up to 92% of NTSC.
(2)本发明采用红光量子点获得的高色域白光LED灯珠,由于量子点荧 光粉激发效率高,封装作业过程中荧光粉浓度较低,降低了封装作业的难度及产品不良率,适合大批量工业化生产。(2) The high color gamut white LED lamp bead obtained by using the red light quantum dot of the present invention, due to quantum dot fluorescence The light powder has high excitation efficiency, and the phosphor concentration is low during the packaging operation, which reduces the difficulty of packaging operation and product defect rate, and is suitable for mass industrial production.
(3)本发明采用红光量子点获得的高色域白光LED灯珠,通过有机溶剂作为连接的桥梁,使量子点与封装胶水实现均匀混合,且避免了量子点荧光粉的团聚失效现象,显著提高了高色域白光LED灯珠的品质。(3) The high color gamut white LED lamp bead obtained by the red light quantum dot adopts the organic solvent as a connecting bridge to uniformly mix the quantum dot and the package glue, and avoids the agglomeration failure phenomenon of the quantum dot phosphor powder, which is remarkable Improve the quality of high color gamut white LED lamp beads.
(4)本发明采用红光量子点获得的高色域白光LED灯珠,通过真空脱泡的方式,使有机溶剂从封装胶水中去除,避免了封装胶水受有机溶剂的影响而中毒、难以固化,从而解决了量子点荧光粉封装的技术瓶颈,极大提高了高色域白光LED灯珠的可靠性。(4) The high color gamut white LED lamp bead obtained by using the red light quantum dot of the invention removes the organic solvent from the sealing glue by vacuum defoaming, thereby avoiding poisoning and hardening of the encapsulating glue by the influence of the organic solvent. Thereby solving the technical bottleneck of the quantum dot phosphor packaging, and greatly improving the reliability of the high color gamut white LED lamp bead.
附图说明DRAWINGS
为了使本发明的内容更容易被清楚的理解,下面根据本发明的具体实施例并结合附图,对本发明作进一步详细的说明,其中In order to make the content of the present invention easier to understand, the present invention will be further described in detail below with reference to the accompanying drawings
图1为实施例1-3中所述高色域白光LED灯珠制作流程示意图;1 is a schematic view showing a manufacturing process of a high color gamut white LED lamp bead according to Embodiment 1-3;
图2为实施例1中所述高色域白光LED灯珠的结构图;2 is a structural diagram of the high color gamut white LED lamp bead described in Embodiment 1;
图3为实施例1中所述高色域白光LED灯珠的发射光谱;3 is an emission spectrum of the high color gamut white LED lamp bead described in Embodiment 1;
图中附图标记表示为:1-支架;2-蓝光芯片;3-键合线;4-红光量子点荧光粉;5-绿光稀土荧光粉;6-封装胶水。Reference numerals in the figures are indicated as: 1-stent; 2-blue chip; 3-bond wire; 4-red quantum dot phosphor; 5-green rare earth phosphor; 6-package glue.
具体实施方式detailed description
实施例1本实施例公开了一种基于红光量子点的高色域白光LED灯珠的制作方法,具体工艺步骤如图1所示: Embodiment 1 This embodiment discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot. The specific process steps are as shown in FIG. 1 :
1)称取一定量发射光峰值波长为630nm的MgTe红光量子点荧光粉(红光量子点荧光粉由市场购买获得,其粒径为5nm)。根据红光量子点与有机溶剂的质量比为1:1000,向红光量子点荧光粉中加入适量的有机溶剂C7H8(甲苯)。1) Weigh a certain amount of MgTe red light quantum dot phosphor with a peak wavelength of 630 nm (red light quantum dot phosphor is commercially available and its particle size is 5 nm). According to the mass ratio of the red light quantum dot to the organic solvent is 1:1000, an appropriate amount of the organic solvent C 7 H 8 (toluene) is added to the red light quantum dot phosphor.
