CN115135033A - Empty welding detection device and electronic equipment - Google Patents
Empty welding detection device and electronic equipment Download PDFInfo
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- CN115135033A CN115135033A CN202210911897.8A CN202210911897A CN115135033A CN 115135033 A CN115135033 A CN 115135033A CN 202210911897 A CN202210911897 A CN 202210911897A CN 115135033 A CN115135033 A CN 115135033A
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- 238000003466 welding Methods 0.000 title claims abstract description 162
- 238000001514 detection method Methods 0.000 title claims abstract description 80
- 239000000945 filler Substances 0.000 claims abstract description 84
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 54
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims 2
- 238000012360 testing method Methods 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Abstract
The invention discloses a welding detection device and electronic equipment, and relates to the field of welding test, wherein the welding detection device comprises a blind hole arranged between the upper surface of a PCB and an inner layer of the PCB and a first filler arranged in the blind hole, and the first filler is made of a conductive material, so that an element can normally work after being welded with a bonding pad corresponding to the blind hole; the PCB welding detection device is characterized by further comprising a through hole arranged between the inner layer of the PCB and the lower surface of the PCB and a second filler arranged in the through hole, and the color of the second filler is different when the pressure of the second filler is different, so that whether the welding pressure is enough when the second filler can reflect elements welded on the welding pad or not can be detected, and whether the PCB is welded in a vacant mode or not can be detected, and the detection result is not affected by stains on the placing position and the surface of the PCB, and the accuracy of PCB vacant welding detection is improved.
Description
Technical Field
The invention relates to the field of empty welding detection, in particular to an empty welding detection device and electronic equipment.
Background
As applications of electronic devices are gradually increased, Printed Circuit Boards (PCBs) are also increasingly used. The premise that the electronic equipment can normally work is that a PCB in the electronic equipment can normally work, and the empty welding is a welding defect which often occurs when elements are welded on the PCB, so that whether the empty welding occurs on the PCB needs to be detected. In the prior art, an Automatic Optical Inspection (AOI) detection method is usually used for performing empty solder joint detection on a Printed Circuit Board (PCB), specifically, an image of a test solder joint on the PCB is automatically acquired by a camera, and the image of the test solder joint is compared with a qualified image in a database to determine a soldering condition of the test solder joint, but when the placement position of the PCB is not correct or stains are on the surface of the PCB, the AOI detection method may cause a problem of false detection.
Disclosure of Invention
The invention aims to provide a solder mask detection device which can detect whether a PCB is subjected to solder mask or not, the detection result is not influenced by the placement position of the PCB and whether stains exist on the surface of the PCB or not, and the accuracy of the solder mask detection of the PCB is improved.
In order to solve the technical problem, the invention provides a welding detection device, which comprises:
the blind hole is arranged between the upper surface of the PCB and the inner layer of the PCB;
the through hole is arranged between the inner layer and the lower surface of the PCB;
the first filler is arranged in the blind hole and made of a conductive material;
and the second filler is arranged in the through hole, and the color of the second filler is different when the pressure applied to the second filler is different.
Preferably, the method further comprises the following steps:
a varistor disposed between the first filler and the second filler;
and the control module is used for detecting the pressure born by the piezoresistor and judging whether the welding spot corresponding to the blind hole is subjected to empty welding or not based on the pressure.
Preferably, the control module is specifically configured to:
detecting the pressure born by the piezoresistor;
judging whether the pressure is greater than a preset empty welding pressure critical value or not;
if yes, judging that no empty welding occurs in the welding point corresponding to the blind hole;
and if not, judging that the welding spot corresponding to the blind hole is empty welded.
Preferably, the control module is further configured to output the current pressure borne by the piezoresistor to a client when it is determined, based on the pressure, that empty welding occurs in the welding spot corresponding to the blind hole.
Preferably, the control module is further configured to output a position of the solder joint on the PCB to a client when it is determined that the solder joint corresponding to the blind via hole has a vacant solder joint based on the pressure.
