CN107545566A - Visible detection method and system - Google Patents
Visible detection method and system Download PDFInfo
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- CN107545566A CN107545566A CN201710626239.3A CN201710626239A CN107545566A CN 107545566 A CN107545566 A CN 107545566A CN 201710626239 A CN201710626239 A CN 201710626239A CN 107545566 A CN107545566 A CN 107545566A
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Abstract
The present invention relates to a kind of visible detection method and system, methods described includes the acquisition parameters value of adjustment camera device；The image for the product to be measured that the camera device is shot according to preset requirement is obtained, and described image is pre-processed；The pre-selection solder joint in described image is detected with element according to preset standard, and exports testing result.The present invention can detect the defects of surface mount elements on product to be measured in a short time, and indicate its position, so as to reduce employee's visual inspection project, improve the efficiency of supplied materials detection, the detection process is accurate, quick, precision is high.
Description
Technical field
Embodiment of the present invention is related to detection field, more particularly to a kind of visible detection method and system.
Background technology
At present, gradually architectonical, high-end optical module product PCBA (assemble printed circuit board (PCB), Printed to high-end optical module product
Circuit Board Assembly) on contain a variety of components and welding position, the numerous pasters of element are complicated, are mounted on PCBA
On component and the solder joint of welding be likely to produce following defect：Material leakage, more material, attachment is reverse, element is edge-on, element splits
Damage, Component Displacement, pin connect few tin of tin, pad etc., and problem above occurs at random, if can not detect, rear end process is not
Good difficulty of doing over again is high and easily causes optical device damage.
Need to carry out Incoming Quality Control to PCBA before the electric optical device with loading on optical module, reduce do over again probability and costliness
Optical device is damaged.And the PCBA of high-end product employs many 010005, electric capacity of 0201 rank, resistive element, at present, mainly
Incoming Quality Control is carried out by way of manually being detected under high-power microscope, the program is disadvantageous in that：
First, to adjudicate foundation, the upper elements of PCBA are more using personal directly perception by reviewer, and employee is under the microscope
Detection time is longer, and employee watches microscope easily generation kopiopia attentively for a long time, deteriorated vision, adds the wind of missing inspection
Danger；Secondly, up to a hundred of a PCBA all types of elements, microscope downward view is limited, and the efficiency of desk checking is low；Again, work
The turnover rate of factory's visual inspection post employee is higher, relies on employee's proficiency.Therefore prior art easily causes missing inspection and may damage
Optical device, cause defective products also to be bound, just find that needs are reprocessed after to be energised, and take a long time to confirm bad original
Cause；It even may repeatedly be reprocessed because fault location quantity is more, cause production efficiency low and be easily damaged the optical device of costliness；
And the inspection equipment of outsourcing manufacturer is too expensive and possibility without secondary development, and the multi items for being unsatisfactory for 100G optical module producing lines are small quantities of
The productive temp of amount.
The content of the invention
Embodiment of the present invention is realized and treated mainly solving the technical problems that provide a kind of visible detection method and system
The automatic detection for the surface mount elements surveyed on product, production efficiency is improved, and the detection process is accurate, quick, precision is high.
In order to solve the above technical problems, the technical scheme that embodiment of the present invention uses is：
A kind of visible detection method, including:
Adjust the acquisition parameters value of camera device；
The image for the product to be measured that the camera device is shot according to preset requirement is obtained, and described image is located in advance
Reason；
The pre-selection solder joint in described image is detected with element according to preset standard, and exports testing result.
In one embodiment, the acquisition parameters value of the adjustment camera device, including：
The trigger signal of light source controller is set, and the acquisition parameters of camera device are adjusted according to Dynamic gene；
Wherein, the Dynamic gene includes the distance between the camera device and the product to be measured and environmental factor；The shooting
Parameter value includes image pixel, image display area, brightness of image and colourity, the filming frequency of image and quantity.
In one embodiment, the image for obtaining the product to be measured that the camera device is shot according to preset requirement,
And described image is pre-processed, including：
Obtain the image for the product to be measured that the camera device shoots and stored according to preset requirement；
Gray processing processing is carried out to described image and is cached；
After the brightness and contrast for adjusting described image, described image is transferred from caching, and it is put down successively
Field correction, open processing and gray scale corrosion treatment；
The average value of light intensity is carried out to the predeterminable area of described image and standard deviation compares, with judge described image whether
Obtained under predetermined light intensity environment.