2)将步骤1)所得混合溶液置于超声波清洗机中进行超声处理。控制超声波清洗机水浴温度为35℃,超声频率为70KHz,超声处理时间为40min,使红光量子点荧光粉完全溶解于有机溶剂中,获得澄清溶液。 2) The mixed solution obtained in the step 1) is placed in an ultrasonic cleaner for ultrasonic treatment. The ultrasonic bath temperature of the ultrasonic cleaning machine was controlled at 35 ° C, the ultrasonic frequency was 70 KHz, and the ultrasonic treatment time was 40 min, so that the red light quantum dot phosphor was completely dissolved in the organic solvent to obtain a clear solution.
3)按照封装胶水A:封装胶水B质量比为1:10(封装胶A、封装胶B为有机硅类封装胶),红光量子点与封装胶水(包括封装胶水A与封装胶水B)的质量比为1:500,称取一定量的封装胶水A和封装胶水B,倒入步骤2)所得红光量子点澄清溶液中。将混有封装胶水的量子点溶液置于磁力搅拌机中,控制磁力转子转速为250rpm,搅拌20min,使红光量子点溶液与封装胶水A、封装胶水B均匀混合。3) According to the package glue A: package glue B mass ratio of 1:10 (package A, package B is silicone package), red light quantum dot and package glue (including package glue A and package glue B) quality A ratio of 1:500, weigh a certain amount of encapsulating glue A and encapsulating glue B, and pour into the red light quantum dot clear solution obtained in step 2). The quantum dot solution mixed with the encapsulating glue was placed in a magnetic stirrer to control the rotation speed of the magnetic rotor to 250 rpm, and stirred for 20 min to uniformly mix the red light quantum dot solution with the encapsulating glue A and the sealing glue B.
4)将步骤3)所得混合液置于真空脱泡机中,抽真空至脱泡机内压强为0.1Kpa,控制脱泡机搅拌转速为800rpm/min,脱泡温度为48℃,对混合液进行真空脱泡搅拌50min,可将步骤3)所得混合液中的有机溶剂抽出,得到混合均匀的红光量子点荧光胶。4) The mixture obtained in the step 3) is placed in a vacuum defoaming machine, vacuum is applied until the pressure in the deaerator is 0.1 Kpa, the stirring speed of the defoaming machine is controlled at 800 rpm/min, and the defoaming temperature is 48 ° C. The organic solvent in the mixture obtained in the step 3) can be extracted by vacuum defoaming and stirring for 50 minutes to obtain a uniformly mixed red light quantum dot fluorescent glue.
5)称取一定量发射光峰值波长为540nm的绿光荧光粉(绿光荧光粉可以为稀土元素掺杂的硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物等体系荧光粉中的至少一种,绿光荧光粉与红光量子点荧光粉的质量比为25:1),加入到步骤4)所得红光量子点荧光胶中,用玻璃棒对荧光胶进行人工搅拌,沿同一方向匀速搅拌8min,使绿光荧光粉混入红光量子点荧光胶中。5) Weigh a certain amount of green fluorescent powder with a peak wavelength of 540 nm (green phosphor can be rare earth doped silicate, aluminate, phosphate, nitride, fluoride, etc.) At least one kind, the mass ratio of the green phosphor to the red quantum dot phosphor is 25:1), added to the red quantum dot fluorescent glue obtained in the step 4), and the fluorescent glue is manually stirred by the glass rod in the same direction Stir for 8 min at a constant speed to mix the green phosphor into the red quantum dot fluorescent gel.
6)再将步骤5)所得混有绿光荧光粉的荧光胶置于真空脱泡机中,控制脱泡温度为40℃,压强脱泡机的压强为1Kpa,脱泡剂搅拌转速为1500rpm/min,进行真空脱泡搅拌8min,使绿光荧光粉与红光量子点荧光胶充分混合,使荧光胶彻底脱泡,得到红、绿光荧光胶。6) The fluorescent glue mixed with the green phosphor in step 5) is placed in a vacuum defoaming machine to control the defoaming temperature to 40 ° C, the pressure of the pressure deaerator is 1 Kpa, and the defoaming stirring speed is 1500 rpm / Min, vacuum defoaming and stirring for 8 min, the green fluorescent powder and the red light quantum dot fluorescent glue are thoroughly mixed, and the fluorescent rubber is completely defoamed to obtain red and green fluorescent glue.