Preferably, the device further comprises a prompting device;
the control module is also used for generating a prompt instruction when the pressure judges that the welding spot corresponding to the blind hole is empty welded;
and the prompting device is used for generating prompting information for prompting that the welding spot has empty welding when receiving the prompting instruction.
Preferably, the size of the blind hole is the same as the size of the pad on the upper surface of the PCB board.
Preferably, the material of the first filler is copper.
Preferably, the second filler is made of a non-conductive material.
In order to solve the technical problem, the invention further provides electronic equipment comprising the empty welding detection device.
In summary, the invention provides a dry soldering detection device and an electronic apparatus, which includes a blind hole disposed between an upper surface of a PCB and an inner layer of the PCB and a first filler disposed in the blind hole, wherein the first filler is made of a conductive material, so that a component can normally work after being soldered to a pad corresponding to the blind hole; still including setting up the through-hole between the inlayer of PCB board and the lower surface of PCB board and setting up the second filler in the through-hole, and the different colour of second filler of pressure that receives also is different, therefore the colour of second filler can reflect welding pressure when welding element on the pad whether enough, and then can judge whether empty condition of welding appears in the PCB board, and do not receive the influence of PCB board locating position and surface whether have spot, improve the accuracy of welding the detection to PCB board empty.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a dry welding detection device according to the present invention;
fig. 2 is a schematic structural diagram of another empty welding detection device provided by the invention.
Detailed Description
The core of the invention is to provide a method for detecting whether the PCB is empty-welded or not, and the detection result is not influenced by the placement position of the PCB and whether stains exist on the surface of the PCB, so that the accuracy of the detection of the PCB empty-welding is improved.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a welding detection device provided in the present invention, the welding detection device includes:
the blind hole 1 is arranged between the upper surface of the PCB and the inner layer of the PCB;
a through hole 2 arranged between the inner layer and the lower surface of the PCB;
the first filler 3 is arranged in the blind hole 1, and the material of the first filler 3 is conductive;
and the second filler 4 is arranged in the through hole 2, and the color of the second filler 4 is different when the pressure applied to the second filler 4 is different.
The empty welding is a common welding defect when elements are welded on the PCB, and the normal use of the PCB is influenced by the problem of the empty welding, so that whether the empty welding occurs on the PCB needs to be detected in time. In the prior art, methods for performing the air welding detection are various, such as manual detection, AOI detection, electromagnetic vibration experiment detection, X-ray detection, red ink experiment and the like, but the modes for performing the air welding detection in the prior art have certain defects, for example, the mode for manually and sequentially observing whether the welding spot on the PCB plate has the air welding is not intuitive and is easy to misjudge; AOI detection is easily influenced by factors such as the placement position of a PCB (printed circuit board) and whether stains exist on the surface of the PCB; the detection of the electromagnetic vibration experiment needs to be carried out by utilizing the resonance principle, the detection process is very complicated, and the detection instrument needs to be calibrated in the early stage; the X-ray detection needs to design a special test mold, and the test period is long and the price is high; the red ink test belongs to destructive tests, and when the solder joint between the element and the pad is verified to have empty solder through verifying whether the red ink exists in the solder joint, the PCB and the element are required to be disassembled, so that the PCB can not be normally used again.
In order to solve the shortcomings of various modes adopted in the process of carrying out empty welding detection on a PCB in the prior art, the application provides an empty welding detection device, which comprises a blind hole 1 arranged between the upper surface of the PCB and the inner layer of the PCB, a first filler 3 arranged in the blind hole 1 and made of a conductive material, a through hole 2 arranged between the inner layer of the PCB and the lower surface of the PCB, and a second filler 4 arranged in the through hole 2, wherein the color of the second filler 4 can be changed along with the pressure applied to the second filler 4. Referring to fig. 1, fig. 1 is a schematic structural diagram of a solder empty detection device provided by the present invention, and L1 in fig. 1 represents an upper surface of a PCB. Ln denotes the lower surface of the PCB, and L2 and L3 denote different inner layers of the PCB between the upper surface of the PCB and the lower surface of the PCB.