It is in one embodiment, described that the pre-selection solder joint in described image is detected with element according to preset standard,
And before exporting testing result, in addition to：
Judge whether need to carry out the scolding tin detection at solder joint in the described image of current product to be measured；
When needing to carry out the scolding tin detection at solder joint, binary conversion treatment is carried out to described image, and send solder joint detection
Instruction；
When the detection of the scolding tin at solder joint need not be carried out, the instruction of transmitting element matching detection.
In one embodiment, it is described when needing to carry out the scolding tin detection at solder joint, binaryzation is carried out to described image
Processing, and solder joint detection instruction is sent, including：
When needing to carry out the scolding tin detection at solder joint, position matching is carried out to described image and shields non-bond pad locations；
Carry out binary conversion treatment successively to described image, close processing, convex closure processing, expansion process and after opening processing, hair
Send solder joint detection instruction.
It is in one embodiment, described that the pre-selection solder joint in described image is detected with element according to preset standard,
And testing result is exported, including：
Receive solder joint detection to instruct, whether the quantity of the block in detection described image is consistent with default number of pads；
When the quantity of block is consistent with default number of pads, the instruction of transmitting element matching detection；Quantity and default pad number in block
When measuring inconsistent, export and show described image and its detect the result of failure；
Receiving element matching detection instructs, and enters the element in described image and default element template according to preset order
Row matching, and judge whether the element in described image is consistent with the number of elements of the element template；It is consistent in number of elements
When, export and show the result that described image detection passes through；When number of elements is inconsistent, exports and show the knot of detection failure
Fruit, mispairing element and its mismatch site.
In one embodiment, it is described to carry out the element in described image and default element template according to preset order
Matching, including：
Obtain the anchor point in described image；
XYR axis coordinate systems are established by origin of the anchor point；
The shielding of non-detection element area is carried out to the described image after pre-processing；
Choose the element in described image successively according to element size order, and by the element of selection and default member
Part template is matched, and is exported according to default match parameter and shown matching result.
A kind of vision detection system, including control module, the display device and camera device that are connected to the control module；
The control module is used for the acquisition parameters value for adjusting camera device；The camera device is obtained according to preset requirement
The image of the product to be measured of shooting, and described image is pre-processed；The pre-selection in described image is welded according to preset standard
Point is detected with element, and exports testing result；
The camera device is used for the image that product to be measured is shot according to the instruction of the control module；
The display device is used to show the testing result and described image according to the instruction of the control module.
In one embodiment, the control module is additionally operable to judge whether need in the described image of current product to be measured
Carry out the scolding tin detection at solder joint；When needing to carry out the scolding tin detection at solder joint, position matching is carried out to described image and is shielded
Cover non-bond pad locations；Carry out binary conversion treatment successively to described image, close processing, convex closure processing, expansion process and open processing
Afterwards, solder joint detection instruction is sent；When the detection of the scolding tin at solder joint need not be carried out, the instruction of transmitting element matching detection.
In one embodiment, the control module is additionally operable to, when receiving solder joint detection instruction, detect in described image
Block quantity it is whether consistent with default number of pads；When the quantity of block is consistent with default number of pads, transmitting element
Matching detection instructs；When the quantity of block is inconsistent with default number of pads, exports and show described image and its detect and lose
The result lost；When receiving element matching detection instructs, according to preset order by the element in described image and default element
Template is matched, and judges whether the element in described image is consistent with the number of elements of the element template；In parts number
When measuring consistent, the result that described image detection passes through is exported and shown；When number of elements is inconsistent, exports and show that detection is lost
Result, mispairing element and its mismatch site lost.
The beneficial effect of embodiment of the present invention is that the visible detection method includes：Adjust the shooting of camera device
Parameter value；The image for the product to be measured that the camera device is shot according to preset requirement is obtained, and described image is located in advance
Reason；The pre-selection solder joint in described image is detected with element according to preset standard, and exports testing result.The present invention can be
The leakage patches of the surface mount elements on product to be measured, rhegma are detected in short time, patch is askew, lose money instead of making money, chip pin connects tin, the few tin of element
The problems such as, and problem component position is indicated, so as to reduce employee's visual inspection project, employee is absorbed in detecting element rosin joint and asked
Topic, the efficiency of supplied materials detection is improved, realize the automatic detection of the surface mount elements on product to be measured, and the detection process is accurate
Really, quickly, precision it is high.
Brief description of the drawings
Fig. 1 is the flow chart of the embodiment of visible detection method one of the present invention.