7)将所述所得红、绿光荧光胶滴入已经固定有蓝光芯片(芯片发射光峰值波长为450nm),且连接键合线(键合线材质可以为金、银、铜及其他导电合金)的LED支架杯壳内,将LED支架置于烘箱中,于160℃下烘烤4h,待杯壳内红、绿光荧光胶固化,即得高色域白光LED灯珠。7) The obtained red and green fluorescent glue is dropped into a blue chip (the peak wavelength of the chip emission light is 450 nm), and the bonding wire is connected (the bonding wire material may be gold, silver, copper and other conductive alloy) In the LED holder cup case, the LED holder is placed in an oven and baked at 160 ° C for 4 hours. After the red and green fluorescent glue in the cup is cured, a high color gamut white LED lamp bead is obtained.
所得的LED灯珠由1支架、2蓝光芯片、3键合线、4红光量子点荧光粉、5绿光稀土荧光粉以及6封装胶水组成(具体见图2所示)。The obtained LED lamp bead is composed of 1 bracket, 2 blue chip, 3 bonding wire, 4 red light quantum dot phosphor, 5 green light rare earth phosphor and 6 package glue (see FIG. 2 for details).
实施例2本实施例公开了一种基于红光量子点的高色域白光LED灯珠的制作方法,具体工艺步骤如图1所示: Embodiment 2 This embodiment discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot. The specific process steps are as shown in FIG. 1 :
1)称取一定量发射光峰值波长为600nm的GaAs、GaN红光量子点荧光粉(红光量子点荧光粉由市场购买获得,其粒径为10nm)。根据红光量子点与有机溶剂的质量比为1:50,向红光量子点荧光粉中加入适量的有机溶剂CHCl3(三氯甲烷)。1) Weigh a certain amount of GaAs, GaN red light quantum dot phosphor with a peak wavelength of 600 nm (red light quantum dot phosphor is commercially available and its particle size is 10 nm). According to the mass ratio of the red light quantum dot to the organic solvent is 1:50, an appropriate amount of the organic solvent CHCl 3 (trichloromethane) is added to the red light quantum dot phosphor.
2)将步骤1)所得混合溶液置于超声波清洗机中进行超声处理。控制超声波清洗机水浴温度为45℃,超声频率为15KHz,超声处理时间为90min,使红光量子点荧光粉完全溶解于有机溶剂中,获得澄清溶液。2) The mixed solution obtained in the step 1) is placed in an ultrasonic cleaner for ultrasonic treatment. The ultrasonic bath temperature of the ultrasonic cleaning machine is controlled to 45 ° C, the ultrasonic frequency is 15 KHz, and the ultrasonic treatment time is 90 min, so that the red light quantum dot phosphor is completely dissolved in the organic solvent to obtain a clear solution.
3)按照封装胶水A:封装胶水B质量比为1:20(封装胶A、封装胶B为聚氨酯封装胶),红光量子点与封装胶水(包括封装胶水A与封装胶水B)的质量比为1:5,称取一定量的封装胶水A和封装胶水B,倒入步骤2)所得红光量子点澄清溶液中。将混有封装胶水的量子点溶液置于磁力搅拌机中,控制磁力转子转速为350rpm,搅拌5min,使红光量子点溶液与封装胶水A、封装胶水B均匀混合。3) According to the package glue A: the package glue B mass ratio is 1:20 (package glue A, package glue B is polyurethane package glue), the mass ratio of red light quantum dot and package glue (including package glue A and package glue B) is 1:5, weigh a certain amount of package glue A and package glue B, and pour into the red light quantum dot clear solution obtained in step 2). The quantum dot solution mixed with the sealing glue was placed in a magnetic stirrer, and the magnetic rotor speed was controlled to be 350 rpm, and the mixture was stirred for 5 minutes to uniformly mix the red light quantum dot solution with the sealing glue A and the sealing glue B.
