Summary of the invention
It, can be it is an object of that present invention to provide a kind of method for separating of OLED display screen and the preparation method of OLED mould group
Screening intercepts the undesirable OLED display screen of quality in advance in OLED mould group preparation process, and material and production capacity is avoided to waste, reduce at
This.
For achieving the above object, the present invention provides a kind of method for separating of OLED display screen, specifically includes that
Driving chip is provided, which is attached with OLED display screen, the driving chip is connected to several
Input pin;
Test FPC is provided, the test FPC includes several test pins, and precompressed draws the test pin with input
Foot is connected;
OLED display screen is lighted, OTP debugging is carried out to the OLED display screen;
Automatic optics inspection is carried out to OLED display screen, the OLED display screen is sorted according to testing result.
As a further improvement of the present invention, by the driving chip bonding in OLED display screen (Clip On
Glass, COG), several input pins are located in OLED display screen.
As a further improvement of the present invention, the driving chip is fixed in flexible circuit board and obtains corresponding flip
Film (Chip On Film, COF), then by the flip chip bonding in the OLED display screen, several inputs are drawn
Foot is located on the flexible circuit board.
As a further improvement of the present invention, the precompressed includes first by several test pins and several inputs
Pin contraposition, then pressure is applied to several test pins and several input pins, so that several tests are drawn
Foot and several input pins keep overlapping.
As a further improvement of the present invention, several test pins are being kept to lead with several input pin overlap joints
When logical, OTP debugging and automatic optics inspection are carried out to OLED display screen,
Preferably, the OTP debugging includes the brightness to the OLED display screen, coloration progress non-contact detection;
Preferably, the OTP debugging and automatic optics inspection are carried out in same station.
As a further improvement of the present invention, it during carrying out OTP debugging with automatic optics inspection, monitors described several
Impedance between test pin and several input pins, in other words, in several test pins and several inputs
In the case that pin is smoothly connected, the OTP debugging and automatic optics inspection are carried out.
As a further improvement of the present invention, the method for separating further includes before OTP debugging, in the OLED display screen
Light emission side attach polaroid.
The present invention also provides a kind of preparation methods of OLED mould group, specifically include that
OLED display screen and driving chip are provided, which are connected in OLED display screen, the driving chip
It is connected to several input pins;
Test FPC is provided, the test FPC includes several test pins, and precompressed draws the test pin with input
Foot is connected;
OLED display screen is lighted, OTP debugging is carried out to the OLED display screen;
Automatic optics inspection is carried out to OLED display screen, the OLED display screen is sorted according to testing result, is obtained
To the OLED display screen for meeting set quality requirements;
Product F PC is provided, then by the product F PC bonding in the aforementioned OLED display screen for meeting set quality requirements.
As a further improvement of the present invention, the direct bonding of the driving chip is in OLED display screen, or will be described
Driving chip, which is fixed in flexible circuit board, obtains corresponding flip chip, then the flip chip bonding is shown in the OLED
In display screen, i.e., the described driving chip is connected to the OLED display screen by the way of COG or COF.
As a further improvement of the present invention, the preparation method further includes the OLED that will complete the product F PC bonding
Display screen carries out OTP again and debugs, to filter out the processing procedures such as the missing inspection being likely to occur in aforementioned method for separating and product F PC bonding
The defective products that may cause.
The beneficial effects of the present invention are: using the method for separating of OLED display screen of the present invention and the preparation side of OLED mould group
Method can screen in advance in OLED mould group preparation process and intercept the undesirable OLED display screen of quality, pass through the test FPC precompressed
OLED display screen is lighted, and then carries out OTP debugging and automatic optics inspection, it is aobvious can effectively to detect the interception undesirable OLED of image quality
Display screen avoids material and production capacity from wasting, reduces cost without carrying out follow-up process.
Specific embodiment
Below with reference to embodiment shown in the drawings, the present invention will be described in detail.But the embodiment is not intended to limit
The present invention, structure that those skilled in the art are made according to the embodiment, method or transformation functionally are wrapped
Containing within the scope of the present invention.
The outward elements such as front end OLED display screen and driving chip, FPC are mainly carried out bonding by the preparation of OLED mould group
(Bonding) process, to meet different clients to the performance requirement of end product.Generally, need to OLED display screen into
The inspection of row supplied materials and cleaning, then ACF (Anisotropic Conductive Film, anisotropic conducting film) is attached, it carries out
The bonding of driving chip;Secondly, carrying out FPC bonding;Then, OTP debugging and finished product detection are carried out.