Specifically, when the component is required to be welded on the PCB, the pin of the component is usually welded on the pad located on the upper surface of the PCB above the blind hole 1, and when the pin of the component and the pad are successfully welded, the component can work together with other components on the PCB through the blind hole 1 below the pad to realize the designated function. Empty among this application welds detection device including setting up blind hole 1 between the upper surface of PCB board and the inlayer of PCB board and setting up first filler 3 in blind hole 1 to the material of first filler 3 is electrically conductive material, consequently, when the component normally welds on the pad and also when the problem that does not have empty welding between component and the pad, the component can normally be got electric or normally with the PCB board on other component cooperation work of being connected with this component through blind hole 1 and the electrically conductive first filler 3 of blind hole 1 intussuseption.
It should be noted that, currently, a common PCB is usually a multilayer PCB, that is, a plurality of inner layers are disposed between an upper surface and a lower surface of the PCB, and the specific position of the blind via 1 is not particularly limited in the present application, for example, the blind via 1 may be disposed between the upper surface of the PCB and a first inner layer of the PCB, where the blind via 1 is a first-order blind via 1.
In addition, the size of the blind via 1 and the specific material of the first filler 3 in the blind via 1 are not particularly limited in the present application, for example, the size of the blind via 1 may be the same as the size of a pad on the upper surface of the PCB, and the first filler 3 may be a conductive metal such as copper.
In order to judge the PCB board more directly perceivedly whether empty problem of welding appears, empty among this application weld detection device still including set up in the through-hole 2 between the inlayer of PCB board and the lower surface of PCB board and set up the second filler 4 in through-hole 2, and the colour of second filler 4 can change along with the pressure that second filler 4 received. The preset idle welding pressure critical value when the idle welding problem does not occur between the component and the bonding pad is determined through a plurality of welding tests before the PCB is automatically welded, and the idle welding problem does not occur between the component and the bonding pad when the pressure applied when the component is welded on the bonding pad is larger than the preset idle welding pressure critical value. Since the color of the second filler 4 in the present application changes with the magnitude of the pressure applied to the second filler 4, when the pressure applied to the second filler 4 (i.e., the pressure applied when the component is soldered to the pad) is smaller than the preset idle soldering pressure threshold value, the color of the second filler 4 is obviously different from the color of the second filler 4 when the pressure applied to the second filler 4 is greater than the preset idle soldering pressure threshold value, and since the second filler 4 is disposed in the through hole 2, it can be determined whether the pressure applied to solder the component and the pad is greater than the preset idle soldering pressure threshold value by observing the color of the second filler 4 on the lower surface of the PCB.
In the present application, the specific material of the second filler 4 is not particularly limited as long as the condition that the color of the second filler 4 is different when the pressure applied to the second filler 4 is different is satisfied.
In summary, the invention provides a dry soldering detection device, which includes a blind hole 1 disposed between the upper surface of a PCB and an inner layer of the PCB, and a first filler 3 disposed in the blind hole 1, wherein the first filler 3 is made of a conductive material, so that an element can normally work after being soldered to a pad corresponding to the blind hole 1; the PCB is characterized by further comprising a through hole 2 arranged between the inner layer of the PCB and the lower surface of the PCB and a second filler 4 arranged in the through hole 2, and the color of the second filler 4 is different when the pressure applied to the second filler 4 is different, so that whether the welding pressure is enough when the elements are welded on the welding pad of the PCB can be reflected by the color of the second filler, and whether the PCB is welded in a vacant mode can be judged.
Moreover, compared with the mode of directly observing the welding spot in the prior art, the mode of observing the color of the second filler 4 by the air welding detection device is more intuitive and is not easy to make mistakes; compared with the AOI detection method in the prior art, the air welding detection device is not affected by the placement position of the PCB and whether stains exist on the surface; moreover, the air welding detection device is very simple in structure and low in cost, and can improve the accuracy of air welding detection of the PCB.
