CN106770367A - A kind of FPC solder joints detection method - Google Patents
A kind of FPC solder joints detection method Download PDFInfo
- Publication number
- CN106770367A CN106770367A CN201611131069.3A CN201611131069A CN106770367A CN 106770367 A CN106770367 A CN 106770367A CN 201611131069 A CN201611131069 A CN 201611131069A CN 106770367 A CN106770367 A CN 106770367A
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- CN
- China
- Prior art keywords
- tin
- detection
- solder
- fpc
- point
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
Abstract
The invention discloses a kind of FPC solder joints detection method, by red in the detection block image of electing frame, it is green, blue channel is converted into tone, saturation degree, luminance channel, the grade information of scolding tin can be reflected by the imaging of the principle of the light wave reflection of different wave length using different inclined-planes, by the tone for comparing pad position, saturation degree and brightness counter can release the basic status of solder joint to detect, so as to go detection FPC plates to whether there is missing solder, many tin, small tin, tin point, connect the purpose of tin, that replace the method that Traditional Man carries out visual inspection, not only reduce cost but also save human resources, the detection efficiency and accuracy of detection of butt welding point are also substantially increased simultaneously.
Description
Technical field
The present invention relates to automatic optics inspection technical field, specially a kind of FPC solder joints detection method.
Background technology
In manufacture industry now, FPC plates are packaged using encapsulation technology usually, but as FPC plates are integrated
Change degree is uprised, and the detection for completing the circuit board of encapsulation is increasingly difficult to.Many elements in FPC plates are connected by electric welding mode
Connect, so solder joint detection is a very necessary detection object in the detection of FPC plates.
The more ripe AOI equipment of in the market is mainly used for detecting the upper tin defects of paster, for the weldering of detection plug-in unit
The equipment of tin defects is also weaker.At present, the detection of tin defects is connected for solder joint, mainly relying on manually carries out visual inspection, and
Manual Visual Inspection there are problems that detection efficiency it is low,.
The content of the invention
It is an object of the invention to provide a kind of light wave reflection principle of utilization different wave length by tone, saturation degree and bright
Spend to judge the FPC solder joint detection methods of the basic status of solder joint, it is accurate to possess detection, it is above-mentioned to solve the advantages of efficiency high
The problem mentioned in background technology.
To achieve the above object, the present invention provides following technical scheme：A kind of FPC solder joints detection method, using different ripples
Light wave reflection principle long judges the basic status of solder joint by tone, saturation degree and brightness, specifically includes following steps：
S1：By light source and held in the surface of measured object set-point；
S2：Default detection parameter, detection parameter includes missing solder, many tin, small tin, tin point and connects tin parameter；
S3：Start primaries RGB and camera is taken pictures to FPC to be detected, obtain image；
S4：Detection block is defined, the element part selected pad on S3 images using window circle and mutually weld with pad；
S5：Analyzing and processing image, by the red, green, blue Channel-shifted in detection block image into tone, saturation degree, luminance channel, point
Jian Ce not tonal range value；
S6：Tonal range value is compared with default parameter values for detection, judges that solder joint whether there is missing solder, many tin, small tin, tin
Point and even tin.
Preferably, the basic status of solder joint include missing solder, many tin, small tin, tin point and even tin, and missing solder, many tin, small tin,
Tin point and Lian Xijun highlight different inclined-planes at solder joint.
Preferably, missing solder brightness value and missing solder area percentage value are included for the missing solder parameter set in S2.
Preferably, in for S6, if tonal range value is in the range of default parameter values for detection, judge that FPC solder joints are qualified；If
Tonal range value judges that FPC solder joints are unqualified not in the range of default parameter values for detection.
