CN112185293A - Display driving chip, chip packaging structure on display driving film and display module - Google Patents
Display driving chip, chip packaging structure on display driving film and display module Download PDFInfo
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- CN112185293A CN112185293A CN202010971941.5A CN202010971941A CN112185293A CN 112185293 A CN112185293 A CN 112185293A CN 202010971941 A CN202010971941 A CN 202010971941A CN 112185293 A CN112185293 A CN 112185293A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
Abstract
The invention discloses a display driving chip, a chip packaging structure on a display driving film and a display module, wherein the display driving chip comprises a resistance testing circuit and a plurality of first binding pads; the resistance test circuit includes: the bridge module is used for measuring the resistance and outputting a measurement message, wherein the bridge module comprises a regulating resistor and a comparator; the adjusting module is electrically connected to the bridge module and used for outputting a control signal to control the adjusting resistor to adjust the resistance value; the selection module is electrically connected to the bridge module and the at least two first binding pads and used for selectively conducting the at least two first binding pads and the bridge module; compared with the prior art, the invention improves the resistance testing efficiency of the binding pad in the display module, saves the process time and the process cost, and is beneficial to the lightening and thinning of the product.
Description
Technical Field
The invention relates to the technical field of display driving, in particular to a display driving chip, a chip packaging structure on a display driving film with the display driving chip and a display module with the chip packaging structure on the display driving film.
Background
With the development of display technology, people have higher and higher requirements on the appearance of LCD/OLED display screens. In order to pursue an extremely good display experience, various LCD/OLED screen manufacturers are dedicated to research and development of high-resolution products, and with the improvement of the resolution of the display screen, the number of the binding pins on the display screen is increased, Pitch between the binding pins is decreased, so that how to ensure the high resolution of the display screen, and at the same time, ensuring the reliability of the binding quality of the pins is a subject worthy of research.
In the current production process, the commonly used method mainly determines and monitors the quality of the bonding pins by measuring the resistance values of the bonding pins, as shown in fig. 2, which is a schematic structural diagram of a display driver module in the prior art, including a driver chip 1 and a flexible circuit board 2 bonded to a display screen 4, in order to measure the resistance values of the bonding pads 6, test points 5 electrically connected with the bonding pads 6 need to be reserved on the driver module 3, and the test points 5 are connected to the test points 5 through a test tool or a manufacturing test fixture to measure the resistance values of the bonding pads 6, and the reserved test points 5 need to be arranged in a certain space, and test fixtures of different sizes need to be manufactured according to different product models to measure, so that the manufacturing time is increased, the manufacturing cost is also increased, and the lightening and thinning of products are not facilitated.
Disclosure of Invention
Embodiments of the present invention provide a display driver chip, a chip packaging structure on a display driver film, and a display module, which can solve the technical problems in the prior art that, because the quality reliability of a bonding pad needs to be tested, a bonding resistance value needs to be tested, a test point needs to be set on a flexible circuit board, and a test fixture needs to be manufactured for measurement, so that the process time and the process cost are increased, and the product is not light and thin.
In order to solve the above technical problem, an embodiment of the present invention provides a display driver chip, where the display driver chip includes a resistance test circuit and a plurality of first bonding pads;
the resistance test circuit includes:
the bridge module is used for measuring the resistance and outputting a measurement message, wherein the bridge module comprises a regulating resistor and a comparator;
the adjusting module is electrically connected to the bridge module and used for outputting a control signal to control the adjusting resistor to adjust the resistance value; and
the selection module is electrically connected to the bridge module and the at least two first bonding pads and used for selectively conducting the at least two first bonding pads and the bridge module.
In an embodiment of the invention, the display driver chip includes a reading module electrically connected to the bridge module and the adjusting module, and configured to receive the measurement message from the comparator and output a stop signal to the adjusting module, so that the adjusting module stops outputting the control signal and generates a measured resistance value.
In an embodiment of the invention, the adjusting module is electrically connected to at least two of the first bonding pads, and respectively configured to receive an external adjusting signal and output the measured resistance value.
In an embodiment of the present invention, the bridge module is electrically connected to one of the first bonding pads for outputting the measurement message.
In an embodiment of the invention, the selection module is further electrically connected to another first bonding pad for receiving an external selection signal.
