CN106816555A - Flexible OLED display part assemble method - Google Patents
Flexible OLED display part assemble method Download PDFInfo
- Publication number
- CN106816555A CN106816555A CN201710063490.3A CN201710063490A CN106816555A CN 106816555 A CN106816555 A CN 106816555A CN 201710063490 A CN201710063490 A CN 201710063490A CN 106816555 A CN106816555 A CN 106816555A
- Authority
- CN
- China
- Prior art keywords
- display part
- peripheral circuit
- skew
- assemble method
- oled display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/84986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
Abstract
The present invention provides a kind of flexible OLED display part assemble method, first chip on film (2) is connected to peripheral circuit (12) is formed on flexible PCB (1), qualified peripheral circuit (12) is filtered out by inspection again, the qualified peripheral circuit (12) is finally connected to OLED bodies (3), the risk that module stage OLED bodies (3) scraps can be reduced, lifting assembling yield, saves production cost.
Description
Technical field
The present invention relates to OLED display device process technique field, more particularly to a kind of flexible OLED display part assembling side
Method.
Background technology
At present, the development of liquid crystal display (Liquid Crystal Display, LCD) has been enter into maturity period, You Jifa
Optical diode display device (Organic Light-Emitting Display, OLED) becomes the new increasing of following display industry
Point long.OLED has that self-luminous (not needing backlight), driving voltage are low, luminous efficiency is high, the response time is short, definition with it is right
Many advantages, such as higher than degree, nearly 180 ° of visual angles, temperature in use wide ranges, achievable Flexible Displays and large area total colouring, quilt
Industry is referred to as " dreamlike display ".
OLED can be divided into passive drive and the major class of active matrix driving two, i.e. direct addressin and film crystal according to type of drive
Pipe (Thin Film Transistor, TFT) class of matrix addressing two.Wherein, active matrix driving is also referred to as active matrix (Active
Matrix, AM) type.
Flexible OLED display part be mainly by OLED bodies (Cell), chip on film (Chip On Film, COF) and
Flexible PCB (Flexible printed circuit board, FPC) assembles.In electronic assembly industry, it is being related to
To the interconnection between electrode terminal and flexible circuit, the interconnection between flexible PCB and rigid circuit board, and flexible circuit
Between interconnection in be widely used anisotropic conductive adhesive, being placed on needs between parts to be joined, then right
Its pressurized, heated is formed reliable and stable machinery between part, electrical connection, and this process is referred to as bonding (Bonding).
In flexible OLED modules (Module) stage, just need OLED bodies, chip on film and flexible PCB Bonding one
Rise, complete the function connects of flexible OLED display part.It is increasing, it is necessary to many flips of Bonding are thin against product size
Film, the difficulty of Bonding processing procedures becomes increasing, and the operation quality for improving Bonding is the emphasis of Module.
As shown in figure 1, existing flexible OLED display part assemble method is first that OLED bodies 100 is thin with several flips
Film 200 carries out Bonding, then Bonding flexible PCBs 300, once occur a certain chip on film 200Bonding it is bad or
Flexible PCB 300Bonding is bad, can cause cost highest but to compare fragile OLED bodies 100 during heavy industry and scrap, and makes
Wasted into cost.
Therefore improving flexible OLED display part assemble method, reduction OLED bodies scrap risk becomes particularly important.
The content of the invention
It is an object of the invention to provide a kind of flexible OLED display part assemble method, module stage OLED can be reduced
The risk that body is scrapped, lifting assembling yield, saves production cost.
To achieve the above object, the present invention provides a kind of flexible OLED display part assemble method, comprises the following steps：
Step S1, offer flexible PCB and at least one chip on film, flexible circuit is connected to by the chip on film
Peripheral circuit is formed on plate；
Step S2, the peripheral circuit is tested, filter out qualified peripheral circuit；
Step S3, offer OLED bodies, OLED bodies are connected to by the qualified peripheral circuit.
Be connected to for the chip on film using hot pressing Welding peripheral circuit formed on flexible PCB by the step S1.
The step S2 is tested by automated optical inspection to the peripheral circuit.
The qualified peripheral circuit is connected to OLED bodies by the step S3 using hot pressing Welding.
