CN106908971A - The binding blocking apparatus and its binding hold-up interception method of liquid crystal display panel - Google Patents
The binding blocking apparatus and its binding hold-up interception method of liquid crystal display panel Download PDFInfo
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- CN106908971A CN106908971A CN201710290590.XA CN201710290590A CN106908971A CN 106908971 A CN106908971 A CN 106908971A CN 201710290590 A CN201710290590 A CN 201710290590A CN 106908971 A CN106908971 A CN 106908971A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13458—Terminal pads
Abstract
The present invention provides a kind of binding blocking apparatus of liquid crystal display panel, chip on film including printed circuit board, liquid crystal display panel and connection printed circuit board and display panel, wherein chip on film include FPC and the multiple chips being fixed on FPC；Also include division module circuit and the control circuit being connected with the division module circuit；Wherein, the division module circuit includes at least two idle pins and on FPC at least two idle pins on chip；The control circuit includes the amplification module circuit being connected with division module circuit and the control module circuit being connected with the amplification module circuit.The present invention can intercept the bonding impedances big product of change extremely and flow to terminal and resulting integrity problem, and this scheme can be i.e. executable before backlight is pasted, and can reprocess, it is possible to reduce material and leeway.
Description
Technical field
The invention belongs to liquid crystal display panel technical field, and in particular to a kind of binding blocking apparatus of liquid crystal display panel
And its binding hold-up interception method.
Technical background
Chip on film (ChipOnFilm, COF), crystal grain mantle on flexible PCB (FPC) is fixed on by chip (IC),
In numerous displays for example：LCD, OLED etc., will use the chip of this encapsulation technology.Being used as what display drove this chip more
Source drive (Source Driver) and raster data model (Gate Driver).COF one end is connected to printing in the driving circuit
Circuit board (PCB), is responsible for receiving the data-signal that printed circuit board is transmitted, the other end connection display panel of COF
(Panel), for the data signal transmission that exports IC to Panel, display panel is driven to be shown.
Specifically, COF connection printed circuit boards and display panel are completed by binding (Bonding) technique,
Bonding techniques are broadly divided into two parts, TCP Bonding and PCB Bonding.TCP Bonding are by pre- by COF
Pressure, this pressure are connected on display panel, and the output on the output pin and display panel on COF is pressed to together, and centre is logical
Cross anisotropic conducting resinl (ACF) and realize conducting.PCB Bonding are by the other end Bonding of COF to printed circuit board
On.
In Bonding, first aligned, then carry out pressure and, pressure and when to pressing the temperature of sum, time and the pressure to have very
Strict requirements, if aligning accuracy not enough or pressure and condition is improper can all cause Bonding bad, is tested before
Bonding is bad can only to be occurred being tested using the test opening point on printed circuit board (PCB) when parsing after exception, in producing line not
Can test.
Fig. 1 show the schematic diagram of the bonding tests of flexible PCB, and flexible PCB 100 is provided with multiple tests
Pin, printed circuit board (PCB) 200 is provided with multiple test openings point.
The first step：At least two test pins are taken on flexible PCB 100 as the first testing impedance point 101 and second
Testing impedance point 102；
Second step：First testing impedance point 101 and the second testing impedance point 102 are respectively connecting to printed circuit board (PCB) 200
On test opening point, i.e.,：First testing impedance point 101 and the second testing impedance point 102 are respectively connecting to printed circuit board (PCB) 200
First test opening point 201 and second test opening point 202.
Fig. 2 show the schematic diagram of the bonding tests of chip, and multiple test pins and multiple also are provided with chip 300
Idle pin, test pin and idle pin are respectively used for the test of chip 300, and idle pin is standby test pin.
The first step：In at least two idle pins up of chip 300, i.e.,：Respectively the first chip pin 301 and the second core
Piece pin 302；
Second step：First chip pin 301 is connected to the first testing impedance point 101 shown in Fig. 1, the second chip pin
302 the second testing impedance points 102 for being connected to shown in Fig. 1 are connected；
3rd step：First testing impedance point 101 and the second testing impedance point 102 are respectively connecting to printed circuit board (PCB) 200
On first test opening point 201 and second test opening point 202.