On the basis of the above-described embodiment:
as a preferred embodiment, the method further comprises the following steps:
a varistor 5 disposed between the first filler 3 and the second filler 4;
and the control module is used for detecting the pressure born by the piezoresistor 5 and judging whether the welding spot corresponding to the blind hole 1 is empty welded or not based on the pressure.
Referring to fig. 2, fig. 2 is a schematic structural diagram of another empty solder detection apparatus provided by the present invention, and L1 in fig. 2 represents an upper surface of a PCB. Ln denotes the lower surface of the PCB, and L2 and L3 denote different inner layers of the PCB between the upper surface of the PCB and the lower surface of the PCB.
In order to further improve the accuracy of the detection result of the empty welding detection device for detecting whether the welding spot on the PCB is empty welded, in this embodiment, a piezoresistor 5 is further arranged between the first filler 3 and the second filler 4, the piezoresistor 5 can sense the pressure of the element welded on the pad on the PCB, when the pressure borne by the piezoresistor 5 is relatively high, it can be determined that the pressure ratio applied when the element is welded to the pad is relatively high, and the problem of the empty welding spot on the blind hole 1 corresponding to the piezoresistor 5 on the PCB does not occur; when the pressure born by the piezoresistor 5 is smaller, the pressure applied when the element and the bonding pad are welded is judged to be smaller, and the problem of empty welding possibly occurs to the welding point on the blind hole 1 corresponding to the piezoresistor 5 on the PCB.
In order to analyze whether the problem of the empty welding of the welding spot on the PCB board occurs based on the pressure born by the piezoresistor 5, the PCB board welding device is also provided with a control module, the control module can detect the pressure born by the piezoresistor 5, namely the pressure applied when an element is welded on a welding pad, and judge whether the problem of the empty welding of the welding spot corresponding to the blind hole 1 occurs based on the pressure born by the piezoresistor 5. For example, the pressure borne by the piezoresistor 5 is compared with a preset empty welding pressure critical value determined in advance according to experiments, and if the pressure borne by the piezoresistor 5 is greater than the preset empty welding pressure critical value, it is proved that empty welding does not occur in a welding point corresponding to the piezoresistor 5; or judging whether the pressure borne by the piezoresistor 5 is within a preset range, and when the pressure borne by the piezoresistor 5 is within the preset range, proving that no empty welding occurs to the welding point corresponding to the piezoresistor 5. The method and the device for judging whether the welding point corresponding to the blind hole 1 is empty-welded or not based on the pressure are not particularly limited by the control module, and the control module can realize the functions.
For example, when a factory detects whether a blank welding occurs by using a blank welding detection device, the detection result and the specific position of the welding point when the blank welding problem occurs are output to a client through a VGA (Video graphics Array)/DVI (Digital Visual Interface) signal, and whether the welding point actually has the blank welding problem is comprehensively judged by combining the color of the second filler 4 in the through hole 2 below the welding point of the blank welding. For example, when an electronic device or other device accidentally causes an accidental situation that a part on a PCB board falls off or the part loosens during transportation, the piezoresistor 5 can sense the change of pressure, and meanwhile, the control module acquires the change of pressure and performs data processing on the pressure borne by the piezoresistor 5 to judge whether a welding spot is abnormal, outputs a judgment result and a specific position where the welding spot is located under the condition that the welding spot is abnormal, and then a maintenance worker observes the color of the second filler 4 at the welding spot where the abnormality occurs, so as to further confirm and maintain the PCB board.
In addition, the control module in the present application may be a chip having a Processing function, such as a CPU (Central Processing Unit), a CPLD (Complex Programmable Logic Device), or an FPGA (Field Programmable Gate Array), which is not particularly limited in this application.