4)将步骤3)所得混合液置于真空脱泡机中,抽真空至脱泡机内压强为0.1Kpa,控制脱泡机搅拌转速为1200rpm/min,脱泡温度为40~55℃,对混合液进行真空脱泡搅拌15min,可将步骤3)所得混合液中的有机溶剂抽出,得到混合均匀的红光量子点荧光胶。4) The mixture obtained in the step 3) is placed in a vacuum defoaming machine, and the vacuum is evacuated to a pressure of 0.1 Kpa in the defoaming machine, the stirring speed of the defoaming machine is controlled to be 1200 rpm/min, and the defoaming temperature is 40 to 55 ° C. The mixed solution was subjected to vacuum defoaming and stirring for 15 minutes, and the organic solvent in the mixed liquid obtained in the step 3) was extracted to obtain a uniformly mixed red light quantum dot fluorescent gel.
5)称取一定量发射光峰值波长为555nm的绿光荧光粉(绿光荧光粉可以为稀土元素掺杂的硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物等体系荧光粉中的至少一种,所述绿光荧光粉与所述红光量子点荧光粉的质量比为1:1,),加入到步骤4)所得红光量子点荧光胶中,用玻璃对荧光胶进行人工搅拌,沿同一方向匀速搅拌5min,使绿光荧光粉混入红光量子点荧光胶中。5) Weigh a certain amount of green fluorescent powder with a peak wavelength of 555 nm (green phosphor can be rare earth doped silicate, aluminate, phosphate, nitride, fluoride, etc.) At least one of the above, the mass ratio of the green phosphor to the red quantum dot phosphor is 1:1,), added to the red quantum dot fluorescent gel obtained in the step 4), and artificially stirred by a glass to the fluorescent glue. Stir in the same direction for 5 min at a constant speed to mix the green phosphor into the red quantum dot fluorescent gel.
6)再将步骤5)所得混有绿光荧光粉的荧光胶置于真空脱泡机中,控制脱泡温度为55℃,脱泡机的压强为0.1Kpa,脱泡剂搅拌转速为2000rpm/min,进行真空脱泡搅拌3min,使绿光荧光粉与红光量子点荧光胶充分混合,使荧光胶彻底脱泡,得到红、绿光荧光胶。6) The fluorescent glue mixed with the green fluorescent powder obtained in the step 5) is placed in a vacuum defoaming machine to control the defoaming temperature to be 55 ° C, the defoaming machine pressure is 0.1 Kpa, and the defoaming agent stirring speed is 2000 rpm / Min, vacuum defoaming and stirring for 3 min, the green phosphor and the red light quantum dot fluorescent glue are thoroughly mixed, and the fluorescent rubber is completely defoamed to obtain red and green fluorescent glue.
7)将所得红、绿光荧光胶滴入已经固定有蓝光芯片(芯片发射光峰值波 长为430nm),且连接键合线(键合线材质可以为金、银、铜及其他导电合金)的LED支架杯壳内,将LED支架置于烘箱中,于120℃下烘烤6h,待杯壳内红、绿光荧光胶固化,即得高色域白光LED灯珠。7) Drop the obtained red and green fluorescent glue into the blue chip that has been fixed (chip emission peak wave) The length is 430nm), and the LED bracket is connected to the bonding wire (the bonding wire material can be gold, silver, copper and other conductive alloy). The LED bracket is placed in an oven and baked at 120 ° C for 6 hours. After the red and green fluorescent glue in the cup is cured, the high color gamut white LED lamp bead is obtained.
所得的LED灯珠由支架、蓝光芯片、键合线、红光量子点荧光粉、绿光稀土荧光粉以及封装胶水组成。The obtained LED lamp bead is composed of a bracket, a blue chip, a bonding wire, a red light quantum dot phosphor, a green rare earth phosphor, and a package glue.