Wherein, the OTP debugging of OLED display screen is both needed to carry out after FPC bonding processing procedure with automatic optics inspection, this just makes
OLED mould group process is flowed through at the OLED display screen for not being able to satisfy Very Important Person quality requirements partially, brings material and equipment capacity
Waste.Based on this, join shown in Fig. 1, the preparation method of OLED mould group provided by the invention includes:
Chamfering, according in OLED display screen substrate material difference also optionally carry out edge processing, overcome collapse it is scarce,
The edge defects such as crackle, flange;
Patch partially will be attached to the light emission side surface of the OLED display screen, the polaroid after the removing of corresponding polaroid
Anti-dazzle and photoextinction can be achieved;
Driving chip is provided, then the driving chip is attached with OLED display screen, the driving chip is to control
The work of each pixel in the OLED display screen is made, the driving chip is connected to several input pins, and the driving chip
Different modes can be used with specification demands according to the structure of set OLED mould group to be attached with OLED display screen;
Sorting carries out sieving and grading to the OLED display screen, obtains the OLED display screen for meeting set quality requirements;
Product F PC is provided, then by the product F PC bonding in the aforementioned OLED display screen for meeting set quality requirements,
That is FOG (FPC On Glass);
The OLED display screen for completing the product F PC bonding is carried out OTP again to debug.
Generally, the driving chip is connected by the way of COG (Clip On Glass) or COF (Chip On Film)
It is connected to the OLED display screen.The former, which refers to, is directly bonded to the driving chip in OLED display screen, and the OLED is shown
Shielding has the input pin for being connected to the driving chip.The latter is then that first the driving chip is fixed in flexible circuit board to obtain
To corresponding flip chip, then by the flip chip bonding to OLED display screen, the flip chip be equipped with it is described
The input pin that driving chip is connected can have other electron component in the flip chip certainly with integrated installation.
The present invention provide OLED mould group preparation method, before carrying out product F PC bonding just to the OLED display screen into
Row sorting, and lower defective products is intercepted according to set quality requirements, it is only aobvious to the OLED for meeting set quality requirements filtered out
Display screen carries out follow-up process, obtains corresponding OLED mould group.
The preparation method further includes providing touch screen (Touch Panel, TP) after FOG processing procedure, carry out TP attach with
Detection;Hereafter, carry out OTP again to debug, filter out the missing inspection defective products that aforementioned assorting room is likely to occur, or due to FOG,
TP attaches the defective products that may cause with inspection process;It carries out obtaining after De-mura compensation, fitting cover board, group are vertical again corresponding
OLED mould group;Finished product detection is finally carried out again, packs shipment.Wherein, De-mura compensation is the display to make OLED display screen
Effect stability, and a kind of external optical compensation way taken.It mainly passes through high-resolution and high-precision CCD camera is shot
The OLED display screen picture lighted analyzes brightness and COLOR COMPOSITION THROUGH DISTRIBUTION, then obtains De- according to preset De-mura backoff algorithm
Mura data are simultaneously burnt in driving chip, are shot OLED display screen picture again and are confirmed.
Join shown in Fig. 2, present invention simultaneously provides a kind of method for separating of OLED display screen, specifically include that
Driving chip is provided, which is attached with OLED display screen, the driving chip is connected to several
Input pin;
Test FPC is provided, the test FPC includes several test pins, and precompressed draws the test pin with input
Foot is connected;
OLED display screen is lighted, OTP debugging is carried out to the OLED display screen;
Automatic optics inspection (Automated Optical Inspection, automated optical inspection are carried out to OLED display screen
Survey), the OLED display screen is sorted according to testing result.
The test FPC is fixed in corresponding test fixture, and if test several test pins of FPC and described
The arrangement of dry input pin is consistent.In the embodiment of the invention, the direct bonding of driving chip is aobvious in OLED
In display screen (Clip On Glass, COG), several input pins are located in OLED display screen.The precompressed includes first by institute
It states several test pins and several input pins aligns, then several test pins and several input pins are applied
Plus-pressure, so that several test pins and several input pins keep overlapping.Match especially by CCD industrial camera
Resultant displacement compensation mechanism is directed at each test pin and is overlapped on the input pin corresponding to it, then passes through corresponding glue
Head is compressed, so that the realization of both the test pin and input pin electrically conducts, input pin and survey after contraposition
Examination pin is able to maintain more preferably overlap joint effect under the pressure of rubber head, so that between input pin and test pin preferably
Conducting.
Preferably, both the test FPC and product F PC preferably use same circuit structure design, to improve OLED
The OTP of display screen is debugged and the reliability of automatic optics inspection.Meanwhile normally connecting in order to ensure the test pin of test FPC
It connects and works, the test FPC can be replaced after both fixed cycles (500~1000 times), the reality of the test FPC
Service life can be adjusted flexibly according to on-site actual situations.In other embodiments of the invention, the test FPC also may be used
Product F PC is directlyed adopt, as long as can guarantee that its pin can smoothly be aligned with input pin and be overlapped under stress.