Impedance detecting method shown in Fig. 1 and Fig. 2, is generally used for using impedance in an experiment during parsing after producing line goes wrong
The impedance that test equipment is tested between two opening points, cannot intercept in producing line.Due to often bonding when bonding is abnormal
Impedance becomes big, but there is no interception bonding impedances to become big method extremely at present, and bonding impedances become big product stream extremely
To terminal, integrity problem is easily produced.
The content of the invention
The bonding impedances big product of change extremely can be intercepted it is an object of the invention to provide one kind to flow to terminal and thus produce
The binding blocking apparatus and its binding hold-up interception method of the liquid crystal display panel of raw integrity problem.
The present invention provides a kind of binding blocking apparatus of liquid crystal display panel, including printed circuit board, liquid crystal display panel,
And the chip on film of connection printed circuit board and display panel, wherein chip on film is including FPC and is fixed on
Multiple chips on FPC；FPC and chip are provided with multiple test pins and multiple idle pins, described
Idle pin is standby test pin；Characterized in that, also including division module circuit and connecting with the division module circuit
Connect and set control circuit on a printed circuit；Wherein, the division module circuit includes at least two on chip
Individual idle pin and on FPC at least two idle pins；The control circuit includes and division module
The amplification module circuit of circuit connection and the control module circuit being connected with the amplification module circuit.
Preferably, two idle pins on setting chip are respectively the first chip pin and the second chip pin, flexible
Two idle pins on wiring board are respectively the first testing impedance point and the second testing impedance point, wherein, the first chip pin
The first testing impedance point is connected to, the first testing impedance point is connected to printed circuit board (PCB) and is grounded with printed circuit board (PCB) junction；
Second chip pin connects the second testing impedance point, and the second testing impedance point is connected on printed circuit board (PCB) and the second testing impedance
Put the input first voltage with the junction of printed circuit board (PCB).
Preferably, the first chip pin is connected with the first flexible test point, the second chip pin is connected to the second flexible survey
The equivalent resistance that pilot and the second flexible test point are connected on printed circuit board (PCB) is second resistance；The division module electricity
Road also includes accessing the first resistor of the second testing impedance point and the junction of printed circuit board (PCB), the division module circuit bag
Include：The second resistance of the first voltage and first resistor other end connection of first resistor and first resistor one end connection,
The second resistance is grounded, and first voltage is the input voltage of the division module circuit, wherein, setting second resistance gained voltage
It is second voltage.
Preferably, the size of second voltage is proportional with the resistance size of second resistance.
Preferably, the amplification module circuit includes：Operational amplifier, 3rd resistor, the 4th resistance, the 5th resistance, with
And the 6th resistance.
Preferably, 3rd resistor one end is connected between first resistor and second resistance, the 3rd resistor other end with transport
The positive input connection of amplifier；4th resistance one end be connected to second resistance and ground connection between, the 4th resistance other end with
The reverse input end connection of operational amplifier；5th resistance one end is connected to the positive input of 3rd resistor and operational amplifier
Between, the 5th resistance other end is connected between second resistance and ground connection；6th resistance one end is connected to the 4th resistance and transport
Between the positive input of amplifier, the 6th resistance other end is connected with the output end of operational amplifier.
Preferably, the control module circuit includes：First metal-oxide-semiconductor, the second metal-oxide-semiconductor, the 7th resistance, the electricity of backlight first
Pressure and backlight second voltage.
Preferably, the grid of the first metal-oxide-semiconductor is connected with the output end of operational amplifier, the source electrode of the first metal-oxide-semiconductor connection the
Four voltages；The drain electrode of the first metal-oxide-semiconductor is connected with the grid of the second metal-oxide-semiconductor, and the first metal-oxide-semiconductor drain electrode and the grid of the second metal-oxide-semiconductor
Voltage between the connection of pole is the 5th voltage；7th resistance is connected between the grid of the second metal-oxide-semiconductor and backlight first voltage；The back of the body
Light first voltage is connected with the source electrode of the second metal-oxide-semiconductor；Backlight second voltage is connected with the drain electrode of the second metal-oxide-semiconductor, and is connected to backlight
In lamp bar.