According to the above object of the present invention, a chip package structure on a display driver film includes a display driver chip and a flexible circuit board, wherein the display driver chip is bound on the flexible circuit board, the flexible circuit board includes a flexible substrate, a plurality of traces disposed on the flexible substrate, and a plurality of second bonding pads disposed at two ends of each of the traces, and the plurality of first bonding pads and the plurality of second bonding pads at one end of the plurality of traces are respectively bound by a conductive bonding material in a one-to-one correspondence manner.
In an embodiment of the invention, at least two of the second bonding pads respectively correspond to the at least two first bonding pads selectively conducted with the bridge module, and the at least two second bonding pads are electrically connected to each other by a trace.
In one embodiment of the invention, the first bonding pads for resistance measurement are grouped two by two, and the selection module is electrically connected to at least two groups of the first bonding pads.
According to the above object of the present invention, a display module is provided, which includes a chip on display driving film package structure, a display panel, and a timing control circuit board, wherein the timing control circuit board includes a substrate, a trace disposed on the substrate, and a plurality of third bonding pads disposed at ends of the trace, and the plurality of second bonding pads and the plurality of third bonding pads are respectively bonded with a conductive bonding material in a one-to-one correspondence manner.
In an embodiment of the invention, at least two of the second bonding pads respectively correspond to the at least two first bonding pads selectively conducted with the bridge module, at least two of the third bonding pads respectively correspond to the at least two second bonding pads selectively conducted with the bridge module, and the at least two third bonding pads are electrically connected to each other by a trace.
The invention has the beneficial effects that: the invention can quickly measure the resistance value of the binding pad on the display driving chip and/or the flexible circuit board by arranging the resistance test circuit in the display driving chip, can test the quality reliability of the binding pad without arranging a large number of test points, can provide more effective wiring spaces, reduces the investment of test tools or jigs in the production process, saves the process time, the process cost and the space, improves the resistance test efficiency of the binding pad, has almost no influence on the size of the display driving chip by arranging the resistance test circuit, can also reduce the wiring area on the flexible circuit board, and is beneficial to the lightening and thinning of products.
Drawings
The technical solution and other advantages of the present invention will be made apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a schematic structural diagram of a display module according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a conventional display module.
Fig. 3 is a schematic partial structure diagram of a display module according to an embodiment of the present invention.
Fig. 4 is a partial structural schematic view of another display module according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a resistance test circuit according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of another resistance test circuit according to an embodiment of the present invention.
Fig. 7 is a schematic cross-sectional structure diagram of a display module according to an embodiment of the invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, all other embodiments obtained by a person skilled in the art based on the embodiments of the present invention without any inventive step are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
Referring to fig. 1, 3 and 5, a display driver chip 10 according to an embodiment of the present invention includes a resistance test circuit 20 and a plurality of first bonding pads 101; the resistance test circuit 20 includes: the bridge module 201 is configured to measure a resistance and output a measurement message, wherein the bridge module 201 includes a tuning resistor Rt and a comparator 2011; the adjusting module 203 is electrically connected to the bridge module 201 for outputting a control signal to control the adjusting resistor Rt to adjust the resistance; and a selection module 202 electrically connected to the bridge module 201 and the at least two first bonding pads 101 for selectively conducting the at least two first bonding pads 101 and the bridge module 201.
In the implementation and application process, the drive chip provided by the embodiment of the invention can measure the resistance values of the bonding pads on the drive chip and other drive components by arranging the resistance test circuit on the drive chip, can test the quality reliability of the bonding pads without arranging a large number of test points, can provide more effective wiring space, is beneficial to the lightening and thinning of products, reduces the investment of test tools or jigs in the production process, saves the process time and the process cost, and improves the resistance test efficiency of the bonding pads.