Fig. 2 is the structured flowchart of the embodiment of vision detection system one of the present invention.
Fig. 3 is the structured flowchart of the another embodiment of vision detection system of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
The visible detection method and system of the present invention improves the efficiency of supplied materials detection, realizes the paster on product to be measured
The automatic detection of element, and the detection process is accurate, quick, precision is high.Refering to Fig. 1 to Fig. 3, embodiment provides in Fig. 1
A kind of visible detection method, including step S10-S30：
In step slo, the acquisition parameters value of camera device 2 is adjusted；In certain embodiments, the camera device 2 wraps
Industrial camera is included, and it is intelligible, the most essential function of high definition industrial camera is exactly to convert optical signals into orderly electric signal.
In one embodiment, the present invention uses compact industrial camera of the resolution ratio for 2252*1944, and 50mm fixed focal lengths of arranging in pairs or groups
Tight shot.It (can be computer and its control that industrial camera, which obtains image and is transformed into digitized signal to be given to control module 1,
Software processed) functions (area, length, quantity, position, angle, offset etc.) such as image procossing, identification, display, positioning are carried out,
Complete defects detection work.Wherein, it is part PCBA products to be measured that the product to be measured, which includes but is not limited to, in one embodiment
In, the part product to be measured is the PCBA of 100G and 25G multi-mode optical module products, and the size of maximum PCBA products is 45*
15mm, effective dimensions 35*15mm, in detection process, it is desirable to the cleannes that product to be measured has had, avoid the external rings such as dust
The influence of border factor.
In this step, the distance between industrial camera and part product to be measured are adjusted to reach suitable working depth, and
The acquisition parameters value of the industrial camera is adjusted according to environmental factor, now can be with up to the acquisition parameters value is made to optimizing
Photograph picture rich in detail of the product to be measured in the case of the full visual field.During shooting, control module 1 can control industrial phase
Machine takes the mode (can also obtain multiple pictures every time as needed) of individual capture, in one embodiment, due to capture
The industrial camera in source is color camera, and each RGB (Red, Green, Blue) image needs 3*8bit space to deposit
Storage, therefore the storage classification selection RGB U32 of figure, and stop capture after individual takes phase and terminate camera setting, release
Camera resource.
In one embodiment, the step S10, including：
The trigger signal of light source controller 4 is set, and the acquisition parameters of camera device 2 adjusted according to Dynamic gene
It is whole；Wherein, it is the distance between the camera device 2 and the product to be measured and ring that the Dynamic gene, which includes but is not limited to,
Border factor；The acquisition parameters value includes image pixel, image display area, brightness of image and colourity, the filming frequency of image
With quantity etc..In the present invention, the light source 5 in vision detection system provides suitable lighting environment, and the light source 5 can be ring
Shape light source, product to be measured is illuminated in detection process, formed with the imaging effect beneficial to image procossing, be advantageous to computer and control
Software obtains the image of high quality.Preferably, adoptable white annular light source.And light source controller 4 provides electricity for light source 5
Can, and for controlling brightness and the illumination condition of light source 5, in certain embodiments, the light source controller 4 can quick program control reality
Existing frequent flashing control, external trigger realization can also be used.
As shown in figure 1, in step S20, the figure for the product to be measured that the camera device 2 is shot according to preset requirement is obtained
Picture, and described image is pre-processed；That is, carrying out a series of pretreatment to the image of acquisition, it is set to be beneficial to use template
Matching detection goes out the defects of product to be measured.
In one embodiment, the step S20 includes：
Obtain the image for the product to be measured that the camera device 2 shoots and stored according to preset requirement；Control module 1 first
Need the image of the product to be measured for being used to detect of acquisition industrial camera shooting.
Gray processing processing is carried out to described image and is cached；That is, to reduce the influence for the external factor such as uneven illumination is even
With lifting image processing speed, coloured image need to be subjected to gray processing processing；It is intelligible, if the industrial camera is not colored phase
Machine, it is convenient to omit the step.That is, after gray processing processing is carried out, described image storage is used for follow-up into caching
Flat field correction.
After the brightness and contrast for adjusting described image, described image is transferred from caching, and it is put down successively
Field correction, open processing and gray scale corrosion treatment；Adjusted that is, carrying out appropriate brightness and contrast to image first, then by its
Carry out flat field correction, hereafter, the processing (dilation operation after first erosion operation) moderately opened described image, to eliminate element
Fine particles, its smooth border.Finally, then to image gray scale corrosion treatment is carried out, protrudes the damage condition on element.