Preferably, it is the 3rd electricity that the second voltage of second resistance is input into control module circuit by amplification module circuit
Pressure, the size of tertiary voltage is directly proportional to the size of second voltage.
The present invention also provides a kind of binding hold-up interception method of the binding blocking apparatus of liquid crystal display panel, including following step
Suddenly：
The first step：Two test points as standby pin are arbitrarily chosen in chip on film, one of test point includes
First chip pin and the first flexible test point being connected with first chip pin, another test point include the second core
Piece pin and the second flexible test point being connected with second chip pin；
Second step：Set the first pin to be grounded on a printed circuit, the electricity that second pin is connected on a printed circuit
It is first resistor R1 to hinder, and the equivalent resistance for binding impedance is second resistance R2；Set printed circuit board input first voltage as
V1；A division module circuit is formed in chip on film；
3rd step：Chip on film one end is connected with printed circuit board, and the control circuit on printed circuit board (PCB) includes and partial pressure
The amplification module circuit of modular circuit connection and the control module circuit being connected with the amplification module circuit；
4th step：Second resistance R2 is by division module circuit output second voltage V2, V2=R2*V1/ (R1+R2)；
5th step：Second voltage V2 can obtain tertiary voltage V3 by the differential amplifier circuit of amplification module circuit：
V3=(1+R6/R4) * (R5/ (R3+R5)) V2；
V4 is the break-make for controlling the second metal-oxide-semiconductor, and V4 selects an electricity for lighting backlight less than backlight chip output
Pressure, adjusts each resistance, makes：
A, when binding impedance it is normal when, V3 ＜ V4, the first metal-oxide-semiconductor conducting, V5=V4<Backlight first voltage, the 2nd MOS
Pipe is turned on；
Backlight second voltage=backlight first voltage, in output to the backlight lamp bar of liquid crystal display panel, LCD
The backlight of plate is normally lighted；
B, when binding impedance becomes big extremely, during more than limit value, close V3 ＞ V4, the first metal-oxide-semiconductor, V5=backlights first
The voltage of voltage, the second metal-oxide-semiconductor is closed, and the backlight of liquid crystal display panel does not work.
The present invention can intercept the bonding impedances big product of change extremely and flow to terminal and resulting integrity problem, and
And this scheme can be i.e. executable before backlight is pasted, and can reprocess, it is possible to reduce material and leeway.
Brief description of the drawings
Fig. 1 show the schematic diagram of the testing impedance of existing flexible PCB；
Fig. 2 show the schematic diagram of the testing impedance of existing chip；
Fig. 3 show the schematic diagram of the testing impedance of flexible PCB of the present invention；
Fig. 4 show the schematic diagram of the testing impedance of chip of the present invention；
Fig. 5 show the current diagram of present invention control circuit.
Specific embodiment
The binding blocking apparatus of liquid crystal display panel of the present invention, including printed circuit board 200, liquid crystal display panel and be used for
The chip on film (COF) of connection printed circuit board 200 and liquid crystal display panel, wherein chip on film (COF) include flexible circuitry
Plate 100 and the multiple chips being fixed on FPC 100.Chip on film (COF) connects printed circuit board and display surface
Plate is completed by binding (Bonding) technique.
It is illustrated in figure 3 the schematic diagram of binding (Bonding) test of FPC, FPC 100 and printing
Circuit board 200 is equipped with multiple test pins and multiple idle pins, and test pin and idle pin are respectively used for flexibility
The test of circuit board 100 and printed circuit board (PCB) 200, idle pin is standby test pin.