In an embodiment of the present invention, referring to fig. 1, fig. 3 and fig. 5, the resistance test circuit 20 includes a bridge module 201, a selection module 202 electrically connected to the bridge module 201, and a regulation module 203 electrically connected to the bridge module 201 and the selection module 202, wherein a regulation resistor Rt and a comparator 2011 are disposed in the bridge module 201, when the resistance test circuit 20 performs a test operation, the selection module 202 turns on at least two first bonding pads 101 and the resistance test circuit 20, wherein two second bonding pads 102 bonded to the at least two first bonding pads 101 are wired to form a loop, and then the regulation module 203 outputs a control signal to control the regulation resistor to regulate a resistance value, it should be noted that the regulation of the resistance value is not limited to a process from high to low or from low to high, the resistance range of the adjusting resistor Rt can be determined by establishing a database according to the resistance value of the actually tested binding pin, and selecting a proper resistance range, and the adjusting precision of the adjusting resistor Rt determines the testing precision of the resistance testing circuit 101, and can be specifically selected according to the actual situation, which is not limited herein.
Specifically, the working principle of the resistance test circuit of this embodiment is described in detail below with reference to fig. 5, and fig. 5 is a schematic structural diagram of the resistance test circuit provided by this embodiment, wherein the bridge module 201 includes a first line and a second line connected in parallel, the first line includes an adjusting resistor Rt, a first resistor R1 electrically connected to the adjusting resistor Rt, and a first node S1 located between the first resistor R1 and the adjusting resistor Rt, the second line includes a second resistor R2, a first test terminal K1 and a second test terminal K2 isolated from each other, wherein the first test terminal K1 is electrically connected to the second resistor R2, and the second line further includes a second node S2 located between the second resistor R2 and the first test terminal K1, the second line is isolated from the second test terminal K1 by the first test terminal K1 and the second test terminal K2, in this embodiment, the resistance values of the first resistor R1 and the second resistor R2 may be limited to be equal to facilitate convenience of subsequent calculation, and two ends of the bridge module 201 may be respectively connected to a power source VDD and a ground VSS, wherein the power source VDD may have a voltage of 1.2V, 1.8V, or 3.3V, and the like, which is not limited herein.
The bridge module 201 further includes a comparator 2011, the comparator 2011 is electrically connected to the first node S1 and the second node S2 respectively to obtain electrical parameters of the first node S1 and the second node S2, and the electrical parameters include a potential, a current or a capacitance.
In addition, referring to fig. 3 and 5, the bridge module 201 is further electrically connected to a first bond pad 101 for outputting the measurement message, specifically, the comparator 2011 is electrically connected to a first bond pad 101, the comparator 2011 obtains and compares the potentials of the first node S1 and the second node S2, and the measurement message is output through the first bond pad 101 electrically connected to the comparator 2011.
Specifically, when the resistance test circuit 20 is operating, the selection module 202 electrically connects the two first bonding pads 101a and 101b to the first test terminal K1 and the second test terminal K2, respectively, it should be noted that the selection module 202 can connect the first bonding pad 101a and the first test terminal K1 and the second test terminal K2 through a switch, a transistor switch or other feasible manners, so as to connect the first bonding pad 101a and the first bonding pad 101b into the resistance test circuit 20, and then the adjustment module 203 outputs a control signal to control the adjustment resistor Rt to adjust the resistance value, since the first line is connected in parallel with the second line, when the potentials of the first node S1 and the second node S2 are equal, the resistance value on the first line is equal to the resistance value on the second line, at this time, the adjusting module 203 can control the adjusting resistor Rt to stop the adjustment of the resistance value, the comparator 2011 outputs the measurement message through the first binding point 101 to enable the user to obtain the measurement message, the comparator 2011 needs to compare the potential of the first node S1 with the potential of the second node S2, and when the two are equal or subtracted from each other, and when the value is 0, the comparator 2011 outputs the measurement message, specifically, the comparator 2011 is a differential amplifier, and when the potential of the first node S1 is equal to the potential of the second node S2, the comparator 2011 outputs a low level, and the user can know the adjusting resistance value remained on the adjusting module 203 at this time by obtaining the low level measurement message, that is, the current resistance value of the adjusting resistor Rt and is equal to the sum of the resistance value of the first binding pad 101a and the resistance value of the first binding pad 101b, specifically, the adjusting module 203 has a memory component for memorizing the current adjusting resistance value and the adjusting range value of the resistance value.