The average value of light intensity is carried out to the predeterminable area of described image and standard deviation compares, with judge described image whether
Obtained under predetermined light intensity environment.That is, predeterminable area (wanting the region detected) is taken to carry out light intensity on product to be measured
Average value and standard deviation compare, with this it is preliminary judge obtain image whether obtained under predetermined light intensity environment.
In step s 30, the pre-selection solder joint in described image is detected with element according to preset standard, and exports inspection
Survey result.That is, the product to be measured is checked by the image after processing and exports testing result.
In one embodiment, also include before the step S30：
Judge whether need to carry out the scolding tin detection at solder joint in the described image of current product to be measured；In this step,
It can judge whether user carries out the scolding tin detection at chip welding spot according to the radio box option under user setup interface.
When needing to carry out the scolding tin detection at solder joint, binary conversion treatment is carried out to described image, and send solder joint detection
Instruction；That is, to carrying out binary conversion treatment by the image handled in step 20, a series of two-value is carried out to the image afterwards
Change computing, make to protrude scolding tin state, reduce interference of the background to testing result.Send after being disposed solder joint detection instruction with
Trigger solder joint detection.When the detection of the scolding tin at solder joint need not be carried out, the instruction of transmitting element matching detection.That is, sending
After the instruction of element matching detection, representing can be according to the order of element from small to large (or order from big to small, or according to position
Put relation arrangement also can) enter units matching detection successively, detect defective element position.
It is described when needing to carry out the scolding tin detection at solder joint in the step of above example, two are carried out to described image
Value handle, and send solder joint detection instruction include：
When needing to carry out the scolding tin detection at solder joint, position matching is carried out to described image and shields non-bond pad locations；
That is, to carry out follow-up non-bond pad locations masking operation, it is necessary first to carry out the positioning of Mark points (anchor point), determining
After anchor point, the coordinate system of XYZ axles is established using the anchor point as origin, non-spot area is carried out on the coordinate system afterwards
Masking operation.
Carry out binary conversion treatment successively to described image, close processing, convex closure processing, expansion process and after opening processing, hair
Send solder joint detection instruction.That is, first, binary conversion treatment is carried out to gray level image, removes interference information beyond solder joint.Again to two
Image after value carries out the appropriate small cavity closed processing (first dilation operation after-contraction computing), fill in solder joint, connects phase
The scolding tin closed on.Hereafter convex closure processing is carried out to closing the binary image after handling, tiny scolding tin and the solder joint closed on is closed
And.Expansion process is carried out to image again, and opens processing.Background area outside butt welding point carries out noise reduction.
In one embodiment, the step S30 includes：
Receive solder joint detection to instruct, whether the quantity of the block in detection described image is consistent with default number of pads；
When the quantity of block is consistent with default number of pads, the instruction of transmitting element matching detection；Quantity and default pad number in block
When measuring inconsistent, export and show described image and its detect the result of failure；That is, after solder joint detection instruction is received,
Image after processing is analyzed, whether the number for counting the block in described image (detects as needed with number of pads
Solder joint is configured) it is identical.Even tin phenomenon if default number of pads is less than be present, can if being more than default number of pads
Can be in gap location with the presence of big grain soldered ball, in such cases, can be by institute because the quantity of block and default number of pads are inconsistent
State image to export and be shown in display device 3, to facilitate user to position scolding tin out-of-the way position；This inspection result is sentenced simultaneously
Certainly for FAIL (detection not by or detection fail).
Receiving element matching detection instructs, and enters the element in described image and default element template according to preset order
Row matching, and judge whether the element in described image is consistent with the number of elements of the element template；It is consistent in number of elements
When, export and show the result that described image detection passes through；That is, now show the detection of the element matching finally detected
As a result, and according to user-defined color shown.When number of elements is inconsistent, exports and show the knot of detection failure
Fruit, mispairing element and its mismatch site, that is, the testing result of now element matching and component number are inconsistent, show not
The element Name ＆ Location matched.
In one embodiment, in the step S30 in above-described embodiment according to preset order by described image
Element matched with default element template, including：
Obtain the anchor point in described image；That is, need to carry out Mark to carry out follow-up not element regions shield
The matching positioning of point (anchor point).
XYR axis coordinate systems are established by origin of the anchor point；That is, after anchor point is determined, with the anchor point
The coordinate system established for origin on XYR axles.