It should be noted that in this embodiment, the solder joint corresponding to the blind hole 1 is a solder joint generated when a pad located above the blind hole 1 on the PCB is soldered to a component.
The whole process of the empty welding detection of the PCB by using the empty welding detection device provided by the embodiment can be summarized as follows: firstly, summarizing and counting various elements through experiments, particularly presetting a dry welding pressure critical value when a patch type element is welded on a welding pad and no dry welding problem occurs; designing a blind hole 1 and a through hole 2 on a via hole of the empty welding detection device, filling a first filler 3 made of a conductive material in the blind hole 1, and filling a second filler 4 with a color changing along with pressure in the through hole 2; inputting a preset idle welding pressure critical value in a welding instrument in the PCB loading stage, and applying pressure to the element and the bonding pad according to the preset idle welding pressure critical value during welding; the pressure value born by the piezoresistor 5 is transmitted to the control module, and whether the component and the pad are in empty welding or not is checked by combining the color of the second filler 4.
In conclusion, this implementation is through increasing the piezo-resistor 5 that sets up between first filler 3 and second filler 4 and being arranged in the empty control module that welds that whether empty welding appears in the solder joint that this pressure judgement and blind hole 1 correspond based on this pressure in the detection device that welds for can judge whether empty welding appears in the PCB board and detect whether empty welding appears in the PCB board in the colour through second filler 4 and combine the pressure that piezo-resistor 5 bore on the basis of the empty welding appears in the PCB board, the degree of accuracy of the testing result whether empty welding to the PCB board has further been improved, and the detection mode is simple easy to operate.
As a preferred embodiment, the control module is specifically configured to:
detecting the pressure born by the piezoresistor 5;
judging whether the pressure is greater than a preset idle welding pressure critical value or not;
if yes, judging that no empty welding occurs in the welding point corresponding to the blind hole 1;
if not, determining that the welding point corresponding to the blind hole 1 has empty welding.
In this embodiment, before the empty soldering detection device is used to perform the empty soldering detection on the PCB, a preset empty soldering pressure critical value when no empty soldering problem occurs between the components and the pads soldered on the PCB is calculated through multiple experiments. Since the pressure borne by the piezoresistor 5 is the pressure applied when the element and the pad are welded, the control module can judge whether the pressure applied when the element and the pad are welded is enough or not by detecting the pressure borne by the piezoresistor 5, and further determine whether the problem of empty welding possibly occurs between the element and the pad. It should be noted that in this embodiment, the solder joints corresponding to the blind holes 1 are solder joints generated when the pads on the PCB above the blind holes 1 are soldered to components.
The specific process that whether empty welding appears in the welded solder joint on blind hole 1 is judged for detecting the pressure that piezo-resistor 5 bore by control module utilizing piezo-resistor 5, then judge whether pressure on piezo-resistor 5 is greater than and predetermine empty welding pressure critical value, and judge when pressure on piezo-resistor 5 is greater than and predetermine empty welding pressure critical value that empty welding does not appear in the solder joint that corresponds with blind hole 1, judge when pressure on piezo-resistor 5 is not greater than and predetermine empty welding pressure critical value that empty welding appears in the solder joint that corresponds with blind hole 1, it is more accurate to have further guaranteed that the empty welding detection result that whether empty welding appears in the solder joint that utilizes the empty welding detection device in this application to the solder joint on the PCB board.
As a preferred embodiment, the control module is further configured to output the currently-received pressure of the piezoresistor 5 to the client when it is determined that empty welding occurs in the welding point corresponding to the blind hole 1 based on the pressure.
In this embodiment, when the control module determines that the solder joint corresponding to the blind via 1 has the empty soldering problem, the current pressure borne by the varistor 5 is output to the client, so that the user can know the pressure condition of the solder joint having the empty soldering in time through the client, and confirm whether the solder joint has the empty soldering problem again, if the solder joint has the empty soldering problem, the factors such as the welding pressure value applied by the automatic welding device when welding the component and the solder pad can be adjusted, and if the solder joint has no empty soldering problem, the judgment standard of the control device is considered to be adjusted, for example, the preset empty soldering pressure critical value is reduced. It should be noted that in this embodiment, the solder joints corresponding to the blind holes 1 are solder joints generated when the pads on the PCB above the blind holes 1 are soldered to components.