Compared with prior art, the beneficial effects of the invention are as follows：This FPC solder joint detection methods, based on traditional optical principle
To carry out automatic optics inspection to the common deficiency run into welding production, machine is obtained by camera automatic scanning circuit plate
Image, automatically extracts the topography of each solder joint, and by image processing techniques, judges the scolding tin at solder joint with the presence or absence of scarce
Fall into, finally the scolding tin of those suspected defects is shown or is marked, conveniently check and maintenance；This method is by the inspection of electing frame
The red, green, blue Channel-shifted surveyed in block diagram picture, can be by different wave length using different inclined-planes into tone, saturation degree, luminance channel
The principle imaging of light wave reflection reflects the grade information of scolding tin, by compare tone, saturation degree and the brightness at pad position come
Detection counter can release the basic status of solder joint, so as to remove detection FPC plates with the presence or absence of missing solder, many tin, small tin, even tin point, tin
Purpose, that replace the method that Traditional Man carries out visual inspection, not only reduce cost but also saved human resources, while also significantly
Improve the detection efficiency and accuracy of detection of butt welding point.
Specific embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below, it is clear that described embodiment
Only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
The every other embodiment that art personnel are obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
The present invention provides a kind of technical scheme：A kind of FPC solder joints detection method, using the light wave reflection principle of different wave length
The basic status of solder joint is judged by tone, saturation degree and brightness, the basic status of solder joint includes missing solder, many tin, small tin, tin
Point and even tin, and missing solder, many tin, small tin, tin point and Lian Xijun highlight different inclined-planes at solder joint, therefore for different oblique
Face can be imaged the grade information of reflection scolding tin by the principle of the light wave reflection of different wave length, then by comparing the color at pad position
Tune, saturation degree and brightness counter can release the basic status of solder joint to detect, specifically include following steps：
S1：By light source and held in the surface of measured object set-point；
S2：Default detection parameter, detection parameter includes missing solder, many tin, small tin, tin point and connects tin parameter, and missing solder parameter includes
Missing solder brightness value and missing solder area percentage value, for comparing offer with reference to data with subsequent handling detection；
S3：Start primaries RGB and camera is taken pictures to FPC to be detected, obtain image and pictorial information；
S4：Detection block is defined, the element part selected pad on S3 images using window circle and mutually weld with pad, its frame
The pad of choosing and the frame of the element part mutually welded with pad, then be defined as detection block；
S5：Analyzing and processing image, the red, green, blue Channel-shifted in detection block image in S4 is led into tone, saturation degree, brightness
Road, corresponds to detection tonal range value respectively；
S6：Tonal range value in S5 and default parameter values for detection are compared, judge solder joint with the presence or absence of missing solder, many tin,
Small tin, tin point and company's tin；If tonal range value is in the range of default parameter values for detection, judge that FPC solder joints are qualified；If tonal range
Whether value judges that FPC solder joints are unqualified not in the range of default parameter values for detection, the mesh qualified so as to reach detection FPC solder joints
's.
In sum：This FPC solder joint detection methods, based on traditional optical principle come common scarce to what is run into welding production
Row automatic optics inspection is trapped into, machine obtains image, automatically extracts the office of each solder joint by camera automatic scanning circuit plate
Portion's image, and by image processing techniques, judge that the scolding tin at solder joint, with the presence or absence of defect, finally shows the scolding tin of those suspected defects
Show or be marked, conveniently check and maintenance；This method is by the red, green, blue passage in the detection block image of electing frame
Hue, saturation, intensity passage is converted into, can be reflected by the imaging of the principle of the light wave reflection of different wave length using different inclined-planes
The grade information of scolding tin, being detected by comparing tone, saturation degree and the brightness at pad position counter can release the basic of solder joint
State, so as to go to detect the purpose that FPC plates whether there is missing solder, many tin, small tin, tin point, company's tin, that replaces Traditional Man and enters
The method of row visual inspection, had not only reduced cost but also had saved human resources, at the same also substantially increase butt welding point detection efficiency and
Accuracy of detection.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding can carry out various changes, modification, replacement to these embodiments without departing from the principles and spirit of the present invention
And modification, the scope of the present invention be defined by the appended.