The shielding of non-detection element area is carried out to the described image after pre-processing；That is, to pretreated
Image carries out the shielding of non-detection element area, removes the interference information beyond element, reduces matching used time and the degree of accuracy.According to
Element size order chooses the element in described image successively, and the element of selection and default element template are carried out
Match somebody with somebody, and exported according to default match parameter and show matching result.That is, by the described image after shielding and default element
Template is matched, and suitable score value and matching angle are set after matching finishes.
Embodiment of the present invention can detect in a short time the leakage patches of the surface mount elements on product to be measured, rhegma, patch it is askew,
Lose money instead of making money, the problems such as chip pin connects tin, element few tin, and indicate problem component position, so as to reduce employee's visual inspection project,
Employee is absorbed in detecting element problem of faulty soldering, improves the efficiency of supplied materials detection, realizes surface mount elements on product to be measured
Automatic detection, and the detection process is accurate, quick, precision is high.The present invention can detect on product to be measured in a short time
The leakage patch of element, rhegma, patch is askew, lose money instead of making money, chip pin connects tin, the few tin problem of element, and indicates problem component position.So as to
Reduce employee's visual inspection project so that employee is absorbed in detecting element problem of faulty soldering, improves the efficiency of supplied materials detection.Meanwhile
Butt welding dot image is handled in welding point defect detection, completes the automatic identification that solder joint connects tin and other defect.It is intelligible,
In one embodiment of the invention, product common deficiency pattern-recognition storehouse to be measured can also be established, to realize common deficiency
Automatic identification.
Corresponding to above example, as shown in Fig. 2 the present invention also provides a kind of vision detection system, including control module
1st, the display device 3 and camera device 2 of the control module 1 are connected to；
The control module 1 is used for the acquisition parameters value for adjusting camera device 2；The camera device 2 is obtained according to default
It is required that the image of the product to be measured of shooting, and described image is pre-processed；According to preset standard to pre- in described image
Select solder joint to be detected with element, and export testing result；In certain embodiments, the camera device 2 includes industrial camera；
It is part PCBA products to be measured that the product to be measured, which includes but is not limited to, and in one embodiment, the part product to be measured is
The PCBA of 100G and 25G multi-mode optical module products, and the size of maximum PCBA products is 45*15mm, effective dimensions 35*15mm,
In detection process, it is desirable to the cleannes that product to be measured has had, avoid the influence of the external environmental factors such as dust.The vision
Detecting system, suitable lighting environment is provided by the light source 5 in Fig. 3, industrial camera obtains image and is transformed into digitized signal
It is given to control module 1 (can be computer and its control software) and carries out the function (faces such as image procossing, identification, display, positioning
Product, length, quantity, position, angle, offset etc.), complete defects detection work.
The camera device 2 is used for the image that product to be measured is shot according to the instruction of the control module 1；
The display device 3 is used to show the testing result and described image according to the instruction of the control module 1.
The vision detection system has three operation interfaces (being shown in the display interface 3)：Main interface, boundary is set
Face, help interface.Clicking on " homepage ", " setting ", " help " three buttons at the top of display interface 3 can switch over.
1st, main interface includes following action pane or option：
Image display window toolbar：The corresponding instrument of selection can be operated (amplification, mobile, mark etc.) accordingly.
Image display window：For showing the image slices and detection process of product to be measured.
Testing result is shown：PASS (passing through) or NG (not passing through).
" selection of detection product type " drop-down list:For the model for the product to be measured for selecting correctly to detect.
" detection " button：Click starts acquisition image and detected.
" preservation " button：Click at any time, by specified file of the image that preservation image window is shown under setting
Under folder.
" colour display "/" white and black displays " button：Click on the display color that switching obtains image.
" NG image reproducings " button：NG file selection windows will be ejected by clicking on, and can show the figure of band " testing result information "
Picture.
" camera " button：Open the camera of light source and industrial camera.
Program state column：Adhere to process for display element, program state and detection are time-consuming.
2nd, interface is set to include following action pane or option：
" image source radio box " " is used for the source for setting detection image.(camera acquisition is industrial camera captured in real-time, this
Ground image is the image of this computer (control module 1) memory storage)
" light source control " radio box：For selecting the working method of control light source 5.(it is used to control light source switch, works as image
When source selection camera obtains, this should select " to trigger ".)
" chip pin detection " radio box：For setting chip pin scolding tin detection switch.
" preserving picture path "：The path of image is preserved for setting.
" help document path "：For setting the storing path of help document.