The automated optical inspection includes that impression checks management and control project and X to skew and Y-direction skew inspection management and control project；X
Refer to skew in the horizontal direction to skew, Y-direction skew refers to the skew in vertical direction.
At least one certification label is set in each chip on film；
Pair chip on film being connected with same flexible PCB, Y-direction skew between any two certification label along Y-direction
Ultimate range, X to skew be between two certification labels of the different same corresponding positions of chip on film along X to away from
From.
The OLED bodies include multiple pixel cells in array arrangement, and each pixel cell is included by several films
The internal drive circuits of transistor composition and the Organic Light Emitting Diode being connected with internal drive circuits.
The thin film transistor (TFT) is low-temperature polysilicon film transistor.
Beneficial effects of the present invention：A kind of flexible OLED display part assemble method that the present invention is provided is first thin by flip
Film is connected to and peripheral circuit is formed on flexible PCB, then filters out qualified peripheral circuit by inspection, finally will be qualified
The peripheral circuit is connected to OLED bodies, can reduce the risk that module stage OLED bodies are scrapped, lifting assembling yield, section
About production cost.
Brief description of the drawings
In order to be able to be further understood that feature of the invention and technology contents, refer to below in connection with of the invention detailed
Illustrate and accompanying drawing, however accompanying drawing only provide with reference to and explanation use, not for being any limitation as to the present invention.
In accompanying drawing,
Fig. 1 is the schematic diagram of existing flexible OLED display part assemble method；
Fig. 2 is the flow chart of flexible OLED display part assemble method of the invention；
Fig. 3 is the schematic diagram of flexible OLED display part assemble method of the invention；
Fig. 4 is the schematic diagram for checking in flexible OLED display part assemble method of the invention X to be offset with Y-direction to skew.
Specific embodiment
Further to illustrate technological means and its effect that the present invention is taken, it is preferable to carry out below in conjunction with of the invention
Example and its accompanying drawing are described in detail.
Please refer to Fig. 2 and Fig. 3, the present invention provides a kind of flexible OLED display part assemble method, including following step
Suddenly：
Step S1, the offer chip on film 2 of flexible PCB 1 and at least one, flexibility is connected to by the chip on film 2
Peripheral circuit 12 is formed on circuit board 1.
Specifically, be connected to the chip on film 2 on flexible PCB 1 using hot pressing Welding form outer by step S1
Enclose circuit 12, i.e. Bonding chip on film 2 and flexible PCB 1.
Step S2, the peripheral circuit 12 is tested, filter out qualified peripheral circuit 12.
Specifically, step S2 passes through automated optical inspection (Automated Optical Inspection, AOI) to institute
Peripheral circuit 12 is stated to test.So-called automated optical inspection, is come to being run into all types of welding productions based on optical principle
The means tested of common deficiency, it passes through camera automatically scanning, collection image, then by image procossing, checks
Where defect.
The automated optical inspection includes that impression checks management and control project and X to skew and Y-direction skew inspection management and control project,
Wherein X directly influences the company of peripheral circuit 12 and OLED bodies 3 in subsequent step to skew with Y-direction skew inspection management and control project
Connect.Further, X refers to skew in the horizontal direction to skew, and Y-direction skew refers to the skew in vertical direction, as shown in figure 4, often
At least one certification label 20 is set in one chip on film 2, and Fig. 4 is illustrated and be provided with each chip on film 2 two inspections
Mark 20；Pair chip on film being connected with same flexible PCB 12, Y-direction skew between any two certification label 20 along Y
To ultimate range, X is the edge between two certification labels 20 of the different same corresponding positions of chip on film 2 to skew
X to distance, such as shown in Fig. 4：Be located between two certification labels 20 at the different lower-left ends of chip on film 2 along X to
Distance is an X to skew, be located between two certification labels 20 of the different bottom righthand sides of chip on film 2 along X to distance be
Another X is to skew.
Step S3, offer OLED bodies 3, OLED bodies 3 are connected to by the qualified peripheral circuit 12.
Specifically, the OLED bodies 3 include multiple pixel cells in array arrangement, each pixel cell include by
The internal drive circuits of several thin film transistor (TFT)s compositions and the Organic Light Emitting Diode being connected with internal drive circuits, wherein thin
The preferred low-temperature polysilicon film transistor of film transistor, this is as good as with prior art, does not launch narration herein.