实施例3本实施例公开了一种基于红光量子点的高色域白光LED灯珠的制作方法,具体工艺步骤如图1所示: Embodiment 3 This embodiment discloses a method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot. The specific process steps are as shown in FIG. 1 :
1)称取一定量发射光峰值波长为660nm的AgInS红光量子点荧光粉(红光量子点荧光粉由市场购买获得,其粒径为1nm)。根据红光量子点与有机溶剂的质量比为1:2000,向红光量子点荧光粉中加入适量的有机溶剂C6H1 2(环己烷)。1) Weigh a certain amount of AgInS red light quantum dot phosphor with a peak wavelength of 660 nm (red light quantum dot phosphor is commercially available and its particle size is 1 nm). According to the mass ratio of the red light quantum dot to the organic solvent: 1:2000, an appropriate amount of the organic solvent C 6 H 1 2 (cyclohexane) was added to the red light quantum dot phosphor.
2)将步骤1)所得混合溶液置于超声波清洗机中进行超声处理。控制超声波清洗机水浴温度为25℃,超声频率为120KHz,超声处理时间为10mi n,使红光量子点荧光粉完全溶解于有机溶剂中,获得澄清溶液。2) The mixed solution obtained in the step 1) is placed in an ultrasonic cleaner for ultrasonic treatment. The ultrasonic bath temperature of the ultrasonic cleaning machine is controlled to 25 ° C, the ultrasonic frequency is 120 KHz, and the ultrasonic treatment time is 10 min, so that the red light quantum dot phosphor is completely dissolved in the organic solvent to obtain a clear solution.
3)按照封装胶水A:封装胶水B质量比为1:20(封装胶A、封装胶B为有机硅类封装胶),红光量子点与封装胶水(包括封装胶水A与封装胶水B)的质量比为1:5,称取一定量的封装胶水A和封装胶水B,倒入步骤2)所得红光量子点澄清溶液中。将混有封装胶水的量子点溶液置于磁力搅拌机中,控制磁力转子转速为350rpm,搅拌5min,使红光量子点溶液与封装胶水A、封装胶水B均匀混合。3) According to the package glue A: the package glue B mass ratio is 1:20 (package A, package B is silicone package), red light quantum dot and package glue (including package glue A and package glue B) quality A ratio of 1:5, weigh a certain amount of encapsulating glue A and encapsulating glue B, and pour into the red light quantum dot clear solution obtained in step 2). The quantum dot solution mixed with the sealing glue was placed in a magnetic stirrer, and the magnetic rotor speed was controlled to be 350 rpm, and the mixture was stirred for 5 minutes to uniformly mix the red light quantum dot solution with the sealing glue A and the sealing glue B.
4)将步骤3)所得混合液置于真空脱泡机中,抽真空至脱泡机内压强为0.2Kpa,控制脱泡机搅拌转速为300rpm/min,脱泡温度为55℃,对混合液进行真空脱泡搅拌15min,可将步骤3)所得混合液中的有机溶剂抽出,得到混合均匀的红光量子点荧光胶。4) The mixture obtained in the step 3) is placed in a vacuum defoaming machine, vacuumed to a pressure of 0.2 Kpa in the defoaming machine, the stirring speed of the defoaming machine is controlled at 300 rpm/min, and the defoaming temperature is 55 ° C. The organic solvent in the mixture obtained in the step 3) can be extracted by vacuum defoaming and stirring for 15 minutes to obtain a uniformly mixed red light quantum dot fluorescent gel.