The OTP debugging preferably carries out non-connect with coloration to the brightness of the OLED display screen using CCD luminance analyzer
Touch detection;It is showed further according to brightness of each region of OLED display screen detected under different operating voltage and coloration, adjustment
The output voltage of the driving chip is modified with the display effect to the OLED display screen different zones, and will amendment
As a result it is burnt in driving chip, improves the consistency of OLED display screen.In addition, the method for separating further includes in the OTP
Before debugging, corresponding polaroid is attached in the light emission side of the OLED display screen, so that aforementioned OTP debugging result is more reliable.Phase
More traditional contact color analysis instrument (such as CA210, CA310, Chroma7321) uses non-contact detection side herein
Formula is carried out convenient for both the OTP of OLED display screen debugging and automatic optics inspection are incorporated into same station, is simplified the internal structure of an organization
Design, facilitates execute-in-place.
The method for separating further includes monitoring several tests during carrying out OTP debugging with automatic optics inspection
Impedance between pin and several input pins, in other words, in several test pins and several input pins
The OTP debugging and automatic optics inspection smoothly are carried out in the case where conducting.It, can be according to different OLED in practical operation
Display screen and test FPC threshold value impedance, when the impedance between the test pin and input pin is hindered greater than the threshold value
When anti-, i.e., the described test pin and input pin poor electrical contact need again to align the two, again to two after contraposition
Person applies pressure, makes preferably to be connected between input pin and test pin.Certainly, when there is above-mentioned condition, scene is usually also needed
In time to it is described test FPC test pin, connect driving chip input pin check, judge whether occur deformation,
Fracture etc. is abnormal, and is handled.
The automatic optics inspection process can cooperate system of unloading goods according to set screening scheme, to completion OTP debugging
OLED display screen carries out automatic optics inspection, classification.Wherein, automatic optics inspection includes the detection to image quality, specifically, can be wrapped
Containing whether there is bright line, concealed wire, bright spot, dim spot to OLED display screen and whether there is colour cast etc. to detect.Actual production
In, the OLED display screen for meeting set quality requirements sub-elected is further continued for back segment FOG processing procedure;And account for about 30% or so number
OLED display screen, which can be screened out, avoids the waste of subsequent material and production capacity without carrying out following process as defective products.
In another embodiment of the present invention, it is different from previous embodiment and is characterized in that:
Flexible circuit board is provided, driving chip fixation is obtained into corresponding flip chip on the flexible circuit board
(COF), then by the flip chip bonding in the OLED display screen, several input pins are located at the flexible circuit
On plate.At this point, the test pin of the test FPC directly passes through rubber head and is pressed in flexible circuit board in aforementioned pre-compaction process,
And be connected by the input pin in the flexible circuit board with the driving chip, then carry out the point of OLED display screen
Bright, OTP debugging and automatic optics inspection.
In the present embodiment, before carrying out OTP debugging, the light emission side of the OLED display screen has equally attached corresponding polarisation
Piece;It is all made of CCD camera in aforementioned bonding, pre-compaction process and carries out exactitude position.The difference of aforementioned difference embodiment is mainly driven
The connection type of dynamic chip is inconsistent, compared to COG, can further decrease frame using the OLED display screen of COF, and then subtract
Small substrate size and pin length.
Method for separating of the present invention by the way that the test FPC to be pressed in OLED display screen in advance, and then lights OLED display screen
OTP, automatic optics inspection are carried out, intercepts filter out the undesirable OLED display screen of all kinds of image quality in advance, especially have transition not
, variegation, indigo plant etc. partially are difficult to eliminate the OLED display screen of defect by later period De-mura compensation, reduce subsequent manpower and material resources
Waste.
In conclusion the method for separating of OLED display screen of the present invention and the preparation method of OLED mould group, pre- by test FPC
The bright OLED display screen of pressure point carries out OTP debugging and automatic optics inspection, can screen in advance and block in OLED mould group preparation process
Cut the undesirable OLED display screen of quality, without carry out subsequent FOG, TP attach with the processing procedures such as detection, avoid material and production capacity from wasting,
Production capacity is improved, production cost is reduced.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiments of understanding.
The series of detailed descriptions listed above only for feasible embodiment of the invention specifically
Protection scope bright, that they are not intended to limit the invention, it is all without departing from equivalent implementations made by technical spirit of the present invention
Or change should all be included in the protection scope of the present invention.