The qualified peripheral circuit 12 is connected to OLED bodies 3, i.e. Bonding by step S3 using hot pressing Welding
The non-defective unit of peripheral circuit 12 and OLED bodies 3.
Be connected to for the qualified peripheral circuit 12 again after qualified peripheral circuit 12 is filtered out by the above method
OLED bodies 3, it is to avoid in the prior art because a certain chip on film Bonding is bad or flexible PCB Bonding is bad
The OLED bodies caused during heavy industry are scrapped such that it is able to reduce the risk that module stage OLED bodies are scrapped, and lifting assembles yield,
Save production cost.
In sum, first be connected to chip on film on flexible PCB by OLED display device assemble method of the invention
Peripheral circuit is formed, then qualified peripheral circuit is filtered out by inspection, be finally connected to the qualified peripheral circuit
OLED bodies, can reduce the risk that module stage OLED bodies are scrapped, and lifting assembling yield saves production cost.
The above, for the person of ordinary skill of the art, can be with technology according to the present invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to appended right of the invention
It is required that protection domain.
Claims (8)
1. a kind of flexible OLED display part assemble method, it is characterised in that comprise the following steps：
Step S1, offer flexible PCB (1) and at least one chip on film (2), the chip on film (2) are connected to soft
Peripheral circuit (12) is formed in property circuit board (1)；
Step S2, the peripheral circuit (12) is tested, filter out qualified peripheral circuit (12)；
Step S3, offer OLED bodies (3), OLED bodies (3) are connected to by the qualified peripheral circuit (12).
2. flexible OLED display part assemble method as claimed in claim 1, it is characterised in that the step S1 uses hot pressing
Be connected to for the chip on film (2) peripheral circuit (12) formed on flexible PCB (1) by Welding.
3. flexible OLED display part assemble method as claimed in claim 2, it is characterised in that the step S2 is by automatic
Optical check is tested to the peripheral circuit (12).
4. flexible OLED display part assemble method as claimed in claim 1, it is characterised in that the step S3 uses hot pressing
The qualified peripheral circuit (12) is connected to OLED bodies (3) by Welding.
5. flexible OLED display part assemble method as claimed in claim 3, it is characterised in that the automated optical inspection bag
Impression inspection management and control project and X are included to skew and Y-direction skew inspection management and control project；X refers to skew in the horizontal direction, Y to skew
Refer to the skew in vertical direction to skew.
6. flexible OLED display part assemble method as claimed in claim 5, it is characterised in that on each chip on film (2)
At least one certification label (20) is set；
Pair chip on film (2) being connected with same flexible PCB (1), Y-direction skew is between any two certification label (20)
Along the ultimate range of Y-direction, X is to two certification labels that skew is positioned at different chip on film (2) same corresponding positions
(20) between along X to distance.
7. flexible OLED display part assemble method as claimed in claim 1, it is characterised in that OLED bodies (3) bag
Multiple pixel cells in array arrangement are included, each pixel cell includes the internal drive electricity being made up of several thin film transistor (TFT)s
Road and the Organic Light Emitting Diode being connected with internal drive circuits.