5)称取一定量发射光峰值波长为555nm的绿光荧光粉(绿光荧光粉可以为稀土元素掺杂的硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物等体系荧光粉中的至少一种,所述绿光荧光粉与所述红光量子点荧光粉的质量比为50: 1),加入到步骤4)所得红光量子点荧光胶中,用玻璃对荧光胶进行人工搅拌,沿同一方向匀速搅拌5min,使绿光荧光粉混入红光量子点荧光胶中。5) Weigh a certain amount of green fluorescent powder with a peak wavelength of 555 nm (green phosphor can be rare earth doped silicate, aluminate, phosphate, nitride, fluoride, etc.) At least one of the mass ratio of the green phosphor to the red quantum dot phosphor is 50: 1), added to the red light quantum dot fluorescent glue obtained in the step 4), artificially stirred the fluorescent glue with glass, and uniformly stirred in the same direction for 5 min, so that the green fluorescent powder is mixed into the red light quantum dot fluorescent glue.
6)再将步骤5)所得混有绿光荧光粉的荧光胶置于真空脱泡机中,控制脱泡温度为25℃,脱泡机的压强为1.5Kpa,脱泡剂搅拌转速为1100rpm/min,进行真空脱泡搅拌10min,使绿光荧光粉与红光量子点荧光胶充分混合,使荧光胶彻底脱泡,得到红、绿光荧光胶。6) The fluorescent glue mixed with the green fluorescent powder obtained in the step 5) is placed in a vacuum defoaming machine to control the defoaming temperature to 25 ° C, the defoaming machine pressure is 1.5 Kpa, and the defoaming agent stirring speed is 1100 rpm / Min, vacuum defoaming and stirring for 10 min, the green fluorescent powder and the red light quantum dot fluorescent glue are thoroughly mixed, and the fluorescent rubber is completely defoamed to obtain red and green fluorescent glue.
7)将所得红、绿光荧光胶滴入已经固定有蓝光芯片(芯片发射光峰值波长为470nm),且连接键合线(键合线材质可以为金、银、铜及其他导电合金)的LED支架杯壳内,将LED支架置于烘箱中,于180℃下烘烤0.5h,待杯壳内红、绿光荧光胶固化,即得高色域白光LED灯珠。7) The obtained red and green fluorescent glue is dropped into the blue chip (the peak wavelength of the chip emission light is 470 nm), and the bonding wire (the bonding wire material can be gold, silver, copper and other conductive alloy) is connected. Inside the LED holder cup case, the LED holder is placed in an oven and baked at 180 ° C for 0.5 h. After the red and green fluorescent glue in the cup is cured, a high color gamut white LED lamp bead is obtained.
所得的LED灯珠由支架、蓝光芯片、键合线、红光量子点荧光粉、绿光稀土荧光粉以及封装胶水组成。The obtained LED lamp bead is composed of a bracket, a blue chip, a bonding wire, a red light quantum dot phosphor, a green rare earth phosphor, and a package glue.
实验例Experimental example
测试采用实施例1-3所述的高色域白光量子点LED的封装方法得到的LED灯珠的色坐标和色域值,结果如表1所示。The color coordinates and color gamut values of the LED lamp beads obtained by the encapsulation method of the high color gamut white light quantum dot LED described in Examples 1-3 were tested. The results are shown in Table 1.
表1Table 1
  实例1Example 1 实例2Example 2 实例3Example 3
色坐标Color coordinates (0.30,0.28)(0.30, 0.28) (0.28,0.26)(0.28, 0.26) (0.29,0.27)(0.29, 0.27)
NTSC色域值NTSC gamut value 93.2%93.2% 94.2%94.2% 92.5%92.5%
上述结果表明,采用实施例1-3所述的高色域白光量子点LED的封装方法得到的LED灯珠发光颜色均为白色,且色域值高,均在92%以上。The above results show that the LED lamp beads obtained by the high color gamut white light quantum dot LED packaging method described in Examples 1-3 have white color and high color gamut values, all of which are above 92%.