Binding (Bonding) method of testing of FPC, including following method：
The first step：At least two idle pins are taken on FPC 100 as test point, two test point difference
For：First flexible test point 11 and the second flexible test point 12；The equivalent resistance for setting FPC 100 is second resistance
R2；
Second step：First flexible test point 11 is grounded；Second flexible test point 12 is connected to the control of printed circuit board (PCB) 200
First resistor R1 is accessed on circuit 300 and between the second flexible test point 12 is connected to control circuit 300.
Fig. 4 show the schematic diagram of the bonding tests of chip, and it includes following method；
The first step, at least two idle pins are got on as test point in chip, and two test points on chip are respectively：
First chip pin 31 and the second chip pin 32；
Second step：First chip pin 31 be connected to shown in Fig. 3 with the first flexible test point 11, the second chip pin 32
It is connected to the second flexible test point 12 shown in Fig. 3；
3rd step：First flexible test point 11 is connected to printed circuit board (PCB) and is grounded with printed circuit board (PCB) junction；Second
Flexible test point 12 is connected on printed circuit board (PCB) 200, and the second testing impedance point 12 is accessed with the junction of printed circuit board (PCB) 200
First resistor R1, and it is input into first voltage V1.
First chip pin 31 is connected with the first flexible test point 11, the second chip pin 32 is connected to the second flexible test
The equivalent resistance that the flexible test point 12 of point 12 and second is connected on printed circuit board (PCB) 200 is second resistance R2, first resistor
R1 is accessed on printed circuit board (PCB) 200, then：First chip pin 31, the first flexible test point 11, the second chip pin 32, second
Flexible test point 12 and printed circuit board (PCB) 200 constitute a division module circuit 301, and first voltage V1 is used to constitute partial pressure mould
Block circuit 301.
The division module circuit 301 includes：The first resistor R1 and first voltage V1 of first resistor R1 one end connection,
Second resistance R2, the second resistance R2 ground connection being connected with the first resistor R1 other ends.Wherein, setting second resistance R2 gained
Partial pressure V2.
I.e.：Division module circuit include at least be connected with each other two chip pins and respectively with two chip pins
Connection and the first flexible test point and the second flexible test point on FPC, the first flexible test point and the
2 flexible test points are connected with printed circuit board (PCB)；The control circuit includes the amplification module electricity being connected with division module circuit
Road and the control module circuit being connected with the amplification module circuit.
Control circuit 300 is set on the printed circuit board 200, and the flip that it is used to extremely become bonding impedances big is thin
Film (COF) is intercepted in advance, and the control circuit 300 is connected with division module circuit 301.
Fig. 3 show the circuit diagram of control circuit, and control circuit 300 includes what is be connected with division module circuit 301
Amplification module circuit 302 and the control module circuit 303 being connected with the amplification module circuit 302.
Amplification module circuit 302 includes：Operational amplifier U1,3rd resistor R3, the 4th resistance R4, the 5th resistance R5, with
And the 6th resistance R6.
3rd resistor R3 one end is connected between first resistor R1 and second resistance R2, the 3rd resistor R3 other ends with transport
The positive input connection of amplifier U1；4th resistance R4 one end is connected between second resistance R2 and ground connection, the 4th resistance R4
The other end is connected with the reverse input end of operational amplifier U1；5th resistance R5 one end is connected to 3rd resistor R3 and transport is amplified
Between the positive input of device U1, the 5th resistance R5 other ends are connected between second resistance R2 and ground connection；6th resistance R6 mono-
End is connected between the 4th resistance R4 and the positive input of operational amplifier U1, the 6th resistance R6 other ends and operational amplifier
The output end connection of U1.
Control module circuit 303 includes：First metal-oxide-semiconductor Q1, the second metal-oxide-semiconductor Q2, the 7th resistance R7, backlight first voltage D1
With backlight second voltage D2.Backlight first voltage D1 is represented：The back of the body in control module circuit 303 is input to from backlight control chip
Photocontrol voltage；Backlight second voltage D2 is represented：The backlight control voltage onto backlight is exported from control module circuit 303, is claimed
Backlight second voltage.