Claims (4)
1. a kind of FPC solder joints detection method, it is characterised in that the light wave reflection principle using different wave length passes through tone, saturation
Spend with brightness to judge the basic status of solder joint, specifically include following steps：
S1：By light source and held in the surface of measured object set-point；
S2：Default detection parameter, detection parameter includes missing solder, many tin, small tin, tin point and connects tin parameter；
S3：Start primaries RGB and camera is taken pictures to FPC to be detected, obtain image；
S4：Detection block is defined, the element part selected pad on S3 images using window circle and mutually weld with pad；
S5：Analyzing and processing image, by the red, green, blue Channel-shifted in detection block image into tone, saturation degree, luminance channel, point
Jian Ce not tonal range value；
S6：Tonal range value is compared with default parameter values for detection, judges that solder joint whether there is missing solder, many tin, small tin, tin
Point and even tin.
2. a kind of FPC solder joints detection method according to claim 1, it is characterised in that the basic status of solder joint includes sky
Weldering, many tin, small tin, tin point and even tin, and missing solder, many tin, small tin, tin point and Lian Xijun highlighted at solder joint it is different oblique
Face.
3. a kind of FPC solder joints detection method according to claim 1, it is characterised in that for the missing solder ginseng set in S2
Number includes missing solder brightness value and missing solder area percentage value.
4. a kind of FPC solder joints detection method according to claim 1, it is characterised in that in for S6, if tonal range value
In the range of default parameter values for detection, judge that FPC solder joints are qualified；If tonal range value is not in the range of default parameter values for detection,
Judge that FPC solder joints are unqualified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611131069.3A CN106770367A (en) | 2016-12-09 | 2016-12-09 | A kind of FPC solder joints detection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611131069.3A CN106770367A (en) | 2016-12-09 | 2016-12-09 | A kind of FPC solder joints detection method |
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| Publication Number | Publication Date |
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| CN106770367A true CN106770367A (en) | 2017-05-31 |
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| CN201611131069.3A Pending CN106770367A (en) | 2016-12-09 | 2016-12-09 | A kind of FPC solder joints detection method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107900485A (en) * | 2017-11-16 | 2018-04-13 | 广州市谊华电子设备有限公司 | Tin soldering machine control system |
| CN110675380A (en) * | 2019-09-23 | 2020-01-10 | 珠海格力电器股份有限公司 | Method for calibrating position of metal plug on circuit board and storage medium |
| CN111122607A (en) * | 2019-12-31 | 2020-05-08 | 麦格纳电子（张家港）有限公司 | Circuit board welding quality detection method |
| CN115135033A (en) * | 2022-07-29 | 2022-09-30 | 苏州浪潮智能科技有限公司 | Empty welding detection device and electronic equipment |
| CN116203396A (en) * | 2023-03-09 | 2023-06-02 | 深圳市燕麦科技股份有限公司 | Missing part test method and device and related equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105115980A (en) * | 2015-09-10 | 2015-12-02 | 苏州威盛视信息科技有限公司 | Missing-solder AOI solder paste detection method |
-
2016
- 2016-12-09 CN CN201611131069.3A patent/CN106770367A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105115980A (en) * | 2015-09-10 | 2015-12-02 | 苏州威盛视信息科技有限公司 | Missing-solder AOI solder paste detection method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107900485A (en) * | 2017-11-16 | 2018-04-13 | 广州市谊华电子设备有限公司 | Tin soldering machine control system |
| CN110675380A (en) * | 2019-09-23 | 2020-01-10 | 珠海格力电器股份有限公司 | Method for calibrating position of metal plug on circuit board and storage medium |
| CN111122607A (en) * | 2019-12-31 | 2020-05-08 | 麦格纳电子（张家港）有限公司 | Circuit board welding quality detection method |
| CN115135033A (en) * | 2022-07-29 | 2022-09-30 | 苏州浪潮智能科技有限公司 | Empty welding detection device and electronic equipment |
| CN115135033B (en) * | 2022-07-29 | 2024-02-09 | 苏州浪潮智能科技有限公司 | Empty detection of welding detection device and electronic equipment |
| CN116203396A (en) * | 2023-03-09 | 2023-06-02 | 深圳市燕麦科技股份有限公司 | Missing part test method and device and related equipment |
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Application publication date: 20170531 |
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