" Camorra Name " drop-down lists：The camera of image is obtained for setting.
3rd, " helping in detail " button is clicked in interface is helped, this specification document will be opened.
The operating procedure of the system is as follows：The switch opening and product to be measured for first ensuring that light source controller 4 exist
It is secured in position in the fixture of system, the switch of selection suitable " image source " and " chip pin detection " is set；Return to main boundary
Face, the product type to be measured of selection preparation detection in the drop-down menu of " selection of detection product type ".Detection button is clicked on to enter
Row detection.Testing result is waited, product to be measured is removed if PASS.It can be put if FAIL in left side " tool image column " inner selection
Big or Drag tool observation out-of-the way position.Clicking on " preservation " button can preserve to present image and FAIL information.
It is intelligible, in one embodiment, if the switch of light source controller 4 and it is not switched on opening, or the light source control
The value of the first passage of device 4 is not 28 (i.e. eight segment numeral pipes show 1028), then prompting window can be ejected, to prompt user to detect
The setting state of current light source controller, user confirm it is errorless after, click on " it is determined that " button, then click on " detection " button can
Reacquire image.
In one embodiment, if having selected mistake product to be measured model or product to be measured be not placed into correct position
(withstanding chuck side edge in golden finger edge), it can now eject placement location or model choosing that prompt window has reminded product to be measured
Whether correctly to select, whether if confirming, the errorless frame that still ejects is prompted, dirty and clear with alcohol at anchor point to make user check
Detected again after washing.
In one embodiment, if there may be unusual condition (Lian Xi or missing) in image, pin scolding tin can now be ejected
Abnormal prompting, now user needs to amplify in the image of acquisition has checked whether scolding tin anomaly at scolding tin.
In one embodiment, as shown in figure 3, the system also includes light source controller 4 and light source 5, the control mould
Block 1 is additionally operable to set the trigger signal of light source controller 4, and the acquisition parameters of camera device 2 are adjusted according to Dynamic gene
It is whole；Wherein, the Dynamic gene includes the distance between the camera device 2 and the product to be measured and environmental factor；It is described
Acquisition parameters value includes image pixel, image display area, brightness of image and colourity, the filming frequency of image and quantity.One
In individual embodiment, the control module 1 is additionally operable to judge whether need to carry out at solder joint in the described image of current product to be measured
Scolding tin detection；When needing to carry out the scolding tin detection at solder joint, position matching is carried out to described image and shields non-solder joint position
Put；Carry out binary conversion treatment successively to described image, close processing, convex closure processing, expansion process and after opening processing, send solder joint
Detection instruction；When the detection of the scolding tin at solder joint need not be carried out, the instruction of transmitting element matching detection.
In one embodiment, the control module 1 is additionally operable to, when receiving solder joint detection instruction, detect in described image
Block quantity it is whether consistent with default number of pads；When the quantity of block is consistent with default number of pads, transmitting element
Matching detection instructs；When the quantity of block is inconsistent with default number of pads, exports and show described image and its detect and lose
The result lost；When receiving element matching detection instructs, according to preset order by the element in described image and default element
Template is matched, and judges whether the element in described image is consistent with the number of elements of the element template；In parts number
When measuring consistent, the result that described image detection passes through is exported and shown；When number of elements is inconsistent, exports and show that detection is lost
Result, mispairing element and its mismatch site lost.
In one embodiment, the control module 1 is additionally operable to obtain the anchor point in described image；The anchor point is
Origin establishes XYR axis coordinate systems；The shielding of non-detection element area is carried out to the described image after pre-processing；According to member
Part size order chooses the element in described image successively, and the element of selection and default element template are carried out
Match somebody with somebody, and exported according to default match parameter and show matching result.
Embodiment of the present invention can detect in a short time the leakage patches of the surface mount elements on product to be measured, rhegma, patch it is askew,
Lose money instead of making money, the problems such as chip pin connects tin, element few tin, and indicate problem component position, so as to reduce employee's visual inspection project,
Employee is absorbed in detecting element problem of faulty soldering, improves the efficiency of supplied materials detection, realizes surface mount elements on product to be measured
Automatic detection, and the detection process is accurate, quick, precision is high.
One of ordinary skill in the art will appreciate that realize all or part of flow in above-described embodiment method, being can be with
The hardware of correlation is instructed to complete by computer program, described program can be stored in a computer read/write memory medium
In, in the embodiment of the present invention, the program can be stored in the storage medium of computer system, and by the computer system
At least one computing device, to realize the flow for including the embodiment such as above-mentioned each method.Wherein, the storage medium can be
Magnetic disc, CD, read-only memory (Read-OnlX MemorX, ROM) or random access memory (Random Access
MemorX, RAM) etc..