It should be noted that, the resistance values of all the first bonding pads 101 on the display driver chip 10 may be set to be equal, and then the resistance value of the first bonding pad 101a is equal to the resistance value of the second bonding pad 101b and equal to one half of the resistance value of the adjusting resistor Rt, where the first bonding pads 101a and 101b may be any bonding pad on the display driver chip 10 that needs to be subjected to a resistance test, and here, only the operation mode of the resistance test circuit 20 is described, and the embodiment of the present invention does not limit the position of the first bonding pad 101.
In the embodiment of the present invention, the first bonding pads 101 to be tested are grouped into two groups, and the selection module 202 is electrically connected to at least two groups of the first bonding pads 101, in addition, as shown in fig. 3, the selection module 202 is also electrically connected to another first bonding pad 101 for receiving an external selection signal, so that a user inputs information to control the selection module 202 to select and connect the bonding pad to be measured, and the adjustment module 203 is also electrically connected to one first bonding pad 101 for receiving an external adjustment signal, so that the user can adjust and control the resistance value of the adjustment resistor Rt.
In summary, in the present embodiment, the resistance test circuit is disposed on the display driver chip, so that the bonding pad to be subjected to the resistance test can be connected and measured, and the resistance value of the bonding pad can be obtained quickly, so as to test the quality reliability of the bonding pad, without additionally disposing a test point and manufacturing a test fixture, thereby saving the wiring space, the process cost and the process time, facilitating the lightening and thinning of the product, and improving the efficiency of the resistance test of the bonding pad.
In another embodiment of the present invention, please refer to fig. 1, fig. 4 and fig. 6, which are different from the above embodiments in that: the resistance testing circuit 20 further includes a reading module 204, and the reading module 204 is further electrically connected to the bridge module 201 and the adjusting module 203, that is, the reading module 204 is electrically connected to the comparator 2011, and is configured to receive the measurement message from the comparator 2011 and output a stop signal to the adjusting module 203, so that the adjusting module 203 stops outputting the control signal, at this time, the adjusting module 203 generates a measurement resistance value, that is, the adjusting module 203 retains a current adjustment resistance value, wherein, in other embodiments, the adjusting module 203 is further electrically connected to at least two first bonding pads 101, and is configured to receive an external adjustment signal to set a resistance adjustment range of the adjusting resistance Rt and output the measurement resistance value, so that the design of the circuit is flexible, specifically, the adjusting module 203 is electrically connected to one or at least two first bonding pads 101 according to the through-usage of the display driving chip 10 Different, the signal input and output can be performed in different time division when the adjusting module 203 is electrically connected to one of the first bonding pads 101, and the signal input and output can be performed respectively at two of the bonding pads 101 when the adjusting module 203 is electrically connected to at least two of the first bonding pads 101.
Specifically, when the selection module 202 turns on two first bonding pads 101 to access the bridge module 201, the adjustment module 203 adjusts the adjustment resistance Rt to make the electrical parameters of the first node S1 and the second node S2 equal, the comparator 2011 outputs a measurement message to the reading module 204, the reading module 204 determines the measurement message and outputs a stop signal to the adjustment module 203, then the adjustment module 203 stops adjusting the resistance value of the adjustment resistance Rt and outputs the current resistance value of the adjustment resistance Rt through the first bonding pad 101 connected thereto, compared with the previous embodiment, the present embodiment can not only quickly measure the resistance value of the pad by adding the reading module 204, but also improves the convenience and the automation degree of the resistance test circuit 20, and can determine the measurement endpoint, and stopping the adjustment of the resistance value of the adjusting resistor Rt, automatically reading the result, and directly outputting the measured resistance value, thereby further improving the efficiency of the resistance test of the binding pad.
Further, the resistance test circuit 20 may not only perform a resistance test on the bonding pads on the display driver chip 10, but also perform a resistance test on the bonding pads on the flexible circuit board 30, specifically, as shown in fig. 1, fig. 4 and fig. 6 (and the embodiment of the present invention takes the resistance test circuit shown in fig. 4 and fig. 6 as an example for explanation), the chip-on-display-driver package structure provided by the embodiment of the present invention includes the display driver chip 10 and the flexible circuit board 30, the display driver chip 10 is bound to the flexible circuit board 30, wherein the flexible circuit board 30 includes a flexible substrate 31, a plurality of traces 32 disposed on the flexible substrate 31 and a plurality of second bonding pads 102 disposed at two ends of each trace 32, and a conductive material 33 is respectively bound between the first bonding pads 101 and the second bonding pads 102 at one end of the plurality of traces 32 And a corresponding bonding, wherein at least two of the second bonding pads 102 respectively correspond to the at least two first bonding pads 101 selectively conducting with the bridge module 201, and the at least two second bonding pads 102 are electrically connected to each other by a trace 321.