Wherein, the grid of the first metal-oxide-semiconductor Q1 is connected with the output end of operational amplifier U1, i.e.,：The second of second resistance R2
Voltage V2 is V3 by the input tertiary voltage that amplification module circuit 302 is input into control module circuit 303, and is herein A points；
The source electrode of the first metal-oxide-semiconductor Q1 connects the 4th voltage V4, and V4 is the break-make for controlling the second metal-oxide-semiconductor Q2；The leakage of the first metal-oxide-semiconductor Q1
Pole is connected with the grid of the second metal-oxide-semiconductor Q2, and is B between the drain electrode of the first metal-oxide-semiconductor Q1 and the grid connection of the second metal-oxide-semiconductor Q2
Point, and the 5th voltage herein is V5；7th resistance R7 is connected to the grid of the second metal-oxide-semiconductor Q2 and the source electrode of the second metal-oxide-semiconductor Q2
Between；Backlight first voltage D1 is connected with the drain electrode of the second metal-oxide-semiconductor Q2；The drain electrode of backlight second voltage D2 and the second metal-oxide-semiconductor Q2
Connection.
Equivalent resistance R2 (i.e. second resistance) with FPC 100 of the invention is bonding impedances, by partial pressure mould
Block circuit 301, obtains second voltage V2, V2=R2*V1/ (R1+R2) of second resistance R2, second voltage V2 and second resistance
Resistance R2 is directly proportional.
Second voltage V2 can obtain A point tertiary voltages V3 by the differential amplifier circuit of amplification module circuit 302.
V3=(1+R6/R4) * (R5/ (R3+R5)) V2, the size of tertiary voltage V3 is with the size of second voltage V2 in just
Than that is, the size of tertiary voltage V3 is directly proportional to second resistance R2.
The voltage of the 4th voltage V4 ＜ backlight first voltages D1 is set, and adjusts each resistance, make：
A, when bonding impedances are normal, V3 ＜ V4, the first metal-oxide-semiconductor Q1 conducting, V5=V4<Backlight first voltage D1's
Voltage, the second metal-oxide-semiconductor Q2 conductings.
The voltage of the voltage of backlight second voltage D2=backlight first voltage D1, the backlight normal point of liquid crystal display panel
It is bright；
B, when bonding impedances become big extremely, during more than limit value, close V3 ＞ V4, the first metal-oxide-semiconductor Q1, the V5=back ofs the body
The voltage of light first voltage D1, the second metal-oxide-semiconductor Q2 is closed, and the backlight of liquid crystal display panel does not work.
General bonding uses the back of the body fixed on tool after FPC and printed circuit board (PCB) before patch backlight
Light carries out liquid crystal display panel and lights as light source, and the present invention can be completed in this website.
If it find that the original backlight for normally the using screen that does not work and test can be with bright, i.e., can not be by after liquid crystal display panel
Stream, intercepts in producing line.
The 7th resistance R7 both end voltages are tested when reprocessing and understands to be bonding problems or backlight drive IC problems.If
For bonding impedance problems can be with rebonding.
The present invention also discloses a kind of binding hold-up interception method of the binding blocking apparatus of liquid crystal display panel, including following step
Suddenly：
The first step：Two are arbitrarily chosen as standby test point in chip on film, and one of test point includes first
Chip pin 31 and the first flexible test point 11 being connected with first chip pin 31, another test point include second
Chip pin 32 and the second flexible test point 12 being connected with second chip pin 32；
Second step：Set the first flexible test point to be grounded on the printed circuit board 200, the second flexible test point 12 is in printing
The resistance connected on circuit board is first resistor R1, and the equivalent resistance for binding impedance is second resistance R2；Setting printed circuit board
The first voltage of input is V1；A division module circuit is formed in chip on film；
3rd step：Chip on film one end is connected with printed circuit board 200, and the chip on film other end connects with control circuit 300
Connect；Control circuit 300 include the amplification module circuit 302 that is connected with division module circuit 301 and with the amplification module circuit
The control module circuit 303 of 302 connections；
4th step：Second resistance R2 by output voltage V2, V2=R2*V1/ (R1+R2) of division module circuit 301, V2 with
R2 is directly proportional；
5th step：Second voltage V2 can obtain tertiary voltage by the differential amplifier circuit of amplification module circuit 302
V3：
V3=(1+R6/R4) * (R5/ (R3+R5)) V2, V3 are directly proportional to V2, i.e., are directly proportional to R2；
The voltage of V4 ＜ backlight first voltages D1 is set, and adjusts each resistance, make：
A, when bonding impedances are normal, V3 ＜ V4, the first metal-oxide-semiconductor Q1 conducting, V5=V4<Backlight first voltage D1's
Voltage, the second metal-oxide-semiconductor Q2 conductings；
The voltage of the voltage of backlight second voltage D2=backlight first voltage D1, the backlight normal point of liquid crystal display panel
It is bright；
B, when bonding impedances become big extremely, during more than limit value, close V3 ＞ V4, the first metal-oxide-semiconductor Q1, the V5=back ofs the body
The voltage of light first voltage D1, the second metal-oxide-semiconductor Q2 is closed, and the backlight of liquid crystal display panel does not work.