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. visible detection method, it is characterised in that including：Adjust the acquisition parameters value of camera device；The image for the product to be measured that the camera device is shot according to preset requirement is obtained, and described image is pre-processed；The pre-selection solder joint in described image is detected with element according to preset standard, and exports testing result.
- 2. the method as described in claim 1, it is characterised in that the acquisition parameters value of the adjustment camera device, including：The trigger signal of light source controller is set, and the acquisition parameters of camera device are adjusted according to Dynamic gene；Wherein, The Dynamic gene includes the distance between the camera device and the product to be measured and environmental factor；The acquisition parameters value Including image pixel, image display area, brightness of image and colourity, the filming frequency of image and quantity.
- 3. the method as described in claim 1, it is characterised in that described to obtain what the camera device was shot according to preset requirement The image of product to be measured, and described image is pre-processed, including：Obtain the image for the product to be measured that the camera device shoots and stored according to preset requirement；Gray processing processing is carried out to described image and is cached；After the brightness and contrast for adjusting described image, described image is transferred from caching, and flat field school is carried out to it successively Just, processing and gray scale corrosion treatment are opened；The average value of light intensity is carried out to the predeterminable area of described image and standard deviation compares, to judge described image whether predetermined Light intensity environment under obtain.
- 4. method as claimed in claim 3, it is characterised in that it is described according to preset standard to the pre-selection solder joint in described image Detected with element, and before exporting testing result, in addition to：Judge whether need to carry out the scolding tin detection at solder joint in the described image of current product to be measured；When needing to carry out the scolding tin detection at solder joint, binary conversion treatment is carried out to described image, and sends solder joint detection instruction；When the detection of the scolding tin at solder joint need not be carried out, the instruction of transmitting element matching detection.
- 5. method as claimed in claim 4, it is characterised in that it is described when needing to carry out the scolding tin detection at solder joint, to institute State image and carry out binary conversion treatment, and send solder joint detection instruction, including：When needing to carry out the scolding tin detection at solder joint, position matching is carried out to described image and shields non-bond pad locations；Carry out binary conversion treatment successively to described image, close processing, convex closure processing, expansion process and after opening processing, send weldering Point detection instruction.
- 6. the method as described in claim 4 or 5, it is characterised in that it is described according to preset standard to the pre-selection in described image Solder joint is detected with element, and exports testing result, including：Receive solder joint detection to instruct, whether the quantity of the block in detection described image is consistent with default number of pads；In block When quantity is consistent with default number of pads, the instruction of transmitting element matching detection；In the quantity of block and default number of pads not When consistent, export and show described image and its detect the result of failure；Receiving element matching detection instructs, and carries out the element in described image and default element template according to preset order Match somebody with somebody, and judge whether the element in described image is consistent with the number of elements of the element template；It is defeated when number of elements is consistent Go out and show the result that described image detection passes through；When number of elements is inconsistent, exports and show the result of detection failure, mistake With element and its mismatch site.
- 7. method as claimed in claim 6, it is characterised in that it is described according to preset order by the element in described image with it is pre- If element template matched, including：Obtain the anchor point in described image；XYR axis coordinate systems are established by origin of the anchor point；The shielding of non-detection element area is carried out to the described image after pre-processing；Choose the element in described image successively according to element size order, and by the element of selection and default element mould Plate is matched, and is exported according to default match parameter and shown matching result.
- A kind of 8. vision detection system, it is characterised in that including control module, be connected to the control module display device and Camera device；The control module is used for the acquisition parameters value for adjusting camera device；The camera device is obtained to shoot according to preset requirement Product to be measured image, and described image is pre-processed；According to preset standard to the pre-selection solder joint in described image with Element is detected, and exports testing result；The camera device is used for the image that product to be measured is shot according to the instruction of the control module；The display device is used to show the testing result and described image according to the instruction of the control module.
- 9. system as claimed in claim 8, it is characterised in that the control module is additionally operable to judge the institute of current product to be measured The scolding tin whether state needs to carry out at solder joint on image detects；When needing to carry out the scolding tin detection at solder joint, to described image Carry out position matching and shield non-bond pad locations；Described image is carried out successively binary conversion treatment, close processing, convex closure processing, it is swollen Swollen processing and after opening processing, sends solder joint detection instruction；When the detection of the scolding tin at solder joint need not be carried out, transmitting element Instructed with detection.