Specifically, the second bonding pads 102 that need to be subjected to the resistance test are also grouped in pairs, that is, the two second bonding pads 102 respectively correspond to the two first bonding pads 101 selectively conducted with the bridge module 201 and are bonded and connected, the two second bonding pads 102 are electrically connected with each other by using the routing 321, then the resistance value of the adjusting resistance Rt is adjusted, so that the electrical parameters of the first node S1 and the second node S2 are equal, that is, the sum of the resistance values of the two first bonding pads 101 and the two second bonding pads 102 can be obtained, specifically, the resistance value of the first bonding pad 101 itself can be ignored, the purpose of the embodiment of the present invention is to measure the resistance generated at the bonding point after the first bonding pad 101 and the plurality of second bonding pads 102 are bonded by the conductive bonding material 33, so as to confirm the bonding quality of the bonding point, specifically, when the bonding quality between the conductive bonding material 33 and the first bonding pad 101 and the plurality of second bonding pads 102 is good, the resistance of the bonding point is small, and the influence on the subsequent signal transmission is small, and if the bonding quality between the conductive bonding material 33 and the first bonding pad 101 and the plurality of second bonding pads 102 is poor, such as empty soldering or poor contact, the resistance of the bonding point is large, and the influence on the subsequent signal transmission is large.
In addition, referring to fig. 1, fig. 4, fig. 6 and fig. 7, which are schematic structural diagrams of a display module according to an embodiment of the present invention, the display module includes a chip-on-display-driving-film package structure, a display panel 50 and a timing control circuit board 40, wherein the chip-on-display-driving-film package structure includes the flexible circuit board 30 and the display driving chip 10 bound on the flexible circuit board 30.
The timing control circuit board 40 includes a substrate 41, a trace 42 disposed on the substrate, and a plurality of third bonding pads 103 disposed at ends of the trace 42, wherein the plurality of second bonding pads 102 and the plurality of third bonding pads 103 are respectively bonded by conductive bonding materials 33 in a one-to-one correspondence manner.
In the embodiment of the present invention, a resistance test may be further performed on the third bonding pads 103 located on the timing control circuit board 40, wherein at least two of the second bonding pads 102 correspond to the at least two first bonding pads 101 selectively conducted with the bridge module 201, at least two of the third bonding pads 103 correspond to the at least two second bonding pads 102 (i.e., the at least two second bonding pads 102 selectively conducted with the bridge module 201 through the at least two first bonding pads 101) respectively, and the at least two third bonding pads 103 are electrically connected to each other by a trace 421.
Specifically, the third bonding pads 103 that need to be subjected to the resistance test are grouped into a group, the selection module 202 conducts the two first bonding pads 101 with the bridge module 201, the two first bonding pads 101 are further bonded with the two second bonding pads 102, the two second bonding pads 102 corresponding to the other end of the routing wire 32 are further bonded with the two third bonding pads 103, so that the two first bonding pads 101, the four second bonding pads 102, the two third bonding pads 103, and the routing wire 421 are connected to the bridge module 201 to form a loop, then the adjustment of the adjustment resistance Rt is performed, so that the electrical parameters of the first node S1 and the second node S2 are equal, and the reading module 204 obtains the measurement information of the comparator 2011 and outputs the measurement information to the adjustment module 203, the adjusting module 203 controls the adjusting resistance Rt to stop adjusting, and outputs the measured resistance value, it should be noted that, at this time, the measured resistance value is the binding resistance value between the two first binding pads 101 and the second binding pads 102 plus the binding resistance value between the two second binding pads 102 and the third binding pads 103, where the binding resistance value between the first binding pads 101 and the second binding pads 102 can be obtained by testing, and the two binding resistance values are subtracted from each other, so as to obtain the binding resistance values of the two second binding pads 102 and the third binding pads 103.