The present invention can intercept the bonding impedances big product of change extremely and flow to terminal and resulting integrity problem, and
And this scheme can be i.e. executable before backlight is pasted, and can reprocess, it is possible to reduce material and leeway.
The preferred embodiment of the present invention described in detail above, but the present invention is not limited in above-mentioned implementation method
Detail, in range of the technology design of the invention, can carry out various equivalents to technical scheme, these
Equivalents belong to protection scope of the present invention.
Claims (10)
1. a kind of binding blocking apparatus of liquid crystal display panel, including printed circuit board, liquid crystal display panel and connection printing
The chip on film of circuit board and display panel, wherein chip on film include FPC and are fixed on FPC
Multiple chips；FPC and chip are provided with multiple test pins and multiple idle pins, and the idle pin is standby
Test pin；Characterized in that, also including division module circuit and being connected with the division module circuit and be arranged on print
Control circuit on printed circuit board；Wherein, the division module circuit include at least two idle pins on the chip, with
And at least two idle pins on FPC；The control circuit includes the amplification being connected with division module circuit
Modular circuit and the control module circuit being connected with the amplification module circuit.
2. the test device of liquid crystal display faceplate device according to claim 1, it is characterised in that：On setting chip two
Individual idle pin is respectively the first chip pin and the second chip pin, and two idle pins on FPC are respectively
Testing impedance point and the second testing impedance point, wherein, the first chip pin is connected to the first testing impedance point, and the first impedance is surveyed
Pilot is connected to printed circuit board (PCB) and is grounded with printed circuit board (PCB) junction；Second chip pin connects the second testing impedance point,
Second testing impedance point be connected on printed circuit board (PCB) and the junction of the second testing impedance point and printed circuit board (PCB) input the
One voltage.
3. the test device of liquid crystal display faceplate device according to claim 2, it is characterised in that：First chip pin with
First flexible test point is connected, the second chip pin is connected to the second flexible test point and the second flexible test point is connected to
Equivalent resistance on printed circuit board (PCB) is second resistance；The division module circuit also includes accessing the second testing impedance point with print
The first resistor of the junction of printed circuit board, the division module circuit includes：First resistor and the first resistor one end connect
First voltage and the first resistor other end connection second resistance, the second resistance ground connection, first voltage be the partial pressure
The input voltage of modular circuit, wherein, it is second voltage to set second resistance gained voltage.
4. the test device of liquid crystal display faceplate device according to claim 3, it is characterised in that：The size of second voltage
Resistance size with second resistance is proportional.
5. the test device of liquid crystal display faceplate device according to claim 4, it is characterised in that：The amplification module electricity
Road includes：Operational amplifier, 3rd resistor, the 4th resistance, the 5th resistance and the 6th resistance.