对实施例1所述方法获得的高色域白光LED灯珠进行发光测试,所得的发射光谱见图3,由图可见,本实施例所述方法所得的灯珠在蓝光芯片激发下,发射出红、绿光,与蓝光芯片复合形成高色域白光。灯珠的红光发射峰(约640nm处)的半波宽较窄,表明发射出的红光色纯度较高,灯珠的色域值高。 The high color gamut white LED lamp bead obtained by the method described in the embodiment 1 is subjected to luminescence test, and the obtained emission spectrum is shown in FIG. 3. It can be seen from the figure that the lamp bead obtained by the method of the embodiment is emitted under the excitation of the blue chip. Red and green light are combined with blue light chips to form high color gamut white light. The half-wave width of the red light emission peak of the lamp bead (about 640 nm) is narrower, indicating that the emitted red light color has higher purity and the color gamut value of the lamp bead is high.
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。 It is apparent that the above-described embodiments are merely illustrative of the examples, and are not intended to limit the embodiments. Other variations or modifications of the various forms may be made by those skilled in the art in light of the above description. There is no need and no way to exhaust all of the implementations. Obvious changes or variations resulting therefrom are still within the scope of the invention.

Claims (10)

  1. 一种基于红光量子点的高色域白光LED灯珠的制作方法,其特征在于,所述工艺步骤如下:A method for fabricating a high color gamut white LED lamp bead based on a red light quantum dot, characterized in that the process steps are as follows:
    1)称取1重量份的红光量子点荧光粉与50~2000重量份的有机溶剂,向红光量子点荧光粉中加入相应量的有机溶剂,得到混合溶液;1) weigh 1 part by weight of red light quantum dot phosphor and 50 to 2000 parts by weight of an organic solvent, and add a corresponding amount of organic solvent to the red light quantum dot phosphor to obtain a mixed solution;
    2)将步骤1)所得混合溶液进行超声处理,直至红光量子点荧光粉完全溶解于有机溶剂中,获得澄清溶液;2) ultrasonically treating the mixed solution obtained in the step 1) until the red light quantum dot phosphor is completely dissolved in the organic solvent to obtain a clear solution;
    3)称取5~1000重量份的封装胶水,倒入步骤2)所得红光量子点澄清溶液中;将混有封装胶水的量子点溶液进行磁力搅拌;3) weigh 5 to 1000 parts by weight of the encapsulating glue, pour into the red light quantum dot clear solution obtained in step 2); magnetically stir the quantum dot solution mixed with the encapsulating glue;
    4)将步骤3)所得混合液进行真空脱泡搅拌;将步骤3)所得混合液中的有机溶剂抽出,得到混合均匀的红光量子点荧光胶;4) The mixture obtained in the step 3) is subjected to vacuum defoaming and stirring; the organic solvent in the mixture obtained in the step 3) is extracted to obtain a uniformly mixed red light quantum dot fluorescent gel;
    5)称取1-50重量份绿光荧光粉,加入到步骤4)所得红光量子点荧光胶中,对荧光胶进行搅拌,使绿光荧光粉混入红光量子点荧光胶中;5) Weigh 1-50 parts by weight of the green fluorescent powder, add to the red light quantum dot fluorescent glue obtained in step 4), stir the fluorescent glue, and mix the green fluorescent powder into the red light quantum dot fluorescent glue;
    6)再将步骤5)所得混有绿光荧光粉的荧光胶进行真空脱泡,使绿光荧光粉与红光量子点荧光胶充分混合,使荧光胶彻底脱泡,得到红、绿光荧光胶;6) vacuum defoaming the fluorescent glue mixed with the green phosphor in step 5), mixing the green phosphor with the red quantum dot fluorescent gel, and completely defoaming the fluorescent gel to obtain red and green fluorescent glue. ;
    7)将步骤6)中得到的红、绿光荧光胶滴入固定有蓝光芯片的LED支架中,并烘烤使荧光胶固化,即得到高色域白光LED灯珠。7) The red and green fluorescent glue obtained in the step 6) is dropped into the LED holder fixed with the blue chip, and baked to cure the fluorescent glue, thereby obtaining a high color gamut white LED lamp bead.
  2. 如权利要求1所述的制作方法,其特征在于,所述步骤1)中,所述红光量子点荧光粉的发射光峰值波长为600~660nm;所述蓝光芯片的发射光峰值波长为430~470nm。The method according to claim 1, wherein in the step 1), the peak wavelength of the emitted light of the red light quantum dot phosphor is 600-660 nm; and the peak wavelength of the emitted light of the blue chip is 430~ 470nm.