- 10. system as claimed in claim 9, it is characterised in that the control module is additionally operable to receiving solder joint detection instruction When, detect described image in block quantity it is whether consistent with default number of pads；Quantity and default pad number in block When measuring consistent, the instruction of transmitting element matching detection；When the quantity of block is inconsistent with default number of pads, exports and show institute State the result of image and its detection failure；When receiving element matching detection instructs, according to preset order by described image Element is matched with default element template, and judges that the element in described image and the number of elements of the element template are It is no consistent；When number of elements is consistent, the result that described image detection passes through is exported and shown；When number of elements is inconsistent, Export and show result, mispairing element and its mismatch site of detection failure.
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| CN201710626239.3A CN107545566A (en) | 2017-07-27 | 2017-07-27 | Visible detection method and system |
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| CN109636776A (en) * | 2018-11-15 | 2019-04-16 | 暨南大学 | A kind of detection method and its detection device of bonding wire welding defect |
| CN109752384A (en) * | 2019-01-18 | 2019-05-14 | 深海弈智京山智能科技有限公司 | A kind of welding guidance of soldering tin box and weld defects detection system and application method |
| CN110133808A (en) * | 2019-05-23 | 2019-08-16 | 深圳市易飞扬通信技术有限公司 | Multi-mode optical module coupling process and system |
| CN110333240A (en) * | 2019-07-03 | 2019-10-15 | 珠海格力智能装备有限公司 | Detection method and device, storage medium and the processor of capacitor appearance |
| CN110837860A (en) * | 2019-11-06 | 2020-02-25 | 惠州皓赛技术有限公司 | Paster detection method based on deep learning and related system |
| CN110936020A (en) * | 2018-09-21 | 2020-03-31 | 大族激光科技产业集团股份有限公司 | Method and device for repairing welding seam track, laser welding equipment and storage medium |
| CN112270329A (en) * | 2020-10-30 | 2021-01-26 | 北京华维国创电子科技有限公司 | Accurate MARK point acquisition and identification algorithm based on multi-level algorithm fusion |
| CN112330583A (en) * | 2019-07-16 | 2021-02-05 | 青岛智动精工电子有限公司 | Product defect detection method, device, equipment and storage medium |
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| CN113344929A (en) * | 2021-08-09 | 2021-09-03 | 深圳智检慧通科技有限公司 | Welding spot visual detection and identification method, readable storage medium and equipment |
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| CN110936020B (en) * | 2018-09-21 | 2022-04-01 | 大族激光科技产业集团股份有限公司 | Method and device for repairing welding seam track, laser welding equipment and storage medium |
| CN110936020A (en) * | 2018-09-21 | 2020-03-31 | 大族激光科技产业集团股份有限公司 | Method and device for repairing welding seam track, laser welding equipment and storage medium |
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| CN110133808A (en) * | 2019-05-23 | 2019-08-16 | 深圳市易飞扬通信技术有限公司 | Multi-mode optical module coupling process and system |
| CN110133808B (en) * | 2019-05-23 | 2020-12-04 | 深圳市易飞扬通信技术有限公司 | Multimode optical module coupling method and system |
| CN110333240A (en) * | 2019-07-03 | 2019-10-15 | 珠海格力智能装备有限公司 | Detection method and device, storage medium and the processor of capacitor appearance |
| CN112330583A (en) * | 2019-07-16 | 2021-02-05 | 青岛智动精工电子有限公司 | Product defect detection method, device, equipment and storage medium |
| CN110837860A (en) * | 2019-11-06 | 2020-02-25 | 惠州皓赛技术有限公司 | Paster detection method based on deep learning and related system |
| CN112270329A (en) * | 2020-10-30 | 2021-01-26 | 北京华维国创电子科技有限公司 | Accurate MARK point acquisition and identification algorithm based on multi-level algorithm fusion |
| CN113038266A (en) * | 2021-03-05 | 2021-06-25 | 青岛智动精工电子有限公司 | Image processing method and device and electronic equipment |
| CN113030111A (en) * | 2021-03-30 | 2021-06-25 | 山东大学 | Machine vision-based automotive oil cooler cold joint detection system and method |
| CN113469991A (en) * | 2021-07-15 | 2021-10-01 | 广东奥普特科技股份有限公司 | Visual online detection method for laser welding spot of lithium battery tab |
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