In summary, in the present embodiment, after determining that the solder joint corresponding to the blind via 1 has the empty solder, the control device further optimizes the scheme of performing the empty solder detection on the PCB by using the empty solder detection device according to the current pressure output value client borne by the varistor 5.
As a preferred embodiment, the control module is further configured to output the position of the solder joint on the PCB to the client when it is determined that the solder joint corresponding to the blind hole 1 is empty-soldered based on the pressure.
Considering that the quantity of solder joints on the PCB is more, the condition that a plurality of solder joints are simultaneously welded in an empty state may occur, in order to realize the accurate positioning of the solder joints with the empty welding problem, in this embodiment, when the control module determines that the solder joints corresponding to the blind holes 1 have the empty welding problem, the specific positions of the solder joints on the PCB are output to the client, so that the user determines the actual positions of the solder joints with the empty welding problem through the client, and the subsequent more accurate solder joints with the empty welding problem are maintained. It should be noted that in this embodiment, the solder joints corresponding to the blind holes 1 are solder joints generated when the pads on the PCB above the blind holes 1 are soldered to components.
In summary, in this embodiment, the control module can also output the specific position output value client of the solder joint where the empty soldering problem occurs, so that the detection performance of the empty soldering detection apparatus provided by the present application is optimized.
As a preferred embodiment, the device further comprises a prompting device;
the control module is also used for generating a prompt instruction when judging that the welding spot corresponding to the blind hole 1 is empty-welded based on the pressure;
the prompting device is used for generating prompting information for prompting that the welding spot is welded in the absence when receiving the prompting instruction.
In order to remind a user that the welding spot on the PCB board is welded in the absence in time, a prompt device is further arranged in the embodiment, when the control module determines that the welding spot corresponding to the blind hole 1 is welded in the absence based on the pressure on the piezoresistor 5, a prompt instruction can be generated, and after the prompt device receives the prompt instruction, prompt information for prompting the welding spot that the welding spot is welded in the absence is generated based on the prompt instruction.
For example, the prompting device may be any one or combination of a display screen, a display lamp or a buzzer. For example, when the prompting device is a display screen, the position of a welding spot with a welding missing problem and the like can be displayed on the display screen after the display screen receives a prompting instruction generated by the control module; when the prompting device is a display lamp, the display lamp can flicker after receiving a prompting instruction generated by the control module; when the prompting device is a buzzer, the buzzer can send out buzzing sound after receiving a prompting instruction generated by the control module, in a word, the specific structure of the prompting device is not particularly limited in the application, and the function of prompting the occurrence of empty welding of a welding spot can be realized.
It should be noted that in this embodiment, the solder joint corresponding to the blind hole 1 is a solder joint generated when a pad located above the blind hole 1 on the PCB is soldered to a component.
To sum up, the condition that the PCB problem was welded to the sky through setting up suggestion device in this embodiment is reminded, has further optimized the empty performance that welds detection device that this application provided.
As a preferred embodiment, the size of the blind hole 1 is the same as the size of the pad on the upper surface of the PCB board.
In this embodiment, the size of the blind hole 1 is set to be the same as the size of the pad on the upper surface of the PCB, so that the contact area between the pin of the component and the pad and the blind hole 1 can be ensured, and the performance of the component after being welded on the pad is more stable, thereby ensuring the working performance of the PCB and the working performance of the electronic device using the PCB.
In a preferred embodiment, the material of the first filler 3 is copper.
In this embodiment, the first filler 3 filled in the blind hole 1 arranged between the upper surface of the PCB and the inner layer of the PCB is made of copper, so that the oxidation resistance of the PCB can be further improved on the basis of meeting the requirement that the element and the pad can normally work after being welded, thereby ensuring the performance of the PCB and the performance of the electronic device using the PCB.