  3. 如权利要求2所述的制作方法,其特征在于,所述步骤1)中,所述红光量子点荧光粉的粒径为1~10nm。The method according to claim 2, wherein in the step 1), the red light quantum dot phosphor has a particle diameter of 1 to 10 nm.
  4. 如权利要求3所述的制作方法,其特征在于,所述步骤1)中,红光量子点荧光粉为BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPb Cl3、CsPbBr3、CsPbI3中的至少一种。The method according to claim 3, wherein in the step 1), the red light quantum dot phosphor is BaS, AgInS 2 , NaCl, Fe 2 O 3 , In 2 O 3 , InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgS, MgSe, MgTe, PbS, PbSe, PbTe, Cd(S x Se 1-x ), BaTiO 3 , PbZrO 3 , At least one of CsPb Cl 3 , CsPbBr 3 , and CsPbI 3 .
  5. 如权利要求4所述的制作方法,其特征在于,所述步骤1)中,所述有机溶剂为正己烷、环己烷、正辛烷、甲苯、二氯甲苯、二氯甲烷、三氯甲烷、吡啶中的至少一种。The method according to claim 4, wherein in the step 1), the organic solvent is n-hexane, cyclohexane, n-octane, toluene, dichlorotoluene, dichloromethane, and chloroform. And at least one of pyridine.
  6. 如权利要求5所述的制作方法,其特征在于,所述步骤4)中,所述封装胶为环氧类封装胶、有机硅类封装胶、聚氨酯封装胶中的一种。The manufacturing method according to claim 5, wherein in the step 4), the encapsulant is one of an epoxy encapsulant, a silicone encapsulant, and a polyurethane encapsulant.
  7. 如权利要求6所述的制作方法,其特征在于,所述步骤5)中,所述绿光荧光粉的射光峰值波长为520~555nm。The method according to claim 6, wherein in the step 5), the green light phosphor has a peak wavelength of 520 to 555 nm.
  8. 如权利要求7所述的制作方法,其特征在于,所述步骤5)中,所述绿光荧光粉为稀土元素掺杂的硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种。The method according to claim 7, wherein in the step 5), the green phosphor is a rare earth doped silicate, aluminate, phosphate, nitride, fluoride fluorescent At least one of the powders.
  9. 如权利要求8所述的制作方法,其特征在于,所述步骤3)中,所述磁力搅拌具体为:将所述混有封装胶水的量子点溶液置于磁力搅拌机中,控制磁力转子转速为120~350rpm,搅拌5~30min。The manufacturing method according to claim 8, wherein in the step 3), the magnetic stirring is specifically: placing the quantum dot solution mixed with the sealing glue in a magnetic stirrer to control the rotation speed of the magnetic rotor 120 to 350 rpm, stirring for 5 to 30 minutes.
  10. 如权利要求9所述的制作方法,其特征在于,所述步骤4)中的真空脱泡搅拌的具体步骤为:将步骤3)所得混合液置于真空脱泡机中,抽真空至脱泡机内压强为0~0.2Kpa,控制脱泡机搅拌转速为300~1200rpm/min,脱泡温度为40~55℃,对混合液进行真空脱泡搅拌15~90min;所述步骤7)中烘烤的温度为120-180℃,烘烤时间为0.5-6h。 The method according to claim 9, wherein the step of vacuum degassing agitation in the step 4) is: placing the mixture obtained in the step 3) in a vacuum defoaming machine, and evacuating to defoaming. The pressure inside the machine is 0~0.2Kpa, the stirring speed of the control defoaming machine is 300~1200rpm/min, the defoaming temperature is 40~55°C, and the mixture is vacuum defoamed and stirred for 15~90min; the step 7) is baked. The baking temperature is 120-180 ° C, and the baking time is 0.5-6 h.
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