8. flexible OLED display part assemble method as claimed in claim 7, it is characterised in that the thin film transistor (TFT) is low
Warm polycrystalline SiTFT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710063490.3A CN106816555A (en) | 2017-02-03 | 2017-02-03 | Flexible OLED display part assemble method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710063490.3A CN106816555A (en) | 2017-02-03 | 2017-02-03 | Flexible OLED display part assemble method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106816555A true CN106816555A (en) | 2017-06-09 |
Family
ID=59113193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710063490.3A Pending CN106816555A (en) | 2017-02-03 | 2017-02-03 | Flexible OLED display part assemble method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106816555A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109801575A (en) * | 2019-03-27 | 2019-05-24 | 霸州市云谷电子科技有限公司 | The method for separating of OLED display screen and the preparation method of OLED mould group |
| CN110416264A (en) * | 2019-07-22 | 2019-11-05 | 武汉华星光电半导体显示技术有限公司 | The binding method and display device of display device |
| CN110783489A (en) * | 2019-10-31 | 2020-02-11 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
| WO2020098006A1 (en) * | 2018-11-16 | 2020-05-22 | 惠科股份有限公司 | Chip-on-film punching device and display device assembly system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009105400A (en) * | 2007-10-24 | 2009-05-14 | Ajuhitek Inc | Manufacturing method for flexible printed circuit board, and inspection method therefor |
| CN104626492A (en) * | 2015-01-08 | 2015-05-20 | 中国计量学院 | Injection molding monitoring detection system based on machine vision and operation method |
| CN105632382A (en) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | Display device and method for detecting binding condition of binding area |
| CN106232004A (en) * | 2014-04-23 | 2016-12-14 | 通用电气公司 | Use the low noise MRI of low harmony wave pulse train |
-
2017
- 2017-02-03 CN CN201710063490.3A patent/CN106816555A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009105400A (en) * | 2007-10-24 | 2009-05-14 | Ajuhitek Inc | Manufacturing method for flexible printed circuit board, and inspection method therefor |
| CN106232004A (en) * | 2014-04-23 | 2016-12-14 | 通用电气公司 | Use the low noise MRI of low harmony wave pulse train |
| CN104626492A (en) * | 2015-01-08 | 2015-05-20 | 中国计量学院 | Injection molding monitoring detection system based on machine vision and operation method |
| CN105632382A (en) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | Display device and method for detecting binding condition of binding area |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020098006A1 (en) * | 2018-11-16 | 2020-05-22 | 惠科股份有限公司 | Chip-on-film punching device and display device assembly system |
| CN109801575A (en) * | 2019-03-27 | 2019-05-24 | 霸州市云谷电子科技有限公司 | The method for separating of OLED display screen and the preparation method of OLED mould group |
| CN110416264A (en) * | 2019-07-22 | 2019-11-05 | 武汉华星光电半导体显示技术有限公司 | The binding method and display device of display device |
| CN110416264B (en) * | 2019-07-22 | 2022-03-01 | 武汉华星光电半导体显示技术有限公司 | Display device and binding method thereof |
| CN110783489A (en) * | 2019-10-31 | 2020-02-11 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106816555A (en) | Flexible OLED display part assemble method | |
| CN107942547B (en) | Lighting and back lighting fixture and method for detecting panel | |
| US8664964B2 (en) | Display device and system for inspecting bonding resistance and inspecting method thereof | |
| CN1916700A (en) | Liquid crystal display device repair system and method thereof | |
| CN1841139A (en) | Electro-optical device and electronic apparatus | |
| US20070046336A1 (en) | Thin film transistor array substrate | |
| US20060285053A1 (en) | Liquid crystal display device and testing method thereof | |
| CN107797348B (en) | Display device with connection unit | |
| JP5028468B2 (en) | Electrophoretic display element production line and method | |
| CN103578358A (en) | Plastic panel and flat panel display device using the same | |
| CN102681227A (en) | Detection method for liquid crystal display panel | |
| US10429700B2 (en) | Display module and display device | |
| US7224425B2 (en) | System and method of manufacturing liquid crystal display wherein the bonding of the printed circuit film on the panel assembly is inspected | |
| CN112309884A (en) | LED display back plate detection device and detection method thereof | |
| US8525969B2 (en) | Repair structure for liquid crystal display panel and repairing method thereof | |
| CN107390395A (en) | Display panel bright spot restorative procedure | |
| CN105629537A (en) | Heavy-industry equipment of liquid crystal display module and heavy-industry method | |
| WO2017124609A1 (en) | Method for inspecting yield of liquid crystal display panels | |
| CN107797355A (en) | Liquid crystal display device and its detection method | |
| JP2006276368A (en) | Array substrate and test method thereof | |
| KR20120075096A (en) | Liquid crystal display device and inspection method thereof | |
| KR20080062264A (en) | Array substrate for liquid crystal display device | |
| KR102092076B1 (en) | Method for inspecting display apparatus | |
| CN109634005A (en) | Method for repairing and mending in array substrate manufacturing process | |
| TWI402562B (en) | Method of fabricating liquid crystal display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170609 |
|
| RJ01 | Rejection of invention patent application after publication |