Referring to fig. 7, it should be noted that the display driver chip 10 is bound between the first binding pad 101 and the second binding pad 102, then bound with the third binding pad 103 on the timing control circuit board 40 through the second binding pad 102, and bound with the binding pad 104 on the display panel 50, so as to transmit driving signals among the timing control circuit board 40, the display driver chip 10, and the display panel 50, and thus implement the normal display function of the display module.
According to the display module provided by the embodiment of the invention, the resistance test circuit is arranged on the display driving chip, so that the resistance of the first binding pad on the display driving chip, the resistance of the second binding pad on the flexible circuit board and the resistance of the third binding pad on the time sequence control circuit board can be quickly and conveniently measured, the quality reliability of the binding pads can be tested, no test point is required to be arranged on the driving component, more effective wiring space can be reserved, the light and thin products can be facilitated, other resistance test fixtures are not required to be manufactured, the process cost and the process time are saved, the resistance test efficiency of the binding pads is greatly improved, and the yield is improved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display driving chip, the chip-on-display-driving-film package structure, and the display module provided in the embodiments of the present invention are described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present invention, and the description of the above embodiments is only used to help understanding the technical scheme and the core idea of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The display driving chip is characterized by comprising a resistance testing circuit and a plurality of first binding pads;
the resistance test circuit includes:
the bridge module is used for measuring the resistance and outputting a measurement message, wherein the bridge module comprises a regulating resistor and a comparator;
the adjusting module is electrically connected to the bridge module and used for outputting a control signal to control the adjusting resistor to adjust the resistance value; and
the selection module is electrically connected to the bridge module and the at least two first bonding pads and used for selectively conducting the at least two first bonding pads and the bridge module.
2. The display driver chip of claim 1, wherein the display driver chip comprises a reading module electrically connected to the bridge module and the adjusting module for receiving the measurement message from the comparator and outputting a stop signal to the adjusting module to stop the adjusting module from outputting the control signal and generate a measured resistance.
3. The display driver chip of claim 2, wherein the adjusting module is electrically connected to at least two of the first bonding pads for receiving an external adjusting signal and outputting the measured resistance value.
4. The display driver chip of claim 1, wherein the bridge module is electrically connected to one of the first bonding pads for outputting the measurement message.
5. The display driver chip of claim 1, wherein the selection module is further electrically connected to another of the first bonding pads for receiving an external selection signal.
6. A chip packaging structure on a display driving film, comprising the display driving chip of any one of claims 1 to 5 and a flexible circuit board, wherein the display driving chip is bound on the flexible circuit board, the flexible circuit board comprises a flexible substrate, a plurality of traces disposed on the flexible substrate and a plurality of second binding pads disposed at two ends of each of the traces, and the plurality of first binding pads and the plurality of second binding pads at one end of the plurality of traces are respectively bound with a conductive binding material in a one-to-one correspondence manner.
7. The chip on display driver film package structure of claim 6, wherein at least two of the second bonding pads respectively correspond to the at least two first bonding pads selectively conducting with the bridge module, and the at least two second bonding pads are electrically connected to each other by a trace.
8. The chip on film package structure of claim 6, wherein the first bonding pads for resistance measurement are grouped in pairs, and the selection module is electrically connected to at least two groups of the first bonding pads.
9. A display module, comprising the chip-on-display-drive-film package structure according to any one of claims 6 to 8, a display panel, and a timing control circuit board, wherein the timing control circuit board comprises a substrate, a trace disposed on the substrate, and a plurality of third bonding pads disposed at ends of the trace, and the plurality of second bonding pads and the plurality of third bonding pads are bonded with conductive bonding materials in a one-to-one correspondence manner.
10. The display module according to claim 9, wherein at least two of the second bonding pads respectively correspond to the at least two first bonding pads selectively conducting with the bridge module, at least two of the third bonding pads respectively correspond to the at least two second bonding pads selectively conducting with the bridge module, and the at least two third bonding pads are electrically connected to each other by a trace.
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| CN113160729A (en) * | 2021-03-05 | 2021-07-23 | 武汉天马微电子有限公司 | Display module, test method thereof and display device |
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| CN113160729B (en) * | 2021-03-05 | 2022-06-14 | 武汉天马微电子有限公司 | Display module, test method thereof and display device |
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| CN112185293B (en) | 2022-09-09 |
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