6. the test device of liquid crystal display faceplate device according to claim 5, it is characterised in that：3rd resistor one end connects
It is connected between first resistor and second resistance, the 3rd resistor other end is connected with the positive input of operational amplifier；4th electricity
Resistance one end is connected between second resistance and ground connection, and the 4th resistance other end is connected with the reverse input end of operational amplifier；The
Five resistance one end are connected between 3rd resistor and the positive input of operational amplifier, and the 5th resistance other end is connected to second
Between resistance and ground connection；6th resistance one end is connected between the 4th resistance and the positive input of operational amplifier, the 6th electricity
The resistance other end is connected with the output end of operational amplifier.
7. the test device of liquid crystal display faceplate device according to claim 6, it is characterised in that：The control module electricity
Road includes：First metal-oxide-semiconductor, the second metal-oxide-semiconductor, the 7th resistance, backlight first voltage and backlight second voltage.
8. the test device of liquid crystal display faceplate device according to claim 7, it is characterised in that：The grid of the first metal-oxide-semiconductor
Pole is connected with the output end of operational amplifier, and the source electrode of the first metal-oxide-semiconductor connects the 4th voltage；The drain electrode of the first metal-oxide-semiconductor and second
Voltage between the grid connection of metal-oxide-semiconductor, and the drain electrode of the first metal-oxide-semiconductor and the grid connection of the second metal-oxide-semiconductor is the 5th voltage；The
Seven resistance are connected between the grid of the second metal-oxide-semiconductor and backlight first voltage；Backlight first voltage connects with the source electrode of the second metal-oxide-semiconductor
Connect；Backlight second voltage is connected with the drain electrode of the second metal-oxide-semiconductor, and is connected on backlight lamp bar.
9. the test device of liquid crystal display faceplate device according to claim 8, it is characterised in that：The second of second resistance
It is tertiary voltage that voltage is input into control module circuit by amplification module circuit, and the size of tertiary voltage is big with second voltage
It is small to be directly proportional.
10. the binding hold-up interception method of the binding blocking apparatus of liquid crystal display panel according to claim 9, its feature exists
In comprising the following steps：
The first step：Two test points as standby pin are arbitrarily chosen in chip on film, one of test point includes first
Chip pin and the first flexible test point being connected with first chip pin, another test point are drawn including the second chip
Pin and the second flexible test point being connected with second chip pin；
Second step：Set the first pin to be grounded on a printed circuit, the resistance that second pin is connected on a printed circuit is
First resistor R1, the equivalent resistance for binding impedance is second resistance R2；The first voltage for setting printed circuit board input is V1；Cover
A division module circuit is formed on brilliant film；
3rd step：Chip on film one end is connected with printed circuit board, and the control circuit on printed circuit board (PCB) includes and division module
The amplification module circuit of circuit connection and the control module circuit being connected with the amplification module circuit；
4th step：Second resistance R2 is by division module circuit output second voltage V2, V2=R2*V1/ (R1+R2)；
5th step：Second voltage V2 can obtain tertiary voltage V3 by the differential amplifier circuit of amplification module circuit：
V3=(1+R6/R4) * (R5/ (R3+R5)) V2；
V4 is the break-make for controlling the second metal-oxide-semiconductor, and V4 selects the voltage for lighting backlight less than backlight chip output, adjusts
Each resistance is saved, is made：
A, when binding impedance it is normal when, V3 ＜ V4, the first metal-oxide-semiconductor conducting, V5=V4<Backlight first voltage, the second metal-oxide-semiconductor is led
It is logical；
Backlight second voltage=backlight first voltage, in output to the backlight lamp bar of liquid crystal display panel, liquid crystal display panel
Backlight is normally lighted；
B, when binding impedance becomes big extremely, during more than limit value, close V3 ＞ V4, the first metal-oxide-semiconductor, V5=backlight first voltages
Voltage, the second metal-oxide-semiconductor closes, and the backlight of liquid crystal display panel do not work.
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| PCT/CN2018/077092 WO2018196473A1 (en) | 2017-04-28 | 2018-02-24 | Liquid crystal display panel packaging structure and bonding test method thereof |
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| CN106908971B (en) | 2019-02-01 |
| WO2018196473A1 (en) | 2018-11-01 |
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