In a preferred embodiment, the second filler 4 is made of a non-conductive material.
In this embodiment, the second filler 4 disposed in the through hole 2 between the inner layer of the PCB and the lower surface of the PCB is made of a non-conductive material, so that the lower surface of the PCB does not affect the working performance of the pad-welded component corresponding to the blind hole 1 in the PCB when contacting other objects, thereby further improving the anti-interference capability of the PCB, and ensuring the performance of the PCB and the performance of the electronic device using the PCB.
The invention also provides electronic equipment comprising the empty welding detection device.
The electronic equipment comprises a blind hole 1 arranged between the upper surface of the PCB and the inner layer of the PCB and a first filler 3 arranged in the blind hole 1, and the first filler 3 is made of a conductive material, so that an element can normally work after being welded with a bonding pad corresponding to the blind hole 1; still including setting up through-hole 2 between the inlayer of PCB board and the lower surface of PCB board and setting up second filler 4 in through-hole 2, and the different colour of second filler 4 also is different of pressure that second filler 4 received, therefore the colour of second filler can reflect welding pressure when welding element on the pad whether enough, and then can judge whether empty condition of welding appears in the PCB board, and do not receive the influence of PCB board locating place and whether there is the spot on the surface, improve the accuracy of PCB board empty welding detection, and then provide the assurance to electronic equipment's normal work.
For the related introduction of the electronic device provided in the present application, please refer to the above-mentioned embodiment of the empty welding detection apparatus, which is not described herein again.
It should be noted that, in the present specification, relational terms such as first and second, and the like are used only for distinguishing one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element. The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A lost motion detection device, comprising:
the blind hole is arranged between the upper surface of the PCB and the inner layer of the PCB;
the through hole is arranged between the inner layer and the lower surface of the PCB;
the first filler is arranged in the blind hole and made of a conductive material;
and the second filler is arranged in the through hole, and the color of the second filler is different when the pressure applied to the second filler is different.
2. The empty weld detection device of claim 1, further comprising:
a varistor disposed between the first filler and the second filler;
and the control module is used for detecting the pressure born by the piezoresistor and judging whether the welding spot corresponding to the blind hole is subjected to empty welding or not based on the pressure.
3. The empty welding detection device of claim 2, wherein the control module is specifically configured to:
detecting the pressure born by the piezoresistor;
judging whether the pressure is greater than a preset empty welding pressure critical value or not;
if yes, judging that no empty welding occurs in the welding spot welded with the blind hole;
and if not, judging that the welding spot welded with the blind hole has empty welding.
4. The empty welding detection device of claim 2, wherein the control module is further configured to output the current pressure applied by the piezoresistor to a client when it is determined that the welding spot corresponding to the blind hole is empty welded based on the pressure.
5. The empty welding detection device as claimed in claim 2, wherein the control module is further configured to output a position of the welding point on the PCB to a client when it is determined that the welding point corresponding to the blind hole is empty welded based on the pressure.
6. A lost motion detection device according to claim 2, further comprising a prompting device;
the control module is also used for generating a prompt instruction when the pressure judges that the welding spot corresponding to the blind hole is empty welded;
and the prompting device is used for generating prompting information for prompting that the welding spot is welded in an empty state when the prompting instruction is received.
7. An empty solder detection apparatus according to claim 1, wherein the size of the blind via is the same as the size of the pad on the upper surface of the PCB board.
8. A void weld detection device, as set forth in claim 1, wherein the first filler is copper.
9. A void weld detection device according to any one of claims 1 to 8, wherein the second filler is of a non-conductive material.
10. An electronic device characterized by comprising the empty solder detection apparatus according to any one of claims 1 to 9.
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| CN202210911897.8A CN115135033B (en) | 2022-07-29 | 2022-07-29 | Empty detection of welding detection device and electronic equipment |
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